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ASML Holding N.V.

Veldhoven, NL

ASML Holding N.V. Patent applications
Patent application numberTitlePublished
20130100430LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - An apparatus and a method to hold a patterning device configured to impart a beam of radiation with a pattern in its cross-section. The apparatus includes a base configured to support the patterning device and an inner cover couplable to the base. The inner cover includes a restraining mechanism that, upon an application of a force external to the inner cover, is configured to provide an in-plane force to the patterning device to restrain movement of the patterning device, the in-plane force being substantially parallel to a patterning surface of the patterning device.04-25-2013
20130063711Linear Motor and Lithography Arrangement Including Linear Motor - A lithographic apparatus including a uniformity correction system is disclosed. The lithographic apparatus comprises an illumination system configured to condition a beam of radiation. The illumination system comprises a uniformity correction system located at a plane configured to receive a substantially constant pupil when illuminated with the beam of radiation. The uniformity correction system includes fingers configured to be movable into and out of intersection with a radiation beam so as to correct an intensity of respective portions of the radiation beam. A linear motor actuator arrangement drives the fingers to their respective appropriate positions to compensate for non-uniform illumination. Control is provided by a control system that precisely manipulates carriers of the fingers.03-14-2013
20130033690ELECTROSTATIC CLAMP, LITHOGRAPHIC APPARATUS AND METHOD OF MANUFACTURING AN ELECTROSTATIC CLAMP - An electrostatic clamp configured to electrostatically clamp an article to an article support in a lithographic apparatus. The clamp comprises a first layer of material, an electrode disposed over the first layer, an isolating, dielectric or semi-dielectric material deposited between portions of the electrode, and a second layer disposed over the electrode. Further, a method of manufacturing of the electrostatic clamp is described.02-07-2013
20130011547Optical Component Fabrication Using Coated Substrates - A method of fabricating or preparing an optical component, such as a mirror, using an amorphous oxide coated substrate is presented. An amorphous oxide coating is applied to an optical substrate. An assessment of surface roughness of the coated surface is performed. The coated surface is polished based on the assessment. Initial assessments can be conducted and polishing can be performed based on those initial assessments prior to applying the coating to better prepare the surface for the coating. Each assessment can assess the surface's Mid-Spatial Frequency Roughness (MSFR), High-Spatial Frequency Roughness (HSFR), or both. The performing of the assessments, polishing and/or coating can be computer-controlled. This process is ideal in the fabrication of an optical component formed from a substrate with a near-zero coefficient of thermal expansion. An optical component fabricated in this manner is also presented.01-10-2013
20130010277System and Method for Using a Two Part Cover and a Box for Protecting a Reticle - Systems and methods to protect a mask from being contaminated by airborne particles are described. The systems and methods include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.01-10-2013
20130010273Linear Motor Magnetic Shield Apparatus - A magnetic shield having non-magnetic gaps provides reduced magnetic cross-talk for a linear motor array in a precision positioning system. Redirecting the leakage flux limits the cross-talk and associated deleterious effects. Such preferred magnetic circuit paths for the leakage are affixed to the moving magnet system of the linear motor. Embodiments of the preferred flux leakage paths are realized by providing a ferromagnetic shield separated by a non-magnetic gap between the permanent magnets and the back-irons. In another embodiment, the ferromagnetic shield separation includes diamagnetic materials.01-10-2013
20120262685Double EUV Illumination Uniformity Correction System and Method - A lithographic apparatus includes a uniformity correction system located at a plane and configured to receive a substantially constant pupil when illuminated with the beam of radiation. The uniformity correction system includes fingers that move into and out of intersection with a beam so as to correct an intensity of respective portions of the radiation beam. According to another embodiment, a method includes for: focusing a beam of radiation at a first plane to form pupil; adjusting the intensity of the beam near the first plane by moving fingers located near the first plane into and out of a path of the beam of radiation, wherein a width of a tip of each of the fingers is larger than that of corresponding actuating devices used to move each corresponding one of the fingers; patterning the beam; and projecting the patterned beam onto a substrate.10-18-2012
20120249983LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - An apparatus, in an embodiment, having a patterning device support including a first planar element having a first flow-restricting surface; a second planar element including a second flow-restricting surface facing the first flow-restricting surface; a support driver to linearly move the support along a certain direction relative to the second planar element, wherein the first and/or second flow-restricting surface has one or more projections and/or recesses between the first and second flow-restricting surfaces, and wherein the projection and/or recess on the first and/or second flow-restricting surface is arranged to provide a flow resistance, per unit width of the first and/or second flow-restricting surface perpendicular to the flow, that is lower against flow that is parallel to the certain direction than against flow that is perpendicular to the certain direction. The flow-restricting surfaces may direct gas flow onto a driver part that generates heat.10-04-2012
20120200839Pulse to Pulse Energy Equalization of Light Beam Intensity - A system for equalizing pulse to pulse energy of a light beam includes a group of optical devices including an optical device configured to exhibit nonlinear properties, e.g., higher order or third order nonlinear properties. Transmission properties of an unequalized light beam passing through the group of optical devices change such that an output intensity of a resulting light beam output from the optical devices is equalized. One example configuration includes at least first and second prisms having nonlinear properties, i.e., higher order or third order, and configured as a beam steering system.08-09-2012
20120171600Time Differential Reticle Inspection - Disclosed are systems and methods for time differential reticle inspection. Contamination is detected by, for example, determining a difference between a first signature of at least a portion of a reticle and a second signature, produced subsequent to the first signature, of the portion of the reticle.07-05-2012
20120140200IMMERSION PHOTOLITHOGRAPHY SYSTEM AND METHOD USING MICROCHANNEL NOZZLES - A liquid immersion photolithography system includes an exposure system that exposes a substrate with electromagnetic radiation and includes a projection optical system that focuses the electromagnetic radiation on the substrate. A liquid supply system provides liquid flow between the projection optical system and the substrate. An optional plurality of micronozzles are arranged around the periphery of one side of the projection optical system so as to provide a substantially uniform velocity distribution of the liquid flow in an area where the substrate is being exposed.06-07-2012
20120140198Patterning Device Support - In a lithographic apparatus, slippage of a patterning device is substantially eliminated during movement of a patterning device stage by providing a magnetostrictive actuator to apply an accelerating force to the patterning device to compensate for forces that would otherwise tend to cause slippage when the patterning device stage moves,06-07-2012
20120120380LOW AND HIGH PRESSURE PROXIMITY SENSORS - A fluid proximity sensor for surface measurements having a measurement chamber (05-17-2012
20120092640Shared Compliance in a Rapid Exchange Device for Reticles, and Reticle Stage - Provided is a method to load a patterning device (04-19-2012
20120087058Image-Compensating Addressable Electrostatic Chuck System - Systems and methods are provided for utilizing an image-compensating addressable electrostatic chuck to correct for imaging errors of a lithographic system. An image-compensating addressable electrostatic chuck comprises a substrate, a plurality of first electrodes, a plurality of second electrodes, and a support layer. The plurality of first electrodes are disposed on the substrate and spaced evenly in a first direction. The plurality of second electrodes are disposed on the substrate and spaced evenly in a second direction, the second direction being generally orthogonal to the first direction. The support layer is disposed above the pluralities of electrodes to support an object. Positionally overlapping portions of the plurality of first and second electrodes form a matrix of electrostatic force points, such that a non-uniform electrostatic force acts on the object in proximity of a given force point upon energizing a pair of the plurality of first and second electrodes associated with the given force point.04-12-2012
20120086800Surface Inspection System with Advanced Illumination - Disclosed are apparatuses, methods, and lithographic systems for surface (e.g., mask) inspection. A surface inspection system can include a plurality of illumination sources, an optical system, and an image sensor. The plurality of illumination sources can be a standalone illumination system or integrated into the lithographic system, where the plurality of illumination sources can be configured to illuminate radiation onto a target portion of a surface. The optical system can be configured to receive at least a portion of reflected radiation from the target portion of the surface. Further, the image sensor can be configured to detect an aerial image corresponding to the portion of the reflected radiation. The surface inspection system can also include an analysis device configured to analyze the aerial image for defects.04-12-2012
20120081684Object Inspection Systems and Methods - Disclosed are systems and methods for object inspection, in particular for inspection of reticles used in a lithography process. The method includes interferometrically combining a reference radiation beam with a probe radiation beam, and storing their complex field images. The complex field image of one object is then compared with that of a reference object to determine the differences. The systems and methods have particular utility in the inspection of a reticle for defects.04-05-2012
20120026607High Numerical Aperture Catadioptric Objectives without Obscuration and Applications Thereof - Disclosed are high numerical (NA) catadioptric objectives without a central obscuration, and applications thereof. Such objectives can operate through a wide spectral bandwidth of radiation, including deep ultraviolet (DUV) radiation. Importantly, refractive elements in the catadioptric objectives can be manufactured from a single type of material (such as, for example, CaF02-02-2012
20120026474Reticle Cooling in a Lithographic Apparatus - An apparatus and method reduce temperature variation across a reticle so as to reduce the expansion variation of the reticle. One method for realizing reduced temperature variation is to fill an inner space with backfill gas under pressure, using distribution trenches and walls (e.g., flow restriction dams), rather than providing uniform backfill gas pressure across the entire reticle. In another method, the perimeter of inner space can be chosen to reduce the expansion variation across the reticle based on the functional relationship between expansion and temperature for the reticle material. In an optional or alternative approach, reduced temperature variation across the reticle can be obtained by selectively filling cavities in the interior of the fluid cooled chuck with backfill gas.02-02-2012
20120013866LITHOGRAPHIC APPARATUS, FLUID COMBINING UNIT AND DEVICE MANUFACTURING METHOD - A system for tuning the refractive index of immersion liquid in an immersion lithographic apparatus is disclosed. Two or more immersion liquids of different refractive index are mixed together in order to achieve a desired refractive index. Further, the fluids may be conditioned and treated to maintain optical characteristics.01-19-2012
20120002187RETICLE CLAMPING SYSTEM - A support structure for positioning an exchangeable object (e.g., patterning device) in a lithographic apparatus. The support structure has a chuck and at least two clamp mechanisms spaced from one another in a first direction. Each clamp mechanism has a plurality of vacuum sections to support the object and apply a localized clamping force to the object to hold the object. The separation between the vacuum sections is in a second direction different from the first direction. The support structure may have a chuck and a clamp mechanism having a plurality of clamp sections to support the object and apply a clamping force to the object. The sections may move relative to each other. Each section may include a channel to communicate a low pressure to hold the object. The stiffness of the clamp mechanism(s) reduces and/or avoids stress and/or slip at the interface of the chuck/clamp and object.01-05-2012
20110317138LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic apparatus is provided in which exposure is carried out by projecting through an aqueous solution of alkali metal halide(s), the solution being in contact with the substrate to be exposed.12-29-2011
20110310393CATADIOPTRIC ILLUMINATION SYSTEM FOR METROLOGY - A catadioptric optical system operates in a wide spectral range. In an embodiment, the catadioptric optical system includes a first reflective surface positioned and configured to reflect radiation; a second reflective surface positioned and configured to reflect radiation reflected from the first reflective surface as a collimated beam, the second reflective surface having an aperture to allow transmission of radiation through the second reflective surface; and a channel structure extending from the aperture toward the first reflective surface and having an outlet, between the first reflective surface and the second reflective surface, to supply radiation to the first reflective surface.12-22-2011
20110310367LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.12-22-2011
20110279805OPTICAL SYSTEM, INSPECTION SYSTEM AND MANUFACTURING METHOD - Systems and methods for inspection are provided utilizing a wide angle optical system. The optical system includes a wide angle input lens group and an output lens group. The wide angle input lens group is configured to receive wide-angle radiation, e.g., having an angular spread of 60 degrees or more, from an object surface, and produce imageable radiation. The wide angle input lens group is arranged such that no intermediate focused image is formed within or after the wide angle input lens group. The output lens group is configured to receive the imageable radiation from the wide angle input lens group and focus the imageable radiation onto an image plane to image at least part of the object surface. A detector receives the image of the at least part of the object surface and, based on the received image, detects, for example, contamination on the object surface.11-17-2011
20110273687LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - In a solid immersion lithography apparatus, the final element of the projection system is maintained at a distance of less than about 50 nm from the substrate by an actuator system. The final element may be formed as two parts, with a fluid, e.g. a liquid, confined between them. The actuator system may be controlled relative to a reference frame, which may be supported by a bearing. Backscatter detection can be used to determine if the distance between the final element and the substrate is too large. A cleaning device can clean the substrate between exposures.11-10-2011
20110273680IMMERSION PHOTOLITHOGRAPHY SYSTEM AND METHOD USING MICROCHANNEL NOZZLES - A liquid immersion photolithography system includes an exposure system that exposes a substrate with electromagnetic radiation and includes a projection optical system that focuses the electromagnetic radiation on the substrate. A liquid supply system provides liquid flow between the projection optical system and the substrate. An optional plurality of micronozzles are arranged around the periphery of one side of the projection optical system so as to provide a substantially uniform velocity distribution of the liquid flow in an area where the substrate is being exposed.11-10-2011
20110273676IMMERSION PHOTOLITHOGRAPHY SYSTEM AND METHOD USING MICROCHANNEL NOZZLES - A liquid immersion photolithography system includes an exposure system that exposes a substrate with electromagnetic radiation and includes a projection optical system that focuses the electromagnetic radiation on the substrate. A liquid supply system provides liquid flow between the projection optical system and the substrate. An optional plurality of micronozzles are arranged around the periphery of one side of the projection optical system so as to provide a substantially uniform velocity distribution of the liquid flow in an area where the substrate is being exposed.11-10-2011
20110273675LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.11-10-2011
20110267590Dual Containment System for Transporting a Fluid Through a "Rolling Loop" Cable Duct - Disclosed are systems and methods for a fluid transportation system having a first flexible tube with an inner wall. The fluid transportation system also has a second flexible tube with an outer wall. The second tube is located inside the first tube and a standoff is located between the inner wall of the first tube and the outer wall of the second tube. The first flexible tube is configured to transport a first fluid and the second flexible tube is configured to transport a second fluid. The first and second flexible tubes are configured such that the first fluid isolates the second fluid from an ambient environment, and the first fluid can be monitored for leakage.11-03-2011
20110261335SYSTEMS AND METHODS FOR THERMALLY-INDUCED ABERRATION CORRECTION IN IMMERSION LITHOGRAPHY - Immersion lithography aberration control systems and methods that compensate for a heating effect of exposure energy in an immersion fluid across an exposure zone are provided. An aberration control system includes actuators that adjust optical elements within the immersion lithography system and a fluid heating compensation module coupled to the actuators. The fluid heating adjustment module determines actuator commands to make aberration adjustments to optical elements within the immersion lithography system based on changes in one or more of a flow rate of the immersion liquid, an exposure dose and a reticle pattern image. In an embodiment, the aberration control system includes an interferometric sensor that pre-calibrates aberrations based on changes in operating characteristics related to the immersion fluid. Methods are provided that calibrate aberrations, determine actuator adjustments and implement actuator adjustments upon changes in operating characteristics to control aberration effects.10-27-2011
20110255173Pulse Modifier with Adjustable Etendue - A beam modifying unit increases both temporal pulse length and Etendue of an illumination beam. The pulse modifying unit receives an input pulse of radiation and emits one or more corresponding output pulses of radiation. A beam splitter divides the incoming pulse into a first and a second pulse portion, and directs the first pulse portion along a second optical path and the second portion along a first optical path as a portion of an output beam. The second optical path includes a divergence optical element. A first and a second mirror, each with a radius of curvature, are disposed facing each other with a predetermined separation, and receive the second pulse portion to redirect the second portion, such that the optical path of the second portion through the pulse modifier is longer than that of the first portion, and the separation is less than radius of curvature.10-20-2011
20110228239LITHOGRAPHIC APPARATUS, AN ILLUMINATION SYSTEM, A PROJECTION SYSTEM AND A METHOD OF MANUFACTURING A DEVICE USING A LITHOGRAPHIC APPARATUS - A gas curtain is provided to separate a component of a lithographic apparatus from contaminated gas. The gas curtain is supplied by an opening. The opening is at a boundary of a protection environment with which a surface of the component comes into contact. The gas curtain may separate the component from a moving part of the apparatus.09-22-2011
20110194094LITHOGRAPHIC APPARATUS WITH SUPPORT FOR AN OBJECT AND METHOD FOR POSITIONING SAME - A support structure for positioning an exchangeable object in a lithographic apparatus. The support structure has a chuck to support and clamp the object and an actuating structure. The actuating structure may have a first actuating structure (e.g., spring) and a second actuating structure (e.g., linear actuator). The first actuating structure is moveable relative to the chuck and is configured to move the second actuating structure between a first position in contact with a side of the object and a second position out of contact with the side of the object. The second actuating structure is configured to move at least a portion thereof relative to the first actuating structure between a first position in contact with the side of the object and a second position out of contact with the side of the object and to apply a pushing force to the side of the object.08-11-2011
20110149263Method for Controlling the Position of a Movable Object, a Control System for Controlling a Positioning Device, and a Lithographic Apparatus - A control system controls a positioning device displaceable in at least one degree of freedom by a reluctance motor. A force sensing element and a controller adjust force applied by the motor responsive to a force sensing element configured to sense force applied by the motor. The controller receives a signal representing force applied by the motor from the force sensing element, obtain an acceleration trajectory plan associated with a velocity trajectory plan for the positioning device, obtain a force trajectory plan associated with the acceleration trajectory plan, compare the force applied with a required amount of force obtained from the force trajectory, and adjust the amount of force applied by the motor based on the comparison. Related methods are also presented.06-23-2011
20110134402LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic apparatus is provided in which exposure is carried out by projecting through an aqueous solution of alkali metal halide(s), the solution being in contact with the substrate to be exposed.06-09-2011
20110122380IMMERSION PHOTOLITHOGRAPHY SYSTEM AND METHOD USING INVERTED WAFER-PROJECTION OPTICS INTERFACE - A liquid immersion photolithography system includes an exposure system that exposes a substrate with electromagnetic radiation, and also includes an optical system that images the electromagnetic radiation on the substrate. A liquid is between the optical system and the substrate. The projection optical system is positioned below the substrate.05-26-2011
20110109891Apparatus for Supporting and Optical Element, and Method of Making Same - An apparatus for supporting an optical element is provided. The apparatus includes a lens cell (05-12-2011
20110085726Tunable Wavelength Illumination System - A lithographic apparatus has an alignment system including a radiation source configured to convert narrow-band radiation into continuous, flat and broad-band radiation. An acoustically tunable narrow pass-band filter filters the broad-band radiation into narrow-band linearly polarized radiation. The narrow-band radiation may be focused on alignment targets of a wafer so as to enable alignment of the wafer. In an embodiment, the filter is configured to modulate an intensity and wavelength of radiation produced by the radiation source and to have multiple simultaneous pass-bands. The radiation source generates radiation that has high spatial coherence and low temporal coherence.04-14-2011
20110080572Anti-Reflective Coating for Optical Elements - An optical element including an anti-reflective coating is provided. The optical element includes a silicon substrate and a reflective layer disposed onto a first portion of the surface of the silicon substrate. An anti-reflective layer is disposed onto a second portion of the surface of the silicon substrate such that destructive interference at the anti-reflective layer substantially reduces any reflection of radiation incident on the anti-reflective layer.04-07-2011
20110075236Method Utilizing an Electrooptic Modulator - A method utilizes a dynamically controllable optical element that receives an electrical field, which changes an index of refraction in at least one direction within the optical element. The change in index of refraction imparts a change to a beam of radiation passing through the optical element. The electric field is controlled by a feedback/control signal from a feedback system that includes a detector positioned proximate an image plane in the system. The optical element can be positioned in various places within the system depending on what light characteristics need to be adjusted, for example after an illumination system or after a light patterning system. In this manner, the optical element, under control of the dynamic electric field, can dynamically change its propagation characteristics to dynamically change either a beam of illumination from the illumination system or a patterned beam of radiation from the patterning system, such that they exhibit desired light characteristics.03-31-2011
20110032505Robot For In-Vacuum Use - A robot positions a workpiece within a vacuum chamber of a lithographic apparatus. A first component of the robot is located within a vacuum chamber to position a workpiece along a translational axis. A shaft supports the first component such that an axis of symmetry of the shaft is perpendicular to the translational axis, and a second component rotates the shaft about the axis of symmetry and moves the shaft in a direction parallel to the axis of symmetry. The second component includes a gas bearing configured to introduce gas along a circumferential surface of the shaft and a scavenging seal configured to evacuate the gas introduced by the second component gas bearing. The robot substantially reduces, or eliminates the out-gassing of hydrocarbon molecules in a range from about 0 to 200 a.m.u., thus rendering the robot suitable for use in extreme ultra-violet (EUV) photolithography applications.02-10-2011
20110020104RAPID EXCHANGE DEVICE FOR LITHOGRAPHY RETICLES - Provided is a method and apparatus for moving and exchanging reticles within a vacuum lithographic system with minimum particle generation and outgassing. In an example of the method, a first arm of a rotational exchange device (RED) receives a first baseplate holding a first reticle. A second arm of the RED supports and buffers a second baseplate. The first and second baseplates are located substantially equidistant from an axis of rotation of the RED.01-27-2011
20110019173Diffraction Elements for Alignment Targets - A patterning device, including alignment targets having alignment features formed from a plurality of diffractive elements, each diffractive element including an absorber stack and a multi-layered reflector stack is provided. The diffractive elements are configured to enhance a pre-determined diffraction order used for pre-alignment and to diffract light in a pre-determined direction of a pre-alignment system when illuminated with light of a wavelength used for the pre-alignment. The diffractive elements may occupy at least half of an area of each alignment feature. The diffractive elements may be configured to enhance first or higher order diffractions, while substantially reducing zero01-27-2011
20110013164Shear-Layer Chuck for Lithographic Apparatus - A lithographic apparatus is described that comprises a support structure (01-20-2011
20110001955System and Method for Using a Two Part Cover and a Box for Protecting a Reticle - Systems and methods to protect a mask from being contaminated by airborne particles are described. The systems and methods include providing a reticle secured in a two-part cover. The two part cover includes a removable protection device used to protect the reticle from contaminants. The cover can be held inside a pod or box that can be used to transport the cover through a lithography system from an atmospheric section to a vacuum section. While in the vacuum section, the removable cover can be moved during an exposure process during which a pattern on the reticle can be formed on a wafer.01-06-2011
20100323171Apparatus and Method for Providing Resist Alignment Marks in a Double Patterning Lithographic Process - A method is described for alignment of a substrate during a double patterning process. A first resist layer containing at least one alignment mark is formed on the substrate. After the first resist layer is developed, a second resist layer is deposited over the first resist layer, leaving a planar top surface (i.e., without topography). By baking the second resist layer appropriately, a symmetric alignment mark is formed in the second resist layer with little or no offset error from the alignment mark in the first resist layer. The symmetry of the alignment mark formed in the second resist can be enhanced by appropriate adjustments of the respective thicknesses of the first and second resist layers, the coating process parameters, and the baking process parameters.12-23-2010
20100302525Lithographic Apparatus and Method for Illumination Uniformity Correction and Uniformity Drift Compensation - A lithographic apparatus including a uniformity correction system is disclosed. Fingers move into and out of intersection with a radiation beam to correct an intensity of the radiation beam. Actuating devices are coupled to the fingers. A width of a tip of each of the fingers is half that of a width of the actuating devices. Systems and methods compensate for uniformity drift. An illumination slit uniformity caused by system drift is measured. First positions of uniformity compensators are determined based on the uniformity. Uniformity compensators are moved to the first respective positions. A substrate is exposed.12-02-2010
20100302522Pulse Stretcher with Reduced Energy Density on Optical Components - A pulse stretcher includes a beam splitter configured to split an input light beam into first and second beams, a con-focal resonator including first and second con-focal mirrors, and a fold mirror. The beam splitter, con-focal resonator, and fold mirror are optically arranged such that at least a portion of the first beam is recombined with the second beam into a modified beam after an optical delay of the first beam caused by the optical arrangement. The apparatus further includes one or more optical elements in an optical path of the input light beam prior to the beam splitter such that a focal point of the first beam is foamed at a distance away from the fold mirror preventing energy density-related damage to the fold mirror. The apparatus can further include one or more additional optical elements to provide re-conditioning of the modified beam. A related method is also disclosed.12-02-2010
20100301458Alignment Target Contrast in a Lithographic Double Patterning Process - A system and method of manufacturing a semiconductor device lithographically and an article of manufacture involving a lithographic double patterning process having a dye added to either the first or second lithographic pattern are provided. The dye is used to detect the location of the first lithographic pattern and to directly align the second lithographic pattern to it. The day may be fluorescent, luminescent, absorbent, or reflective at a specified wavelength or a given wavelength band. The wavelength may correspond to the wavelength of an alignment beam. The dye allows for detection of the first lithographic pattern even when it is over coated with a radiation sensitive-layer (e.g., resist).12-02-2010
20100290017Folded Optical Encoder and Applications for Same - A system and method are used to determine a parameter (e.g., angle, position, orientation, etc.) of a device. A first portion includes a source of radiation configured to produce a beam of radiation that is directed to be reflected from a reflective portion of the device. A second portion is coupled to the first portion and includes a measurement device and, optionally, a detector, such that the reflected beam transmits through the measurement device onto the detector. The parameter of the device is determined based on the interaction of the reflected beam and the measurement device. In one example, the first and second portions can form a folded optical encoder that measures an angle of a scanning mirror or a position or orientation of a stage within a lithography apparatus.11-18-2010
20100271605Side Seal for Wet Lens Elements - A method for protecting a wet lens element from liquid degradation is provided. The method includes applying a thin coating of an organoxy-metallic compound to the side portions of a wet lens element to leave behind an optically inert, light absorbing metal oxide film. A liquid shield coating is applied on top of the metal oxide coating. The two coating layers protect the wet lens element from liquid degradation when the side portion of the wet lens element is submerged into a liquid. In an embodiment, the wet lens element is an immersion lithography wet lens element and the liquid is an immersion lithography liquid.10-28-2010
20100271604SYSTEM AND METHOD TO INCREASE SURFACE TENSION AND CONTACT ANGLE IN IMMERSION LITHOGRAPHY - A system and method to allow organic fluids to be used in immersion lithographic systems. This is done by providing a showerhead portion of a liquid supply system that is partially coated or made from a TEFLON like material. The TEFLON like material reduces wetness effect, and thus increases containment, when using an organic immersion fluid in a space between the last optic and the substrate.10-28-2010
20100259743Optical System for Increasing Illumination Efficiency of a Patterning Device - A lithography system can include a radiation source, an illumination system, a patterning device, and a projection system. The illumination system can be configured to process a beam of radiation to produce a plurality of beams of radiation. The illumination system can include a pupil defining element, a condenser lens, a field defining element, a first relay that includes first and second lens arrays, a plurality of rods, a diaphragm having transmission areas, and a second relay. The patterning device can be configured to pattern the plurality of beams of radiation. Further, the projection system can be configured to project the patterned beams onto a substrate.10-14-2010
20100242465Shock Absorbing Fluidic Actuator - A fluidic actuator and a control system for the fluidic actuator are described. A first component of the actuator may have two openings interconnected by a passageway. A second component may be moveably housed within the passageway and divide the passageway into two portions. A fluid delivery system may be connected to the two openings. The fluid delivery system may supply a first pressure of fluid to the first portion of the passageway causing the second component to move within the passageway at a first speed. When the second component is in a selected position within the passageway, the fluid delivery system may reduce the pressure of the fluid, causing a reduction in speed of the second component. The fluidic actuator may be used in a wafer processing system.09-30-2010
20100214544FLUID HANDLING DEVICE, AN IMMERSION LITHOGRAPHIC APPARATUS AND A DEVICE MANUFACTURING METHOD - A fluid handling device for an immersion lithographic apparatus, the fluid handling device comprising: at least one body with a surface facing a space for fluid; a plurality of openings for the flow of fluid therethrough defined in the surface; at least one barrier moveable relative to the plurality of openings for selectively allowing or preventing the flow of fluid through selected openings of the plurality of openings.08-26-2010
20100195081Reticle Support that Reduces Reticle Slippage - A system and method substantially eliminate reticle slip during the movement of a reticle stage. The system includes a mask holding system, a mask force device, and a support transport device. The mask holding system includes a support device and a holding device where the holding device releasably couples a mask, e.g., a patterning device such as a reticle having a pattern, to the support device. The mask force device is releasably connected to the mask in order to provide an accelerating force to the mask, such that a projection optic in a lithographic apparatus may accurately project a pattern imparted by the patterning device onto a target portion of the substrate by using a radiation beam. The support transport device is coupled to and moves the mask support device concurrently with the mask force device.08-05-2010
20100167189Optically Compensated Unidirectional Reticle Bender - Patterning provided by a lithographic apparatus is optically corrected for focus errors that would result from a topology of a substrate being patterned. Focus control is provided in a cross-scan direction by bending a reticle about a scan axis based on a mapped topology of the substrate. The bending can be updated from field to field as the reticle is scanned. The bending may be unidirectional (e.g., down only), but an optical compensation element (e.g., a lens or mirror polished to a cylindrical shape or a transparent plate or mirror bent by a force actuator to a cylindrical shape) can be included in order to introduce either positive or negative curvature (or no curvature) to the beam wavefront, thereby simplifying the mechatronics of the bender.07-01-2010
20100165311Linear Motor Magnetic Shield Apparatus - A magnetic shield having non-magnetic gaps provides reduced magnetic cross-talk for a linear motor array in a precision positioning system. Redirecting the leakage flux limits the cross-talk and associated deleterious effects. Such preferred magnetic circuit paths for the leakage are affixed to the moving magnet system of the linear motor. Embodiments of the preferred flux leakage paths are realized by providing a ferromagnetic shield separated by a non-magnetic gap between the permanent magnets and the back-irons. In another embodiment, the ferromagnetic shield separation includes diamagnetic materials.07-01-2010
20100165310EUV Mask Inspection - A system for inspecting an extreme ultra violet (EUV) mask. The system includes an array of sensors and an optical system. The array of sensors is configured to produce analog data corresponding to received optical energy. The optical system is configured to direct EUV light from an inspection area of an EUV patterning device onto the array of sensors, whereby the analog data is used to determine defects or to compensate for irregularities found on the EUV mask.07-01-2010
20100163757Pulse Modifier with Adjustable Etendue - A beam modifying unit increases both temporal pulse length and Etendue of an illumination beam. The pulse modifying unit receives an input pulse of radiation and emits one or more corresponding output pulses of radiation. A beam splitter divides the incoming pulse into a first and a second pulse portion, and directs the first pulse portion along a second optical path and the second portion along a first optical path as a portion of an output beam. The second optical path includes a divergence optical element. A first and a second mirror, each with a radius of curvature, are disposed facing each other with a predetermined separation, and receive the second pulse portion to redirect the second portion, such that the optical path of the second portion through the pulse modifier is longer than that of the first portion, and the separation is less than radius of curvature.07-01-2010
20100149548Reticle Inspection Systems and Method - A method and systems for reticle inspection. The method includes coherently illuminating surfaces of an inspection reticle and a reference reticle, applying a Fourier transform to scattered light from the illuminated surfaces, shifting the phase of the transformed light from the reference reticle such that a phase difference between the transformed light from the inspection reticle and the transformed light from the reference reticle is 180 degrees, combining the transformed light as an image subtraction, applying an inverse Fourier transform to the combined light, and detecting the combined light at a detector. An optical path length difference between two optical paths from the illumination source to the detector is less than a coherence length of the illumination source. The image detected by the detector represents a difference in amplitude and phase distributions of the reticles allowing foreign particles, defects, or the like, to be easily distinguished.06-17-2010
20100149514LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.06-17-2010
20100149505EUV Mask Inspection System - Disclosed are apparatuses, methods, and lithographic systems for EUV mask inspection. An EUV mask inspection system can include an EUV illumination source, an optical system, and an image sensor. The EUV illumination source can be a standalone illumination system or integrated into the lithographic system, where the EUV illumination source can be configured to illuminate an EUV radiation beam onto a target portion of a mask. The optical system can be configured to receive at least a portion of a reflected EUV radiation beam from the target portion of the mask. Further, the image sensor can be configured to detect an aerial image corresponding to the portion of the reflected EUV radiation beam. The EUV mask inspection system can also include a data analysis device configured to analyze the aerial image for mask defects.06-17-2010
20100128242Bonding Silicon Silicon Carbide to Glass Ceramics - A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.05-27-2010
20100110399Reverse Flow Gas Gauge Proximity Sensor - A gas gauge proximity sensor supplying gas in a reverse flow direction from the injection chamber to the measurement chamber. Supplying gas in a reverse flow direction enables the transient behavior in the sensor to more rapidly stabilize, with a resulting increase in bandwidth. Optionally, a scavenger chamber can be used to remove the excess gas by locating a scavenger aperture of the scavenger chamber in close proximity to the exit aperture of the injection chamber. A bridge proximity sensor can be used with a reference chamber to receive gas flow from a location close to the exit aperture of the injection chamber in order to reduce common mode errors.05-06-2010
20100103399Fluid Assisted Gas Gauge Proximity Sensor - A fluid assisted gas gauge coupled to a pressure sensor enables proximity measurements to be made with a high bandwidth. A two-chamber gas gauge, containing a gas-filled measurement chamber and a fluid-filled transfer chamber and a diaphragm separating the two chambers, exhausts gas onto the surface being measured, while the incompressible fluid transmits the pressure to a pressure sensor. By minimizing the gas volume of the gas gauge, the response time is enhanced. In addition, the incompressible fluid permits the pressure sensor to be remotely located from the point of measurement without sacrificing the response time performance. In an embodiment, a differential bridge version of the fluid assisted gas gauge reduces common mode effects.04-29-2010
20100079748Inspection Apparatus, Lithographic Apparatus and Method for Sphero-Chromatic Aberration Correction - A semiconductor inspection system and method are described. The system includes an illumination system transmitting light at a given wavelength and an optical system receiving light from the illumination system and transmit light at the given wavelength to a surface. The optical system includes at least one lens that is moveable (for example, a zoomable lens) to change the nominal wavelength of the semiconductor inspection system to correspond to the illumination wavelength of the illumination system so that the sphero-chromatic aberration of the semiconductor inspection system meets a user-defined tolerance.04-01-2010
20100053574Liquid Immersion Lithography System Comprising a Tilted Showerhead Relative to a Substrate - A liquid immersion lithography system includes projection optics (PL) and a showerhead (03-04-2010
20100046092Catadioptric Optical System for Scatterometry - A catadioptric system is provided comprising a correcting plate and an optical system. The correcting plate is configured to condition electromagnetic radiation to correct at least one aberration. The optical system is configured to reflect a first portion of the conditioned electromagnetic radiation, to refract a second portion of the conditioned electromagnetic radiation, and to focus the reflected first portion of the conditioned electromagnetic radiation onto a target portion of a substrate. The first portion of the electromagnetic radiation is not refracted by an optical element, allowing the catadioptric optical system to operate in a broad spectral range.02-25-2010
20100045955Particle Detection on an Object Surface - Systems and methods are provided for inspecting an object surface. An illumination source illuminates the object surface. An optic intercepts scattered light from the illuminated object surface and projects a real image of an area of the object surface. A sensor receives the projected real image. A computer system, coupled to the sensor, stores and analyzes the real image. The real image is processed to detect particles located on the object surface. This arrangement is particularly useful for detecting contaminants or defects on a reticle of a lithography device.02-25-2010
20100033698Full Wafer Width Scanning Using Steps and Scan System - A system and method are provided for writing a pattern onto a substrate. A patterned beam of radiation is produced using a reticle and projected onto a substrate to expose the pattern. Reticle and substrate speeds are controlled such that respective scanning speeds of the reticle and the substrate allow the pattern to be exposed across an entire width of the substrate in the scanning direction, which provides a substantial increase in wafer throughput.02-11-2010
20100026976Actuator System Using Multiple Piezoelectric Actuators - A positioning system adjusts a position of an optical element within an optical device, such as a variable-zoom lens system. A frame supports the optical element, and an elongated surface of each of one or more elongated support structures supports the frame. The frame also supports one or more piezoelectric actuators that, respectively, engage one of the elongated support structures. A controller supplies a control signal to activate each of the one or more actuator modules. Upon activation, a piezoelectric element of each of the activated actuator modules applies a combination of a first force and a second force to an elongated surface of the respective elongated support structures to position the frame along the elongated surface. The combination of forces applied by the piezoelectric element advances the piezoelectric actuator module along the elongated support structure.02-04-2010
20100026974Cooling of Actuator Coils - In order to effectively transfer heat from inner layers of an actuator coil to an area external to the coil, heat transfer elements, located proximate to the actuator coil, can be used. In an embodiment, a heat transfer apparatus for the actuator coil can include one or more heat transfer elements located proximate to one or more layers or one or more windings of the actuator coil and a cooling surface located proximate to the one or more heat transfer elements and to the actuator coil. In this configuration, the heat transfer apparatus can transfer heat from inner layers of the actuator coil to the cooling surface, which in turn transfers the heat to an area external to the actuator coil.02-04-2010
20100002221Systems and Methods for Minimizing Scattered Light in Multi-SLM Maskless Lithography - A lithography method is provided. The method includes generating a beam of radiation, patterning portions of the beam of radiation, projecting the patterned beam of radiation towards a substrate, and blocking scattered light from the beam of radiation from the substrate.01-07-2010
20090325087Parallel Process Focus Compensation - Disclosed are systems, methods, and computer program products for parallel process focus compensation. Such methods may include three steps. First, a first sensor senses a top surface of a wafer to provide first-sensor data which defines a first topographic map of the first surface of the wafer. The first sensor may be, for example, an air gauge. Second, a second sensor senses the top surface of the wafer in parallel with the first sensor to provide second-sensor data which defines a second topographic map of the first surface of the wafer. The second sensor may be, for example, an optical sensor or a capacitance sensor. Third, a calibration module calibrates focus-positioning parameters of an exposure system based on the first- and second-sensor data. The calibration module may be embodied in hardware, software, firmware, or a combination thereof.12-31-2009
20090310111Pulse to Pulse Energy Equalization of Light Beam Intensity - A system for equalizing pulse to pulse energy of a light beam includes a group of optical devices including an optical device configured to exhibit third order nonlinear properties. Transmission properties of an unequalized light beam passing through the group of optical devices change such that an output intensity of a resulting light beam output from the optical devices is equalized. One example configuration includes a beam splitter, a nonlinear interference filter, a mirror and a beam combiner. A first portion of the light beam that is reflected from the nonlinear interference filter is combined with the light beam such that a resulting combined light beam has equalized output intensity. Another example includes at least first and second prisms having third order nonlinear properties and configured as a beam steering system. A lithography system and a method of equalizing pulse to pulse energy in a light beam are also presented.12-17-2009
20090303455LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A porous member is used in a liquid removal system of an immersion lithographic projection apparatus to smooth uneven flows. A pressure differential across the porous member may be maintained at below the bubble point of the porous member so that a single-phase liquid flow is obtained. Alternatively, the porous member may be used to reduce unevenness in a two-phase flow.12-10-2009
20090303450Particle Detection on Patterning Devices with Arbitrary Patterns - A detection system for detecting particle contamination in a lithographic apparatus includes an illumination system that directs a radiation beam onto a section of a surface of a patterning device to generate at least first and second components of patterned radiation. A first detector is configured to detect the first component. A filter is configured to adaptively change the second component based on the detected first component, and a second detector is configured to detect the filtered second component. An imaging device generates an image corresponding to the detected second filtered component, and the image indicates an approximate location of a particle on the surface of the patterning device.12-10-2009
20090259337Robot Position Calibration Tool (RPCT) - A Robot Position Calibration Tool (RPCT) is used to accurately calibrate a robot position for a reticle hand-off to a transfer station in a lithography tool with minimized particle generation and outgassing. Method(s), system(s) and computer program product(s) are described to calibrate the robot with minimal sensor usage and minimal slippage of a payload leading to minimized particle generation and outgassing inside a vacuum chamber of a lithography tool.10-15-2009
20090257053High Numerical Aperture Catadioptric Objectives Without Obscuration and Applications Thereof - Disclosed are high numerical (NA) catadioptric objectives without a central obscuration, and applications thereof. Such objectives can operate through a wide spectral bandwidth of radiation, including deep ultraviolet (DUV) radiation. Importantly, refractive elements in the catadioptric objectives can be manufactured from a single type of material (such as, for example, CaF10-15-2009
20090257044LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic apparatus and method for simultaneously exposing two patterning devices onto a substrate is disclosed. In an embodiment, a lithographic apparatus includes a plurality of illumination systems for receiving and conditioning a pulsed radiation beam, a beam director arranged between a source of the pulsed radiation and the illumination systems for alternately directing pulses of the radiation beam to the respective illumination systems, a support table for holding a plurality of patterning devices, each of the patterning devices being capable of imparting a respective conditioned radiation beam with a pattern in its cross-section to form a plurality of patterned radiation beams, and a projection system configured to project each of the plurality of patterned radiation beams coincidentally onto a target portion of a substrate. In an embodiment, the substrate is covered with a phase change material.10-15-2009
20090251786Optical System for Transforming Numerical Aperture - A system is provided to form illumination light beams having desirable divergence and directivity. For instance, the system can include an optical element and a relay. The optical element can include a pupil defining element. Further, the relay can have a first and second lens array arranged in series and configured to receive the plurality of beams and to re-image the plurality of beams into a corresponding plurality of beams in an image plane. Each of the plurality of corresponding beams can have a numerical aperture less than a numerical aperture of each of the plurality of beams.10-08-2009
20090213343RE-FLOW AND BUFFER SYSTEM FOR IMMERSION LITHOGRAPHY - A system is disclosed to isolate an environmental chamber of an immersion lithographic apparatus, to which an immersion fluid comprising liquid, is provided from an external environment. Further, there is disclosed a system for measuring flow rate and/or vapor concentration of a gas using a transducer to send and/or receive an acoustic signal.08-27-2009
20090207399Lithographic method - A method of calibrating a front to backside alignment capable lithographic apparatus. The method includes attaching a substrate having a plurality of alignment marks to a carrier, the substrate being arranged such that the alignment marks face towards the carrier; reducing the thickness of the substrate; using an alignment system of the apparatus to measure the positions of images of alignment marks formed by optics in a substrate table of the apparatus; projecting a pattern onto the substrate, the position of the pattern being determined according to the measured positions of the alignment marks; measuring the positions of the projected pattern and the alignment marks provided on the opposite side of the substrate, the position of the alignment marks provided on the opposite side of the substrate being measured by the alignment system directing radiation through the substrate; and comparing the measured positions in order to determine an overlay error.08-20-2009
20090201505Tunable Alignment Geometry - An alignment target with geometry designs provides a desired alignment offset for processes (both symmetric and asymmetric) on a wafer substrate. The alignment target includes one or more sub-targets, where each sub-target is defined as having a left portion and a right portion having a different geometric pattern, and where the left portion has a geometry density and the right portion has a geometry density.08-13-2009
20090190106IMMERSION LITHOGRAPHY APPARATUS - An immersion lithographic apparatus is disclosed having a projection system, a liquid supply system, and a recycling system. The projection system is configured to project a patterned radiation beam onto a target portion of a substrate, wherein a substrate table is configured to support the substrate. The liquid supply system is configured to provide an immersion liquid to a space between the projection system and the substrate or the substrate table. The recycling system is configured to collect the immersion liquid from the liquid supply system and to supply the immersion liquid to the liquid supply system. The recycling system includes a fiber configured to remove organic contaminants from the immersion liquid.07-30-2009
20090185149IMMERSION LITHOGRAPHIC APPARATUS WITH IMMERSION FLUID RE-CIRCULATING SYSTEM - A lithographic apparatus includes a projection system, a fluid handling structure, a metrology device, and a recycling control device. The projection system is configured to project a patterned radiation beam onto a target portion of a substrate, the substrate being supported on a substrate table. The fluid handling structure is configured to provide an immersion fluid to a space between the projection system and the substrate and/or substrate table. The metrology device is configured to monitor a parameter of the immersion fluid. The recycling control device regulates a routing of the immersion fluid either to be reused by the fluid handling structure or to be reconditioned based on the quality of immersion fluid indicated by the metrology device.07-23-2009
20090161093Systems and Methods for Lithographic Illuminator Beam Deviation Measurement and Calibration Using Grating Sensors - Angular deviation of illumination beam is measured with high accuracy for an expanded continuous range of angles using grating sensors that are configured to exhibit Surface Plasmon Resonance effects at actinic wavelengths. The beam deviation measurement systems and procedures are applicable to both mask-based and maskless lithography tools. A control system adopts an appropriate calibration algorithm based on whether the SPR effect is detected or not. Relative intensity shift in an SPR-affected diffractive order, and/or relative position and slope change in non-SPR-affected diffractive orders are used as a basis of the adopted calibration algorithm.06-25-2009
20090161088Beam Characterization Monitor for Sensing Pointing or Angle of an Optical Beam - The divergence of an optical beam is determined. An optic is configured to provide internal reflection of at least a part of a beam of radiation scanned over varying angles of incidence on the optic. The optic has a film configured to provide a surface plasmon resonance (SPR) effect. A detector is arranged relative to the optic and configured to electronically detect radiation reflected from the optic. The divergence angle of the beam of radiation is calculated based on a change in reflectance relative to angle of incidence.06-25-2009
20090154311Pre-Filter For A Servo Control Loop, And Applications Thereof - A method, system and computer program product to control position of an error control module in a lithography apparatus using a servo control loop is described herein. The system comprises a filter, a servo controller coupled to the filter and configured to receive a control signal and an actuator coupled to the servo controller and configured to control the position of the error control module. The filter is configured to filter the control signal by modulating the amplitude and phase of the control signal in a desired frequency range, prior to the servo control loop.06-18-2009
20090153954Off-Axis Catadioptric Projection Optical System for Lithography - The present invention is directed to off-axis catadioptric projection optical systems for use in lithography tools for processing modulated light used to form an image on a substrate, such as a semiconductor wafer or flat panel display. In one embodiment the optical system includes an off-axis mirror segment, a fold mirror, a relay, an aperture stop and a refractive lens group. Modulated light is transmitted through the system to form an image on a substrate. In a second embodiment the projection system includes an off-axis mirror segment, an aperture stop and a refractive lens group. In a third embodiment the projection system includes an off-axis mirror segment, a negative refractive lens group, a concave mirror, a relay, an aperture stop, and a refractive lens group. A method to produce a device using a lithographic apparatus including a projection system with an off-axis mirror segment as the first element in a projection optics system is also provided.06-18-2009
20090153826Lithographic method and apparatus - A multiple patterning process employs a phase change material, portions of which can be converted to an amorphous state and then a remaining portion is selectively removed to provide high resolution pattern features with a feature spacing smaller than, for example, a minimum spacing available in a conventional patterning layer employing a single exposure. A lithographic apparatus for use in the process may comprise an exposure tool having a single illuminator and single patterning device that is imaged through a single exposure slit onto a scanning substrate. Alternatively, the exposure tool may have multiple illuminators and/or multiple scanning complementary patterning devices optionally used with multiple exposure slits on the scanning substrate to facilitate double patterning in a single substrate pass.06-18-2009
20090122289Thin Film Continuous Spatially Modulated Grey Attenuators and Filters - A system and method for use of a lithography apparatus having a substrate and an absorbing film formed on the substrate. A thickness of the absorbing film is spatially modulated across at least a part of the substrate to reduce a non-uniform intensity of a radiation beam transmitted through the substrate.05-14-2009
20090109412Lithographic apparatus and device manufacturing method - A lithographic apparatus comprises an immersion fluid system and an interferometric temperature detection system. The immersion fluid system is configured to provide immersion fluid to an exposure system. The interferometric temperature detection system is configured to measure a temperature of the immersion fluid.04-30-2009
20090109411Systems and Methods for Insitu Lens Cleaning Using Ozone in Immersion Lithography - An immersion lithography apparatus is provided that includes an energy source, a projection optical system, a stage, a showerhead including an immersion liquid supply device and an immersion liquid discharge device that produces a flow of liquid within an exposure zone, and a cleaning device that cleans a portion of the projection optical system having been contacted with the immersion liquid by means of a cleaning gas. In an embodiment, the cleaning device includes an ozone generation unit produces a flow of ozone into the exposure zone. In embodiments, the apparatus includes a stage that includes a dose sensor and/or an ultra-violet light source. A method for insitu cleaning of a final lens element within an immersion lithography system having an immersion fluid showerhead that provides immersion fluid to an exposure zone of the immersion lithography system is also provided.04-30-2009
20090100392Securing Authenticity of Integrated Circuit Chip - A system and method are provided for securely manufacturing a device at a foundry. For example, an integrated circuit chip may be securely fabricated at an untrusted foundry by later verifying authenticity of the integrated circuit chip based on a valid usage of an original source code file associated with a semiconductor manufacturing process of the integrated circuit chip. The integrated circuit chip may be authenticated by matching a first set of unique daughter codes generated during fabrication with a second set of unique daughter codes generated independently by some entity other than the foundry. In this way, a trusted electronics integrator may compare the first and second unique daughter codes to nondestructively determine whether the integrated circuit chip is a trusted device or a tampered device.04-16-2009
20090086184Controlling Fluctuations in Pointing, Positioning, Size or Divergence Errors of a Beam of Light for Optical Apparatus - A system and method are used for controlling fluctuations in one or more of a beam pointing error, a beam positioning error, a beam size error or a beam divergence error of a beam of light in a lithography system. An optical apparatus may comprise a first beam control module having a first optics in an optical axis for optically isolating a laser pulse from a light source associated with an illuminator to provide the beam of light. These beam related errors may be selectively stabilized by either homogenizing selectively the spatial field and/or angular information of a given illumination profile for the beam of light and symmetrizing other one of the spatial field or angular information which is not being homogenized based on a first arrangement of the first optics or homogenizing and symmetrizing both of the spatial field and angular information based on a second arrangement of the first optics.04-02-2009
20090086179Radiometric Kirk Test - Systems and methods for measuring stray light in a lithographic apparatus are described using Radiometric Kirk Test (also known as Scanning SAMOS Test). The Radiometric Kirk Test of the present invention involves a test pattern having an isolated dark area within a much larger bright field. The radiometric Kirk test includes at least two continuous or stepped scans of an aperture of a detector in an image plane of a lithographic system. During a dark area measurement, the aperture of the detector is positioned such that at least at one point the aperture of the detector is centered within an image of the dark area. During a bright area measurement, the aperture of the detector is positioned within the image of the bright field. The integrated detector signal is correspondingly computed for the dark area measurement and the bright area measurement. The ratio of the integrated dark area measurement result and integrated bright area measurement result is a measure of stray light present in the lithographic apparatus.04-02-2009
20090046373Illumination System with Low Telecentricity Error and Dynamic Telecentricity Correction - An illuminator with substantially reduced telecentricity error relative to conventional illuminators includes one or more modules having movable optical elements with low telecentricity error that may be adjusted to compensate for telecentricity errors. The modules may include a zoom zoom axicon, a condenser, and a multi field relay. The zoom zoom axicon may include one or more lenses adjustable in up to six degrees of freedom. The condenser and the multi field relay may include one or more lenses adjustable in up to six degrees of freedom or a set of two or more mirrors with one or more of the mirrors adjustable in up to six degrees of freedom. The illuminator may also include a control system to control the adjustments of the movable optical elements. A lithography system including such an illuminator is also presented, along with a method of providing illumination with low telecentricity error.02-19-2009
20090046338Beam Positioning and Pointing - A beam pointing and positioning system includes a first lens, movable in a first plane perpendicular to a nominal optical axis, which receives and positions a light beam. The system also includes a second lens, movable in a second plane perpendicular to the nominal optical axis, which receives and points the positioned light beam. The system is thereby capable of directing the light beam to a desired location at a desired angle. The system may also include a beam splitter that receives, transmits, and reflects the pointed light beam, one or more sensors that receive the reflected light beam, and a controller coupled to the sensor(s) and first and second lenses. The controller may control the positioning of the first and second lenses based on beam position and pointing data and/or signals received from the sensor(s). A method of positioning and pointing a light beam is also presented.02-19-2009
20090046278Real Time Telecentricity Measurement - Systems and methods are provided for measuring and correcting for a given telecentricity in lithographic apparatus. A radiation beam is partitioned into a plurality of beams, each of which is modulated using an array of individually controllable elements and projected onto a portion of a substrate through a projection system. A set of alignment beams are transmitted simultaneously on paths similar to those traversed by the plurality of radiation beams, and a corresponding set of sensors respectively measures an angle and a position of the set of alignment beams proximate an entrance of the projection system. An assembly of telecentricity control mirrors (TCMs) adjusts appropriate ones of the plurality of radiations beams in response to the measurement to correct for induced any detected telecentricity.02-19-2009
20090033893Methods and Systems to Compensate for a Stitching Disturbance of a Printed Pattern in a Maskless Lithography System Not Utilizing Overlap of the Exposure Zones - A method and system are provided for forming a pattern within an area of a photosensitive surface. An exemplary method includes performing a first exposure of the photosensitive surface in accordance with predetermined image data, wherein the first exposure occurs during a first pass and produces a first image within the area. The image data is adjusted to compensate for identified image deficiencies image deficiencies, the image deficiencies being within a region of the first image. A second exposure, of the photosensitive surface, is performed in accordance with the adjusted image data during a second pass.02-05-2009
20090021845Catadioptric Optical System for Scatterometry - A catadioptric optical system having a high numerical aperture operates in a wide spectral range. The catadioptric optical system includes a correcting plate, a first reflective surface and a second reflective surface. The correcting plate conditions electromagnetic radiation to correct at least one aberration. The first reflective surface is positioned to reflect the electromagnetic radiation conditioned by the correcting plate. The second reflective surface is positioned to focus the electromagnetic radiation reflected by the first reflective surface onto a target portion of a substrate. The electromagnetic radiation reflected by the first reflective surface and focused by the second reflective surface is not refracted by a refractive element, thereby enabling the catadioptric optical system to operate in a broad spectral range.01-22-2009
20090021748Method and system for wavefront measurements of an optical system - A wavefront measurement system includes a source of electromagnetic radiation. An illumination system delivers the electromagnetic radiation to an object plane. A source of a diffraction pattern is in the object plane. A projection optical system projects the diffraction pattern onto an image plane, which includes a mechanism (e.g., a shearing grating) to introduce the lateral shear. A detector is located optically conjugate with the pupil of the projection optical system, and receives an instant fringe pattern, resulting from the interference between sheared wavefronts, from the image plane. The diffraction pattern is dynamically scanned across a pupil of the projection optical system, and the resulting time-integrated interferogram obtained from the detector is used to measure the wavefront aberration across the entire pupil.01-22-2009
20090015841Refractive Index Sensor Utilizing Gold Island Surface Plasmon Resonance on Optical Fiber - A system for measuring an index of refraction that has a light emitting diode and a plurality of reference fibers not in contact with a sample to be measured and that receive light from the light emitting diode. A plurality of sensing fibers with different-shaped plasmon sensors are in contact with the sample and receive light from the light emitting diode. Detectors sense an output of the light from the fibers. The sensing fibers can be arrayed in a planar arrangement, or in a bundle. A cylindrical lens can be used for directing light into the fibers. A plurality of light emitting diodes can be used, each directing its light output into a corresponding fiber. A ball lens can be used for directing the light into the reference fiber. A plurality of wavelength filters can be placed between the light emitting diode and the sensing fiber, and a wavelength of the light entering the fiber may be selected using the filters.01-15-2009
20090000354Method and System for Operating an Air Gauge at Programmable or Constant Standoff - Provided are a methods and systems for determining a topography of an object. In an embodiment, a system includes a reference probe configured to measure a surface of a reference surface and to generate a reference signal, a measuring probe configured to measure a surface of an object and to generate a measurement signal, a sensor configured to sense a position of the measuring probe and to generate a sensor signal, and a combiner configured to receive the sensor signal and the measurement signal and to generate a combination signal therefrom. A desired distance between the measuring probe and the object is substantially maintained by adjusting the position of the measuring probe based on the measurement signal. A topography of the object is determined based at least on a comparison of the reference signal and the combination signal.01-01-2009
20090000353Increasing Gas Gauge Pressure Sensitivity Using Nozzle-Face Surface Roughness - A gas gauge for sensing distance to an object includes a gas supply system and a nozzle that supplies the gas from the gas supply system to a space between the nozzle and the object. For example, the gas supply system supplies the gas with a flow rate that corresponds to a flow in a transitional region between laminar flow and turbulent flow. A surface of the nozzle may be roughened so as to increase a friction factor across the surface, which increases gas pressure drop and also a gain of the nozzle. Noise generated by the increased flow rate may be attenuated using one or more strategically placed Helmholtz attenuators and/or snubbers.01-01-2009
20080318066Optical Component Fabrication Using Coated Substrates - A method of fabricating or preparing an optical component, such as a mirror, using an amorphous oxide coated substrate is presented. An amorphous oxide coating is applied to an optical substrate. An assessment of surface roughness of the coated surface is performed. The coated surface is polished based on the assessment. Initial assessments can be conducted and polishing can be performed based on those initial assessments prior to applying the coating to better prepare the surface for the coating. Each assessment can assess the surface's Mid-Spatial Frequency Roughness (MSFR), High-Spatial Frequency Roughness (HSFR), or both. The performing of the assessments, polishing and/or coating can be computer-controlled. This process is ideal in the fabrication of an optical component formed from a substrate with a near-zero coefficient of thermal expansion. An optical component fabricated in this manner is also presented.12-25-2008
20080297747Lithographic Apparatus and Device Manufacturing Method - One or more patterning arrays are mounted to a mounting plate via height adjustment structures that enable the flatness of the active surfaces of the patterning arrays to be controlled. The height adjustment structures may comprise an array of piezoelectric actuators or screws. Alternatively, the backside of the patterning means may be polished to optical flatness and bonded by crystal bonding to an optically flat surface of a rigid mounting body.12-04-2008
20080291422Light Attenuating Filter for Correcting Field Dependent Ellipticity and Uniformity - Ellipticity in an illumination beam may be corrected by measuring an ellipticity of the illumination beam and substantially eliminating the ellipticity using a light attenuating filter at a defocus position of the illumination beam, wherein the light attenuating filter has a two-dimensional pattern that compensates for ellipticity variations in the illumination beam. The light attenuating filter may stand alone, or the filter may be combined with a uniformity correction system, such that it corrects both uniformity and ellipticity. In one embodiment, the light attenuating filter is printed with an assembly of microscopic dots according to the two-dimensional pattern.11-27-2008
20080285428System and Method for Forming Nanodisks Used in Imprint Lithography and Nanodisk and Memory Disk Formed Thereby - A system and method form a nanodisk that can be used to form isolated data bits on a memory disk. The imprint stamp is formed from first and second overlapping patterns, where the patterns are selectively etched. The selective etching leaves either pits or posts on the imprint stamp. The pits or posts are imprinted on the memory disk, leaving either pits or posts on the memory disk. The pits or posts on the memory disk are processed to form relatively small and dense isolated data bits. Instability of the isolated data bits caused by outside magnetic and thermal influences is substantially eliminated.11-20-2008
20080280539Optical component fabrication using amorphous oxide coated substrates - A method of fabricating or preparing an optical component, such as a mirror, using an amorphous oxide coated substrate is presented. An amorphous oxide coating is applied to an optical substrate. An assessment of surface roughness of the coated surface is performed. The coated surface is polished based on the assessment. Initial assessments can be conducted and polishing can be performed based on those initial assessments prior to applying the coating to better prepare the surface for the coating. Each assessment can assess the surface's Mid-Spatial Frequency Roughness (MSFR), High-Spatial Frequency Roughness (HSFR), or both. The performing of the assessments, polishing and/or coating can be computer-controlled. This process is ideal in the fabrication of an optical component formed from a substrate with a near-zero coefficient of thermal expansion. An optical component fabricated in this manner is also presented.11-13-2008
20080278813Ultraviolet Polarization Beam Splitter with Minimum Apodization - A beamsplitter includes a first fluoride prism and a second fluoride prism. A coating interface is between the first and second fluoride prisms, wherein an overall R(s)*T(p) function of the beamsplitter varies no more than ±2.74% in the range of 40-50 degrees of incidence.11-13-2008
20080273180Lithographic apparatus - A projection system suitable for use in a lithographic apparatus, the projection system including a transmissive optical element and a thermal profile corrector configured to change a thermal profile of the transmissive optical element, the thermal profile corrector including a transfer member and a thermal profile conditioner, the transfer member being moveable into and out of proximity with the transmissive optical element to transfer a desired thermal profile from the thermal profile conditioner into the transmissive optical element.11-06-2008
20080231937Spatial Light Modulator Using an Integrated Circuit Actuator and Method of Making and Using Same - A spatial light modulator (SLM) includes an integrated circuit actuator that can be fabricated using photolithography or other similar techniques. The actuator includes actuator elements, which can be made from piezoelectric materials. An electrode array is coupled to opposite walls of each of the actuator elements is an electrode array. Each array of electrodes can have one or more electrode sections. The array of reflective devices forms the SLM.09-25-2008
20080224251Optimal Rasterization for Maskless Lithography - A lithographic system is provided in which an extent of overlap between pattern sections is adjusted in order to match a size of a pattern section to a size of a repeating portion of the pattern to be formed.09-18-2008
20080219562System and Method for Calculating Aerial Image of a Spatial Light Modulator - A method of calculating an aerial image of a spatial light modulator array includes calculating pair-wise interference between pixels of the spatial light modulator array; calculating effective graytones corresponding to modulation states of the pixels; and calculating the aerial image based on the pair-wise interference and the effective graytones. The graytones depend only on the modulation states of the pixels. The pair-wise interference depends only on position variables. The position variables are position in an image plane and position in a plane of a source of electromagnetic radiation. The pair-wise interference can be represented by a matrix of functions. The pair-wise interference can be represented by a four dimensional matrix. The effective graytones are approximated using sinc functions, or using polynomial functions.09-11-2008
20080198363System and Method to Align and Measure Alignment Patterns on Multiple Layers - A system and method are used to increase alignment accuracy of feature patterns through detection of alignment patterns on both a surface layer and at least one below surface layers of an object. A first frequency of light, such as visible light, is used to detect alignment patterns on the surface layer and a second frequency of light, such as infrared light, is used to detect patterns one layer below the surface. For example, reflected light of a first frequency and transmitted light of a second frequency are co-focused onto detector after impinging on respective alignment patterns. The co-focused light is then used to determine proper alignment of the object for subsequent pattern features. This substantially increases accuracy of alignment of pattern features between layers, as compared to conventional systems.08-21-2008
20080198343Systems and methods for insitu lens cleaning in immersion lithography - An immersion lithography apparatus is provided that includes an energy source, a projection optical system, a stage, a showerhead including an immersion liquid supply device and an immersion liquid discharge device that produces a flow of liquid within an exposure zone, and a cleaning device that cleans a portion of the projection optical system having been contacted with the immersion liquid by means of a cleaning gas. In an embodiment, the cleaning device includes a gas supply device and a gas discharge device that produce a flow of cleaning gas into the exposure zone. In embodiments, the apparatus includes a stage that includes a dose sensor and/or an ultra-violet light source. A method for insitu cleaning of a final lens element within an immersion lithography system having an immersion fluid showerhead that provides immersion fluid to an exposure zone of the immersion lithography system is also provided.08-21-2008

Patent applications by ASML Holding N.V.