| AIR WATER INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120041209 | PROCESS FOR PRODUCING PYRIDINE COMPOUND, AND PYRIDINE COMPOUND - Provided is a process for producing a high-purity pyridine compound from a crude pyridine compound that contains a diazine compound as an impurity, the method including a reaction step of reacting the crude pyridine compound with an aluminum hydride compound, and a distillation step of distilling the product obtained from the reaction step. The aluminum hydride compound preferably contains one or more compounds selected from lithium aluminum hydride and sodium aluminum hydride. | 02-16-2012 |
| 20120009368 | GAS BARRIER FILM, ELECTRONIC DEVICE INCLUDING THE SAME, GAS BARRIER BAG, AND METHOD FOR PRODUCING GAS BARRIER FILM - A gas barrier film in which a gas barrier layer deposited by catalyst CVD in contact with each of both main surfaces of a plastic film is an SiCNFH layer satisfying conditions of 0.01| 01-12-2012 | |
| 20110281404 | METHOD OF SEALING A SEMICONDUCTOR ELEMENT WITH AN EPOXY RESIN COMPOSITION - A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: | 11-17-2011 |
| 20090137725 | PHENOLIC RESIN, PRODUCTION METHOD AND USE THEREOF - Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin. | 05-28-2009 |
| 20090069602 | Process for Producing 2,2'-Bis(Trifluoromethyl)-4,4'-Diaminobiphenyl - A process for producing 2,2′-bis (trifluoromethyl)-4,4′-diaminobiphenyl which is useful as a raw material for polyimide resin, etc. | 03-12-2009 |
