ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD.
|ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20130016932||BEARING DEVICEAANM CHEN; BINAACI Shenzhen CityAACO CNAAGP CHEN; BIN Shenzhen City CN - A bearing device comprises a bearing fixing base, a hub, an oil seal bush, and an oily felt. The bearing fixing base is fixedly joined with a tubular support; the hub is fixedly joined with a rotor spindle which extends into the tubular support and rotates with respect to the tubular support; the oil seal bush is disposed between the spindle and the tubular support with a receiving clearance being defined between the oil seal bush and the tubular support; the oily felt is disposed in the receiving clearance. The oily felt supplies lubrication oil to lubricate the oil seal bush for prolonging a life span of the bearing device.||01-17-2013|
|20120273167||LOOP HEAT PIPE STRUCTURE WITH LOW-PROFILE EVAPORATOR - A loop heat pipe structure includes an evaporator and a first pipe. The evaporator has a first chamber, a first wick layer, and a bottom. The first wick layer is provided in the first chamber. The first pipe includes a first inlet and a first outlet communicably connected to the evaporator. The first inlet internally defines a second chamber communicable with the first wick layer. By providing the second chamber outside the evaporator, the evaporator can have a reduced overall height without creating very high vapor pressure in the evaporator, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.||11-01-2012|
|20120247736||LOOP HEAT PIPE STRUCTURE - A loop heat pipe structure includes a transport pipe, an evaporator, a first wick layer, a second wick layer, and a plurality of grooves. The transport pipe communicates with the evaporator. The evaporator has a bottom and internally defines a first chamber and a second chamber, and has a working fluid filled therein. The first wick layer is located on the bottom, and the second wick layer is located on and covers the first wick layer. The grooves can be selectively provided on the first wick layer or the bottom. The first and second wick layers are so designed that the situation of very high vapor pressure would not occur in the second chamber, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.||10-04-2012|
|20110049007||PROTECTIVE CASE FOR FAN - A protective case for fan includes a case body having a closed bottom portion and a sidewall portion extended along a periphery of the bottom portion, so that a receiving space is defined between the bottom and sidewall portions. A case cover can be closed onto an open top of the receiving space to seal the same. Two first raised ribs are formed on the closed bottom portion adjacent to two opposite sides thereof, such that first retaining portions are defined between the sidewall portion and faces of the first raised ribs facing toward the sidewall portion, and second retaining portions are defined on another faces of the first raised ribs facing away from the sidewall portion. By providing the first and second retaining portions, the same protective case can be conveniently used to stably pack differently sized fans to save the manufacturing cost of the protective case.||03-03-2011|
|20110030920||Heat Sink Structure - A heat sink structure includes a heat dissipating body and at least one heat pipe. The heat dissipating body includes a main body having two opposite first and second end faces, and a plurality of radiating fins formed on two wall surfaces of the main body. The heat dissipating body is made of a heat-conducting plastic material through injection molding, and the heat pipe is embedded in the heat dissipating body during the process of injection molding the heat dissipating body. The heat pipe has two opposite first and second ends respectively exposed from the first and second end faces of the heat dissipating body for directly contacting with a heat source, and a pipe body helically extended between the first and second ends and embedded in the heat dissipating body. With these arrangements, the heat sink structure has reduced weight and material cost while providing good heat dissipating effect.||02-10-2011|
|20100079950||Radiating Fin and Thermal Module Formed Therefrom - A thermal module includes a base for contacting with a heat-producing element, a radiating fin assembly consisting of a plurality of stacked radiating fins, a heat pipe having an end connected to the base and the other end extended through the radiating fin assembly, and a fan mounted to one side of the radiating fin assembly. Each of the radiating fins includes a flat main body having a first and a second transverse edge, and at least one projected portion provided on at least one of the first and the second transverse edge. Positions on the first and/or the second transverse edge without the projected portion are open portions. The projected portions on two adjacent radiating fins are staggered, so that a plurality of expanded heat dissipating spaces can be formed on the radiating fin assembly to enable smooth flowing of heat-carrying airflows and upgraded heat dissipating efficiency.||04-01-2010|
|20100014299||Thermal module for light-emitting diode - A thermal module for LED includes a base in direct contact with an LED module; a first radiating fin assembly consisting of a plurality of parallelly spaced radiating fins and being connected at one side to the base opposite to the LED module; at least one second radiating fin assembly consisting of a plurality of parallelly spaced radiating fins, so that an air passage is provided between any two adjacent radiating fins of the second radiating fin assembly; and at least one heat pipe having a conducting section extended through and closely bearing against an interface between the base and the first radiating fin assembly, and at least one radiating section outward extended from an end of the conducting section to extend through the second radiating fin assembly. The second radiating fin assembly and the air passages thereof largely upgrade the heat dissipating efficiency of the thermal module.||01-21-2010|
Patent applications by ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD.