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AMI SEMICONDUCTOR, INC.

AMI SEMICONDUCTOR, INC. Patent applications
Patent application numberTitlePublished
20100142714METHOD AND SYSTEM FOR ACOUSTIC SHOCK PROTECTION - An acoustic shock protection method and device are provided. A pattern analysis-based approach is taken to an input signal to perform feature extraction. A parameter space is identified, which is corresponding to, the signal space of the input signal. A rule-based decision approach is taken to the parameter space to detect an acoustic shock event. The device may be advantageously implemented using a weighted overlap-add approach to provide low group delay, high-fidelity and a high degree of protection from acoustic shock events.06-10-2010
20090231204MINIATURE ANTENNA FOR WIRELESS COMMUNICATIONS - An antenna and a method for direct matching the antenna to a transceiver is provided. The method includes designing the antenna to directly match an antenna impedance to at least one of an input impedance of the transceiver and an output impedance of the transceiver. The step of designing includes modeling the antenna and the transceiver and implementing an electromagnetic field simulation using a human body phantom model with the antenna to determine the value of an antenna parameter for the antenna model. The antenna for a communication device having a transceiver, includes an antenna element directly coupled with the transceiver having a transmitter and a receiver, an antenna parameter of the antenna element being tuned so that the real part of the impedance of the antenna is maximized, and a plate for optimizing the reactive part of the impedance of the antenna. The impedance of the antenna is directly matched to at least one of an impedance of the transmitter and an impedance of the receiver. The method for antenna design includes providing estimate of a package, designing possible realization(s) of the antenna given the space limitations of the package to realize maximum power transfer around the head, for a given design of LNA and PA, generating power efficiency maps for all possible bias realizations versus all possible impedance values of the antenna, and modifying the antenna design in order to maximize the overall link efficiency.09-17-2009
20090152725Thick metal interconnect with metal pad caps at selective sites and process for making the same - The present invention relates to a high power IC (Integrated Circuit) semiconductor device and process for making same. More particularly, the invention encompasses a high conductivity or low resistance metal stack to reduce the device R-on which is stable at high temperatures while in contact with a thick aluminum wire-bond that is required for high current carrying capability and is mechanically stable against vibration during use, and process thereof. The invention further discloses a thick metal interconnect with metal pad caps at selective sites, and process for making the same.06-18-2009
20090152100Thick metal interconnect with metal pad caps at selective sites and process for making the same - The present invention relates to a high power IC (Integrated Circuit) semiconductor device and process for making same. More particularly, the invention encompasses a high conductivity or low resistance metal stack to reduce the device R-on which is stable at high temperatures while in contact with a thick aluminum wire-bond that is required for high current carrying capability and is mechanically stable against vibration during use, and process thereof. The invention further discloses a thick metal interconnect with metal pad caps at selective sites, and process for making the same.06-18-2009
20090115437HIGH TEMPERATURE RANGE ELECTRICAL CIRCUIT TESTING - An electrical circuit testing assembly that includes a mechanical reference that is relatively stationary as compared to a circuit under test. A probe support assembly is coupled to the mechanical reference and includes probes for contacting interconnect pads on the circuit under test. Optionally, the probe support structure is attached to the mechanical reference via a column that is thermally resistive. Also optionally, a testing circuitry support structure (e.g., a printed circuit board) is not rigidly attached to the mechanical reference or to the probe support structure, thereby permitting the testing circuitry support structure to float with respect to the probe support structure.05-07-2009
20090097588DIGITAL DATA ENCODING AND DECODING METHOD AND SYSTEM - Digital data encoding and decoding method and system is provided. The method for digital data communication include encoding bit stream having monitoring a specific bit pattern in the bit stream when a frame signal is received, and based on the monitoring, creating a unique encoding pattern for the frame signal in encoded data. The system for digital data communication includes an encoder having a control unit for monitoring incoming bit stream to detect a specific bit pattern at a bit position relative to a frame signal and asserting a control signal, and a mark and space unit for generating encoded data having at least one of one or more marks and one or more spaces, based on the bit stream in response to the control signal so that the frame signal is embedded into the encoded data. The method for decoding includes recovering bit stream from encoded data. The encoded data is generated using a unique encoding pattern for a frame signal in the encoded data. The recovering includes detecting at least one of mark and space. The method includes recovering a frame signal from the encoded data, including detecting a pattern associated with the unique encoding pattern based on the detection of the at least one of mark and space. The system for decoding includes a first recover for recovering bit stream from encoded data. The encoded data is generated using a unique encoding pattern for a frame signal in the encoded data. The first recover includes a circuit for detecting at least one of mark and space. The system includes a second recover for recovering a frame signal from the encoded data. The second recover includes a circuit for detecting a pattern associated with the unique encoding pattern based on the detection of the at least one of mark and space.04-16-2009
20090096543MULTI-FORMAT ALL-DIGITAL MODULATOR AND METHOD - A method, system and digital modulator for modulation are provided The modulator includes a dividing mechanism for dividing a reference clock by a divide value to produce a modulated signal associated with at least one input data, and a control unit for providing at least one divide sequence to the dividing mechanism. The at least one divide sequence includes a sequence of one or more divide values. The divide value of the divide sequence is configurable and selectively provided to the dividing mechanism based on the at least one input data. The method includes configuring at least one divide sequence including a sequence of one or more divide values, and selecting a divide value from the at least one divide sequence based on at least one input data. The method includes dividing a reference clock by the selected divide value and generating a modulated signal based on the divide operation. The system for modulation-based commutations link includes a modulation unit having a dividing mechanism for dividing a reference clock by a divide value, and a configuration register for one or more configurable divide sequences.04-16-2009
20090096519CONFIGURABLE DEMODULATOR AND DEMODULATION METHOD - A method and system for a frequency shift key demodulation is provided. The system includes a counting block for counting a reference clock within a window defined by a modulated signal, a detector for comparing a count value output from the counting block with digital multi-level thresholds and outputting baseband data based on the comparison, and a configurations block for configuring at least one of the counting block and the detector. The method includes counting a reference clock within a window defined by the FSK modulated signal and outputting a count value as a result of the counting, and comparing the count value with multi-level thresholds to output baseband data based on the comparison.04-16-2009

Patent applications by AMI SEMICONDUCTOR, INC.