| ANTARES ADVANCED TEST TECHNOLOGIES, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090321901 | THERMALLY BALANCED HEAT SINKS - According to example embodiments, a device configured to dissipate heat from a first chip and a second chip on a multi-chip package includes a primary heat sink configured to contact an upper surface of the first chip, a secondary heat sink configured to contact an upper surface of the second chip, the secondary heat sink disposed within the primary heat sink and movable in relation to the primary heat sink, and a thermally conductive substance disposed in contact with the primary heat sink and the secondary heat sink. | 12-31-2009 |
| 20090261851 | SPRING PROBE - According to some example embodiments, an interconnect has a crown with contact tips, in which each of the contact tips is structured to physically contact a substantially spherical solder ball along a curved inner surface of the contact tip. | 10-22-2009 |
