POLYTRONICS TECHNOLOGY CORP. Patent applications |
Patent application number | Title | Published |
20160035468 | POSITIVE TEMPERATURE COEFFICIENT DEVICE - A PTC device comprises two electrode layers and a PTC material layer laminated therebetween. The PTC material layer has a volumetric resistivity less than 0.2 Ω-cm, and comprises a crystalline polymer, conductive ceramic fillers and crystalline low molecular weight organic compound. The crystalline polymer comprises thermoplastic polymer, thermosetting polymer or combination thereof. The conductive ceramic fillers dispersed in the crystalline polymer have volumetric resistivity less than 500 μΩ-cm, and comprise 40-70% by volume of the PTC material layer. The crystalline low molecular weight organic compound has a molecular weight less than 5000, and comprises 6-30% by volume of the PTC material layer. The hold current at 60° C. divided by a covered area of the PTC device is greater than 0.2 A/mm | 02-04-2016 |
20150155080 | RADIAL-LEADED OVER-CURRENT PROTECTION DEVICE - A radial-leaded over-current protection device includes a PTC device, first and second electrode leads and an insulating encapsulation layer. The PTC device has first and a second conductive layers and a PTC material layer therebetween. The PTC material layer has a resistivity less than 0.18 Ω-cm and includes crystalline polymer and conductive ceramic filler. The ceramic filler has a resistivity less than 500 Ω-cm and is 35-65% by volume of the PTC material layer. The first electrode lead has an end connecting to the first conductive layer, whereas the second electrode lead has an end connecting to the second conductive layer. The insulating encapsulation layer wraps the PTC device and the ends of the conductive layers. The radial-leaded over-current protection device at 25° C. has a value of hold current thereof divided by an area of the PTC device ranging from 0.027-0.3 A/mm | 06-04-2015 |
20150146334 | OVER-CURRENT PROTECTION DEVICE AND PROTECTIVE CIRCUIT BOARD CONTAINING THE SAME - An over-current protection device adapted to be soldered onto a circuit board comprises a PTC material layer, a first electrode foil, a second electrode foil, a bonding section and a metal connecting member. The PTC material layer has opposite first and second surfaces. The first electrode foil is in physical contact with the first surface, and the second electrode foil electrically connects to the second surface. Both the second electrode foil and the bonding section are disposed on bottom of the device, and the bonding section is separated from the second electrode foil. The metal connecting member is disposed on the lateral surface of the device. The second electrode foil is adapted to be soldered onto an electrode section of the circuit board. The bonding section and the metal connecting member connect to corresponding joint section of the circuit board. | 05-28-2015 |
20150124366 | ANTI-SURGE OVER-CURRENT PROTECTION DEVICE - An anti-surge over-current protection device comprises a PTC material layer, first and second conductive layers. The PTC material layer has opposite first and second planar surfaces. The first conductive layer is in physical contact with the first planar surface and comprises a plurality of first conductive members isolated from each other. The second conductive layer is in physical contact with the second planar surface, and comprises a plurality of second conductive members isolated from each other. The first conductive layer, the PTC material layer and the second conductive layer form a circuit containing first and second conductive paths. In the first conductive path, the PTC material layer forms a first series connection resistive component having at least two resistors. In the second conductive path, the PTC material layer forms a second series connection resistive component having at least two resistors. | 05-07-2015 |
20150036344 | ILLUMINATION APPARATUS - An illumination apparatus comprises a heat sink, at least one light module and an insulating adhesive layer. The light module is disposed on the heat sink, and the insulating adhesive layer is disposed between the light module and heat sink to combine the light module with the heat sink. The insulating adhesive layer comprises polymer component and heat conductive filler dispersed therein. The polymer comprises thermoset epoxy resin. The insulating adhesive layer has heat conductivity greater than 0.5 W/m-K and a thickness of 0.02-10 mm. The bonding strength of the insulating adhesive layer to the heat sink and the light module is greater than 300 g/cm | 02-05-2015 |
20150022929 | OVER-CURRENT PROTECTION DEVICE - An over-current protection apparatus applied to a secondary battery comprises a lead frame, an IC and a PTC device. The lead frame has a carrier portion and two end portions bending therefrom to form an accommodating space. The two end portions electrically connect to positive and negative electrodes of the secondary battery. The carrier portion comprises a plurality of blocks. The IC and PTC device are disposed on the carrier portion and received in the accommodating space and encapsulated by a cover. The PTC device comprises a first electrode and a second electrode, and the first electrode and the second electrode electrically connect to different blocks of the carrier portion. | 01-22-2015 |
20150008360 | HEAT RADIATING MATERIAL - A heat radiating material contains components which comprise 10-45 wt % of titanium dioxide, 5-25 wt % of zirconium dioxide, 2-30 wt % of magnesium oxide, and 0.01-0.5 wt % of an oxide of rare earth metal. The heat radiating material has a heat conductivity of 0.34-1.35 W/m-K, and a radiation efficiency equal to or larger than 88% which is measured in infrared spectroscopy wavelength range 4-14 μm and at a temperature of 40° C.. | 01-08-2015 |
20140374649 | ADHESIVE MATERIAL - An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K. | 12-25-2014 |
20140306605 | PTC COMPOSITION AND RESISTIVE DEVICE AND LED ILLUMINATION APPARATUS USING THE SAME - A PTC composition comprises crystalline polymer and conductive ceramic filler dispersed therein. The crystalline polymer has a melting point less than 90° C. and comprises 5%-30% by weight of the PTC composition. The crystalline polymer comprises ethylene, vinyl copolymer or the mixture thereof. The vinyl copolymer comprises at least one of the functional group selected from the group consisting of ester, ether, organic acid, anhydride, imide or amide. The conductive ceramic filler comprises a resistivity less than 500 μΩ-cm and comprises 70%-95% by weight of the PTC composition. The PTC composition has a resistivity about 0.01-5 Ω-cm and its resistance at 85° C. is about 10 | 10-16-2014 |
20140285938 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device comprises a PTC device, first and second electrodes, a first welding metal plate and a second welding metal plate. The PTC device comprises a first conductive layer, at second conductive layer and a PTC polymeric material layer laminated therebetween. The first electrode electrically connects to the first conductive layer. The second electrode electrically connects to the second conductive layer and is separated from the first electrode. The first welding metal plate is formed on an upper surface of the device and connects to the first electrode. The second welding metal plate is formed on the upper surface or a lower surface of the device and connects to the second electrode. The first and second welding metal plates are placed at two opposite ends of the strip-like structure, and each of them has a thickness sufficient to withstand spot-welding without significant resultant damage to the PTC device. | 09-25-2014 |
20140209365 | OVER-CURRENT PROTECTION DEVICE AND CIRCUIT BOARD STRUCTURE CONTAINING THE SAME - An over-current protection device, which can be surface-mounted and stand upright on a circuit board and withstand 60 to 600 volts, comprises a PTC device, first and second electrodes. The PTC device is a laminated structure comprising first and second conductive layers and a PTC material layer. The first and second conductive layers are in physical contact with first and second planar surfaces of the PTC material layer, respectively. The first electrode is disposed on the first conductive layer. The second electrode is disposed on the second conductive layer and is separated from the first electrode. The first electrode, the second electrode and the PTC device commonly form an end surface which is substantially perpendicular to the first and second planar surfaces. The first electrode and the second electrode at the end surface serve as interfaces electrically connecting to the circuit board. | 07-31-2014 |
20140118871 | SURFACE MOUNTABLE OVER-CURRENT PROTECTION DEVICE - A surface mountable over-current protection device having upper and lower surfaces comprises a PTC device, first and second electrodes, and first and second circuits. The PTC device comprises a PTC material layer and first and second conductive layers. The PTC material layer is disposed between the conductive layers and comprises crystalline polymer and conductive filler dispersed therein. The first electrode comprises a pair of first metal foils, whereas the second electrode comprises a pair of second metal foils. The first circuit connects the first electrode and conductive layer, and has a first planar line extending horizontally. The second circuit connects the second electrode and conductive layer, and has a second planar line extending horizontally. At least one of the planar lines has a thermal resistance sufficient to mitigate heat dissipation by which the over-current protection device undergoes a test at 25° C. and 8 amperes can trip within 60 seconds. | 05-01-2014 |
20140063671 | SURFACE MOUNTABLE OVER-CURRENT PROTECTION DEVICE - A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 Ω-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises a pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface. | 03-06-2014 |
20140049357 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device comprises a PTC material layer, a first electrode layer and a second electrode layer. The PTC material layer has opposite first and second surfaces and opposite first and second lateral surfaces. The first electrode layer is in physical contact with the first surface of the PTC material layer and extends to the first lateral surface. The second electrode layer is in physical contact with the first surface of the PTC material layer and extends to the second lateral surface. The second electrode layer is insulated from the first electrode layer by a first separation. The first electrode layer and the second electrode layer are substantially laterally symmetrical, and serve as interfaces for current flowing in and out of the device when the over-current protection device is in use. | 02-20-2014 |
20140035719 | OVER-CURRENT PROTECTION DEVICE AND METHOD OF MAKING THE SAME - An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PIC devices is less than 0.7 mm. | 02-06-2014 |
20140035718 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device is of an approximately quadrilateral structure with upper and lower surfaces, first and second side surfaces, in which the second side surface contains a bevel. The device comprises first and second electrodes, a first PTC material layer, and first and second conductive connecting members. The first electrode is formed on the upper or lower surface. The second electrode is formed on the lower surface and is insulated from the first electrode. The first PTC material layer extends along the upper surface and has a first surface electrically coupled to the first electrode, and a second surface electrically coupled to the second electrode. The first conductive connecting member is formed on the first side surface and is electrically coupled to the first electrode. The second conductive connecting member is formed on the second side surface and extends along the bevel to electrically couple to the second electrode. | 02-06-2014 |
20130328491 | ILLUMINATION APPARATUS AND POWER SUPPLY VOLTAGE MANAGEMENT METHOD THEREOF - An illumination apparatus includes a rectifier, a linear regulator, a lighting unit and a temperature sensing control circuit. The rectifier is connected to an AC supply voltage. The regulator is electrically connected to the rectifier and is adaptive to a first voltage. The lighting apparatus and the regulator form a circuit coupled to the AC power supply. The lighting unit has first and second loads having respective first and second lighting components adaptive to the first voltage. The control circuit can effectively sense the temperature of the regulator and thereby determines whether the first and second load are connected in series or in parallel. If the supply voltage is the first voltage, the first and second load is connected in parallel. If the supply voltage is a second voltage greater than the first voltage, the temperature sensing control circuit switches the first and second load to be connected in series. | 12-12-2013 |
20130249415 | CURRENT-LIMITING DEVICE AND LIGHT-EMITTING DIODE APPARATUS CONTAINING THE SAME - An LED apparatus includes an LED component and a current-limiting device. The LED component includes at least one LED having a corresponding current-limiting resistance value. The current-limiting device includes a plurality of PTC devices connected in series. The plurality of PTC devices are capable of effectively sensing the temperature of the LED and are electrically coupled to the LED component. The resistance value of the current-limiting device increases with the increment of sensed temperature. The current-limiting device has a resistance close to or equal to the current-limiting resistance value at a temperature at which the LED operates normally. When the temperature of the LED gradually increases to an abnormal temperature, current allowable to be flowed through the current-limiting device gradually decreases to be lower than LED operating current. | 09-26-2013 |
20130215547 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device comprises a resistance material with positive or negative temperature coefficient and an upper surface and a lower surface; a first electrode layer having a first groove, disposed on the upper surface; a first surface mount pad disposed on the upper surface; a second electrode layer disposed on the lower surface, electrically connecting to the first surface mount pad; a second surface mount pad disposed on the lower surface, electrically connecting to the first electrode layer; a second groove electrically separating the fist surface mount pad from the first electrode layer; and a third groove electrically separating the second electrode layer from the second surface mount pad. The first groove divides the first electrode layer into two connected regions. The first and second surface mount pads are separated from each other and one end of the first groove connects to the second groove. | 08-22-2013 |
20130200988 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes two metal foils and a PTC material layer. The PTC material layer is laminated between the two metal foils and has a resistivity less than 0.4 Ω-cm. The PTC material layer includes crystalline polymer and electrically conductive ceramic filler dispersed in the crystalline polymer. The conductive ceramic filler is of HCP structure and includes 70-95% by weight of the PTC material layer. The trip jump value of the over-current protection device after 300 times trip is less than or equal to 25. The resistance repeatability of the device can be effectively improved by adding the conductive ceramic filler. | 08-08-2013 |
20130200987 | THERMISTOR - A thermistor includes a resistive device, a first insulation layer, a first electrode, a second electrode and a first heat-conductive layer. The resistive device includes a first electrically conductive member, a second electrically conductive member and a polymeric material layer laminated therebetween. The polymeric material layer exhibits positive temperature coefficient (PTC) or negative temperature coefficient (NTC) behavior. The first insulation layer is disposed on the first electrically conductive member. The first electrode is electrically coupled to the first electrically conductive member, whereas the second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The first heat-conductive layer is disposed on the first insulation layer, and has a heat conductivity of at least 30 W/m-K and a thickness of 15-250 μm. | 08-08-2013 |
20130187748 | SURFACE MOUNTABLE THERMISTOR - A surface mountable thermistor comprises a resistive device, first and second electrodes, and at least one heat conductive dielectric layer. The resistive device contains first and second electrically conductive members and a polymeric material layer laminated therebetween. The polymeric material layer exhibits PTC or NTC behavior. The polymeric material layer and the first and second electrically conductive members commonly extend in a first direction. The first electrode is electrically coupled to the first electrically conductive member. The second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The heat conductivity of the first electrode or the second electrode is at least 50 W/mK. The heat conductive dielectric layer comprises polymeric insulation matrix and heat conductive filler, and is disposed between the first electrode and the second electrode. The heat conductivity of heat conductive dielectric layer is between 1.2 W/mK-13 W/mK. | 07-25-2013 |
20130176655 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes a resistive device, an insulation layer, an electrode layer and at least one electrically conductive connecting member. The resistive device includes a first electrode foil, a second electrode foil and a positive temperature coefficient (PTC) material layer laminated between the electrode foils. The insulation layer is formed on the surface of the first electrode foil, and the electrode layer is formed on the surface of the insulation layer. The conductive connecting member penetrates the electrode layer, the insulation layer and the first electrode foil for electrically connecting the electrode layer and the first electrode foil. The conductive connecting member is insulated from the second electrode foil. One of the first and second electrode foils is configured to electrically connect to a protective circuit module (PCM), and the other one is configured to electrically connect to an electrode terminal of a battery to be protected. | 07-11-2013 |
20130176654 | OVER-CURRENT PROTECTION DEVICE AND BATTERY PROTECTION CIRCUIT ASSEMBLY CONTAINING THE SAME - An over-current protection device is disposed on a circuit board and configured to protect a battery. The over-current protection device includes a resistive device, at least one insulation layer and a weld electrode layer. The resistive device exhibits positive temperature coefficient behavior. The insulation layer has a thickness of at least 0.03 mm. The weld electrode layer is configured to weld a strip interconnect member to electrically coupled to the battery, and has a thickness of at least 0.03 mm. The insulation layer and the resistive device are disposed between the weld electrode layer and the circuit board. The circuit board, the resistive device and the weld electrode layer are electrically coupled in series. The association of the resistive device and the weld electrode layer has a thermal mass capable of withstanding welding the strip interconnect member without significant damage to the over-current protection device. | 07-11-2013 |
20130070381 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes a first substrate, a second substrate, a first grating electrode, a second grating electrode and a positive temperature coefficient (PTC) material layer. The first grating electrode and the second grating electrode are formed on the first substrate and are interlaced and spaced on a same plane. The PTC material layer is formed on the first substrate, the first grating electrode and the second grating electrode, and between the first grating electrode and the second grating electrode. In an embodiment, the first grating electrode and the second grating electrode serve as a current input port and a current output port, respectively. | 03-21-2013 |
20130070380 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 Ω-cm and 0.32 Ω-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 μm and 50 μm and a volume resistivity less than 0.1 Ω-cm, and a carbon black filler. The weight ratio of the carbon black filler to the conductive ceramic carbide filler is between 1:90 and 1:4. The conductive ceramic carbide filler and the carbon black filler are dispersed in the crystalline polymer. The resistance ratio R | 03-21-2013 |
20130062045 | HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK. | 03-14-2013 |
20130021704 | OVER-CURRENT AND OVER-TEMPERATURE PROTECTION DEVICE - An over-current and over-temperature protection device includes a first conductive member, a second conductive member, a resistive device, at least one current input electrode and at least two current output electrodes. The first conductive member has a current input portion and a first insulative portion restricting current to only input through the current input portion, and the second conductive member has two or more current output portions and a second insulative portion restricting current to only output through the current output portions, in which the current output portions are electrically isolated by the second insulative portion. The resistive device is laminated between the first conductive member and the second conductive member. The current input electrode is electrically connected to the current input portion, and current output electrodes are electrically connected to the current output portions individually. | 01-24-2013 |
20130021703 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes a first conductive member, a second conductive member, a resistive device and a temperature sensing switch. The first conductive member includes a first electrode foil and a second electrode foil those are formed on a same plane. The resistive device is laminated between the first conductive member and the second conductive member and exhibits positive temperature coefficient or negative temperature coefficient behavior. The temperature sensing switch can switch the first electrode foil and the second electrode foil between electrically conductive status and current-restriction status, e.g., open circuit, according to temperature variation. The threshold temperature of the temperature sensing switch is lower than the trip temperature of the resistive device. | 01-24-2013 |
20120182118 | OVER-CURRENT PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME - An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite. | 07-19-2012 |
20120075762 | Over-Current Protection Device - An over-current protection device includes a first electrode layer, a second electrode layer, and a resistance material disposed between the first and second electrode layers. The first electrode layer includes a first groove pattern formed on and through the first electrode layer. The first groove pattern is configured to separate the first electrode layer into a plurality of connected regions. The second electrode layer includes a second groove pattern formed on and through the second electrode layer. The second groove pattern is configured to separate the second electrode layer into a plurality of connected regions. The first and second groove patterns are further configured to be formed in an interlaced manner that when the first and second electrode layers are overlapped, the first and second groove patterns form a plurality of independent regions, which divide the resistance material into a plurality of electrically isolated and parallel connected units. | 03-29-2012 |
20110217462 | METHODS FOR MANUFACTURING INSULATED HEAT CONDUCTIVE SUBSTRATE AND INSULATED HEAT CONDUCTIVE COMPOSITE SUBSTRATE - A method for manufacturing an insulated heat conductive substrate comprises the steps of: performing hydrolysis and condensation of at least one thermally conductive ceramic powder to prepare at least one modified thermally conductive ceramic powder, which comprises a plurality of modified powder particles, each grafted with an organic material; mixing the at least one modified thermally conductive ceramic powder with two substantially mutually soluble polymers to achieve a uniform mixture; blending the uniform mixture with a curing agent to obtain a melt extrudable dielectric curable material; extruding the dielectric curable material through a slit to form a sheet-like substrate; and disposing a first film and a second film on two side surfaces of the substrate to obtain an insulated heat conductive substrate, wherein each of the first and second films can be either a metal foil or a release film. | 09-08-2011 |
20110214852 | HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K. | 09-08-2011 |
20100134942 | SURFACE-MOUNTED OVER-CURRENT PROTECTION DEVICE - A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm | 06-03-2010 |