| Arakawa Chemical Industries, Ltd. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120108830 | METHOD FOR MANUFACTURING AN EPOXY COMPOUND AND METHOD FOR EPOXIDIZING A CARBON-CARBON DOUBLE BOND - The present invention provides a method for producing an epoxy compound, comprising oxidizing a carbon-carbon double bond of an organic compound by hydrogen peroxide in the presence of a neutral inorganic salt and a mixed catalyst of a tungsten compound (a), at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphonic acids, and salts thereof (b) and a surfactant (c), and an epoxidizing method comprising oxidizing a carbon-carbon double bond by hydrogen peroxide in the presence of the catalyst and the neutral inorganic salt. | 05-03-2012 |
| 20120090646 | CLEANING AGENT FOR REMOVAL OF, REMOVAL METHOD FOR, AND CLEANING METHOD FOR WATER-SOLUBLE, LEAD-FREE SOLDER FLUX - An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water. | 04-19-2012 |
| 20120037405 | FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 μm. | 02-16-2012 |
| 20120010358 | ROSIN-MODIFIED PHENOL RESIN, MANUFACTURING METHOD THEREOF, AND PRINTING INK - A rosin-modified phenolic resin, comprising a product obtained by reaction of (a) a rosin material containing 0.4 to 10% of dihydroagathic acid, (b) a condensate of a phenolic compound and formaldehyde, and (c) a polyol. | 01-12-2012 |
| 20110244326 | ELECTRODE FOR SECONDARY BATTERY AND MANUFACTURING PROCESS FOR THE SAME - It is an assignment to be solved to provide an electrode for secondary battery, electrode in which the active material is suppressed from coming off or falling down from the electricity collector, and that has excellent cyclic performance. | 10-06-2011 |
| 20110094545 | CLEANING COMPOSITION FOR REMOVING LEAD-FREE SOLDER FLUX AND SYSTEM FOR REMOVING LEAD-FREE SOLDER FLUX - An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid. | 04-28-2011 |
| 20110070433 | Sheet and Adhesive Sheet - A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing. | 03-24-2011 |
| 20100215937 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND VARIOUS ARTICLES DERIVED FROM THOSE - A curable resin composition which is easily cured by heating or ultraviolet irradiation and capable of forming a thick cured film due to low shrinkage. This curable resin composition enables to obtain a cured product satisfying various characteristics such as heat resistance, chemical resistance, high surface hardness and high refractive index. Also disclosed is a cured product obtained from such a composition. Specifically disclosed is a curable resin composition containing at least one substance selected from the group consisting of condensates (A) obtained by hydrolyzing and condensing a thiol group-containing alkoxysilane (a1) represented by the following general formula: | 08-26-2010 |
| 20100180917 | CLEANER COMPOSITION FOR REMOVING LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVING LEAD-FREE SOLDERING FLUX - The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water. | 07-22-2010 |
| 20090145329 | Tackifier and Tackifier Emulsion - The present invention provides a tackifier that is a raw material of an adherence adhesive having good adhesion performance (in particular, holding power) for all members and can be used for various adherence adhesives, and a tackifier emulsion capable of being used for various aqueous adherence adhesives. The tackifier and the tackifier emulsion including a rosin resin wherein a ratio of the content of a component with a molecular weight of at most 300 comprised in the rosin resin to the softening point of the rosin resin (the content (% by weight) of a component with a molecular weight of at most 300/softening point (K)) is at most 0.004; and the adherence adhesive composition including the tackifier; and the aqueous adherence adhesive composition including the tackifier emulsion. | 06-11-2009 |
| 20090042762 | CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX - The present invention provides a cleaner composition that can satisfactorily remove lead-free soldering flux adhered to the object to be cleaned, has little impact on the environment, and has odor, inflammability, etc., which are of an acceptable level for practical use; a rinsing agent for rinsing the cleaned object after cleaning with the cleaner composition to remove lead-free soldering flux more effectively; and a removal method using the composition (and the rinsing agent). The cleaner composition for the removal of lead-free soldering flux contains:
| 02-12-2009 |
