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Aeroflex Microelectronic Solutions
| Aeroflex Microelectronic Solutions Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110037162 | HERMETIC PACKAGING AND METHOD OF FORMING THE SAME - The invention relates to a hermetically sealed semiconductor module and more particularly to repacking a non-hermetically sealed semiconductor module thereby forming a hermetically sealed semiconductor module. | 02-17-2011 |