ALTI-ELECTRONICS CO., LTD.
|ALTI-ELECTRONICS CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20100019267||LED OF SIDE VIEW TYPE AND THE METHOD FOR MANUFACTURING THE SAME - A side view type light emitting diode (LED) and a method of manufacturing the same are disclosed. In one embodiment, the LED includes i) a pair of lead frames, ii) a reflector surrounding the lead frames, wherein a groove is defined in the reflector, wherein the reflector comprises a plurality of walls surrounding the groove, and wherein at least two walls of the groove face each other, iii) an LED chip mounted in the groove and electrically connected to the lead frames and iv) a lens array contained in the groove.||01-28-2010|
|20090309122||LIGHT EMITTING DIODE PACKAGE - A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.||12-17-2009|
|20090189176||Light-emitting diode package - Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.||07-30-2009|
|20090189175||Side view type light emitting diode package - Disclosed is a side view light emitting diode (LED) package whose light emitting surface has been relatively expanded. The LED package includes a housing and a lead frame extended externally through the housing and bent in a direction of the recessed space. The housing includes a reflecting housing having a cavity and a supporting housing.||07-30-2009|
|20090189174||Light emitting diode package - A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.||07-30-2009|
|20090189171||Light emitting diode package - An LED package includes a housing, a substrate, a pad frame and an LED chip. The housing includes a plastic material, and has a recess with an opening at a top of the housing. The substrate includes substantially the same material with the housing. The pad frame includes conductive material, and is inserted on the substrate, and is fixed between the housing and the substrate. The LED chip is mounted on the pad frame and is disposed at a center of the recess. The housing is protruded and extended to a lower portion of the LED chip. Thicknesses of the housing's sidewalls facing to each other through the recess are substantially the same with each other.||07-30-2009|
|20090040416||DISPLAY DEVICE HAVING A BACKLIGHT UNIT - A display device is disclosed in the present invention. The display device includes a case including an install space inside the case, an opened display area at a front face of the case and a slit at a side of the case, the slit connected to the install space, a display panel attached to the case at the install space to be exposed to the display area, a backlight unit installed at the install space after the display panel through the slit by sliding engagement.||02-12-2009|
|20090039381||LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An LED package is disclosed. The LED package includes a substrate having a plurality of sub patterns adhered by insulation adhesive, an LED chip mounted on the substrate and electrically connected to the substrate and a molding cap covering the LED chip. According to the LED package, as well as simplifying structure, an obstacle is removed at a light course of light emitted from the LED chip, so that light efficiency of the LED chip is improved.||02-12-2009|
|20090002988||BACKLIGHT UNIT OF DIRECT TYPE - The present invention provides a backlight unit including an LED module and a frame separately, and each separated part is stable and is capable of simple use and assembly. The backlight unit of direct type includes a plurality of makeup LED modules including an LED package of direct type on a PCB and a heat sink releasing heat generated from driving the LED package of direct type, a reflection plate reflecting light emitted from the makeup LED module to a front face, and attached at the remaining surface except for the makeup LED packages, an optical sheet disposed on the reflection plate, and improving brightness and uniformity of the light emitted from the makeup LED module and the reflection plate, and guide the light into a front face of the optical sheet and a frame including a guide rail to combine the makeup LED module by a sliding combination.||01-01-2009|
|20080254557||Method for manufacturing lens for led package - A method for manufacturing a lens for a light emitting diode (LED) package is disclosed. The method for manufacturing a lens for an LED package includes: forming a dome lens on each of a plurality of LED packages placed on a fixing plate, the dome lens made of silicon; forming a concave groove in the dome lens by using a jig for pressing the dome lens; curing the dome lens; and removing the LED packages from the fixing plate.||10-16-2008|
Patent applications by ALTI-ELECTRONICS CO., LTD.