AKRON POLYMER SYSTEMS, INC.
|AKRON POLYMER SYSTEMS, INC. Patent applications|
|Patent application number||Title||Published|
|20140037930||THERMALLY STABLE, FLEXIBLE SUBSTRATES FOR ELECTRONIC DEVICES - A flexible substrate with a high optical transparency (>80% from 400 to 750 nm) that is retained after exposure to 300° C., near-zero birefringence (<±0.001), and a relatively low CTE (<60 ppm/° C.) is disclosed. The substrate may be manufactured as single layer, polyimide films and as a multi-layer laminate comprising a polyimide layer and a thin glass layer. The polyimides may include alicyclic dianhydrides and aromatic, cardo diamines. The films formed of the polyimides can serve as flexible substrates for optical displays and other applications that require their unique combination of properties.||02-06-2014|
|20130216803||THERMALLY STABLE, LOW BIREFRINGENT COPOLYIMIDE FILMS - A class of solvent resistant, flexible copolyimide substrates having high optical transparency (>80% from 400 to 750 nm) that is retained after brief exposure to 300° C., near-zero birefringence (<0.001) and a maximum CTE of approximately 60 ppm/° C. is disclosed. The copolyimides are prepared from alicyclic dianhydrides, aromatic cardo diamines, and aromatic diamines containing free carboxyl groups. The substrates are manufactured from solutions of the copolyimides containing multifunctional epoxides in the form of single layer films, multilayer laminates and glass fiber reinforced composite films. The substrates can be used in the construction of flexible optical displays, and other microelectronic and photovoltaic devices that require their unique combination of properties.||08-22-2013|
|20130011642||AROMATIC POLYAMIDE FILMS FOR SOLVENT RESISTANT FLEXIBLE SUBSTRATES - Films with optical transmittance of >80% between 400 and 750 nm and with CTEs less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have Tgs >300° C. The films are crosslinked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.||01-10-2013|
|20120283371||OPTICAL FILMS CAST FROM STYRENIC FLUOROPOLYMER SOLUTIONS - A method for casting a styrenic fluoropolymer film on a substrate includes preparing a polymer solution by dissolving the fluoropolymer in a solvent or solvent blend whose Hansen solubility parameters (HSPs. MPa||11-08-2012|
Patent applications by AKRON POLYMER SYSTEMS, INC.