| Advanced Interconnections Corp. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120003845 | SPLIT RING TERMINAL ASSEMBLY - A connector assembly configured to electrically connect a first substrate with a second substrate is provided. The connector assembly includes an insulating support member including an array of apertures, and terminal assemblies disposed in the apertures. Each terminal assembly includes a hollow cylindrical body, and first and second terminals disposed on opposed ends of the body. The body is split by an opening extending between opposed ends, and resiliency of the body biases the first and second terminals in opposed directions along the longitudinal axis. | 01-05-2012 |
| 20100252311 | TERMINAL ASSEMBLY WITH REGIONS OF DIFFERING SOLDERABILITY - An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material. | 10-07-2010 |
| 20090251874 | SOLDER BALL INTERFACE - An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling component. | 10-08-2009 |
| 20090023311 | TERMINAL ASSEMBLY WITH PIN-RETAINING SOCKET - Socket terminal assemblies and intercoupling components are configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate. The socket terminal assembly includes a socket shell, a pin, and a resilient member. The socket shell includes a portion defining an interior cavity and a protrusion extending inwardly relative to the portion, the protrusion defining an opening into the cavity within the socket shell. The pin includes a first portion having a first outer dimension and defining an interior cavity within the pin, and a second portion having a second outer dimension that is smaller than the first outer dimension. The first pin portion is received within the cavity of the socket shell with the second pin portion extending through the opening and out of the socket shell. In addition, the resilient member is interposed between the socket shell and the pin. | 01-22-2009 |
