Adwelds Corporation Patent applications |
Patent application number | Title | Published |
20130152757 | VIBRATION CUTTING APPARATUS - Provided is a technique which can prevent abnormal vibrations from occurring on a resonator and apply, to a putting edge, vibrations with the magnitude of amplitude thereof adjusted in the direction of width of the edge, thereby cutting an object of interest with high accuracy. The resonator ( | 06-20-2013 |
20110088257 | MOUNTING APPARATUS - The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed. | 04-21-2011 |
20110036897 | SUPPORT DEVICE FOR RESONATOR - The purpose of this invention is to provide a support device for a resonator that can support the resonator at an optional location, can let the resonator vibrate with a specified vibration consistently, and can apply an ultrasonic vibration to objects efficiently. By inserting first clamping means and second clamping means, which comprise supporting member at least at each contacting portion, into first portion-to-be-supported and second portion-to-be-supported of resonator, the resonator is supported. As substances of the supporting member, substances that have a logarithmic decrement higher than 0.01 and lower than 1.0 and/or a sound propagation speed of more than 5900 m/s are suitable. | 02-17-2011 |