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IBIDEN CO., LTD
OGAKI-SHI, JP
1. 20090244865 METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD 10-01-20092. 20090243781 METHOD OF MANUFACTURING A CONDUCTOR CIRCUIT, AND A COIL SHEET AND LAMINATED COIL 10-01-2009
3. 20090242261 PRINTED WIRING BOARD AND ASSOCIATED MANUFACTURING METHODOLOGY 10-01-2009
4. 20090242255 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME 10-01-2009
5. 20090242241 FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING SAME 10-01-2009
6. 20090239744 HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE 09-24-2009
7. 20090231827 INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER 09-17-2009
8. 20090218119 METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD 09-03-2009
9. 20090205857 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 08-20-2009
10. 20090188708 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 07-30-2009
11. 20090173523 MULTILAYER BUILD-UP WIRING BOARD - Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another 07-09-2009
12. 20090173522 INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER 07-09-2009
13. 20090143217 ALUMINA-SILICA-BASED FIBER, CERAMIC FIBER, CERAMIC FIBER COMPLEX, RETAINING SEAL MATERIAL, PRODUCTION METHOD THEREOF, AND ALUMINA FIBER COMPLEX PRODUCTION METHOD 06-04-2009
14. 20090140415 COMBINATION SUBSTRATE - includes a first substrate having wiring board mounting pads for installing a printed wiring board and connection pads on an 06-04-2009
15. 20090139760 Multilayer printed wiring board and method of manufacturing the same 06-04-2009
16. 20090120680 METHOD FOR MANUFACTURING A PRINTED WIRING BOARD 05-14-2009
17. 20090120677 WIRING SUBSTRATE AND ASSOCIATED MANUFACTURING METHOD 05-14-2009
18. 20090090003 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 04-09-2009
19. 20090075812 ALUMINA-SILICA-BASED FIBER, CERAMIC FIBER, CERAMIC FIBER COMPLEX, RETAINING SEAL MATERIAL, PRODUCTION METHOD THEREOF, AND ALUMINA FIBER COMPLEX PRODUCTION METHOD 03-19-2009
20. 20090053911 PRINTED BOARD WITH COMPONENT MOUNTING PIN 02-26-2009
21. 20090053910 PRINTED BOARD WITH COMPONENT MOUNTING PIN 02-26-2009
22. 20090038835 MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 02-12-2009
23. 20090029037 PLATING APPARATUS AND METHOD OF PLATING - plating apparatus and method to perform plating in non-through-hole openings or through-hole openings of a 01-29-2009
24. 20090019693 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 01-22-2009
25. 20090016671 MULTILAYER PRINTED CIRCUIT BOARD - The multilayer printed circuit board according to the present invention is a multilayer printed circuit board where 01-15-2009
26. 20090001139 METHOD FOR MANUFACTURING A PRINTED WIRING BOARD 01-01-2009
27. 20090000812 MULTILAYER PRINTED WIRING BOARD - includes a core substrate and a built-up wiring layer formed by alternately layering conductor circuits and insulating 01-01-2009
28. 20080314632 MULTILAYERED PRINTED WIRING BOARD - has a core substrate having a through hole opening with a radius R 12-25-2008
29. 20080310793 OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION 12-18-2008
30. 20080308311 OPTICAL PATH CONVERTING MEMBER, MULTILAYER PRINT CIRCUIT BOARD, AND DEVICE FOR OPTICAL COMMUNICATION 12-18-2008
31. 20080302560 PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD 12-11-2008
32. 20080292852 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 11-27-2008
33. 20080289864 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 11-27-2008
34. 20080289176 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 11-27-2008
35. 20080283580 METHOD FOR MANUFACTURING A PRINTED WIRING BOARD 11-20-2008
36. 20080277148 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD 11-13-2008
37. 20080264686 MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE 10-30-2008
38. 20080253097 INTERPOSER - is constructed with a substrate body having first and second through-holes a capacitor formed by a laminating dielectric layer and a second 10-16-2008
39. 20080247704 PACKAGE SUBSTRATE AND DEVICE FOR OPTICAL COMMUNICATION 10-09-2008
40. 20080247703 SUBSTRATE FOR MOUNTING IC CHIP AND DEVICE FOR OPTICAL COMMUNICATION 10-09-2008
41. 20080247116 INTERPOSER, A METHOD FOR MANUFACTURING THE SAME AND AN ELECTRONIC CIRCUIT PACKAGE 10-09-2008