Helio Optoelectronics Corporation Patent applications |
Patent application number | Title | Published |
20140183444 | HIGH-VOLTAGE FLIP-CHIP LED STRUCTURE AND MANUFACTURING METHOD THEREOF - A high-voltage flip-chip LED structure and a manufacturing method thereof are disclosed. The manufacturing method includes: providing a die substrate, depositing a first passivation layer, forming a co-electrical-connecting layer, depositing a second passivation layer, depositing a mirror layer, forming two conductive tunnels by etching, and providing two connecting metal layers. The die substrate includes a sapphire substrate and multiple LED chips thereon. The fully transparent co-electrical-connecting layer, formed after formation of the first passivation layer, electrically connects the LED chips in series. The outer surface of the deposited second passivation layer is a flat passivation surface that enables the mirror layer thereon to be level and reflect light without optical path difference. The two connecting metal layers are provided for electrical conduction. The high-voltage flip-chip LED structure thus formed has fully transparent electrodes and can output light without optical path difference. | 07-03-2014 |
20140145221 | LED LAMP STRUCTURE WITH HEAT SINK - An LED lamp structure with a heat sink includes a reflection cup, an LED module, and a cover, in addition to the heat sink. The reflection cup has an inside bottom surface, a reflection surface, an outside bottom surface, and a light exit. The LED module is thermally conductively and fixedly provided on the inside bottom surface. The cover covers the LED module. The heat sink is thermally conductively connected to the outside bottom surface. The LED lamp structure is efficient in not only light extraction but also heat dissipation. | 05-29-2014 |
20140091330 | LED PACKAGE STRUCTURE WITH TRANSPARENT ELECTRODES - The present invention discloses a LED package structure with transparent electrodes. The electrode layers | 04-03-2014 |
20140077710 | LED LAMP STRUCTURE DRIVEN BY DOUBLE CURRENT AND DOUBLE CURRENT DRIVING METHOD THEREOF - Disclosed are an LED lamp structure driven by double current and a double current driving method thereof. The LED lamp structure driven by double current includes a COB package, a temperature sensor, and a controller. The COB package is provided therein with a blue LED chipset to be driven by a first current and a red LED chipset to be driven by a second current. The temperature sensor detects the working temperature of the red LED chipset, and the controller performs dynamic adjustment on the second current according to the working temperature so as to stabilize the color temperature of the LED lamp structure. Thus, as soon as the LED lamp structure is activated, its color temperature will be stabilized to ensure user comfort, which may otherwise be disturbed by variation of the color temperature. | 03-20-2014 |
20130134447 | LOW-LIGHT-EMITTING-ANGLE HIGH-LUMINANCE UV LED NAIL LAMP STRUCTURE AND LED LIGHT SOURCE MODULE THEREOF - A low-light-emitting-angle high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The UV LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein the light-emitting angle of each UV LED ranges between 25° and 80°. The UV LED nail lamp structure features high luminance and enhanced lighting effect. | 05-30-2013 |
20130127352 | HIGH-VOLTAGE AC LED STRUCTURE - The present invention provides a high-voltage alternating current light-emitting diode (AC LED) structure. The high-voltage AC LED structure includes a circuit substrate and a plurality of AC LED chips. The AC LED chips each include an insulated substrate, an LED set, a first metal layer and a second metal layer. The AC LED chips manufactured by a wafer level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure. | 05-23-2013 |
20130126914 | HIGH-VOLTAGE AC LIGHT-EMITTING DIODE STRUCTURE - A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure. | 05-23-2013 |
20130109001 | HIGH-LUMINANCE UV LED NAIL LAMP STRUCTURE AND LED LIGHT SOURCE MODULE THEREOF | 05-02-2013 |
20130095585 | MULTI-FIELD ARRANGING METHOD OF LED CHIPS UNDER SINGLE LENS - A multi-field arranging method of LED chips under a single lens includes the steps of: setting a first concentric circle on a bottom of a hemispherical lens, wherein the first concentric circle is centered at an axis of the hemispherical lens; equidistantly arranging plural first LED chips on the first concentric circle; setting a second concentric circle, which is also centered at the same axis as the first concentric circle, and the second concentric circle is larger than the first concentric circle in radius; and equidistantly arranging plural second LED chips and plural third LED chips on the second concentric circle. The present invention allows the LED chips to present symmetrical light patterns through the hemispherical lens, thereby obtaining a light field with evener color mixture and evener color temperature distribution in every illuminating direction. | 04-18-2013 |
20120018773 | ALTERNATING-CURRENT LIGHT EMITTING DIODE STRUCTURE WITH OVERLOAD PROTECTION - The present invention relates to an alternating current (AC) light emitting diode (LED) structure with overload protection, which comprises an AC LED, a heat dissipating unit and an overload protecting unit. The AC LED is thermally connected with the heat dissipating unit, and the overload protecting unit is connected in series between the AC LED and a power source. Thus, when an overload current is inputted to the AC LED structure, the temperature of the overload protecting unit will rise to disconnect the AC LED from the power source. In this way, an open-circuit status can be produced timely in the AC LED structure to block the power input into the AC LED for purpose of protection against overload. | 01-26-2012 |
20110171765 | MULTI-FIELD ARRANGING METHOD OF LED CHIPS UNDER SINGLE LENS - A multi-field arranging method of LED chips under a single lens includes the steps of: setting a first concentric circle on a bottom of a hemispherical lens, wherein the first concentric circle is centered at an axis of the hemispherical lens; and equidistantly arranging at least one first color chip, at least one second color chip and at least one third color chip on the first concentric circle in sequence. The present invention allows the color chips to present symmetrical light patterns through the hemispherical lens, thereby obtaining a light field with evener color mixture. | 07-14-2011 |
20110165715 | MANUFACTURING METHOD FOR AN AXIALLY SYMMETRIC LIGHT-EMITTING DIODE ASSEMBLY - A manufacturing method for an axially symmetric light-emitting diode assembly disclosed herein includes steps of: providing a substrate; and forming a plurality of light-emitting areas on the substrate. The substrate has a central axis. The light-emitting areas are arranged with axial symmetry around the central axis while being insulated from each other. Each of the light-emitting areas has at least one light-emitting diode, and the light-emitting diodes are electrically connected to each other. Since the light-emitting areas are formed on the substrate with the axially symmetric arrangement, the axially symmetric light-emitting diode assembly can present a well symmetric light pattern. | 07-07-2011 |
20110121723 | LED Base Structure with Embedded Capacitor - An LED base structure with an embedded capacitor includes a body, at least one pair of metal layers, at least one dielectric layer, and at least two conductive channels. The body is an insulating base. The metal layers are disposed in the body, and the dielectric layer is disposed between the metal layers, so as to form an embedded capacitor. The conductive channels are electrically connected to the metal layers, respectively. The LED base structure is further electrically connected to a resistor for forming a resistor-capacitor delay circuit whereby a phase delay is effectuated whenever AC power is supplied to the LED base structure, so as to control the time for switching on one of two parallel-connected LEDs and, as a result, prevent the LEDs from flashing which might otherwise arise when the LEDs are supplied with AC power. | 05-26-2011 |
20110121329 | AC LED Structure - An AC LED structure includes an insulating substrate, an LED set, a first metal layer and a second metal layer. The LED set has a first light-emitting diode and a second light-emitting diode, which are deposited on the insulating substrate and insulated from each other. The first metal layer and the second metal layer commonly have a first profile and serve to electrically connect the first light-emitting diode and the second light-emitting diode in an inverse parallel connection. In virtue of the first metal layer and the second metal layer of the first profile deposited on the first light-emitting diode and the second light-emitting diode, the LED set is allowed to be connected in series or in parallel with another LED set according to practical needs, so as to be able to endure high current density or high voltage operation. | 05-26-2011 |
20110090713 | FLEXIBLE BACKLIGHT MODULE - A flexible backlight module includes a light source module and a flexible light guide panel, wherein the flexible light guide panel has a light incident surface, a light reflecting surface, and a light outgoing surface. The light incident surface of the flexible light guide panel is directly connected and thereby optically coupled to the light source module so that the light emitted by the light source module can be completely coupled to the flexible light guide panel. Consequently, the loss of light is reduced while the luminous efficiency of light is increased. Light entering the flexible light guide panel is reflected by the light reflecting surface to the light outgoing surface and then projected outward. The flexible light guide panel can be curved as needed thanks to its flexibility and thus features a wide application range. | 04-21-2011 |
20110044035 | PARALLEL BRIDGE CIRCUIT STRUCTURE AND HIGH-VOLTAGE PARALLEL BRIDGE CIRCUIT STRUCTURE - A parallel bridge circuit structure and a high-voltage parallel bridge circuit structure are disclosed. The parallel bridge circuit structure includes a first bridge circuit and a second bridge circuit. The first bridge circuit includes a plurality of first diodes, and the second bridge circuit includes a plurality of second diodes. Each of the second diodes is exclusively connected to one of the first diodes in parallel. With the design of the parallel connection between the first bridge circuit and the second bridge circuit, break of the entire circuit caused by a damaged diode is prevented. Moreover, with the aid of the AC signal phase delay circuit structure, the output voltage of the parallel bridge circuit structure can be stable and continuous voltage, while the high-voltage parallel bridge circuit structure includes a plurality of parallel bridge circuit structures so as to endure a high voltage input. | 02-24-2011 |
20100277932 | Halation-Free Light-Emitting Diode Holder - A halation-free light-emitting diode holder includes a body and a retaining portion. The body has a die holder, which includes a first surface, a second surface, and an opened end. The retaining portion is provided on the second surface. By using the retaining portion, the optical gel in the die holder is blocked from capillary movement up along the second surface. Furthermore, having nano-material layers further formed on the second surface or having the area of the first surface made greater than the area of the opened-end also prevents the optical gel from climbing along the second surface. Thereby, a light halation circling a light pattern of the resultant light-emitting diode is avoided and the light-emitting diode is improved in luminance uniformity. | 11-04-2010 |
20100059733 | LED Structure - An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The first trenches or the second trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment. | 03-11-2010 |