| 20100059576 | TIN ALLOY SOLDER COMPOSITION - A lead-free and solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises, by weight, about 0.2% to about 1% copper; about 0.001% to about 0.039% nickel; about 0.001% to about 0.039% cobalt; and the balance of tin. The alloy composition has a melting temperature of about 227° C., with superior wetting and mechanical strength making the alloy composition wells suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders. | 03-11-2010 |
