Applies Materials, Inc. Patent applications |
Patent application number | Title | Published |
20110263079 | INTERFACE PROTECTION LAYAER USED IN A THIN FILM TRANSISTOR STRUCTURE - Embodiments of the disclosure generally provide methods of using an interface protection layer disposed between an active layer and a source-drain metal electrode layer. In one embodiment, a method for forming an interface protection layer in a thin film transistor includes providing a substrate having an active layer formed thereon, wherein the active layer is a metal oxide layer, forming an interface protection layer on a portion of the active layer, and forming a source-drain electrode layer on the interface protection layer. | 10-27-2011 |
20090035918 | POST DEPOSITION PLASMA TREATMENT TO INCREASE TENSILE STRESS OF HDP-CVD SIO2 - Methods of forming a dielectric layer where the tensile stress of the layer is increased by a plasma treatment at an elevated position are described. In one embodiment, oxide and nitride layers are deposited on a substrate and patterned to form an opening. A trench is etched into the substrate. The substrate is transferred into a chamber suitable for dielectric deposition. A dielectric layer is deposited over the substrate, filling the trench and covering mesa regions adjacent to the trench. The substrate is raised to an elevated position above the substrate support and exposed to a plasma which increases the tensile stress of the substrate. The substrate is removed from the dielectric deposition chamber, and portions of the dielectric layer are removed so that the dielectric layer is even with the topmost portion of the nitride layer. The nitride and pad oxide layers are removed to form the STI structure. | 02-05-2009 |
20090031957 | HIGH RESOLUTION SUBSTRATE HOLDER LEVELING DEVICE AND METHOD - A method for adjusting a spacing of a leveling plate from a chamber body comprises attaching a mounting stud that includes a stud threaded surface to the chamber body. An adjustment screw is provided that has a first threaded surface threadingly engaged with the stud threaded surface. A bushing is provided that has a bushing threaded surface threadingly engaged with a second threaded surface of the adjustment screw. The bushing is movably coupled to the leveling plate. Coarse adjustment of the spacing between the leveling plate and the chamber body is made by rotating the adjustment screw with respect to the mounting stud. The bushing is fixed to the leveling plate. Fine adjustment of the spacing between the leveling plate and the chamber body is made by rotating the adjustment screw with respect to the mounting stud and the bushing. | 02-05-2009 |