| ADLINK TECHNOLOGY INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20100064278 | PROGRAMMING SYSTEM AND PROGRAM EXPANDING METHOD - The invention provides a programming system comprising a software component, a client side, and N expanding module. The software component comprises a receiving/processing interface and N first link interface; the client side could be used for transferring client information to the software component through the receiving/processing interface; and each expanding module is corresponding to one of the first link interface and comprises an expanding content. Accordingly, a connecting relation could be built between the software component and one expanding module, corresponding to the client information, of the N expanding module through the first link module, so that the software component can communicate with the expanding module to obtain the expanding content. | 03-11-2010 |
| 20090021918 | STACKED HEAT-TRANSFER INTERFACE STRUCTURE - A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation. Each first heat transfer device comprises a first heat-transfer sheet member having a high heat conductivity and a low thermal resistance and bonded to one first heat generating electronic device, an elastically deformable second heat-transfer sheet member having a low heat conductivity and a high thermal resistance and bonded to the heat plate to compensate for height tolerance of the respective first heat generating electronic device, and a heat-transfer block for spreading heat energy from the first heat-transfer sheet member onto the heat plate through the second heat-transfer sheet member. | 01-22-2009 |
| 20080310095 | Multi-stack storage module board assembly - A multi-stack storage module board assembly includes a host board having an electric connector, multiple brackets mounted on the host board and fastened to one another in a stack, multiple multimedia storage devices respectively mounted in the brackets, and adapter modules mounted on support arms in the brackets to electrically connect the multimedia storage devices to the connector of the host board. Each adapter module has a first connector, which receives one multimedia storage device, a second connector connectable to the connector of the host board, and a third connector for receiving the second connector of another adapter module. | 12-18-2008 |
