| ALCHIMER Patent applications |
| Patent application number | Title | Published |
|---|
| 20120000785 | DEVICE AND METHOD TO CONDUCT AN ELECTROCHEMICAL REACTION ON A SURFACE OF A SEMI-CONDUCTOR SUBSTRATE - The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: a container ( | 01-05-2012 |
| 20110294231 | METHOD FOR REPAIRING COPPER DIFFUSION BARRIER LAYERS ON A SEMICONDUCTOR SOLID SUBSTRATE AND REPAIR KIT FOR IMPLEMENTING THIS METHOD - Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method. | 12-01-2011 |
| 20100038256 | ELECTROPLATING METHOD FOR COATING A SUBSTRATE SURFACE WITH A METAL - The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. | 02-18-2010 |
| 20100003808 | METHOD OF PREPARING AN ELECTRICALLY INSULATING FILM AND APPLICATION FOR THE METALLIZATION OF VIAS - The present invention essentially relates to a method of preparing an electrically insulating film at the surface of an electrical conductor or semiconductor substrate, such as a silicon substrate. | 01-07-2010 |
| 20090294293 | ELECTRODEPOSITION COMPOSITION AND METHOD FOR COATING A SEMICONDUCTOR SUBSTRATE USING THE SAID COMPOSITION - The present invention relates to an electrodeposition composition intended particularly for coating a semiconductor substrate in order to fabricate structures of the “through via” type for the production of interconnects in integrated circuits. According to the invention, the said solution comprises copper ions in a concentration of between 14 and 120 mM and ethylenediamine, the molar ratio between ethylenediamine and copper being between 1.80 and 2.03 and the pH of the electrodeposition solution being between 6.6 and 7.5. The present invention also relates to the use of the said electrodeposition solution for the deposition of a copper seed layer, and to the method for depositing a copper a seed layer with the aid of the electrodeposition solution according to the invention. | 12-03-2009 |
| 20090183993 | Electroplating Composition for Coating a Substrate Surface with a Metal - The object of the present invention is an electroplating composition intended in particular for coating a copper-diffusion barrier layer in the fabrication of interconnects for integrated circuits. | 07-23-2009 |
| 20080249272 | Modification Process For Polymer Surfaces, Notably For Hydroxylation Of Polymer Surfaces And Products So Obtained - The present invention concerns the use of RO. radicals, R being a hydrogen, an alkyl group having 2 to 15 carbons, an acyl group —COR′ in which R′ represents an alkyl group having 2 to 15 carbons, or an aroyl group —COAr in which Ar represents an aromatic group having 6 to 15 carbons, for the hydroxylation, alkoxylation or oxycarbonylation of polymer surfaces, the said polymers being different from polymers chosen from: polymethylmethacrylate (PMMA) and fluorocarbon polymers when R represents a hydrogen, or of polymer mixture surfaces, notably hydrophobic ones, the said polymers consisting in monomeric units of which at least 50% among these are aliphatic units, and the said RO. radicals being generated by electrochemical or photochemical means. | 10-09-2008 |
