| ASETEK A/S Patent applications |
| Patent application number | Title | Published |
|---|
| 20120012282 | DIRECT AIR CONTACT LIQUID COOLING SYSTEM HEAT EXCHANGER ASSEMBLY - A heat exchanger assembly for use in hybrid liquid-air cooling system adapted to provide a liquid cooling mechanism for components in a personal computer system. The heat exchanger assembly consists of a heat exchanger chamber, though which the thermal transfer liquid flows. An air pump injects air bubbles into the heat exchanger chamber through a porous material. The air bubbles rise up through the thermal transfer liquid and exit at the top of the heat exchanger chamber through a semi-permeable membrane which inhibits loss of the thermal transfer fluid. As the air bubbles pass through the thermal transfer liquid, heat is exchanged directly between the thermal transfer liquid and the contained air. The heat is then removed from the system as the heated air is expelled from the heat exchanger chamber. | 01-19-2012 |
| 20080247137 | Cooling System For Electronic Devices, In Particular, Computers - The invention concerns a cooling system for electronic devices, especially computers, comprising an evaporator ( | 10-09-2008 |
