ADVANCED COOLING TECHNOLOGIES, INC. Patent applications |
Patent application number | Title | Published |
20150327402 | HEAT MANAGEMENT FOR ELECTRONIC ENCLOSURES - An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure. | 11-12-2015 |
20150191352 | FUEL REFORMING SYSTEM AND PROCESS - Fuel reforming processes and systems are disclosed. The fuel reforming process includes providing a fuel reformer, the fuel reformer comprising a reaction zone configured for exothermic partial oxidation to generate reformates and a heat exchanger extending from the reaction zone, the heat exchanger configured to expel the reformates through a reformate path and receive fuel-rich reactants through a fuel path, generating the reformates by the exothermic partial oxidation of the fuel-rich reactants within the reaction zone, heating the fuel-rich reactants in reaction zone with the heat exchanger by heat from the reformates in the reformate path. The process is energetically self-sustained and operates without a catalyst. The fuel reforming system includes the fuel reformer with a spiral heat exchanger and a component capable of operation with the reformates and incompatible with combustion products, such as a fuel cell. | 07-09-2015 |
20140246095 | MULTI-PHASE PUMP SYSTEM AND METHOD OF PUMPING A TWO-PHASE FLUID STREAM - A multi-phase pump system and method that directs incoming two-phase flow into a fixed cylinder that contains a vortical flow. The system includes a momentum-driven, vortex phase separator, the phase separator accepting liquid-gas flows at any ratio from all liquid to all gas. The pump system also includes a liquid prime mover; a gas prime mover; and a control system. The vortical flow is driven by injecting the two-phase or another fluid stream tangent or approximately tangent to the curved surface of the cylindrical chamber. Inertial forces generated within the vortical flow drive a buoyancy-driven separation process within the cylindrical chamber. Single-phase prime movers are then used to pump the separated phases to a higher pressure. | 09-04-2014 |
20130147050 | SEMICONDUCTOR HAVING INTEGRALLY-FORMED ENHANCED THERMAL MANAGEMENT - A semiconductor structure and method of manufacturing that has integrally-formed enhanced thermal management. During operation of a semiconductor device, electron flow between the source and the drain creates localized heat generation. A containment gap is formed by selectively removing a portion of the back side of the semiconductor device substrate directly adjacent to a localized heat generation area. A thermal management material is filled in the containment gap. This thermal management material enhances the thermal management of the semiconductor device by thermally coupling the localized heat generation area to a heat sink. The thermal management material may be a Phase Change Material (PCM) having a heat of fusion effective for absorbing heat generated in the localized heat generation area by the operation of the semiconductor device for reducing a peak operating temperature of the semiconductor device. | 06-13-2013 |