AZUREWAVE TECHNOLOGIES, INC. Patent applications |
Patent application number | Title | Published |
20150241496 | INTER-STAGE TEST STRUCTURE FOR WIRELESS COMMUNICATION APPARATUS - An inter-stage test structure for a wireless communication apparatus is provided. The wireless communication apparatus has a unit under test (UUT) and a next-stage component connected to the UUT through a signal wire. The inter-stage test structure is disposed on the signal wire and electrically connects the UUT to the next-stage unit component. The inter-stage test structure includes an upper board, a lower board, and an intermediate layer. The intermediate layer is disposed between the upper board and the lower board. The intermediate layer includes a first region and a second region defined thereon. The first region has an air cavity for generating an air impedance. The second region has an impedance adjusting cavity for generating an adjustable impedance. Accordingly, the inter-stage test structure can detect the condition of the UUT of the wireless communication apparatus based on the air impedance and the adjustable impedance. | 08-27-2015 |
20150131230 | MODULE IC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. Whereby, the heat-dissipating efficiency of the module IC package structure can be increased by matching the heat-dissipating base layer and the heat-dissipating auxiliary layers. | 05-14-2015 |
20150130034 | MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELDING FUNCTION AND METHOD FOR MANUFACTURING THE SAME - A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate and a grounding layer disposed inside the circuit substrate. The grounding layer is exposed from the outer surrounding peripheral surface of the circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The electronic components are electrically connected to the grounding layer through the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer disposed on the outer surface of the package gel body and the surrounding peripheral surface of the circuit substrate. The metal shielding layer directly contacts the grounding layer, thus the electronic components are electrically connected to the metal shielding layer through the grounding layer. | 05-14-2015 |
20150130033 | MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELDING FUNCTION AND METHOD FOR MANUFACTURING THE SAME - A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit including a circuit substrate, a grounding layer disposed inside the circuit substrate, and an outer conductive structure disposed on the outer surrounding peripheral surface of the circuit substrate. The outer conductive structure includes a plurality of outer conductive layers. The grounding layer is exposed from the circuit substrate for directly contacting the outer conductive layers. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer enclosing the package gel body and directly contacting the outer conductive structure. Whereby, the grounding layer is electrically connected to the metal shielding layer through the outer conductive structure directly. | 05-14-2015 |
20150053849 | SENSOR PACKAGE STRUCTURE AND PRODUCTION APPARATUS FOR MANUFACTURING THE SAME - A sensor package structure includes a sensing die, a light-filtering sheet, and an annular pressure-sensitive adhesive sheet. An active surface of the sensing die has a sensing region and a connecting region around the sensing region. The periphery contour of sensing die is greater than or equal to the periphery contour of light-filtering sheet. The pressure-sensitive adhesive sheet has two opposite adhesive surfaces and defines an opening. The adhesive surfaces respectively adhere to the connecting region of the sensing die and the inner surface of the light-filtering sheet, and the sensing region faces the inner surface of the light-filtering sheet via the opening. The sensing region is sealed by the pressure-sensitive adhesive sheet and the light-filtering sheet. Thus, the instant disclosure provides the sensor package structure with low cost, high capacity, and high yield. Moreover, the instant disclosure provides a production apparatus for manufacturing the sensor package structure. | 02-26-2015 |
20150049241 | WIRELESS CAMERA APPARATUS AND WIRELESS CAMERA DEVICE - A wireless camera apparatus includes a power supply track and a wireless camera device detachably installed on the power supply track. The wireless camera device has a camera module and a linking module fixed on the camera module. The linking module has a connecting unit and a conductive unit electrically connected to the camera module. When the wireless camera device is installed on the power supply track, the connecting unit is coupled to the power supply track, and the conductive unit is electrically connected to the power supply track. Thus, the instant disclosure provides the wireless camera apparatus, which is adjustable to any position of the power supply track according to the user's demand. Besides, the instant disclosure further provides a wireless camera device. | 02-19-2015 |
20150048386 | IMAGE SENSING MODULE AND METHOD OF MANUFACTURING THE SAME - An image sensing module includes an image sensing unit, a light transmitting unit, a substrate unit and lens unit. The image sensing unit includes an image sensing element having an image sensing area on the top side of the image sensing element. The light transmitting unit includes a light transmitting element supported above the image sensing element by a plurality of support members. The substrate unit includes a flexible substrate disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, and the flexible substrate has at least one through opening for receiving the light transmitting element. The lens unit includes an opaque holder disposed on the flexible substrate to cover the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element. | 02-19-2015 |
20150029694 | BULB TYPE APPARATUS AND BULB SOCKET - The bulb socket comprises a main body, a lighting module, and an adapter cover. The main body has a head portion and a carrying portion arranged on two opposite end portions thereof. The lighting module is fixed on the carrying portion of the main body and electrically connecting to the head portion. The adapter cover module has a translucent cover and a power supply. The translucent cover is disposed on the carrying portion of the main body for allowing light generated from the lighting module to go through the translucent cover. The translucent cover has a receiving compartment. The power supply unit is disposed on the receiving compartment and electrically connecting to the head portion. Thus, the bulb socket of the instant disclosure can be used for being inserted by an electronic device. | 01-29-2015 |
20140176433 | INTERACTIVE PROJECTION SYSTEM, PROJECTOR THEREOF, AND CONTROL METHOD THEREOF - The present invention discloses an interactive projection system including a pointing device and a projector. The pointing device is used to generate a light spot. The projector includes a projecting module, an image capturing module, and a processing module, and the projector includes a built-in operating system. The operating system includes a plurality of applications with graphical user interfaces. The projecting module projects a projected image being present of the operating system onto a screen. The image capturing module captures an image generated by projecting the light spot onto the screen. The processing module calculates a coordinate of the light spot according to the above-mentioned image, and determines whether the light spot has stayed on the graphical user interface associated with one of the applications on the projection screen, so as to execute the application corresponding to the light spot. | 06-26-2014 |
20140139808 | PROJECTION DEVICE FOR INCREASING LIGHT-TRANSMITTING EFFICIENCY - A projection device for increasing light-transmitting efficiency includes a light-emitting unit, a light-guiding unit, an image display module and an image projection unit. The light-emitting unit includes a first light-emitting module for generating a first predetermined light source, a second light-emitting module for generating a second predetermined light source, and a third light-emitting module for generating a third predetermined light source. The light-guiding unit includes at least one photonic crystal fiber structure having a first light input terminal for receiving the first predetermined light source, a second light input terminal for receiving the second predetermined light source, a third light input terminal for receiving the third predetermined light source, and a light output terminal. The image display module is corresponding and adjacent to the light output terminal. The image projection unit includes at least one projection lens corresponding and adjacent to the image display module. | 05-22-2014 |
20140125756 | AUDIOVISUAL APPARATUS FOR REDUCING ECHO - The present disclosure relates to an audiovisual apparatus, which includes an audiovisual capturing unit, an audiovisual broadcast unit, and a transmission cable module. The two ends of the transmission cable module are respectively connected to the audiovisual capturing unit and the audiovisual broadcast unit. The transmission cable module has a video cable group for transmitting video signals and an audio cable group for transmitting audio signals suitable for reducing echo. The audio cable group includes a cable for providing a digital clock for the audio signal, a cable for providing a clock for the left right channel switching audio signal, a cable for inputting serial audio signal, and a cable for outputting serial audio signal. With this arrangement, the audio signals captured by the audiovisual capturing unit and transmitted by the transmission cable module to the audiovisual broadcast unit can be effectively removed of echo. | 05-08-2014 |
20130307105 | IMAGE-SENSING MODULE FOR REDUCING ITS WHOLE THICKNESS - An image-sensing module for reducing its whole thickness includes a substrate unit, a carrier unit, an image-sensing unit and a lens unit. The substrate unit includes a substrate body and a through opening passing through the substrate body. The carrier unit includes a carrier body disposed on the bottom surface of the substrate body and corresponding to the through opening. The image-sensing unit includes an image-sensing element disposed on the top surface of the carrier body and embedded in the through opening. The lens unit includes an opaque frame disposed on the top surface of the carrier body to surround the image-sensing element and a lens connected to the opaque frame and positioned above the image-sensing element. Hence, the whole thickness of the image-sensing module can be reduced due to the design of placing the substrate body, the image-sensing element and the opaque frame on the carrier body. | 11-21-2013 |
20130279028 | SLIDING MECHANISM AND ELECTRONIC DEVICE USING THE SAME - The instant disclosure relates to a lens structure, which includes a mounting seat, a sliding carriage, a lens cover, and at least one elastic member, wherein the mounting seat has a first through-hole formed thereon and defines two operating positions, the sliding carriage slidably coupled to the mounting seat and having a second through-hole formed thereon, wherein the second through-hole corresponds to the first through-hole in one operating position, the lens cover arranged on the sliding carriage and having a plurality of heat-dissipating holes formed thereon in correspondence with the second through-hole, one end of the elastic member fixed to the mounting seat, and the other end of the elastic member fixed to the sliding carriage, wherein the sliding carriage is urged to move a predetermined distance form one operating position, the elastic member provides resilient force to drive the sliding carriage to another operating position. | 10-24-2013 |
20130256492 | THIN-TYPE COLLAPSIBLE FOOT STAND - A thin-type collapsible foot stand includes a base unit, a first rotatable unit and a second rotatable unit. The base unit includes a base body having a first pivot portion, a first connection portion and a first extending portion. The first rotatable unit includes a rotatable platform having a second pivot portion corresponding to the first extending portion, a second connection portion corresponding to the first connection portion, and a second extending portion corresponding to the first pivot portion. The second rotatable unit includes two rotatable support frames. Each rotatable support frame includes a support body disposed between the base body and the rotatable platform, a first pivot structure connected between one end portion of the support body and the first pivot portion, and a second pivot structure connected between the other end portion of the support body and the second pivot portion. | 10-03-2013 |
20130234534 | POWER SOCKET WITH WIRELESS COMMUNICATION CAPABILITY, SYSTEM HAVING THE SAME AND METHOD THEREOF - This instant disclosure provides a power socket with wireless communication capability including a case, a power input unit, a power output unit, a switch, and a wireless communication module. The power input unit is used for electrically coupling to a power source. The power output unit is used to output an electrical power of the power source. The switch is electrically coupled between the power input unit and the power output unit for controlling whether the power output unit outputs the electrical power of the power source. The wireless communication module is electrically coupled to the power input unit and the switch for wireless receiving a control signal. The wireless communication module controls the switch according to the control signal. Therefore, the power socket outputs or not outputs the electrical power of the power source to an electrical device according to the control signal. | 09-12-2013 |
20130234272 | IMAGE-SENSING MODULE - An image-sensing module includes a substrate unit, a light-transmitting unit, an image-sensing unit and a lens unit. The substrate unit includes at least one flexible substrate having at least one through opening. The light-transmitting unit includes at least one light-transmitting element disposed on the top surface of the flexible substrate and corresponding to the through opening. The image-sensing unit includes at least one image-sensing element disposed on the bottom surface of the light-transmitting element and embedded in the through opening, and the image-sensing element is electrically connected to the flexible substrate. The lens unit includes an opaque frame disposed on the top surface of the flexible substrate to surround the light-transmitting element and a lens positioned on the opaque frame to correspond to the light-transmitting element. | 09-12-2013 |
20130162597 | OPTICAL TOUCH CONTROL MODULE - An optical touch control module for providing at least one sensing area includes: a light-reflecting unit, a first light-sensing unit and a second light-sensing unit. The light-reflecting unit includes a light-reflecting element for partially surrounding the at least one sensing area. The first light-sensing unit is disposed beside one edge of the at least one sensing area and adjacent to one end of the light-reflecting element. The first light-sensing unit includes at least one first light-emitting element, at least one first light-detecting element, and at least one first oscillating reflecting element oscillating depending on time. The second light-sensing unit is disposed beside another edge of the at least one sensing area and adjacent to another end of the light-reflecting element. The second light-sensing unit includes at least one second light-emitting element, at least one second light-detecting element, and at least one lens element. | 06-27-2013 |
20130161491 | OPTICAL TOUCH CONTROL MODULE - An optical touch control module for providing at least one sensing area includes: a light-reflecting unit, a first light-sensing unit and a second light-sensing unit. The light-reflecting unit includes a light-reflecting element for partially surrounding the sensing area. The first light-sensing unit is disposed beside one edge of the at least one sensing area and adjacent to one end of the light-reflecting element. The first light-sensing unit includes at least one first light-emitting element, at least one first light-detecting element, and at least one first oscillating reflecting element oscillating depending on time. The second light-sensing unit is disposed beside another edge of the at least one sensing area and adjacent to another end of the light-reflecting element. The second light-sensing unit includes at least one second light-emitting element, at least one second light-detecting element, and at least one second oscillating reflecting element oscillating depending on time. | 06-27-2013 |
20130158933 | SYSTEM OF TESTING MULTIPLE RF MODULES AND METHOD THEREOF - This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module. | 06-20-2013 |
20130113089 | MODULE IC PACKAGE STRUCTURE HAVING A METAL SHIELDING FUNCTION FOR PREVENTING ELECTRICAL MALFUNCTION INDUCED BY SHORT-CIRCUIT - A module IC package structure having a metal shielding function includes a substrate unit, an electronic unit, a shielding unit, and an insulative unit. The substrate unit includes a substrate body and at least one grounding pad disposed on the substrate body. The electronic unit includes at least one electronic module disposed on the circuit substrate and electrically connected to the circuit substrate. The shielding unit includes a metal shielding layer formed on an external surface of the at least one electronic module, and the metal shielding layer contacts the at least one grounding pad. The insulative unit includes an insulative layer formed on an external surface of the metal shielding layer. Hence, the module IC package structure can be used to prevent electrical malfunction induced by short-circuit due to the design of forming the insulative layer formed on the external surface of the metal shielding layer. | 05-09-2013 |
20130009175 | VERTICAL STACKED LIGHT EMITTING STRUCTURE - A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially. | 01-10-2013 |
20130009174 | VERTICAL STACKED LIGHT EMITTING STRUCTURE - A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially. | 01-10-2013 |
20120211876 | MODULE IC PACKAGE STRUCTURE - A module IC package structure includes a substrate unit, a radio frequency unit, an inner shielding unit, an insulative package unit, and an outer shielding unit. The substrate unit includes a circuit substrate. The radio frequency unit includes at least one radio frequency element disposed on and electrically connected to the circuit substrate. The inner shielding unit includes an inner metal shielding layer formed on a predetermined surface of the radio frequency element. The insulative package unit includes an insulative package resin body disposed on the circuit substrate to cover the radio frequency element. The outer shielding unit is formed on the outer surface of the insulative package resin body and electrically connected to the circuit substrate. The inner metal shielding layer is a radio frequency property maintaining layer disposed between the radio frequency element and one part of the outer shielding unit for shielding the radio frequency element. | 08-23-2012 |
20120162930 | MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELD FUNCTION AND METHOD FOR MAKING THE SAME - A module IC package structure with electrical shield function includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one conductive element disposed on the circuit substrate, and the conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the conductive element, and the conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion. | 06-28-2012 |
20120139089 | MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME - A module IC package structure includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one elastic conductive element disposed on the circuit substrate, and the elastic conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the elastic conductive element, and the elastic conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion. | 06-07-2012 |
20110304379 | SIGNAL MATCHING MODULE WITH COMBINATION OF ELECTRONIC COMPONENTS FOR SIGNAL MATCHING OF SINGLE OR MULTIPLE SUBSYSTEMS - A signal matching module for a single or multiple subsystems is disclosed. The signal matching module includes a plurality of electronic components with a first part of the electronic components categorized into external electronic components and a second part of the electronic components categorized into internal components. Each of the electronic components may correspond to a switch that is controllable by a corresponding control pin. And the external electronic components may be used to compensate the internal electronic components when the latter fail to cause the impedance to reach the desired level. One of the embodiments is to provide a unit cell which is used to connect with one or multiple subsystems, and an external communication port to which the external electronic components are connected serving as a feeding point for the purpose of better impedance matching. | 12-15-2011 |
20110253885 | IMAGE-CAPTURING MODULE FOR SIMPLIFYING OPTICAL COMPONENT AND REDUCING ASSEMBLY TIME - An image-capturing module for simplifying optical component and reducing assembly time includes a substrate unit, an image-capturing unit, a cover unit, a light-emitting unit and an optical imaging unit. The image-capturing unit has at least one image-capturing element electrically disposed on the substrate unit. The cover unit has at least one cover element disposed on the substrate unit and covering the image-capturing element, and the cover element has an opening for exposing the image-capturing element. The light-emitting unit has at least one light-emitting element electrically disposed on the substrate unit. The optical imaging unit has a light-guiding element disposed on the cover element for receiving light beams generated by the light-emitting element and an imaging element connected with the light-guiding element and disposed in the opening of the covering element. The light-guiding element and the imaging element are integrated with each other to form one piece. | 10-20-2011 |
20110215695 | LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY - An LED package structure for increasing light-emitting efficiency includes a heat-dissipating unit, an insulating unit, a light-emitting unit and a conductive unit. The heat-dissipating unit has a heat-dissipating substrate. The insulating unit has an insulating layer formed on the heat-dissipating substrate and at least one receiving groove passing through the insulating layer and formed above the heat-dissipating substrate. The insulating layer has a top surface on a top side thereof and an inner surface, and the inner surface of the insulating layer is an annular inclined surface in the receiving groove. The light-emitting unit has at least one light-emitting element received in the receiving groove and disposed on the heat-dissipating substrate. The conductive unit has at least two conductive structures disposed on the insulating layer and separated from each other, and the light-emitting element has two electrodes respectively electrically connected to the two conductive structures via two conductive wires. | 09-08-2011 |
20100220450 | PACKAGING STRUCTURE OF SIP AND A MANUFACTURING METHOD THEREOF - A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module. | 09-02-2010 |
20090079447 | TESTING SYSTEM FOR A RADIO FREQUENCY MODULE - A testing system for a RF module includes a metal casing formed a testing space therein, a RF testing socket disposed inside the testing module, and a pressing manipulator penetrating through the metal casing. A shielding material layer is disposed on the internal surface of the metal casing so that the RF signal is isolated inside the metal casing. An end of the pressing manipulator extends into the testing space. The pressing manipulator is controlled automatically and provides for a pressure on a RF module disposed on the testing module so as to execute a testing process. As mentioned above, the testing set for a RF module can prevent from RF testing interference and the testing manufacture efficiency is improved. | 03-26-2009 |
20090077226 | METHOD AND SYSTEM OF AUTO-MONITORING NETWORK PORTS - A method of auto-monitoring network ports includes the steps of: receiving at least one path of an application program; detecting whether or not the application program represented by the received path needs at least one network port; notifying a router to open the relative network port required by the application program if the detecting result indicates that the application program needs the network port; and notifying the router to close the relative network port required by the application program if the detecting result indicates that the application program no longer needs the network port. Hence, the present invention can achieve the purpose of exempting users from a mandatory setup of network ports for the router according to different application programs. | 03-19-2009 |
20090051461 | OUTPUT POWER DETECTING SYSTEM WITH A DIRECTIONAL COUPLER - A output power detecting system with a directional coupler has a directional coupler at the output terminal of the output power detecting system. The directional coupler includes a main line, a first sub line, and a second sub line. The output of the power amplifying unit is fully coupled to a power detecting unit via the coupling between the main line and the first sub line, and the external noise is coupled to the ground via the coupling between the first sub line and the second sub line. Therefore, the power detecting unit accurately detects the output power of the output power detecting system. | 02-26-2009 |
20090039479 | MODULE FOR INTEGRATING PERIPHERAL CIRCUIT AND A MANUFACTURING METHOD THEREOF - A module for integrating peripheral circuit includes a silicon chip substrate, at least one peripheral circuit unit, and at least one main circuit unit. The peripheral circuit unit is integrated in the silicon chip substrate via a semiconductor manufacturing process. The main circuit unit is mounted on the surface of the silicon chip substrate and is electrically connected with the peripheral circuit unit for transmitting the signal. Thereby, the dimension of the module is reduced. | 02-12-2009 |
20090021329 | CHIP-LEVEL THROUGH HOLE STRUCTURE OF ELECTRONIC PACKAGE - A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference. | 01-22-2009 |
20090010230 | AUTOMATIC WIRELESS NETWORK LINKING METHOD WITH SECURITY CONFIGURATION AND DEVICE THEREOF - An automatic wireless network linking method with a security configuration includes: providing an access point with a floating service set identifier and a shared key. The floating service set identifier has a prefix name. Next, a host system is provided to execute a setting and linking application to automatically scan the access point with the prefix name and obtain the floating service set identifier of the access point. Both the access point and the setting and linking application perform an operation process to generate a dynamic key. The dynamic key is converted into a wireless network encryption algorithm. Finally, the host system links to the access point to perform wireless communication, and uses the wireless network encryption algorithm to encrypt and decrypt data. Thereby, the time required for setting up the wireless network platform is reduced. | 01-08-2009 |
20090009584 | WIRELESS IMAGE SIGNAL TRANSMISSION DEVICE - A wireless image signal transmission device includes a wireless receiving and sending unit, an image-obtaining unit, and a control unit. The image-obtaining unit is used for obtaining an image signal. The control unit is electrically connected between the wireless receiving and sending unit and the image-obtaining unit. The control unit includes an image-processing unit, a plurality of first expanding interface units, and a core unit. The core unit is electrically connected with the image-processing unit and the first expanding interface unit so that the image-processing unit processes the image data received by the first expanding interface unit and converts the processed image data into a wireless network signal. Next, the wireless receiving and sending unit transmits the wireless network signal to the application system. Thereby, it is easy to integrate the system and can be applied to a variety of application fields. | 01-08-2009 |