ACCURUS SCIENTIFIC CO., LTD. Patent applications |
Patent application number | Title | Published |
20140328719 | LEAD-FREE SOLDER COMPOSITION - A lead-free solder composition includes: 3 wt % to 5 wt % of Ag, 0.2 wt % to 0.8 wt % of Cu, 1 wt % to 7 wt % of Bi, 0.005 wt % to 0.06 wt % of Ni, 0.005 wt % to 0.02 wt % of Ge, and the balance being Sn based on 100 wt % of the lead-free solder composition. | 11-06-2014 |
20140134042 | SILVER-FREE AND LEAD-FREE SOLDER COMPOSITION - A silver-free and lead-free solder composition includes: 2 wt % to 8 wt % of Bi, 0.1 wt % to 1.0 wt % of Cu, 0.01 wt % to 0.2 wt % of at least one of Ni, Fe, and Co, and the balance of Sn based on 100 wt % of the silver-free and lead-free solder composition. | 05-15-2014 |