| ANAREN, INC. Patent applications |
| Patent application number | Title | Published |
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| 20120103169 | Magnetic Instrument Pickup - An instrument pickup including a stack of thin laminated printed circuit boards. Each layer includes an etched coil conductor structure with narrow lines and spaces defining the coil structure. The layers are connected via through holes. The etched lines are smaller than the insulated copper wire (also sometimes called magnetic wire) of a conventional instrument pickup, which means that the size, volume and/or height of the pickup may be reduced relative to a conventional wire wound instrument pickup. | 05-03-2012 |
| 20100259336 | SURFACE MOUNTABLE CIRCULATOR - The present invention is directed to a surface mountable circulator/isolator device that includes a first dielectric layer having an electric circuit formed thereon. A second center dielectric layer is disposed adjacent the first dielectric layer, the center dielectric layer including an opening formed therein, the opening being aligned relative to the electric circuit. A ferrite element is disposed in the opening such that the ferrite abuts the electric circuit and is aligned in two-dimensions relative to the electric circuit. A third dielectric layer is disposed adjacent the second center layer. The third dielectric layer includes a ground plane formed on each major surface thereof. The first dielectric layer, the second center dielectric layer, the ferrite element, and the third dielectric layer are bonded together to form a laminated multi-layer structure. A permanent magnet is bonded to the second ground plane. | 10-14-2010 |
| 20100109791 | CIRCULATOR/ISOLATOR WITH AN ASYMMETRIC RESONATOR - The present invention is directed to a circulator device that includes a housing defining an interior three-dimensional volume. The housing includes a plurality of port openings disposed therein. A gyromagnetic resonator stack is disposed in the housing. The gyromagnetic resonator stack includes a circuit disposed between a first ferrite disk and a second ferrite disk. The first ferrite disk and the second ferrite disks form a pair of ferrite disks having a ferrite disk centroid and a ferrite disk perimeter. The circuit including an asymmetric center resonator having a eccentric region characterized by a predetermined resonator geometry. The circuit further including an impedance matching transmission line structure coupled to an edge of the eccentric region proximate the ferrite disk perimeter and at least one 50 Ohm transmission line structure coupled to a non-eccentric portion of the asymmetric center resonator. Each of the impedance matching transmission line structure and the at least one 50 Ohm transmission line structure extending through corresponding port openings of the plurality of port openings. The impedance matching transmission line structure is characterized by a section geometry and a predetermined matching impedance. The predetermined matching impedance is a function of the section geometry and at least one performance parameter of the device is a function of the predetermined resonator geometry. | 05-06-2010 |
| 20100026412 | COMPACT BALUN - The present invention is directed to a compact balun device that includes an unbalanced port and a set of balanced differential ports. A first set of coupled transmission line structures is coupled to the unbalanced port and one port of the set of balanced differential ports. The first set of coupled transmission line structures is characterized by at least one device parameter and a first length that is substantially equal to a quarter of a wavelength (λ). The wavelength (λ) corresponds to a first frequency. A second set of coupled transmission line structures is coupled to another port of the set of balanced differential ports. The second set of coupled transmission line structures is characterized by the at least one device parameter and a second length that is substantially equal to the quarter of a wavelength (λ). The wavelength (λ) corresponds to the first frequency. A plurality of interconnections couples the first set of coupled transmission line structures and the second set of coupled transmission line structures. The plurality of interconnections are configured such that the compact balun operates at a reduced operating frequency, the reduced operating frequency being selected from a range of frequencies by varying at least one device parameter. The range of frequencies is approximately between one-sixth of the first frequency and one-half the first frequency. | 02-04-2010 |
| 20100007433 | Power Splitter/Combiner - The present invention is directed to a system that includes a front-end interface device having a first front-end interface port, a second front-end interface port and a third front-end interface port. The front-end interface device is configured to split a first signal directed into the first front-end interface port into a second signal provided at the second front-end interface port and a third signal provided at the third front-end interface port. The first signal has a first bandwidth, the second signal has a second bandwidth and the third signal has a third bandwidth. The second bandwidth is substantially disposed in a relatively high frequency portion of the first bandwidth and the third bandwidth is substantially disposed in a relatively low frequency portion of the first bandwidth. An N-way high-band device includes a first high-band device port coupled to the second front-end interface port and N second high band ports. N is an integer greater than or equal to two (2). The N-way high-band device is configured to split the second signal into N-high band signals and direct the N-high band signals out of corresponding ones of the N-second high band ports. An N-way low-band device includes a first low-band device port coupled to the third front-end interface port and N-second low band ports. The N-way low-band device is configured to split the third signal into N-low band signals and direct the N-low band signals out of corresponding ones of the N-second low band ports. N back-end interface devices are coupled to the N-way high-band device and the N-way low-band device. Each back-end interface device of the N back-end interface devices includes a first back-end interface port coupled to a corresponding one of the N second high band ports, a second back-end interface port coupled to a corresponding one of the N second low band ports, and a third back-end interface port. Each back-end interface is configured to combine one of the N-high band signals and one of the N-low band signals to form a fourth signal directed out of the third back-end interface port such that N-fourth signals are directed out of the N back-end interface devices. The fourth signal has a fourth bandwidth. The fourth signal is a version of the first signal such that the fourth bandwidth and the first bandwidth are substantially identical. | 01-14-2010 |
| 20090243746 | Circulator Device And A Method For Assembly - The present invention is directed to a circulator/isolator device that includes a housing having a substantially planar base portion integrally connected to a segmented flexible wall structure extending in a direction normal thereto. The substantially planar base portion and the segmented flexible wall structure forms an interior housing volume having a predetermined geometry. The segmented flexible wall structure includes a plurality of port apertures disposed therein. The plurality of port apertures are separated from each other and disposed at predetermined locations in the segmented flexible wall structure. A central stack is disposed within the interior housing volume at a predetermined position on the base portion. The central stack includes a substantially flat conductor having a plurality of port structures extending therefrom. Each of the plurality of port structures are disposed at predetermined positions at a perimeter portion of the substantially flat conductor. The predetermined positions substantially conform to the predetermined locations such that each of the plurality of port structures extend through the segmented flexible wall structure at a corresponding one of the plurality of port apertures. A cover member is disposed within the housing at one end thereof, opposite the base portion, such that an exterior major surface of the cover is accessible via an exterior of the device and an interior major surface of the cover is disposed adjacent the central stack. A retaining member is disposed around a perimeter of the segmented flexible wall structure at the one end. The retaining member is configured to apply a substantially uniform radial compressive force to the segmented flexible wall structure to retain the cover member there within. The cover member applies a registration force to the central stack assembly to maintain the central stack assembly at the predetermined position. | 10-01-2009 |
| 20090027143 | High Power Hybrid Material Surface Mount Stripline Devices - The present invention is directed to a method for making a hybrid material stripline device. The method includes providing an inner layer of material, the inner layer including a dielectric material and at least one conductive sheet. At least one stripline device is formed in the inner layer by processing the at least one conductive sheet. The at least one stripline device is characterized by a surface area footprint. A first exterior layer and a second exterior layer are provided. At least one of the first exterior layer and/or the second exterior layer includes at least one ceramic portion. The at least one ceramic portion has a ceramic surface area greater than or substantially equal to the surface area footprint of the at least one stripline device. At least one of the first exterior layer and/or the second exterior layer further includes a softboard dielectric material. The inner layer of material is sandwiched between the first exterior layer and the second exterior layer. The first exterior layer, the inner layer and the second exterior layer are laminated to form a laminate panel structure, a surface of the first exterior layer forming a first major surface of the laminate panel structure and a surface of the second exterior layer forming a second major surface of the laminate panel structure. A first conductive sheet is disposed over the first major surface and a second conductive sheet is disposed over the second major surface, the first conductive sheet and the second conductive sheet being configured as parallel ground planes for the at least one stripline device. | 01-29-2009 |
