Innovative Silicon ISi SA Patent applications |
Patent application number | Title | Published |
20110273947 | TECHNIQUES FOR REFRESHING A SEMICONDUCTOR MEMORY DEVICE - Techniques for refreshing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for refreshing a semiconductor memory device may include applying a plurality of voltage potentials to a memory cell in an array of memory cells. Applying a plurality of voltage potentials to the memory cell may include applying a first voltage potential to a first region of the memory cell via a respective source line of the array. Applying a plurality of voltage potentials to the memory cells may also include applying a second voltage potential to a second region of the memory cell via a respective local bit line and a respective selection transistor of the array. Applying a plurality of voltage potentials to the memory cells may further include applying a third voltage potential to a respective word line of the array, wherein the word line may be spaced apart from and capacitively to a body region of the memory cell that may be electrically floating and disposed between the first region and the second region. Applying a plurality of voltage potentials to the memory cells may further include applying a fourth voltage potential to a third region of the memory cell via a respective carrier injection line of the array. | 11-10-2011 |
20110273941 | TECHNIQUES FOR REFRESHING A SEMICONDUCTOR MEMORY DEVICE - Techniques for refreshing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell may include a first region coupled to a source line and a second region coupled to a carrier injection line. Each memory cell may also include a body region capacitively coupled to at least one word line and disposed between the first region and the second region and a decoupling resistor coupled to at least a portion of the body region. | 11-10-2011 |
20110222356 | TECHNIQUES FOR PROVIDING A SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell including a first region, a a second region, and a body region capacitively coupled to at least one word line and disposed between the first region and the second region. Each memory cell also including a third region, wherein the third region may be doped differently than the first region, the second region, and the body region. | 09-15-2011 |
20110216617 | TECHNIQUES FOR SENSING A SEMICONDUCTOR MEMORY DEVICE - Techniques for sensing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the technique(s) may be realized as a semiconductor memory device comprising a plurality of memory cells arranged in an array of rows and columns and data sense amplifier circuitry coupled to at least one of the plurality of memory cells. The data sense amplifier circuitry may comprise first amplifier circuitry and resistive circuitry, wherein the first amplifier circuitry and the resistive circuitry may form a feedback loop. | 09-08-2011 |
20110216608 | TECHNIQUES FOR READING FROM AND/OR WRITING TO A SEMICONDUCTOR MEMORY DEVICE - Techniques for reading from and/or writing to a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus including a first memory cell array having a first plurality of memory cells arranged in a matrix of rows and columns and a second memory cell array having a second plurality of memory cells arranged in a matrix of row and columns. The apparatus may also include a data sense amplifier latch circuitry having a first input node and a second input node. The apparatus may further include a first bit line input circuitry configured to couple the first memory cell array to the first input node of the data sense amplifier latch circuitry and a second bit line input circuitry configured to couple the second memory cell array to the second input node of the data sense amplifier latch circuitry. | 09-08-2011 |
20110216605 | TECHNIQUES FOR PROVIDING A SEMICONDUCTOR MEMORY DEVICE HAVING HIERARCHICAL BIT LINES - Techniques for providing a semiconductor memory device having hierarchical bit lines are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells and a plurality of local bit lines coupled directly to the plurality of memory cells. The semiconductor memory device may also include a multiplexer coupled to the plurality of local bit lines and a global bit line coupled to the multiplexer. | 09-08-2011 |
20110199848 | TECHNIQUES FOR CONTROLLING A SEMICONDUCTOR MEMORY DEVICE - Techniques for controlling a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for controlling a semiconductor memory device including applying a plurality of voltage potentials to a plurality of memory cells arranged in an array of rows and columns. Applying the plurality of voltage potentials to the plurality of memory cells may include applying a first voltage potential to a first memory cell in a row of the array via a first respective bit line and a first switch transistor, applying a second voltage potential to a second memory cell in the row of the array via a second respective bit line and a second switch transistor, and applying a third voltage potential to at least one third memory cell in the row of the array via at least one third respective bit line and at least one third switch transistor, wherein the at least one third memory cell may be located between the first memory cell and the second memory cell in the row of the array. | 08-18-2011 |
20110141836 | TECHNIQUES FOR REDUCING IMPACT OF ARRAY DISTURBS IN A SEMICONDUCTOR MEMORY DEVICE - Techniques for reducing impact of array disturbs in a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for reducing impact of array disturbs in a semiconductor memory device by increasing the refresh rate to the semiconductor memory device based at least in part on a frequency of active operations. The method may comprise receiving a first refresh command including a first subarray address to perform a first refresh operation to a first logical subarray of memory cells associated with the first subarray address. The method may also comprise receiving a second refresh command including a second subarray address to perform a second refresh operation to a second logical subarray of memory cells associated with the second subarray address, wherein the second refresh command is received after a time period from the reception of the first refresh command. The method may further comprise performing a number of concurrent refresh operations during the time period. | 06-16-2011 |
20110122687 | TECHNIQUES FOR REDUCING DISTURBANCE IN A SEMICONDUCTOR DEVICE - Techniques for reducing disturbance in a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device having reduced disturbance. The semiconductor memory device may comprise a plurality of memory cells arranged in arrays of rows and columns. The semiconductor memory device may also comprise a plurality of data sense amplifiers, coupled to the plurality of memory cells, configured to perform one or more operations during an operation/access cycle, wherein the operation/access cycle may comprise an operation segment and a disturbance recovery segment. | 05-26-2011 |
20110058436 | TECHNIQUES FOR SENSING A SEMICONDUCTOR MEMORY DEVICE - Techniques for sensing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus including a memory cell array comprising a plurality of memory cells. The apparatus may also include a first data sense amplifier circuitry including an amplifier transistor having a first region coupled to at least one of the plurality of memory cells via a bit line. The apparatus may further include a data sense amplifier latch circuitry including a first input node coupled to the data sense amplifier circuitry via a second region of the amplifier transistor. | 03-10-2011 |
20110019482 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. At least one of the plurality of memory cells may include a first region coupled to a respective bit line of the array and a second region coupled to a respective source line of the array. At least one of the plurality of memory cells may also include a body region spaced apart from and capacitively coupled to a respective word line of the array, wherein the body region may be electrically floating and disposed between the first region and the second region. At least one of the plurality of memory cells may further include a third region coupled to a respective carrier injection line of the array and wherein the respective carrier injection line may be one of a plurality of carrier injection lines in the array that are coupled to each other. | 01-27-2011 |
20110019481 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device including the steps of applying a first non-negative voltage potential to a first region via a bit line and applying a second non-negative voltage potential to a second region via a source line. The method may also include applying a third voltage potential to a word line, wherein the word line may be spaced apart from and capacitively to a body region that may be electrically floating and disposed between the first region and the second region. The method may further include applying a fourth positive voltage potential to a third region via a carrier injection line, wherein the third region may be disposed below at least one of the first region, the body region, and the second region. | 01-27-2011 |
20110019479 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region coupled to a source line, a second region coupled to a bit line. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region coupled to a carrier injection line configured to inject charges into the body region through the second region. | 01-27-2011 |
20110007578 | TECHNIQUES FOR PROVIDING A SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus including a first region and a second region. The apparatus may also include a body region disposed between the first region and the second region and capacitively coupled to a plurality of word lines, wherein each of the plurality of word lines is capacitively coupled to different portions of the body region. | 01-13-2011 |
20100296327 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region connected to a bit line extending in a first orientation and a second region connected to a source line extending in a second orientation. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line extending in the second orientation, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region connected to a carrier injection line extending in the second orientation, wherein the first region, the second region, the body region, and the third region are disposed in sequential contiguous relationship. | 11-25-2010 |
20100277982 | SEMICONDUCTOR DEVICE WITH FLOATING GATE AND ELECTRICALLY FLOATING BODY - Techniques for providing floating body memory devices are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor device comprising a floating gate, a control gate disposed over the floating gate, a body region that is electrically floating, wherein the body region is configured so that material forming the body region is contained under at least one lateral boundary of the floating gate, and a source region and a drain region adjacent the body region. | 11-04-2010 |
20100271880 | TECHNIQUES FOR CONTROLLING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for controlling a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for controlling a direct injection semiconductor memory device. The method may comprise applying a first voltage potential to a first region via a bit line and applying a second voltage potential to a second region of the memory device via a source line. The method may also comprise applying a control voltage potential to a body region of the memory device via a word line that is spaced apart and capacitively coupled to the body region, wherein the body region is electrically floating and disposed between the first region and the second region. The method may further comprise applying a third voltage potential to a third region of the memory device via a carrier injection line in order to bias at least one of the first region, the second region, the third region, and the body region to perform one or more operations. | 10-28-2010 |
20100271858 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE HAVING GANGED CARRIER INJECTION LINES - Techniques for providing a direct injection semiconductor memory device having ganged carrier injection lines are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus including a first region coupled to a bit line and a second region coupled to a source line. The apparatus may also comprise a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The apparatus may further comprise a third region coupled to a constant voltage source via a carrier injection line configured to inject charges into the body region through the second region. | 10-28-2010 |
20100271857 | TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for biasing a direct injection semiconductor memory device. The method may comprise applying a first voltage potential to a first N-doped region via a bit line and applying a second voltage potential to a second N-doped region via a source line. The method may also comprise applying a third voltage potential to a word line, wherein the word line is spaced apart from and capacitively coupled to a body region that is electrically floating and disposed between the first N-doped region and the second N-doped region. The method may further comprise applying a fourth voltage potential to a P-type substrate via a carrier injection line. | 10-28-2010 |
20100259964 | TECHNIQUES FOR PROVIDING A SEMICONDUCTOR MEMORY DEVICE - Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell may include a first region connected to a source line extending in a first orientation. Each memory cell may also include a second region connected to a bit line extending a second orientation. Each memory cell may further include a body region spaced apart from and capacitively coupled to a word line, wherein the body region is electrically floating and disposed between the first region and the second region. The semiconductor device may also include a first barrier wall extending in the first orientation of the array and a second barrier wall extending in the second orientation of the array and intersecting with the first barrier wall to form a trench region configured to accommodate each of the plurality of memory cells. | 10-14-2010 |
20100224924 | TECHNIQUES FOR FORMING A CONTACT TO A BURIED DIFFUSION LAYER IN A SEMICONDUCTOR MEMORY DEVICE - Techniques for forming a contact to a buried diffusion layer in a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device. The semiconductor memory device may comprise a substrate comprising an upper layer. The semiconductor memory device may also comprise an array of dummy pillars formed on the upper layer of the substrate and arranged in rows and columns. Each of the dummy pillars may extend upward from the upper layer and have a bottom contact that is electrically connected with the upper layer of the substrate. The semiconductor memory device may also comprise an array of active pillars formed on the upper layer of the substrate and arranged in rows and columns. Each of the active pillars may extend upward from the upper layer and have an active first region, an active second region, and an active third region. Each of the active pillars may also be electrically connected with the upper layer of the substrate. | 09-09-2010 |
20100210075 | TECHNIQUES FOR PROVIDING A SOURCE LINE PLANE - Techniques for providing a source line plane are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for providing a source line plane. The apparatus may comprise a source line plane coupled to at least one constant voltage source. The apparatus may also comprise a plurality of memory cells arranged in an array of rows and columns, each memory cell including one or more memory transistors. Each of the one or more memory transistors may comprise a first region coupled to the source line plane, a second region coupled to a bit line, a body region disposed between the first region and the second region, wherein the body region may be electrically floating, and a gate coupled to a word line and spaced apart from, and capacitively coupled to, the body region. | 08-19-2010 |
20100110816 | TECHNIQUES FOR BLOCK REFRESHING A SEMICONDUCTOR MEMORY DEVICE - Techniques for block refreshing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for block refreshing a semiconductor memory device. The method may comprise arranging a plurality of memory cells in one or more arrays of rows and columns. Each of the plurality of memory cells may comprise a first region coupled to a source line, a second region, a first body region disposed between the first region and the second region, wherein the body region may be electrically floating and charged to a first predetermined voltage potential, and a first gate coupled to a word line, wherein the first gate may be spaced apart from, and capacitively coupled to, the first body region. The method may also comprise applying voltage potentials to the plurality of memory cells to refresh a plurality of data states stored in the plurality of memory cells. | 05-06-2010 |
20100091586 | TECHNIQUES FOR SIMULTANEOUSLY DRIVING A PLURALITY OF SOURCE LINES - Techniques for simultaneously driving a plurality of source lines are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for simultaneously driving a plurality of source lines. The apparatus may include a plurality of source lines coupled to a single source line driver. The apparatus may also include a plurality of dynamic random access memory cells arranged in an array of rows and columns, each dynamic random access memory cell including one or more memory transistors. Each of the one or more memory transistors may include a first region coupled to a first source line of the plurality of source lines, a second region coupled to a bit line, a body region disposed between the first region and the second region, wherein the body region may be electrically floating, and a gate coupled to a word line and spaced apart from, and capacitively coupled to, the body region. | 04-15-2010 |
20100075471 | Recessed Gate Silicon-On-Insulator Floating Body Device With Self-Aligned Lateral Isolation - Embodiments of a manufacturing process for recessed gate devices on silicon-on-insulator (SOI) substrate with self-aligned lateral isolation are described. This allows the creation of true in-pitch recessed gate devices without requiring an extra isolation dimension. A lateral isolation trench is formed between pairs of recessed gate devices by etching the silicon-on-insulator area down to a buried oxide layer on which the silicon-on-insulator layer is formed. The position of the trench is self-aligned and defined by the gate width and the dimension of spacers disposed on either side of the gate. The isolation trench is filled with a dielectric material and then etched back to the middle of the SOI body and the remaining volume is filled with a doped conductive material. The doped conductor is subject to a thermal cycle to create source and drain regions of the device through out-diffusion of the doped material. | 03-25-2010 |