ARACA Incorporated Patent applications |
Patent application number | Title | Published |
20100203811 | METHOD AND APPARATUS FOR ACCELERATED WEAR TESTING OF AGGRESSIVE DIAMONDS ON DIAMOND CONDITIONING DISCS IN CMP - The present invention is a method and apparatus for accelerated pulling and fracturing of aggressive diamonds on a CMP diamond conditioner disc wherein aggressive diamonds of known position are pulled or fractured by contacting the diamond conditioner disc to a plate or sheet of a hard material or a plate or sheet containing discrete structures of hard material relative to which the diamond disc is in motion at a determinable and reproducible rate for a determinable and reproducible period of time and the number and position of the pulled or fractured aggressive diamonds are determined following the completion of said contact. | 08-12-2010 |
20090268283 | CONFOCAL MICROSCOPY PAD SAMPLE HOLDER AND METHOD OF HAND USING THE SAME - The present invention is a sample holder for confocal microscopy of CMP pad samples cut or otherwise removed from either new or used CMP pads that maintains a uniform load and pressure over the part of the sample visible to the confocal microscope by placing the pad behind a transparent window and holding it against the said window by a means comprising upper transparent window retaining means having an offset adjacent the transparent window having the same or essentially the same refractive index as the pad material so that when the pad is held against the transparent window, the edges of the pad are outside the outer edge of the transparent window; lower pad retaining means to press the pad under a known/load against the transparent window, which lower pad retaining means has a size less than the size of the pad; spherical force transmitting means pressed against the lower pad retaining means;, through a load cell to measure the load transferred to the sample through lower pad retaining means, the spherical force transmitting means, the force transfer means and load cell from the posterior structural housing of the sample holder which is forced together with the said window retaining means by a force generating means; and means to adjust the known load and a method of confocal microscopy of new and used CMP pad samples to determine relative surface area and other characteristics using the said confocal sample. | 10-29-2009 |
20090124176 | REMOVABLE POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING - The present invention offers a device for rendering CMP polishing pads easily and temporarily removable from and replaceable upon the platen of a CMP polishing apparatus comprising two sheets, the upper sheet attached to the said CMP polishing pad and the lower attached to the said platen, the said two sheets held together by pegs, pins or protrusions fitted to matching holes in the upper surface of the lower sheet and the lower surface of the upper sheet, said pegs or pins attached to either the upper or lower sheet and able to enter the hold on the adjoining sheet when the sheets are brought together and hold the sheets together by means of the sliding friction attendant upon a tight fit with the said holes. The device allows far easier metrology and storage of CMP polishing pads at different stages of use with no damage to the CMP pad, which may be put back into service at any time. The transparency of the upper sheet further allows users to prevent formation of bubbles in the adhesive holding the CMP pad to the upper sheet, thereby avoiding significant degradation of CMP performance. | 05-14-2009 |
20080200032 | POLISHING METHOD OF SEMICONDUCTOR SUBSTRATE - The present invention relates to a method of polishing a semiconductor substrate, comprising pressing a semiconductor substrate having a film to be polished that is held by a carrier onto a polishing cloth fixed on a revolving polishing table and supplying a polishing slurry to the space between the polishing cloth and the semiconductor substrate, wherein the end point of polishing is determined according to the change in the friction coefficient while the friction coefficient between the semiconductor substrate and the polishing cloth is measured. According to the present invention it is possible to measure friction coefficient accurately in polishing a semiconductor substrate and use the change thereof to determine the end point of polishing. | 08-21-2008 |