ASAHI KASEI EMD CORPORATION Patent applications |
Patent application number | Title | Published |
20110114256 | ANISOTROPIC CONDUCTIVE ADHESIVE SHEET AND CONNECTING STRUCTURE - An anisotropic conductive adhesive sheet comprising at least a curing agent, a curable insulating resin and conductive particles, wherein in a region extending from a one-side surface of the anisotropic conductive adhesive sheet along the thickness direction to a position of not greater than 2.0 times the average diameter of the conductive particles, 90% or more of the sum of conductive particles are present, the 90% or more of the sum of conductive particles being present without contact with other conductive particles, and wherein the average diameter of conductive particles is in the range of 1 to 8 μm, the average particle distance between adjacent conductive particles being in the range of 1 to 5 times the average particle diameter and not greater than 20 μm, and wherein the thickness of the anisotropic conductive adhesive sheet is at least 1.5 times the average particle distance but not greater than 40 μm. | 05-19-2011 |
20100277163 | Spatial Information Detecting System, its Detecting Method, and Spatial Information Detecting Device - The present invention relates to a spatial information detecting system. A magnetic sensor driving unit drives a magnetic sensor via a multiplexer unit. Signals of the magnetic sensor are converted from analog signals to digital signals, and are transmitted from a data transmitting unit to an arithmetic unit as magnetic data. A Fourier transform unit calculates the amplitudes and phases of a plurality of frequency components of individual axes from the output signal of the magnetic data receiving unit. A magnetic field vector calculating unit calculates signs of the amplitudes of the individual axes from phase relationships between the plurality of frequency components on the individual axes from the output signal from the Fourier transform unit, and calculates the magnetic field vector representing the direction and magnitude of the magnetic field from the signs and amplitudes. A direction calculating unit calculates the direction of the information terminal. | 11-04-2010 |
20100225517 | Delta-Sigma Modulator - The present invention provides a continuous-time delta-sigma modulator which is configured with an SC (SCR) feedback DA ( | 09-09-2010 |
20100117638 | MAGNETIC SENSOR AND SENSITIVITY MEASURING METHOD THEREOF - The present invention relates to a magnetic sensor with a sensitivity measuring function and a method thereof. Magnetic sensitivity surfaces detect flux density, and a switching unit extracts magnetic field intensity information of each axis, and inputs it to a sensitivity calculating unit. The sensitivity calculating unit calculates the sensitivity from the magnetic field intensity information about the individual axes from the magnetic sensitivity surfaces. The sensitivity calculating unit includes an axial component analyzing unit for analyzing the flux density from the magnetic sensitivity surfaces into magnetic components of the individual axes; a sensitivity decision unit for deciding the sensitivity by comparing the individual axial components of the magnetic field intensity from the axial component analyzing unit with a reference value; and a sensitivity correction unit for carrying out sensitivity correction in accordance with the sensitivity information from the sensitivity decision unit. | 05-13-2010 |
20100090249 | Compound Semiconductor Lamination, Method for Manufacturing the same, and Semiconductor Device - The present invention relates to a compound semiconductor lamination that enables an InSb film to be formed on an Si substrate and enables development of applications to magnetic sensors, such as Hall elements, magneto-resistance elements, etc., optical devices, such as infrared sensors, etc., and electronic devices, such as transistors, etc., to be provided industrially, and a method for manufacturing the compound semiconductor lamination. An active layer, which is a compound semiconductor that does not contain As, is directly formed on an Si substrate. As is present at an interface of the active layer and a single crystal layer of the Si substrate. The compound semiconductor contains at least nitrogen. The compound semiconductor is a single crystal thin film. The Si substrate is a bulk single crystal substrate or a thin film substrate with an uppermost layer being Si. | 04-15-2010 |
20090267239 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition comprising parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more armatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000. | 10-29-2009 |
20090233228 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION - The present invention provides a positive photosensitive resin composition, characterized by comprising 1 to 50 parts by mass of a photo-acid generator and 0.01 to 70 parts by mass of a terpene compound in combination with 100 parts by mass of a hydroxypolyamide having repeating units. A terpene compound can be combined with a hydroxypolyamide having a particular structure to provide a positive photosensitive resin composition excellent in positive lithography performance such as sensitivity and resolution. | 09-17-2009 |
20090160553 | DISTORTION SUPPRESSION CIRCUIT FOR DIGITAL CLASS-D AUDIO AMPLIFIER - A digital Class-D amplifier distortion suppression circuit design is disclosed. A distortion suppression feedback loop is described to improve audio performance by suppressing output stage non-linearity and improving power supply noise rejection achieving reduced THD+N. The feedback loop is placed around the power stage. It forces tracking between the audio band signals at the input and output of the power stage by automatically adjusting the gating signal timing based on sensed effective duty ratio error. Error sensing and compensation are performed using techniques that lend to simple circuit implementation. | 06-25-2009 |
20090139608 | Conductive Filler and Solder Material - There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range. | 06-04-2009 |
20090045807 | POSITION DETECTION APPARATUS - A magnetic flux detection unit and a rectangular solid magnet are provided. The magnetic flux detection unit includes one or more pairs of Hall sensors, each pair having two Hall sensors arranged on a substrate. The solid magnet is arranged movably in a direction in a plane parallel to the substrate. Each pair of two Hall sensors is arranged on the substrate so that a line connecting the centers of magnetism sensing sections of each pair of two Hall sensors is orthogonal to a movement direction of the magnet. A tetragon has a long side and a short side and the long side has a inclination angle to the line connecting the centers of magnetism sensing sections of the each pair of two Hall sensors. The magnet has one N-pole and one S-pole separately magnetized in orthogonal to the substrate on which the Hall sensors are arranged. | 02-19-2009 |
20090029287 | PHOTOSENSITIVE RESIN COMPOSITION - The present invention provides a photosensitive resin composition and a resin film obtained from the photosensitive resin particularly useful for a buffer coating material for LSI chips. For this purpose, there are used a photosensitive resin composition, comprising: 100 parts by weight of a polycondensate obtained by condensation-polymerizing compounds represented by specific chemical formulas in a specific mixing ratio, 0.01 to 5 parts by weight of a photopolymerization initiator and 1 to 30 parts by weight of a specific organosilane, and a resin film obtained by coating the photosensitive resin composition on a silicon wafer surface, exposing the coated film, developing the exposed film, and curing the developed film. | 01-29-2009 |
20090020733 | CONDUCTIVE PASTE - A conductive paste that includes a binder containing a thermosetting resin and conductive particles, in which the lowest exothermic peak temperature T | 01-22-2009 |