| ASM NUTOOL, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090065365 | METHOD AND APPARATUS FOR COPPER ELECTROPLATING - A method and apparatus for a copper electroplating procedure, wherein a first additive is preferentially adsorbed onto the field region of a substrate and a second additive is preferentially adsorbed onto the surfaces of at least one recessed region of the substrate, is provided. The first additive is more resistive to the electrodeposition relative to the second additive such that the recessed regions are filled at a faster rate than a layer is deposited on the field region. | 03-12-2009 |
| 20080242078 | PROCESS OF FILLING DEEP VIAS FOR 3-D INTEGRATION OF SUBSTRATES - A method for filling defect-free conductive material in deep vias or cavities in semiconductor wafers in 3-D integration structures is provided. The process may be performed in at least two steps for depositing the conductive material, including a first deposition step that partially fills the cavity with the conductive material and forms a conformal layer, which may also reduce the depth and width of the cavity, and a second deposition step that completely fills the same conductive material into the space defined by the conformal layer. | 10-02-2008 |
