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Asat Ltd.
| Asat Ltd. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100224970 | LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD - A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material. | 09-09-2010 |