Anji Microelectronics (Shanghai) Co., Ltd.

Patent application number	Title	Published
Anji Microelectronics (Shanghai) Co., Ltd. Patent applications
20090121178	Polishing Slurry - The present invention discloses a polishing slurry, wherein said polishing slurry comprises a carrier and functionalized alumina grains. The polishing slurry, which comprises functionalized alumina grains having desirable dispersibility, has desirable stability and is able to lower the defect rate of the substrate surface, improve the surface quality, decrease the total metal loss and enlarge the variation range of the technical parameters.	05-14-2009
20090095320	Composition for Removing Photresist Layer and Method for Using it - A new composition for removing a photoresist layer and a method for using the same are disclosed. The composition comprises a polar solvent and an oxidant. The composition according to the present invention comprises chemical substances with less toxicity and flammability at lower contents, which makes it more friendly to environment and decreases the expense for disposing the chemical waste. The method for using the composition shortens the time for cleaning and removes the residue more completely, thereby enhancing the electrical conductivity.	04-16-2009