| AMBIT MICROSYSTEMS (ZHONGSHAN) LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120045216 | OPTICAL TRANSCEIVER AND PACKAGING METHOD THEREOF - An optical transceiver includes a substrate, a plurality of laser components, a bracket and a plurality of lenses. The substrate defines a plurality of through holes, a plurality of receiving grooves and at least two fixing holes. The laser components are received in the plurality of receiving grooves and installed on the substrate. The bracket includes a top cover with an upper surface and one or more side walls. The one or more sidewalls include at least two positioning posts and one or more fixing surfaces. The positioning posts are engaged with the fixing holes to position the bracket to the substrate. The fixing surfaces are affixed on the substrate by an adhesive. The one or more sidewalls define one or more through channels extending from the one or more fixing surface to the upper surface. The lenses are installed on the bracket and correspond to the laser components. | 02-23-2012 |
| 20110309484 | LEAD FRAME, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE USING THE SAME - A semiconductor package includes a lead frame, a first chip, a second chip, a plurality of bonding wires and a mold compound. The lead frame includes a pad portion at a center of the frame and a plurality of lead portions. The pad portion and the plurality of lead portions collectively define a receiving portion. The first chip is securely received in the receiving portion. The second chip is mechanically attached to the first chip. The plurality of bonding wires electrically connect the second chip to the plurality of lead portions. The mold compound encapsulates the lead frame, the first chip, the second chip and the plurality of bonding wires to form the semiconductor package. | 12-22-2011 |
| 20110261285 | ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL DISPLAY MODULE - An electronic device includes a bezel, a housing, a liquid crystal display (LCD) module, a shielding frame and a rubber frame. The housing includes a frame portion defining a plurality of latching grooves and a plurality of receiving grooves and a supporting shoulder. The LCD module is received in the housing and supported on the supporting shoulder. The rubber frame is disposed between the housing and the LCD module. The shielding frame including a plurality of latching portions covers the rubber frame. The latching portions engage with the plurality of latching grooves to fix the LCD module in the housing. The bezel includes a panel covering the shielding frame and a plurality of retaining arms respectively received in the plurality of receiving grooves and engaged with the shielding frame to secure the bezel to the shielding frame. | 10-27-2011 |
| 20110221046 | SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD THEREFOR - A semiconductor assembly package includes a package unit, a shielding layer and a protection layer. The package unit includes a semiconductor assembly, a daughter substrate and a mold compound. The semiconductor assembly is disposed on and electrically connected to the daughter substrate. The daughter substrate includes a metal portion grounded. The mold compound encapsulates the semiconductor assembly and the daughter substrate to expose the metal portion out of the package unit. The shielding layer is applied to the package unit and electrically connected to the metal portion, to provide electromagnetic shielding for the semiconductor assembly. The non-conductive protection layer is covered on the shielding layer. | 09-15-2011 |
| 20110150494 | OPTICAL TRANSCEIVER AND PACKAGING METHOD THEREOF - An optical transceiver includes a substrate, a positioning seat, a plurality of laser components, a bracket and a plurality of lenses. The positioning seat is installed on the substrate and includes a pair of positioning posts and a plurality of receiving holes between the positioning posts. The laser components pass through the receiving holes and are installed on the substrate. The bracket includes a top cover and one or more sidewalls. The one or more sidewalls surround the positioning seat and the plurality of laser components. The top cover defines a pair of positioning holes engaged with the pair of positioning posts to position the bracket corresponding to the positioning seat. The lenses are installed on the top cover of the bracket and correspond to the plurality of laser components on the substrate. | 06-23-2011 |
