HITACHI CABLE, LTD. Patent applications |
Patent application number | Title | Published |
20150348679 | PRECURSOR WIRE FOR NB3AL SUPERCONDUCTING WIRE, NB3AL SUPERCONDUCTING WIRE, METHOD FOR PRODUCING PRECURSOR WIRE FOR NB3AL SUPERCONDUCTING WIRE, AND METHOD FOR PRODUCING NB3AL SUPERCONDUCTING WIRE | 12-03-2015 |
20140236125 | CATHETER WIRE - A catheter wire includes a core bundle formed by twisting a plurality of core wires each including a solid conductor covered with an insulation, a tape layer formed by spirally winding a binding tape on an outer periphery of the core bundle, a shield layer formed by spirally winding a metal wire on an outer periphery of the tape layer, and a sheath layer formed on an outer periphery of the shield layer. The binding tape is wound in a direction opposite to a twisting direction of the core wires. The solid conductor and the metal wire have a tensile strength of not less than 900 MPa and an elongation percentage of not more than 2%. | 08-21-2014 |
20140182881 | SHIELDED CABLE - A shielded cable includes a twisted cable including a plurality of electric wires each including a conductor covered with an insulation therearound, and an electrically conductive wire twisted together with the plurality of electric wires, and a strip-like member including a conductive layer and an insulating layer. The strip-like member is wound around the twisted cable in the same direction as a twist direction of the twisted cable and at substantially the same winding pitch as a twist pitch of the twisted cable such that the conductive layer is continuously contacted with and along the lead wire. | 07-03-2014 |
20140182130 | ELECTRODE TERMINAL CONNECTOR PRODUCING METHOD - A method is for producing an electrode terminal connector for electrically connecting together a positive and a negative terminal formed of mutually dissimilar metals respectively. The method includes the steps of pressing a thin plate formed of a similar metal to the positive terminal to form a mounting hole in the thin plate, pressing a thick plate formed of a similar metal to the negative terminal to form a metallic member which is smaller in diameter than the mounting hole, and inserting the metallic member into the mounting hole and flattening the metallic member in the mounting hole to widen the mounting hole and join the thin plate and the metallic member together. The steps are continuously performed by a pressing device. | 07-03-2014 |
20140182129 | ELECTRODE TERMINAL CONNECTOR PRODUCING METHOD - A method is for producing an electrode terminal connector for electrically connecting together a positive terminal and a negative terminal of mutually dissimilar metals. The method includes pressing a first plate of a similar metal to the positive terminal to form a mounting hole in the first plate, pressing a second plate of a similar metal to the negative terminal to form a metallic member which is larger in diameter than the mounting hole, and inserting the metallic member into the mounting hole by press fitting to join the first plate and the metallic member together. The method further includes providing the metallic member with an intervening layer of metal having an ionization tendency between an ionization tendency of metal constituting the first plate and an ionization tendency of metal constituting the second plate, and the first plate and the metallic member are joined together via the intervening layer. | 07-03-2014 |
20140154928 | CABLE CONNECTOR AND CABLE ASSEMBLY, AND METHOD OF MANUFACTURING CABLE ASSEMBLY - Provided is a cable connector, a cable assembly, and a method of manufacturing the cable assembly, in which electric characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which is easily connectable by reducing the number of parts. In a ground contact, an outer-conductor adhering portion which is protruded from a side wall portion of a connector main body and which is adhered with an outer conductor by a conductive adhesive is provided. In this manner, elastic deformation of a cable for differential signal transmission is suppressed, so that electric characteristics can be stabilized. Also, connecting work between the outer conductor and the ground contact can be simplified as reducing the number of parts. Further, the cable for differential signal transmission is not exposed to a high temperature of soldering or others, and therefore, thermal deformation thereof does not occur, either. | 06-05-2014 |
20140154927 | CABLE CONNECTOR AND CABLE ASSEMBLY, AND METHOD OF MANUFACTURING CABLE ASSEMBLY - A cable connector and a cable assembly in which electrical characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which are easily connectable by reducing the number of parts, and a method of manufacturing the cable assembly are provided. Respective ground contacts and respective signal line contacts positioned between the respective ground contacts through a space are provided in a connector main body. Front-side arm portions and rear-side arm portions mutually extending toward the respective signal line contacts are integrally provided with end portions of the respective ground contacts protruded from a side wall portion of the connector main body. And, under a state that respective signal line conductors are arranged in the respective signal line contacts, an outer conductor is held by the front-side arm portions and the rear-side arm portions. | 06-05-2014 |
20140144700 | OIL-COOLED EQUIPMENT HARNESS - An oil-cooled equipment harness includes a front end to be enclosed in a shielding case of an oil-cooled equipment for connecting to a terminal of a body of the oil-cooled equipment disposed in the shielding case, a wire including a conductor, a sheath including an insulating elastic member on a periphery side of the conductor, and a flexibility, a terminal fitting enclosing a portion of the conductor and a portion of the sheath of the wire, connecting to the conductor, and connecting to the terminal of the body of the oil-cooled equipment, a housing attached to shielding case and enclosing a periphery of the wire a predetermined distance away from the terminal fitting such that the wire is exposed from the terminal fitting, and an oil entry-preventing unit disposed between the wire and the terminal fitting for preventing oil in the shielding case from entering into the conductor. | 05-29-2014 |
20140138154 | CABLE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - Outer-conductor-exposed portions are positioned in respective second body portions of a cable holder, and solder is supplied into solder pools provided in the respective second body portions, whereby outer conductors and ground contacts are connected to each other. Hence, even if the solder is in a molten state, a heated soldering bit does not touch the outer conductors. Therefore, the occurrence of any deformation or melting of insulators is suppressed. Furthermore, since there is no need to caulk any shield connection terminals in such a manner as to conform to the shapes of the outer conductors as in the known art, there is no chance of the insulators undergoing elastic deformation. Hence, the insulators are protected from any factors for thermal deformation and elastic deformation, and electric characteristics of differential signal transmission cables for individual finished products are thus stabilized. Consequently, the reliability of the cable assembly is improved. | 05-22-2014 |
20140133101 | Signal Transmission Device - A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate. | 05-15-2014 |
20140109655 | CABLE CONDITION MONITORING DEVICE - A cable condition monitoring device for monitoring a damaged condition of a cable including a conductor part including a plurality of element wires and an insulating material part formed on a periphery of the conductor part includes a gas feeding device configured to feed a compressed gas into the conductor part, a pressure gauge configured to measure a pressure in the conductor part, and an insulating material part damage judgment part configured to judge whether the insulating material part is damaged or not based on the pressure measured by the pressure gauge. | 04-24-2014 |
20140105536 | OPTICAL BOARD, METHOD OF MANUFACTURING THE OPTICAL BOARD AND OPTICAL MODULE STRUCTURE - An optical board includes a plate-shaped resin base material including a slit-shaped optical fiber housing portion formed thereon, a metal layer formed on a surface of the based material, and a reflective layer for reflecting light propagating in an optical fiber housed in the optical fiber housing portion. The base material further includes an inclined surface inclined with respect to the surface of the base material at a terminal end of the optical fiber housing portion. The reflective layer is formed over an end face of the metal layer and the inclined surface, the end face forming a flat surface continuously with the inclined surface. | 04-17-2014 |
20140102756 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND MULTI-CORE DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A differential signal transmission cable includes first and second signal lines arranged parallel to each other, a conductive layer made of a conductor in which a current is induced when signals propagate through the first and second signal lines, and a dielectric disposed between the first and second signal lines and the conductive layer. The conductive layer has a signal attenuating structure including a non-continuous section in which the conductor is non-continuous, the non-continuous section being located such that, among differential signal components and common-mode signal components included in the signals propagating through the first and second signal lines, the common-mode signal components are attenuated by an attenuation factor greater than an attenuation factor of the differential signal components. | 04-17-2014 |
20140086528 | OPTICAL COMMUNICATION MODULE - An optical communication module includes: an optical element array; a supporting member on which the optical element array is placed; an optical member for optically coupling the optical element array and a plurality of optical fibers together; a plurality of grooves provided in the supporting member or the optical member; and a plurality of protrusions provided on the optical member or the supporting member in correspondence with the grooves respectively. The grooves and the protrusions are mated together. The grooves are provided as being widened toward their openings. The grooves and the protrusions are each provided so that a location in a width direction at which no relative locational misalignment occurs therebetween lies on a line through the center of the optical element array. The grooves and the protrusions are each provided on at least two or more different lines through the center of the optical element array. | 03-27-2014 |
20140080933 | FOAMED RESIN MOLDED ARTICLE, FOAM INSULATED WIRE, CABLE AND METHOD OF MANUFACTURING FOAMED RESIN MOLDED ARTICLE - A foamed resin molded article that is obtained by kneading and foaming a pellet including one or more fluorine resins and a chemical foaming agent in an extrusion molding process. The pellet is formed by mixing powder of the one or more fluorine resins and powder of the chemical foaming agent without heating and melting, and solidifying and molding. A method of manufacturing a foamed resin molded article includes making pellets including one or more fluorine resins and a chemical foaming agent, and kneading and foaming the pellets in an extrusion molding process. | 03-20-2014 |
20140079359 | OPTICAL-ELECTRICAL COMPOSITE CABLE - An optical-electrical composite cable includes an optical fiber, a tubular resin inner cover to enclose the optical fiber, a plurality of electric wires disposed on an outside of the inner cover, and a tubular outer cover to collectively cover the plurality of electric wires. The plurality of electric wires are helically wound around an outer peripheral surface of the inner cover so as to be situated between the inner cover and the outer cover. | 03-20-2014 |
20140069686 | FOAMED RESIN MOLDED PRODUCT, FOAMED INSULATED WIRE, CABLE AND METHOD OF MANUFACTURING FOAMED RESIN MOLDED PRODUCT - A foamed resin molded product includes not less than two fluorine resins that have a different melting point from each other. One of the not less than two fluorine resins comprises a fluorine resin that has a melting point of not more than 230 degrees C. An other of the not less than two fluorine resins comprises a fluorine resin that has a melting point of not less than 40 degrees C. higher than the fluorine resin having the melting point of not more than 230 degrees C. | 03-13-2014 |
20140069685 | FLUORINE-CONTAINING ELASTOMER COMPOSITION AND INSULATED WIRE - A fluorine-containing elastomer composition includes a fluorine-containing resin including a copolymer of tetrafluoroethylene and α-olefin having carbon number of 2 to 4. The copolymer of tetrafluoroethylene and α-olefin having carbon number of 2 to 4 is configured such that a peak integrated value of −132 ppm relative to a peak integrated value 10,000 of −110 to −125 ppm falls within the range of 0.3 to 2.0 in nuclear magnetic resonance analysis. | 03-13-2014 |
20140048302 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND MULTI-CORE CABLE - A differential signal transmission cable includes a pair of center conductors for transmitting a differential signal, an insulator covering peripheries of the center conductors, a shield tape longitudinally wrapped around the insulator, an insulating tape including an adhesive surface and spirally wrapped around the shield tape while the adhesive surface faces inside, and a non-adhesive tape provided between the shield tape and the insulating tape along a longitudinal direction, and non-adhesively covering a part of an outer periphery of the shield tape in a circumferential direction. | 02-20-2014 |
20140034352 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE, MULTIWIRE DIFFERENTIAL SIGNAL TRANSMISSION CABLE, AND DIFFERENTIAL SIGNAL TRANSMISSION CABLE PRODUCING METHOD AND APPARATUS - A differential signal transmission cable includes an insulated wire including a pair of differential signal transmission conductors coated with an insulation, a shield tape conductor made of a band-like member including an electrically conductive metal layer, and wrapped along an outer surface of the insulated wire so that its ends in a width direction are overlapped together, a first resin tape spirally wound along an outer surface of the shield tape conductor and around an outer side of the shield tape conductor, and a second resin tape spirally wound along an outer surface of the first resin tape and around an outer side of the first resin tape. The shield tape conductor, the first resin tape and the second resin tape are wound in a same circumferential direction around a center axis of the insulated wire. | 02-06-2014 |
20140027151 | SHIELDED CABLE - A shielded cable includes an electric wire bundle configured such that a plurality of electric wires are bundled, a first band-shaped member configured to be spirally wound so as to cover the electric wire bundle, a second band-shaped member configured to be spirally wound on the outer periphery of the first band-shaped member, and a drain wire configured to be arranged between the first band-shaped member and the second band-shaped member. The first band-shaped member and the second band-shaped member include a metal layer including a conductive metal and a resin layer including an insulating resin, and are wound such that the metal layers thereof face each other across the drain wire. The first band-shaped member, the second band-shaped member and the drain wire are wound in the same direction to the electric wire bundle. | 01-30-2014 |
20140000932 | SOFT DILUTE-COPPER ALLOY WIRE, SOFT DILUTE-COPPER ALLOY TWISTED WIRE, AND INSULATED WIRE, COAXIAL CABLE, AND COMPOSITE CABLE USING THESE | 01-02-2014 |
20130333913 | MULTIPAIR DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A multipair differential signal transmission cable includes a plurality of differential signal transmission cables being bundled and each including two signal conductors as a differential pair covered with an insulation and a first shielding tape conductor provided therearound. The first shielding tape conductor is longitudinally lapped so as to have an overlapping portion in a cable longitudinal direction. The plurality of differential signal transmission cables include at least one or more pairs of two adjacent differential signal transmission cables. The two adjacent differential signal transmission cables are arranged such that the overlapping portion of one of the two adjacent differential signal transmission cables does not face the other of the two adjacent differential signal transmission cables. | 12-19-2013 |
20130319724 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A differential signal transmission cable includes a pair of differential signal lines arranged in parallel to each other, an insulation for bundle-covering the pair of differential signal lines, and a shield conductor wound around an outer periphery of the insulation. The insulation is configured such that an outer circumference thereof in a cross section perpendicular to a longitudinal direction thereof has an oval shape formed with a continuous convex arc-curve. The outer circumference of the insulation includes a first curved portion with a pair of symmetrical elliptical arcs located at both ends in a first direction along the arrangement direction of the pair of differential signal lines and a second curved portion with a pair of symmetrical elliptical arcs located at both ends in a second direction orthogonal to the first direction. | 12-05-2013 |
20130316582 | CONNECTION STRUCTURE BETWEEN SHIELD SHELL AND BRAIDED SHIELD AND WIRE HARNESS - A connection structure includes a shield shell enclosing a part of a plurality of wires, a braided shield collectively covering the plurality of wires, a belt-shaped clamping member sandwiching the braided shield between it and an outer surface of the shield shell so as to press the braided shield against the shield shell by a clamping force thereof, and an annular member disposed between the braided shield and the clamping member and having an elasticity to be deformed by the clamping force of the clamping member. The clamping member presses the braided shield against the shield shell through the annular member. | 11-28-2013 |
20130314284 | ANTENNA DEVICE - Provided is an antenna device including a substrate, a metal chassis disposed adjacent a rear surface of the substrate, multiple patch antenna elements formed in an array on a front surface of the substrate, feeding lines formed on the front surface of the substrate and through which electricity is fed to the multiple patch antenna elements, and a ground conductor formed on the rear surface of the substrate in a portion opposite the feeding lines. | 11-28-2013 |
20130285866 | DUAL BAND ANTENNA - A dual band antenna providing a high forward gain includes a radiator, a director disposed in front of the radiator, and a reflector disposed behind the radiator. A dual resonance notch antenna including a conducting plate and a feeding portion is used as the radiator. The director includes a conducting plate and a short-circuiting portion and the reflector includes a conducting plate and a short-circuiting portion. Each conducting plate is disposed such that the direction of a normal to the conducting plate is a front-rear direction. Two slots having different lengths are formed in each conducting plate so as to be aligned with each other. The feeding portion is disposed in one of the slots. Each short-circuiting portion is disposed in one of the two slots at a position corresponding to the feeding portion. | 10-31-2013 |
20130277087 | COMPLEX HARNESS - A complex harness includes a composite cable including an electric brake cable, an ABS sensor cable and an outer sheath. The electric brake cable and the ABS sensor cable are integrated by being commonly covered with the outer sheath. | 10-24-2013 |
20130272650 | WAVELENGTH CROSS CONNECT DEVICE - A wavelength cross connect device includes an input demultiplexing optical system for demultiplexing light input from a plurality of input ports into respective wavelengths, a wavelength switching optical system for switching and outputting the lights of respective wavelengths input from the input demultiplexing optical system to respective desired ports, and an output multiplexing optical system for multiplexing the lights of respective wavelengths input from the wavelength switching optical system per port. The input demultiplexing optical system and the output multiplexing optical system includes a lens system that has a function of focusing lights independently in vertical and widthwise directions. The wavelength switching optical system includes two light deflector arrays for outputting incoming light of each wavelength after adjusting a horizontal reflection angle of the light, and a switching lens including a lens that has a focal length equal to the Rayleigh length and acts only in a widthwise direction. | 10-17-2013 |
20130272113 | CHASSIS TYPE SWITCH - A chassis type switch is provided which can shorten a time required for switching-over to a backup route when a failure has occurred in a line card. In a chassis type switch including a plurality of line cards within a chassis, the switch further includes a failure detection unit for detecting a failure in each of the plural line cards, and a forced flooding processing unit included in each of the plural line cards and operating such that when, in trying to transfer a received unicast frame to another line card, a failure is detected in the relevant line card at a transfer destination, the received unicast frame is forcibly transferred to all ports of the own line card other than a reception port thereof and to all other line cards. | 10-17-2013 |
20130272112 | NETWORK SWITCH - A network switch is provided which can shorten a time required for switching-over to a backup route when a failure has occurred in a port for which an LAG is set. The network switch includes a failure detection unit for detecting a port failure, and a forced transfer processing unit for, when a failure is detected in a port at a transfer destination as a target in trying to transfer a received unicast frame and when an link aggregation group is set for a plurality of ports including the relevant port at the transfer destination, forcibly transferring the received unicast frame to another port for which the same link aggregation group as that set for the relevant port at the transfer destination is set. | 10-17-2013 |
20130271344 | ANTENNA DEVICE - An antenna device includes a substrate including a front surface, a back surface, and via holes formed therein, a plurality of patch antenna elements formed in an array on the front surface of the substrate, a feed line formed on the back surface of the substrate to feed the plurality of patch antenna elements through the via holes formed in the substrate, and a metal chassis disposed opposite the substrate with an air layer therebetween on the back surface of the substrate. The metal chassis is electrically grounded. | 10-17-2013 |
20130264886 | NON-CONTACT POWER SUPPLY SYSTEM - A non-contact power supply system for supplying power from a power transmission-side AC source to a power receiving-side load in a non-contact manner includes a power transmission-side resonance coil receiving AC power supplied from the AC source, a power receiving-side resonance coil having a resonant frequency causing electromagnetic-coupling to the power transmission-side resonance coil, a power transmission-side transformer disposed between the power transmission-side resonance coil and the AC source, and a power receiving-side transformer disposed between the power receiving-side resonance coil and the load. | 10-10-2013 |
20130260538 | METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE - A method of manufacturing a gallium nitride substrate includes machining a gallium nitride crystal, and wet-etching the gallium nitride crystal prior to the machining. | 10-03-2013 |
20130260193 | ASSEMBLED BATTERY WIRING MEMBER AND ASSEMBLED BATTERY MODULE - An assembled battery wiring member for an assembled battery that plural single cells each having a positive terminal and a negative terminal are arranged in a predetermined array direction and the positive terminal of one of a pair of single cells adjacent in the array direction is connected to the negative terminal of another single cell one after another by a conductive coupling member. It includes a flat cable including plural linear conductors arranged parallel to each other and an insulating film covering the plural linear conductors, and a connecting member to connect the plural linear conductors to the coupling member. The connecting member includes a plate-shaped conductor and an insulation covering the conductor, one end of the conductor is connected to the coupling member and another end of the conductor is connected to the linear conductor through an opening formed in the insulation film of the flat cable. | 10-03-2013 |
20130256390 | JUNCTION MATERIAL, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF JUNCTION STRUCTURE - The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer ( | 10-03-2013 |
20130255992 | INSULATED WIRE - An insulated wire includes a conductor and an insulation covering formed thereon. The insulation covering includes a first insulation covering layer formed directly on the conductor and a second insulation covering layer formed on a periphery of the first insulation covering layer. The first insulation covering layer includes a resin composition including a resin (A) including polyphenylene sulfide and a resin (B) including polyamide mixed at a mass ratio in a range of “30/70≦B/A≦90/10”. The second insulation covering layer includes a resin composition mainly including a resin (C) including polyphenylene sulfide or polyetheretherketone. | 10-03-2013 |
20130249354 | PIEZOELECTRIC FILM-ATTACHED SUBSTRATE, PIEZOELECTRIC FILM ELEMENT AND METHOD OF MANUFACTURING THE SAME - There is provided a piezoelectric film-attached substrate, including a piezoelectric film having a specific thickness, wherein a reflection spectrum shows a relation between a light obtained in such a way that the surface of the piezoelectric film is irradiated with an irradiation light having a specific wavelength and the irradiation light is reflected on the surface of the piezoelectric film, and a light obtained in such a way that the irradiation light is transmitted through the piezoelectric film and is reflected on the surface of the lower electrode, which is the reflection spectrum at least at one point on a center part and an outer peripheral part of the piezoelectric film, and such a reflection spectrum has at least one of the maximum value and the minimum value respectively, wherein the reflectance at least in one maximum value is 0.4 or more. | 09-26-2013 |
20130248820 | GALLIUM NITRIDE SUBSTRATE AND EPITAXIAL WAFER - A gallium nitride substrate includes a plurality of physical level differences in a surface thereof. All the physical level differences existing in the surface have a dimension of not more than 4 μm. A relationship of (H−L)/H×100≦80 is satisfied in all the physical level differences, where H represents a higher value of cathodoluminescence emission intensities of a wavelength corresponding to a bandgap of the gallium nitride substrate, and L represents a lower value of the cathodoluminescence emission intensities, the cathodoluminescence emission intensities being measured in an upper step and a lower step of the physical level difference. | 09-26-2013 |
20130247817 | METAL CHLORIDE GAS GENERATOR, HYDRIDE VAPOR PHASE EPITAXY GROWTH APPARATUS, AND METHOD FOR FABRICATING A NITRIDE SEMICONDUCTOR TEMPLATE - A metal chloride gas generator includes a reactor including a receiving section for receiving a metal on an upstream side and a growing section in which a growth substrate is placed on a downstream side, a raw material section heater and a growing section heater each of which heats an inside of the reactor, an upstream end comprising a gas inlet, and a gas inlet pipe arranged to extend from the upstream end via the receiving section to the growing section, for introducing a chloride gas from the upstream end to supply the chloride gas to the receiving section and supplying a metal chloride gas produced by a reaction between the chloride gas and the metal in the receiving section to the growing section. The gas inlet pipe includes a suppressing section for suppressing an optical waveguiding phenomenon which waveguides a radiant heat from the growing section heater or the growing section. | 09-26-2013 |
20130240244 | INSULATED WIRE AND COIL FORMED BY USING THE SAME - An insulated wire includes a flat type conductor, and an insulating film on an outer periphery of the flat type conductor. The insulating film includes a polyimide layer including a polyimide and having a breaking elongation percentage of more than 80%. | 09-19-2013 |
20130240239 | PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT RESIN COMPOSITION, PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT INSULATED ELECTRIC WIRE AND PHOSPHORUS-FREE BASED HALOGEN-FREE FLAME-RETARDANT CABLE - A phosphorus-free based halogen-free flame-retardant resin composition includes a base polymer including a copolymer of ethylene and α-olefin having carbon number of 3 to 8 polymerized by a metallocene catalyst as a main component, and 5 to 30 weight % of an ethylene-vinyl acetate copolymer that has a melt flow rate of not less than 50 g/min and a vinyl acetate content of not less than 40%, a metal hydroxide blended with the base polymer in a ratio of 100 to 250 parts by weight relative to 100 parts by weight of the base polymer, and a mineral oil blended with the base polymer in a ratio of 1 to 20 parts by weight relative to 100 parts by weight of the base polymer. | 09-19-2013 |
20130236741 | VIBRATION-DAMPING COMPOSITE MATERIAL - A vibration-damping composite material includes a clad material that includes a base material includes a zinc-aluminum alloy and metal layers each including a ferritic stainless steel on both surfaces of the base material. A total thickness of the metal layers is not less than 40% and not more than 80% of the thickness of the clad material. | 09-12-2013 |
20130234549 | ELECTRIC MOTOR AND CENTRALIZED POWER DISTRIBUTION MEMBER - An electric motor includes a stator including multiple phase windings wound around a plurality of teeth arranged in a circular pattern, and an annular bus ring arranged concentrically with the stator to supply drive current to the windings. The bus ring includes a metal conductor and a lead-out wire inserting portion for inserting a lead-out wire of the winding therethrough, the lead-out wire inserting portion being formed by bending the metal conductor. The lead-out wire inserting portion is crimped with the lead-out wire inserted therethrough such that the metal conductor is electrically connected to the lead-out wire. | 09-12-2013 |
20130233616 | CABLE HOLDING STRUCTURE - A cable holding structure includes a plate-shaped member having an opening, and a conductive wire holding portion holding a plurality of wires inserted therethrough, the wire holding portion being disposed in the opening and electrically connected to a braided shield that collectively covers the plurality of wires. The wire holding portion protrudes from the opening of the plate-shaped member and includes a plurality of through-holes extending in a direction orthogonal to the plate-shaped member. The plurality of wires are each enclosed in the through-holes. The braided shield is electrically connected to an outer surface of the wire holding portion protruding from the opening. | 09-12-2013 |
20130233590 | ADHESIVE FILM AND FLAT CABLE USING THE SAME - There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts.wt. or more and 250 pts.wt. or less with respect to 100 pts.wt. of the mixed resin composition. | 09-12-2013 |
20130233589 | DIFFERENTIAL TRANSMISSION CABLE AND METHOD OF MANUFACTURING THE SAME - A differential transmission cable includes at least one pair of inner conductors arranged in parallel and extending parallel to each other, and a foamed insulating material formed on the inner conductors by a collective extrusion coating and molding of a resin material by using a chemical foaming method and have a variation of foaming degree of not more than 1%. The variation of foaming degree is defined as a difference between a maximum value and a minimum value among foaming degrees (%) of the foamed insulating material at 20 positions at intervals of 50 cm in a longitudinal direction in an arbitrary part of 10 m cut out from the differential transmission cable. | 09-12-2013 |
20130230765 | CURRENT COLLECTOR COPPER FOIL OF NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, METHOD OF MANUFACTUING THE CURRENT COLLECTOR COPPER FOIL OF NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, METHOD OF MANUFACTURING NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY - There is provided a current collector copper foil of negative electrode for lithium ion secondary battery, including: at least 0.15 wt % or more and 0.40 wt % or less of Cr; and Cu as a remaining portion, wherein a Cr solid solution index Z is in a range of 0.05≦Z≦0.3 and represented by the following formula: Z=(R | 09-05-2013 |
20130230447 | GALLIUM NITRIDE SUBSTRATE AND OPTICAL DEVICE USING THE SAME - A gallium nitride substrate that a GaLα/CKα peak intensity ratio in EDX spectrum is not less than 2. The EDX spectrum is obtained in energy dispersive X-ray microanalysis (EDX) of a surface of the gallium nitride substrate using a scanning electron microscope (SEM) at an accelerating voltage of 3 kV. | 09-05-2013 |
20130228358 | MULTILAYER INSULATED WIRE - A multilayer insulated wire includes a conductor, an inner layer coated on an outer periphery of the conductor, the inner layer comprising a resin compound containing 100 parts by weight of base polymer containing modified-poly(2,6-dimethylphenyleneether) as a main component, and 10 to 100 parts by weight of calcined clay as additive, and an outer layer coated on an outer periphery of the inner layer, the outer layer including a polyester resin compound including 100 parts by weight of base polymer containing polyester resin as a main component, and 50 to 150 parts by weight of polyester block copolymer, 0.5 to 3 parts by weight of hydrolysis inhibitor, and 10 to 30 parts by weight of magnesium hydroxide. | 09-05-2013 |
20130222002 | CABLE WITH WIRE DISCONNECTION DETECTION FUNCTION - A cable with a wire disconnection detection function includes a detecting wire including a conductor formed by twisting a plurality of strands, and a detected wire including a conductor formed by twisting a plurality of the strands. A twist pitch of the conductor of the detecting wire is longer than that of the conductor of the detected wire. | 08-29-2013 |
20130220677 | Thermosetting Adhesive Composition, and Heat Resistant Adhesive Film and Wiring Film Using the Same - Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film. | 08-29-2013 |
20130220674 | Adhesive Composition, Varnish, Adhesive Film and Wiring Film - Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight. | 08-29-2013 |
20130220670 | CABLE HOLDER - A cable holder includes a pair of holding members that are relatively moved in a predetermined sliding direction to sandwich and hold a cable therebetween. The pair of holding members each include a plurality of guide planes each parallel to the sliding direction and a plurality of sliding contact surfaces parallel to the sliding direction. One of the pair of holding members is guided in the sliding direction by sliding the sliding contact surfaces thereof on the guide planes of the other holding member. The other holding member is guided in the sliding direction by sliding the sliding contact surfaces thereof on the guide planes of the one of the holding members. The pair of holding members are fixed to each other by a frictional force between the sliding contact surfaces and the guide planes in a state of holding the cable. | 08-29-2013 |
20130220404 | SOLAR BATTERY RECTANGULAR CONDUCTOR, METHOD FOR FABRICATING SAME AND SOLAR BATTERY LEAD WIRE - A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor | 08-29-2013 |
20130216179 | OPTICAL MODULE - An optical module has a circuit board, a photoelectric conversion element mounted on a mount surface of the circuit board, an optical coupling member for holding an optical fiber and optically coupling the optical fiber and the photoelectric conversion element, a semiconductor circuit element mounted on the mount surface of the circuit board and electrically connected to the photoelectric conversion element, and a plate-shaped supporting substrate arranged to sandwich the optical coupling member between the supporting substrate and the circuit board. An electrically conductive metal foil which extends in a thickness direction of the supporting substrate is provided integrally with a side surface of the supporting substrate, and the metal foil is connected at one end thereof to an electrode provided on a non-mount surface of the circuit board. | 08-22-2013 |
20130209803 | CROSSLINKED RUBBER, RUBBER-SHEATHED CABLE USING SAME, AND CROSSLINKED RUBBER PRODUCING METHOD - A crosslinked rubber is composed of rubber molecules, which, before crosslinking, contain hot dissociatable and cold associatable crosslinking groups to dissociate from each other in a hot state and associate together in a cold state, and silane crosslinking groups, and which, after molding, are silane-crosslinked together by a silanol condensation reaction of the silane crosslinking groups together with moisture, with the hot dissociatable and cold associatable crosslinking groups associated together. | 08-15-2013 |
20130209027 | PHOTOELECTRIC COMPOSITE WIRING MODULE - A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device. | 08-15-2013 |
20130195470 | OPTICAL MODULE, OPTICAL TRANSMISSION DEVICE AND METHOD OF MANUFACTURING OPTICAL TRANSMISSION DEVICE - An optical module includes a circuit board having flexibility, a photoelectric conversion element mounted on a mounting surface of the circuit board, a semiconductor circuit element mounted on the mounting surface of the circuit board and electrically connected to the photoelectric conversion element, a plate-shaped optical connection member having a groove into which an end part of an optical fiber is pushed so as to be housed and optically connecting the optical fiber and the photoelectric conversion element, and a supporting member arranged so as to sandwich the optical connection member between the circuit board. The groove is formed between the semiconductor circuit element and the supporting member so as to have an opening into which the optical fiber is pushed at the supporting member side. The semiconductor circuit element has a height from the mounting surface of the circuit board higher than the photoelectric conversion element. | 08-01-2013 |
20130193304 | OPTICAL MODULE - An optical module includes a circuit board including a mount surface and a non-mount surface opposite the mount surface, a photoelectric conversion element mounted on the mount surface of the circuit board, an optical coupling member for holding an optical fiber and optically coupling the optical fiber and the photoelectric conversion element, a semiconductor circuit element mounted on the mount surface of the circuit board, and electrically connected to the photoelectric conversion element, a plate-shaped supporting member arranged so as to sandwich the optical coupling member between the supporting member and the circuit board, and an electrically conductive body supported by the supporting member, extended in a thickness direction of the supporting member, and connected at one end to an electrode provided on the non-mount surface of the circuit board. | 08-01-2013 |
20130192887 | FLAT WIRING MATERIAL AND MOUNTING BODY USING THE SAME - A flat wiring material includes a plurality of conductors arranged in parallel, an insulating covering member covering collectively the plurality of conductors while allowing both end portions of the plurality of conductors to be exposed, an engaging member disposed at a position on the covering member and close to at least one of the exposed both end portions of the plurality of conductors and including an insertion portion that is formed at an end portion extending in the width direction for being inserted into and engaged with a through-hole formed on a mounting substrate, and a fixing member fixing the engaging member to the covering member. The insertion portion of the engaging member includes an opening allowing an elastic deformation thereof upon the insertion into the through-hole and a protruding portion for preventing disengagement in a direction opposite to the insertion direction after being inserted into the through-hole. | 08-01-2013 |
20130189541 | COMPOSITE MATERIAL - A composite material includes a clad material including a base material that includes an iron-chromium alloy and vibration-damping layers that are provided on both surfaces of the base material and include a metal to suppress a vibration. A total thickness of the vibration-damping layers provided on the both surfaces of the base material is in a range of not less than 10% and not more than 40% relative to a total thickness of the clad material | 07-25-2013 |
20130188906 | OPTICAL MODULE AND METHOD FOR PRODUCING THE SAME - An optical module includes a substrate, an optical device of a surface-emitting element or a surface-receiving element mounted on a surface of the substrate with a light-emitting portion or a light-receiving portion located to face the surface of the substrate, an optical fiber disposed parallel to the surface of the substrate and in a longitudinal direction of the substrate, a mirror provided to face the light-emitting portion or the light-receiving portion of the optical device and a tip of the optical fiber, and optically connect the optical device and the optical fiber, and an optical fiber receiving groove provided in the surface of the substrate to receive the optical fiber. A width of the mirror is greater than a width of the optical fiber receiving groove. Reflecting portions are provided on edges, respectively, of a mirror side end of the optical fiber receiving groove, and the reflecting portions reflect incident light from the mirror facing the edges, again back to the facing mirror. | 07-25-2013 |
20130187516 | PIEZOELECTRIC ELEMENT AND PIEZOELECTRIC DEVICE - A piezoelectric element includes a substrate, and at least a lower electrode layer, a piezoelectric film represented by a general formula of (Na | 07-25-2013 |
20130187172 | NITRIDE SEMICONDUCTOR EPITAXIAL WAFER AND FIELD EFFECT NITRIDE TRANSISTOR - A nitride semiconductor epitaxial wafer includes a substrate, a GaN layer provided over the substrate, and an AlGaN layer provided over the GaN layer. The GaN layer has a wurtzite crystal structure, and a ratio c/a of a lattice constant c in a c-axis orientation of the GaN layer to a lattice constant a in an a-axis orientation of the GaN layer is not more than 1.6266. | 07-25-2013 |
20130185771 | NETWORK SYSTEM - A network system includes network relay devices including a master device for administrating the network system, and a member device to be administrated by the master device. When the master device receives an authentication request from an external terminal connected to the network system, the master device performs an authentication processing for authorizing or denying the authentication request. When the authentication request is authorized, one network relay device connected to the external terminal in the network system performs a communication-authorizing processing for authorizing a communication between the external terminal and the one network relay device, and performs a transmission processing for transmitting a communication authorization data to an other network relay device which is not connected to the external terminal in the network system. When the other network relay device receives the communication authorization data, the other network relay device performs the communication-authorizing processing. | 07-18-2013 |
20130183006 | FERRULE HOLDING MEMBER AND OPTICAL CONNECTOR - A ferrule holding member has a tube-shaped receiving portion including a receiving space therein, the receiving space receiving at least partially a ferrule mounted to a terminal of an optical fiber; and an engaging portion engaged to the ferrule received in the receiving portion, to thereby regulate movement of the ferrule relative to the receiving portion. The receiving portion includes a communicating hole to allow the receiving space to communicate externally. The engaging portion includes an engaging protrusion configured to be inserted in the communicating hole from an outer periphery side of the receiving portion, to engage the ferrule. | 07-18-2013 |
20130180754 | LAN CABLE - A LAN cable includes an unshielded LAN cable including one or plural pairs of pair twisted wires and a sheath formed collectively covering a periphery of the pair twisted wires. The sheath includes a resin including nickel hydroxide at a mixing mass ratio of not less than 25% and not more than 60%. | 07-18-2013 |
20130180752 | PARALLEL FOAMED COAXIAL CABLE - A parallel foamed coaxial cable includes one or more pairs of inner conductors aligned in parallel, a foamed insulation covering together the inner conductors and having a cross sectional shape including an elliptical shape, a rounded-rectangular shape or a quasi-elliptical shape formed by combining a plurality of curved lines, a non-foamed skin layer covering the foamed insulation and having a maximum thickness in a major axis direction of the cross sectional shape of the foamed insulation and a minimum thickness in a minor axis direction of the cross sectional shape of the foamed insulation, an outer conductor covering the non-foamed skin layer, and an insulation jacket covering the outer conductor. The maximum thickness of the non-foamed skin layer is not less than 1% of a major axis of the cross sectional shape of the foamed insulation. | 07-18-2013 |
20130175081 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A differential signal transmission cable includes a pair of differential signal lines arranged in parallel to each other, an insulation for bundle-covering the pair of differential signal lines, and a shield conductor wound around an outer periphery of the insulation The insulation is configured such that an outer circumference thereof in a cross section perpendicular to a longitudinal direction thereof has an oval shape formed with a continuous convex arc-curve The oval shape has a width in a first direction along the arrangement direction of the pair of differential signal lines being larger than a width in a second direction orthogonal to the first direction | 07-11-2013 |
20130170790 | OPTICAL BOARD, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL MODULE STRUCTURE - An optical board including a substrate including a plate-shaped resin including a first main plane and a second main plane facing each other, and a slit-shaped optical fiber receiving portion which penetrates between the first main plane and the second main plane in a thickness direction, a metal layer provided on the second main plane, and a wiring pattern consisting of metal and provided on the first main plane. An inclined plane is provided at an end of the optical fiber receiving portion in the substrate, a tilt angle of the inclined plane with respect to the first main plane is an obtuse angle, and a reflective layer is provided on the inclined plane for reflecting a light output from an optical fiber received in the optical fiber receiving portion toward the first main plane. | 07-04-2013 |
20130162484 | ANTENNA APPARATUS - An antenna apparatus includes a horizontal polarization antenna element, and the horizontal polarization antenna element includes a radiation conductor that includes two conductor plates subjected to bending work and arranged to be opposite to each other with a specific interval therebetween and has a tube shape extending in a vertical direction in whole, a ground conductor that is arranged in an inner space surrounded by the two conductor plates of the radiation conductor and is electrically grounded, and a feeding element that is arranged in the inner space, is arranged along inner walls of the conductor plates in a top view, operates as a reverse L antenna when electrical power is fed between one end thereof and the ground conductor, and feeds power to the radiation conductor by electromagnetic coupling. | 06-27-2013 |
20130161071 | CONNECTION STRUCTURE, CONNECTION METHOD AND DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A connection structure for connecting an outer conductor of a differential signal transmission cable to a substrate includes a connecting member including a main body portion and a protruding portion protruding from the main body portion. The outer conductor is connected via the connecting member to the substrate. The connecting member is solder-connected to the outer conductor via the main body portion and is solder-connected to the substrate via the protruding portion. | 06-27-2013 |
20130161065 | INSULATED WIRE AND COIL - An insulated wire includes a conductor, and an insulating covering layer including a first insulation layer formed around the conductor and a second insulation layer formed around the first insulation layer. An elastic modulus of the second insulation layer at 300° C. is not less than 300 MPa, and a relative permittivity of the insulating covering layer is not more than 3.0. | 06-27-2013 |
20130161061 | INSULATED WIRE AND COIL USING THE SAME - An insulated wire includes a conductor, and an insulation covering on an outer periphery of the conductor, the insulation covering including a low-relative-permittivity insulating film that has a relative permittivity of not more than 3.2 and contains an imide structural component. The low-relative-permittivity insulating film includes a polyimide resin having a repeating unit represented by the following formulas: | 06-27-2013 |
20130156385 | OPTICAL MODULE - An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface. | 06-20-2013 |
20130153858 | NITRIDE SEMICONDUCTOR TEMPLATE AND LIGHT-EMITTING DIODE - A nitride semiconductor template includes a substrate, and a group III nitride semiconductor layer formed on the substrate and including a Si-doped layer doped with Si as an uppermost layer thereof. The group III nitride semiconductor layer has a total thickness of not less than 4 μm and not more than 10 μm. The Si-doped layer includes a Si concentration gradient layer having a carrier concentration that gradually decreases toward an outermost surface thereof so as to be not less than 1×10 | 06-20-2013 |
20130134936 | VEHICLE BATTERY CHARGER - A vehicle battery charger for charging a vehicle that is operable to detect a disengagement of a connecter or a preparing operation of the disengagement of the connector by a change in an electric current value of an electric current output from a terminal of the connecter and to stop charging a storage battery of the vehicle upon the detection includes a charging device configured to charge the vehicle, and a simulation operation device configured to change the electric current value by switching a pathway of the electric current output from the terminal of the connecter in a state that the connecter is in engagement and the preparing operation of the disengagement of the connecter is not carried out so as to cause the vehicle to stop charging the storage battery. | 05-30-2013 |
20130130031 | INSULATED WIRE - There is provided an insulated wire including a wire conductor and at least one extruded insulation layer formed on the wire conductor. The at least one extruded insulation layer is made of a phase separated resin composition including: a resin (A) including polyether ether ketone as a continuous phase; and a resin (B) with a relative dielectric constant of 2.6 or less as a dispersed phase. | 05-23-2013 |
20130126345 | SILICON DEVICE STRUCTURE, AND SPUTTERING TARGET USED FOR FORMING THE SAME - There is provided a silicon device structure, comprising: a P-doped n | 05-23-2013 |
20130122345 | ELECTRODE LEAD CONNECTION BODY, NONAQUEOUS ELECTROLYTE ELECTRICITY STORING DEVICE AND METHOD OF MANUFACTURING THE SAME - An electrode lead connection body includes a first member that includes a same material as the positive electrode lead and is configured to be connected the positive electrode lead, a second member that includes a same material as the negative electrode lead and is configured to be connected the negative electrode lead, the first and second members being joined to each other at a portion excluding a positive electrode joint as a portion to be joined to the positive electrode lead and a negative electrode joint as a portion to be joined to the negative electrode lead, and an insulating material at a position between the first and second members and near a joint portion to join the first and second members so as to prevent a contact between the first and second members. | 05-16-2013 |
20130121651 | OPTICAL MODULE - An optical module includes a housing, an optical adapter attached to an end portion of the housing, and an optical transmitter assembly mounted in the housing. The optical transmitter assembly includes a TOSA including a plurality of light-emitting elements for outputting optical signals, and a circuit board electrically connected to the TOSA. The TOSA further includes a TOSA base having opposing side surfaces on which the plurality of light-emitting elements are oppositely arranged so as to form at least one pair. The TOSA base includes a light outputting surface having an optical component mounting portion formed thereon, and the optical component mounting portion mounts an optical multiplexer including a plurality of filters. | 05-16-2013 |
20130121650 | OPTICAL MODULE - An optical module includes a housing, an optical adapter attached to an end portion of the housing, and an optical transmitter and receiver assembly mounted in the housing. The optical transmitter and receiver assembly includes a TOSA including a plurality of light-emitting elements, a ROSA including a light-receiving element, and a circuit board electrically connected to the TOSA and the ROSA. The TOSA further includes a TOSA base having an opposing side surface on which the plurality of light-emitting elements are oppositely arranged so as to form at least one pair. The circuit board includes a first flexible substrate mounting the TOSA and a first rigid substrate connected to the first flexible substrate. The first flexible substrate includes a TOSA base facing-portion facing the TOSA base, and a connection portion extending from both end portions of the TOSA base-facing portion and connected to the plurality of light-emitting elements. | 05-16-2013 |
20130108224 | OPTICAL MODULE AND SIGNAL TRANSMISSION MEDIUM | 05-02-2013 |
20130106242 | PIEZOELECTRIC FILM ELEMENT AND PIEZOELECTRIC FILM DEVICE | 05-02-2013 |
20130092950 | NITRIDE SEMICONDUCTOR GROWTH SUBSTRATE AND MANUFACTURING METHOD OF THE SAME, NITRIDE SEMICONDUCTOR EPITAXIAL SUBSTRATE AND NITRIDE SEMICONDUCTOR ELEMENT - A nitride semiconductor growth substrate includes a principal surface including a C-plane of a sapphire substrate, and a convex portion that is formed on the principal surface, has a cone or pyramid shape or a truncated cone or pyramid shape, is disposed to form a lattice pattern in a top view thereof, and includes a side surface inclined at an angle of less than 90 degrees relative to the principal surface. The convex portion has a height of 0.5 to 3 μm from the principal surface. A distance between adjacent ones of the convex portion is 1 to 6 μm. The side surface of the convex portion has a surface roughness (RMS) of not more than 10 nm. | 04-18-2013 |
20130087368 | HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE - A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. Areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate. | 04-11-2013 |
20130087367 | HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE - A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. The plurality of filled portions includes non-overlapping portions that extend from the plurality of wiring patterns as viewed from the first surface side of the substrate, areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate. | 04-11-2013 |
20130087361 | FOAMED RESIN COMPOSITION, WIRE AND CABLE - A foamed resin composition includes syndiotactic polystyrene, and a polyolefin resin of not less than 5.3 parts by weight and not more than 54 parts by weight relative to 100 parts by weight of the syndiotactic polystyrene. Alternatively, a foamed resin composition includes syndiotactic polystyrene, and fluorine-resin-containing powder of not less than 0.5 parts by weight and not more than 10 parts by weight relative to 100 parts by weight of the syndiotactic polystyrene. | 04-11-2013 |
20130077622 | NETWORK SYSTEM - A network system includes a plurality of lower switching hubs; and one or more upper switching hubs. Each lower switching hub includes a lower switch configuring portion for configuring a first LAG for all ports connected to the one or more upper switching hubs, and transmitting a first control frame containing its own identifier from all the ports connected to the upper switching hubs. Each upper switching hub includes an upper switch configuring portion for configuring a second LAG for ports connected to the same lower switching hub, based on the first control frames received from the lower switching hubs, and transmitting a second control frame containing its own identifier from the ports configured as the second LAG. The upper switch configuring portion is configured to prohibit normal frame transmission and reception and the transmission of the second control frame at a port which is not configured as the second LAG. | 03-28-2013 |
20130074728 | METAL MICROPARTICLES AND METHOD FOR PRODUCING THE SAME, METAL PASTE CONTAINING THE METAL MICROPARTICLES, AND METAL COAT MADE OF THE METAL PASTE - To provide metal microparticles, with less content of alkali metal, halogen, sulfur, and phosphorus as impurities, wherein surfaces thereof are coated with a protective agent, and the protective agent is selected from at least one type of an amine compound and a calboxylic acid compound, and a total content of the alkali metal, halogen, sulfur, and phosphorus contained in the metal microparticles is less than 0.1 mass % relative to a mass of the metal microparticles. | 03-28-2013 |
20130072041 | NON-DRAIN DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND GROUND CONNECTION STRUCTURE THEREOF - A non-drain differential signal transmission cable includes a pair of signal conductors aligned in parallel, an insulation around the pair of signal conductors, a shield conductor around the insulation, and a ground connecting pin to electrically connect the shield conductor to a ground, the ground connecting pin including a wire. An end portion of the pair of signal conductors is exposed with the insulation and the shield conductor removed. The ground connecting pin includes a winding portion wound around the shield conductor to be electrically connected to the shield conductor, and a pin portion extending from the winding portion and having an elongate shape. | 03-21-2013 |
20130072005 | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE - To provide a method for manufacturing a nitride semiconductor substrate capable of reducing a cleavage during slicing of a nitride semiconductor single crystal, and capable of improving a yield rate of the nitride semiconductor substrate, comprising: growing a nitride semiconductor single crystal on a seed crystal substrate by vapor phase epitaxy; grinding an outer peripheral surface of the grown nitride semiconductor single crystal; and slicing the nitride semiconductor single crystal with its outer peripheral surface ground, wherein a grinding amount of the outer peripheral surface of the nitride semiconductor single crystal in the step of grinding is 1.5 mm or more. | 03-21-2013 |
20130069754 | LAMINATED COIL - A laminated coil includes a plurality of circular conductive plates in the form of a flat plate, each of the circular conductive plates being laminated via an insulating material in an axis direction. The plurality of circular conductive plates each include a plurality of concentric circular arc parts having different inner diameter and outer diameter from each other, and a connection part interconnecting the plurality of circular arc parts. The plurality of circular conductive plates are arranged such that the connection parts thereof face each other and the circular arc parts thereof are juxtaposed to each other in a radial direction. | 03-21-2013 |
20130069670 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE PROPERTY EVALUATING MECHANISM AND EVALUATING METHOD THEREFOR - A differential signal transmission cable property evaluating mechanism includes a substrate having a signal line pad to be connected with a signal line conductor of a differential signal transmission cable and a ground pad to be connected with a shield conductor of the differential signal transmission cable, a pressing member for pressing the signal line conductor to the signal line pad, a shield conductor holding sheet including an elastic insulating sheet and a metal foil provided over one side of the elastic insulating sheet, the shield conductor holding sheet provided for indirectly connecting the shield conductor and the ground pad to each other by contacting the metal foil with the shield conductor and the ground pad, and a clip for fixing the shield conductor holding sheet. | 03-21-2013 |
20130069589 | VEHICLE BATTERY CHARGING APPARATUS - A vehicle battery charging apparatus includes a charging connector including a charging current output terminal for outputting a charging current to a vehicle having an electric motor as a drive source and a proximity detection terminal for detecting a proximity of the charging connector to a inlet on the vehicle, a voltage output portion that outputs a voltage from the proximity detection terminal via a first resistor, a detection means that can detect a variation in current flowing through the first resistor caused by fitting the charging connector to the vehicle inlet, and a control section that detects the proximity of the charging connector and the vehicle inlet based on the variation in current flowing through the first resistor detected by the detection means, and enables the charging current output terminal to output a charging current when the proximity is detected. | 03-21-2013 |
20130069075 | NITRIDE SEMICONDUCTOR CRYSTAL PRODUCING METHOD, NITRIDE SEMICONDUCTOR EPITAXIAL WAFER, AND NITRIDE SEMICONDUCTOR FREESTANDING SUBSTRATE - A nitride semiconductor crystal producing method, a nitride semiconductor epitaxial wafer, and a nitride semiconductor freestanding substrate, by which it is possible to suppress the occurrence of cracking in the nitride semiconductor crystal and to ensure the enhancement of the yield of the nitride semiconductor crystal. The nitride semiconductor crystal producing method includes growing a nitride semiconductor crystal over a seed crystal substrate, while applying an etching action to an outer end of the seed crystal substrate during the growing of the nitride semiconductor crystal. | 03-21-2013 |
20130065426 | CONNECTOR AND WIRE HARNESS - A connector includes one contact terminal including a contact portion to be in contact with an other contact terminal and a connecting portion to be connected to an electric wire, and a housing including a housing hole formed therein to house the contact portion of the one contact terminal. The one contact terminal contacts with the other contact terminal by inserting the other contact terminal into the housing hole, and the contact portion of the one contact terminal is housed in the housing hole so as to be movable in a direction of intersecting with the insertion direction of the other contact terminal into the housing hole. | 03-14-2013 |
20130064499 | PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes a substrate, a photoelectric conversion element optically coupled to an optical fiber, and a conductor pattern that is provided on a surface of the substrate and includes an electrode pattern mounting the photoelectric conversion element and a restriction pattern for restricting a position of the optical fiber. | 03-14-2013 |
20130048942 | NITRIDE SEMICONDUCTOR TEMPLATE AND LIGHT-EMITTING DIODE - A nitride semiconductor template includes a substrate, and a group III nitride semiconductor layer having an oxygen-doped layer formed on the substrate, and a silicon-doped layer formed on the oxygen-doped layer. A total thickness of the group III nitride semiconductor layer is not smaller than 4 μm and not greater than 10 μm, and an average silicon carrier concentration in the silicon-doped layer is not lower than 1×10 | 02-28-2013 |
20130043442 | METAL CHLORIDE GAS GENERATOR, HYDRIDE VAPOR PHASE EPITAXY GROWTH APPARATUS, AND NITRIDE SEMICONDUCTOR TEMPLATE - A metal chloride gas generator includes: a tube reactor including a receiving section for receiving a metal on an upstream side, and a growing section in which a growth substrate is placed on a downstream side; a gas inlet pipe arranged to extend from an upstream end with a gas inlet via the receiving section to the growing section, for introducing a gas from the upstream end to supply the gas to the receiving section, and supplying a metal chloride gas produced by a reaction between the gas and the metal in the receiving section to the growing section; and a heat shield plate placed in the reactor to thermally shield the upstream end from the growing section. The gas inlet pipe is bent between the upstream end and the heat shield plate. | 02-21-2013 |
20130043069 | CABLE HOLDING STRUCTURE - A cable holding structure includes a shielded cable that includes a center conductor and a shield conductor on an outer periphery of the center conductor, and a holding portion being electrically conductive, provided on a flat plate portion and configured to hold the shielded cable. The holding portion includes a through-hole aligned in a direction intersecting with the flat plate portion. The shielded cable is held by the holding portion such that at least the center conductor is enclosed in the through-hole and the shield conductor is electrically connected to the conductive holding portion. | 02-21-2013 |
20130043058 | ADHESIVE FILM AND FLAT CABLE - An adhesive film includes an insulation film, an adhesive layer formed on the insulation film and including a copolyamide resin being soluble in a solvent at a room temperature (25° C.) and having a melting point of not less than 100° C. and not more than 150° C., a halogen-free flame retardant at a rate of not less than 100 parts by mass and not more than 250 parts by mass relative to 100 parts by mass of the copolyamide resin, and a carbodiimide compound soluble in the solvent at the room temperature (25° C.), and a conductor adhesion layer laminated on the adhesive layer. | 02-21-2013 |
20130042949 | METHOD OF MANUFACTURING SOFT-DILUTE-COPPER-ALLOY-MATERIAL - A method of manufacturing a soft-dilute-copper-alloy material includes a plastic working of a soft-dilute-copper-alloy including an additional element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn and Cr, and a balance consisting of copper and inevitable impurity, and a subsequent annealing treatment of the soft-dilute-copper-alloy. A working ratio in the plastic working before the annealing treatment is not less than 50%. | 02-21-2013 |
20130038176 | MANUFACTURING METHOD OF PIEZOELECTRIC FILM ELEMENT, PIEZOELECTRIC FILM ELEMENT AND PIEZOELECTRIC DEVICE - A manufacturing method of a piezoelectric film element includes forming a piezoelectric film including a lead-free alkali niobate based compound having a perovskite structure represented by a compositional formula of (K | 02-14-2013 |
20130037209 | OPTICAL FIBER CONNECTION METHOD AND OPTICAL FIBER CONNECTING DEVICE - An optical fiber connection method for connecting an optical fiber to an optical waveguide on a circuit board, including arranging an end portion of the optical fiber along a groove such that an end face of the optical fiber contacts with a core end face of the optical waveguide, the groove being formed on the circuit board and extending to the core end face of the optical waveguide, wherein an extended portion of the optical fiber extending out of the groove is arranged being inclined at a predetermined inclination angle with respect to the circuit board, pressing an optical fiber hold-down member against the circuit board by a pressing member, the optical fiber hold-down member being arranged on the circuit board via an adhesive so as to cover the end portion of the optical fiber, and curing the adhesive while pressing the optical fiber hold-down member against the circuit board. | 02-14-2013 |
20130032377 | INSULATED WIRE AND METHOD OF MANUFACTURING THE SAME - An insulated wire includes a conductor, and an insulation covering layer around the conductor. The insulation covering layer includes a resin composition containing a resin (A) including at least one of a polyphenylene sulfide resin and a polyetheretherketone resin and a resin (B) containing a polyethylene. The resin composition has a storage elastic modulus at 150° C. of not less than 1×10 | 02-07-2013 |
20130032374 | POLYAMIDE-IMIDE RESIN INSULATING VARNISH AND METHOD OF MANUFACTURING THE SAME, INSULATED WIRE AND COIL - A polyamide-imide resin insulating varnish includes an amic acid-containing amide compound including a repeating unit represented by a general formula (1): | 02-07-2013 |
20130023128 | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE - There is provided a method for manufacturing a nitride semiconductor substrate, comprising: etching and flattening a surface of a nitride semiconductor substrate disposed facing a surface plate, by using the surface plate having a surface composed of any one of Ni, Ti, Cr, W, and Mo or nitride of any one of them, disposing the surface of the surface plate and a flattening surface of a nitride semiconductor substrate proximately so as to be faced each other, and supplying gas containing at least hydrogen and ammonia between the surface of the surface plate and the surface of the nitride semiconductor substrate, wherein the surface plate and the nitride semiconductor substrate facing each other are set in a high temperature state of 900° C. or more. | 01-24-2013 |
20130022831 | SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE - A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 μm. | 01-24-2013 |
20130022044 | NETWORK SYSTEM - A network system includes lower switches and upper switches connected to the lower switches. Each of the upper switches transmits a first notification frame containing a connected lower switch number information indicative of the number of the lower switches connected to each of the upper switches, to the lower switches connected to each of the upper switches. Each of the lower switches configures a link aggregation group for ports which received the first notification frames each of which contains a maximum value of the connected lower switch number information among the connected lower switch number informations contained in the received first notification frames. | 01-24-2013 |
20130021930 | NETWORK SYSTEM - A network system has lower switches and upper switches connected to the lower switches. Each of the upper switches includes a connection information notifying means for notifying connected lower switch list informations each of which includes an identification information on each of the lower switches connected to each of the upper switches, to the lower switches connected to each of the upper switches. Each of the lower switches includes a comparison determination means for comparing the connected lower switch list informations notified by the connection information notifying means, in order to determine a connection state between the upper switches and the lower switches. | 01-24-2013 |
20130016949 | MULTICORE FIBERAANM YAO; BingAACI HitachiAACO JPAAGP YAO; Bing Hitachi JPAANM OHSONO; KazumasaAACI HitachiAACO JPAAGP OHSONO; Kazumasa Hitachi JPAANM SHIINA; NoribumiAACI HitachiAACO JPAAGP SHIINA; Noribumi Hitachi JP - A multicore fiber includes cores located at vertexes of a polygonal ring and a cladding including sub medium regions and covering the cores. A refractive index of the cladding is lower than a refractive index of the cores and higher than a refractive index of the sub medium regions. The sub medium regions are arranged at positions to reduce a crosstalk between adjacent cores of the cores. | 01-17-2013 |
20130015392 | PIEZOELECTRIC FILM AND METHOD FOR MANUFACTURING THE SAME, PIEZOELECTRIC FILM ELEMENT AND METHOD FOR MANUFACTURING THE SAME, AND PIEZOELECTRIC FILM DEVICEAANM SUENAGA; KazufumiAACI Tsuchiura-shiAACO JPAAGP SUENAGA; Kazufumi Tsuchiura-shi JPAANM Shibata; KenjiAACI Tsukuba-shiAACO JPAAGP Shibata; Kenji Tsukuba-shi JPAANM Watanabe; KazutoshiAACI Tsuchiura-shiAACO JPAAGP Watanabe; Kazutoshi Tsuchiura-shi JPAANM Nomoto; AkiraAACI Kasumigaura-shiAACO JPAAGP Nomoto; Akira Kasumigaura-shi JPAANM Horikiri; FumimasaAACI Nagareyama-shiAACO JPAAGP Horikiri; Fumimasa Nagareyama-shi JP - There is provided a piezoelectric film having an alkali niobate-based perovskite structure expressed by a general formula (Na | 01-17-2013 |
20130009662 | SOLAR PHOTOVOLTAIC JUNCTION BOX - A solar photovoltaic junction box for being electrically connected to a solar cell array. The junction box comprises a plurality of input branch lines electrically connected to solar cell strings, an output aggregate line that converges the plurality of branch lines, a back-flow preventing diode provided on each of the branch lines, a capacitor parallel-connected to each of the back-flow preventing diodes, an AC voltage generator that is provided on the aggregate line to allow an AC voltage to be applied to the solar cell array, a measuring means for measuring an alternating current flowing in the solar cell array, and a control unit comprising an malfunction determination portion for determining a malfunction in the solar cell array on the basis of the AC voltage applied by the AC voltage generator and the alternating current measured by the measuring means. | 01-10-2013 |
20130009519 | PIEZOELECTRIC THIN-FILM ELEMENT AND PIEZOELECTRIC THIN-FILM DEVICE - There is provided a piezoelectric thin film element, comprising: a substrate | 01-10-2013 |
20130001644 | Nitride Semiconductor Epitaxial Substrate and Nitride Semiconductor Device - There is provided a nitride semiconductor epitaxial substrate having a group III nitride semiconductor layer with C-plane as a surface, grown on a substrate via a buffer layer of the group III nitride semiconductor containing Al, wherein the buffer layer has an inversion domain on the surface. | 01-03-2013 |
20130001633 | LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGE - A light-emitting element mounting substrate includes an insulative substrate including a single-sided printed circuit board, a pair of wiring patterns formed on one surface of the substrate, the wiring patterns being separated with a first distance, a pair of filled portions including a metal filled in a pair of through-holes to contact the pair of wiring patterns and to be exposed on a surface of the substrate opposite to the one surface, the pair of through-holes being formed to penetrate through the substrate in a thickness direction and to be separated with a second distance, and an insulation layer having a light reflectivity formed on the one surface of the substrate. The pair of filled portions each have a horizontal projected area of not less than 50% of each area the pair of wiring patterns, and the insulation layer includes an opening to expose the pair of wiring patterns. | 01-03-2013 |
20130001632 | LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, LED PACKAGE AND METHOD OF MANUFACTURING THE LED PACKAGE - A light-emitting element mounting substrate includes an insulative substrate, a pair of wiring patterns formed on one surface of the substrate, and a pair of filled portions including a metal filled in a pair of through-holes to contact the pair of wiring patterns and to be exposed on a surface of the substrate opposite to the one surface, the pair of through-holes penetrating through the substrate in a thickness direction. The pair of filled portions includes a protruding portion that protrudes outward from the pair of wiring patterns when viewed from the one surface side of the substrate. | 01-03-2013 |
20130001618 | LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGE - A light-emitting element mounting substrate includes an insulative substrate including a single-sided printed circuit board, a pair of wiring patterns formed on one surface of the substrate, the wiring patterns being separated with a first distance, a pair of through-holes penetrating through the substrate in a thickness direction, the through-holes being separated with a second distance, and a pair of filled portions including a metal filled in the pair of through-holes to contact the pair of wiring patterns and to be exposed on a surface of the substrate opposite to the one surface. Each of the pair of filled portions has a horizontal projected area of not less than 50% of an area of each the pair of wiring patterns. | 01-03-2013 |
20130001585 | GALLIUM NITRIDE RECTIFYING DEVICE - A gallium nitride rectifying device includes a p-type gallium nitride based semiconductor layer and an n-type gallium nitride based semiconductor layer, the two layers forming a pn junction with each other. The p-type gallium nitride based semiconductor layer has a carrier trap (level) density of not more than 1×10 | 01-03-2013 |
20130000951 | INSULATED ELECTRIC WIRE AND COIL USING SAME - An insulated electric wire includes a conductor and an insulating coating provided around a perimeter of the conductor. The insulating coating includes a first insulating coating film around the perimeter of the conductor, the first insulating coating film being formed of a resin containing an imide structure in its molecule, and a second insulating coating film around a perimeter of the first insulating coating film, the second insulating coating film being formed of a polyimide resin comprising a repeat unit represented by Formula 1, and having an imide concentration of not less than 15% and not more than 36%, | 01-03-2013 |
20130000767 | METHOD OF MANUFACTURING RUBBER HOSE, RUBBER HOSE AND RUBBER HOSE WITH END CLAMP - A method of manufacturing a rubber hose that includes an inner rubber tube having a hollow portion, first and second braided layers formed by braiding strands, and an outer rubber tube. The method includes forming a laminated structure by sequentially forming the first braided layer on the inner rubber tube, a thermoplastic resin layer including a thermoplastic resin on the first braided layer, the second braided layer on the thermoplastic resin layer and the outer rubber tube on the second braided layer, vulcanizing the inner rubber tube and the outer rubber tube and softening the thermoplastic resin layer by heating the laminated structure to not lower than a softening temperature of the thermoplastic resin layer, and integrating the first and second braided layers by softening the thermoplastic resin layer and then solidifying the soft thermoplastic resin penetrated into mesh openings formed between the strands. | 01-03-2013 |
20120329337 | WIRE HARNESS AND METHOD OF MANUFACTURING THE SAME - A wire harness includes a plurality of wires, and a connector including a housing for holding end portions of the plurality of wires. The housing includes an airtight block that includes a resin, an insertion hole formed thereon for inserting the plurality of wires, a flow channel in communication with the insertion hole to flow a molten resin therethrough for resin-sealing a gap between the insertion hole and the plurality of wires, and a melting section to be the molten resin being integrally formed with the flow channel. The gap between the insertion hole and the plurality of wires is resin-sealed such that an ultrasonic vibrator relatively moving with respect to the airtight block is brought into contact with the melting section, and the molten resin melted from the melting section by heat generated by vibration of the ultrasonic vibrator is poured into the gap. | 12-27-2012 |
20120324726 | METHOD OF MANUFACTURING WIRE HARNESS - A method of manufacturing a wire harness including a plurality of wires and a connector with a housing. The method includes arranging the plurality of wires in an insertion hole of an airtight block of the housing to have a gap between the plurality of wires and an inner surface of the insertion hole, supplying a molten resin having a fluidity into the gap through a flow channel in communication with the gap, and solidifying the molten resin inside the space to resin-seal the gap between the insertion hole and the plurality of wires. The supplying of the molten resin is conducted such that a tool for melting a solid resin member is attached to the airtight block, the resin member is melted by applying an ultrasonic vibration while being pressed against the tool, and the molten resin obtained by the melting is poured into the flow channel. | 12-27-2012 |
20120322319 | CONNECTOR SYSTEM - A connector system includes a plurality of first connecting terminals, a plurality of second connecting terminals, a first housing, a second housing, a plurality of insulating members, a laminated structure formed by the plurality of first and second connecting terminals and the plurality of insulating members, a pressing mechanism including a rotary member rotatably supported on the first housing and configured to generate a pressing force to press the laminated structure in a lamination direction thereof, a rotation inhibiting mechanism configured to inhibit a rotation of the rotary member in a direction of generating the pressing force when the first housing is not fitted to the second housing, and a rotation-inhibition release mechanism configured to release the inhibition of the rotation of the rotary member by the rotation inhibiting mechanism so as to allow the rotation of the rotary member when the first housing is fitted to the second housing. | 12-20-2012 |
20120321252 | Optical Connector - In an optical connector, end faces of a pair of ferrules that hold multiple optical fibers are positioned with two guide pins and butted against each other to connect the optical fibers in the pair of ferrules. The optical connector is provided with an urging member for pushing the end faces against each other. The end faces are ground at an angle. The gap between the guide pins and guide holes, which open at the end faces and into which the guide pins are fitted, is larger than 0.004 mm and smaller than or equal to 0.008 mm. Powder caused by the friction generated when the guide pins are inserted and fitted into the guide holes is greatly reduced. Connection loss does not increase even when frequent connection and disconnection are performed, and cleaning the connector becomes unnecessary. | 12-20-2012 |
20120318557 | CROSSLINKED RESIN COMPOSITION, AND WIRE, CABLE AND MOLDED WIRE COATED WITH THE SAME - A crosslinked resin composition includes a resin composition including not less than 0.01 parts by mass and not more than 20 parts by mass of a vinyl monomer relative to 100 parts by mass of a thermoplastic polyurethane, the vinyl monomer having a molecular structure including at least one functional group of acid anhydride, silane, amine and epoxy. The resin composition is crosslinked by an electron beam irradiation. | 12-20-2012 |
20120318555 | POLYAMIDE-IMIDE RESIN INSULATING COATING MATERIAL, INSULATED WIRE AND COIL - A polyamide-imide resin insulating coating material includes an polyamic acid having a thermally crosslinkable reactive group, and an amide compound having a thermally crosslinkable reactive group. The polyamic acid includes an acid synthesized using at least a diamine component, a tetracarboxylic dianhydride and a cross-linking agent as raw materials. The cross-linking agent includes an amino group or an anhydride group and a thermally crosslinkable reactive group. The amide compound includes a compound synthesized using at least a carboxylic acid compound and a diisocyanate component as raw materials. The carboxylic acid compound includes a thermally crosslinkable reactive group that is crosslinkable with the cross-linking agent contained in the polyamic acid. | 12-20-2012 |
20120313108 | SEMICONDUCTOR DIODE - To provide a semiconductor diode with a part of a semiconductor lamination portion having a mesa structure portion, which is the part where a pn-junction is formed by lamination of an n-type semiconductor layer and a p-type semiconductor layer on a substrate, comprising: a protective insulating film formed by coating a main surface of the mesa structure portion, a side face of the mesa structure portion in which an interface of the pn-junction is exposed, and an etched and exposed surface of the n-type semiconductor layer; and an anode electrode formed in ohmic-contact with the p-type semiconductor layer exposed from an opening formed on a part of the main surface of the mesa structure portion of the protective insulating film, extending from the main surface, through the side face of the mesa structure portion, to the surface of the n-type semiconductor layer. | 12-13-2012 |
20120312581 | SILANE-CROSSLINKED POLYOLEFIN INSULATED WIRE - A silane-crosslinked polyolefin insulated wire includes a conductor, and an insulating cover layer extruded on an outer periphery of the conductor. The insulating cover layer includes a silane-crosslinked polyolefin to be crosslinked by reacting water with a polyolefin having an alkoxysilyl group as a side chain. The insulating cover layer further includes an amine compound having a boiling point of not less than an extrusion temperature in an environment at 760 mmHg as a crosslinking promoter to promote crosslinking of the polyolefin in an amount of not less than 0.03 parts by mass and not more than 0.5 parts by mass per 100 parts by mass of the polyolefin. | 12-13-2012 |
20120312580 | SILANE-CROSSLINKED POLYOLEFIN INSULATED WIRE - A silane-crosslinked polyolefin insulated wire includes a conductor, and an insulating cover layer extruded on an outer periphery of the conductor. The insulating cover layer includes a silane-crosslinked polyolefin to be cross-linked by reacting water with a polyolefin having an alkoxysilyl group as a side chain. The insulating cover layer further includes a guanidine derivative having a boiling point of not less than 170° C. and a melting point of less than 190° C. in an environment at 760 mmHg as a crosslinking promoter to promote crosslinking of the polyolefin in an amount of not less than 0.05 parts by mass and not more than 0.5 parts by mass per 100 parts by mass of the polyolefin. | 12-13-2012 |
20120308238 | DISTRIBUTED ANTENNA SYSTEM - A distributed antenna system includes a first antenna disposed covering a predetermined communication range, the first antenna carrying out a communication at least at a low-frequency band, and a plurality of second antennas disposed covering the predetermined communication range, the plurality of second antennas carrying out a communication at a high-frequency band. The distributed antenna system is operable to carry out a communication between the first antenna and the second antennas, and a mobile terminal located within the predetermined communication range by means of carrier aggregation using the low-frequency band and the high-frequency band. The distributed antenna system further includes a BB module equipped in a base station for carrying out a communication within the predetermined communication range, the first antenna and the second antennas being each connected to the one BB module via an RF module. | 12-06-2012 |
20120306314 | PIEZOELECTRIC THIN FILM ELEMENT, AND PIEZOELECTRIC THIN FILM DEVICE - Disclosed are a piezoelectric thin film element and a piezoelectric thin film device which have improved piezoelectric properties and high performance and can be produced in improved yields. The piezoelectric thin film element ( | 12-06-2012 |
20120305935 | APPARATUS FOR PRODUCING METAL CHLORIDE GAS AND METHOD FOR PRODUCING METAL CHLORIDE GAS, AND APPARATUS FOR HYDRIDE VAPOR PHASE EPITAXY, NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR DEVICE, WAFER FOR NITRIDE SEMICONDUCTOR LIGHT EMITTING DIODE, METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR FREESTANIDNG SUBSTRATE AND NITRIDE SEMICONDUCTOR CRYSTAL - There is provided an apparatus for producing metal chloride gas, comprising: a source vessel configured to store a metal source; a gas supply port configured to supply chlorine-containing gas into the source vessel; a gas exhaust port configured to discharge metal chloride-containing gas containing metal chloride gas produced by a reaction between the chlorine-containing gas and the metal source, to outside of the source vessel; and a partition plate configured to form a gas passage continued to the gas exhaust port from the gas supply port by dividing a space in an upper part of the metal source in the source vessel, wherein the gas passage is formed in one route from the gas supply port to the gas exhaust port, with a horizontal passage width of the gas passage set to 5 cm or less, with bent portions provided on the gas passage. | 12-06-2012 |
20120304429 | MANUFACTURING METHODS OF PIEZOELECTRIC FILM ELEMENT AND PIEZOELECTRIC DEVICE - A manufacturing method of a piezoelectric film element includes forming a lower electrode on a substrate, forming a piezoelectric film including a lead-free alkali niobate based compound having a perovskite structure on the lower electrode, forming a mask pattern on the piezoelectric film, dry-etching the piezoelectric film via the mask pattern, removing the mask pattern after the dry etching, and heat-treating the piezoelectric film in an oxidizing atmosphere. A manufacturing method of a piezoelectric device includes forming an upper electrode on the piezoelectric film of the piezoelectric film element formed by the manufacturing method of the piezoelectric film element, and connecting an electric voltage applying means or an electric voltage detecting means to the lower electrode and the upper electrode. | 12-06-2012 |
20120300773 | NETWORK SYSTEM AND METHOD OF OPERATING THE SAME - A network system includes a plurality of lower switches, a plurality of upper switches, and a link group for interconnecting the plurality of lower switches to the plurality of upper switches in a multipoint-to-multipoint relationship. The link group includes a sub-link for interconnecting the plurality of lower switches to the plurality of upper switches in a point-to-point relationship as one logical link and a main link for interconnecting the plurality of lower switches to the plurality of upper switches in a point-to-multipoint relationship as one logical link. The plurality of lower switches are each set such that a broadcast frame with a broadcast address set as a destination is transmitted to the plurality of upper switches through the sub-link. The plurality of upper switches each receive the broadcast frame and resister a source address contained in the broadcast frame into an FDB of the plurality of upper switches. | 11-29-2012 |
20120298400 | TWISTED PAIR WIRE AND TWISTED PAIR CABLE USING STRANDED CONDUCTORS HAVING MOISTURE RESISTANCE - A twisted pair wire includes a pair of covered wires each formed by covering stranded conductors with a covering body. The covering body includes a covering body material including a silane coupling agent. Alternatively, the covering body includes a plurality of covering layers, and an innermost layer of the plurality of covering layers contacting with the stranded conductors includes a covering body material including a silane coupling agent. | 11-29-2012 |
20120292078 | HALOGEN-FREE FLAME-RETARDANT RESIN COMPOSITION, WIRE AND CABLE - A halogen-free flame-retardant resin composition includes a polyolefin-based resin, a phenolic antioxidant, a metal hydroxide, a pigment comprising one of titanium dioxide, monoazo yellow, benzimidazolone yellow, isoindolinone yellow, quinacridone red and perylene red, and an additive including an amide bond. The additive having the amide bond is added in an amount of 0.01 to 2 parts by weight relative to 100 parts by weight of the polyolefin-based resin. | 11-22-2012 |
20120292077 | RESIN COMPOSITION, AND WIRE AND CABLE USING THE SAME - A resin composition includes a silane-crosslinked polyethylene as a main component provided by crosslinking a polyethylene in the presence of a silanol condensation catalyst and water, the polyethylene being graft-copolymerized with a silane compound by a free radical generating agent. The polyethylene has a density of 0.87 to 0.91 g/cm3. The silane compound is included not less than 2 parts by mass relative to 100 parts by mass of the polyethylene. The resin composition includes silicon detected by a fluorescence X-ray at a rate of not less than 0.3 mass % and has a gel fraction of not less than 70%. A mass ratio of the silane compound to the free radical generating agent is not less than 35 and not more than 150. | 11-22-2012 |
20120288403 | GaAs SINGLE CRYSTAL WAFER AND METHOD OF MANUFACTURING THE SAME - The present invention provides a GaAs single crystal wafer and a method of manufacturing the same, wherein the wafer is characterized in that, when the strain in the radial direction in the GaAs single crystal wafer is expressed as Sr and the strain in the tangential direction on the circumference of the same is expressed as St, the residual stress in a wafer plane of the semi-insulating GaAs wafer denoted by |Sr−St| is smaller than 1.0×10 | 11-15-2012 |
20120285729 | ELECTRICAL WIRE HOLDING DEVICE - An electrical wire holding device includes a seal retention member having an insertion hole configured to allow an electrical wire to be inserted therethrough, and housed in a mounting hole formed in a mounted member, an outer periphery seal member retained on an outer peripheral surface of the seal retention member, and sealing a gap between an inner surface of the mounting hole and seal retention member, and an electrical wire holding member juxtaposed with the seal retention member along the electrical wire, and having a fixing part configured to retain the electrical wire and fixing the electrical wire to the mounted member. The seal retention member is configured to be relatively movable to the electrical wire holding member. | 11-15-2012 |
20120276772 | FLAT CABLE AND CONNECTION STRUCTURE BETWEEN FLAT CABLE AND PRINTED WIRING BOARD - A flat cable includes a plurality of conductors arranged in parallel, an insulating member covering the plurality of conductors, a first reinforcing member on a surface of an end portion of the insulating member, and a second reinforcing member on an opposite side of the first reinforcing member across the conductor and the insulating member. The first reinforcing member includes a reinforcing metal plate including an end portion bent toward the second reinforcing member, a covering member covering at least a portion of a periphery of the reinforcing metal plate, and an adhesive interposed between the reinforcing metal plate and the covering member and between the covering member and the insulating member to bond the reinforcing metal plate to the covering member and the covering member to the insulating member. The second reinforcing member has a rigidity greater than that of the covering member of the first reinforcing member. | 11-01-2012 |
20120271930 | TRANSMISSION DEVICE CONTROL SYSTEM - A control computer | 10-25-2012 |
20120268336 | ELECTROMAGNETIC WAVE RADIATION COAXIAL CABLE AND COMMUNICATION SYSTEM USING THE SAME - An electromagnetic wave radiation coaxial cable and a communication system using the same. The electromagnetic wave radiation coaxial cable includes an inner conductor which is formed of a conductor and extends along a cable axis, an insulator covering the inner conductor, and an outer conductor spirally wound around the insulator in a single winding at a predetermined pitch to provide a gap from which a part of the insulator is exposed. Following formula is established: | 10-25-2012 |
20120267143 | SHIELDED FLAT RIBBON CABLE AND METHOD FOR FABRICATING A SHIELDED FLAT RIBBON CABLE - A shielded flat ribbon cable includes a plurality of insulated conductors being spaced parallel to each other, the insulated conductors each including an inner conductor and an insulation coating the inner conductor; an outer conductor bundling the insulated conductors together, the outer conductor including a first shell and a second shell in association with each other to sandwich the insulated conductors therebetween, each of the first shell and the second shell including a plurality of grooves covering outer surfaces of the insulated conductors, and a plurality of edge portions integral with both sides of the grooves, and gap formation-suppressing means for suppressing formation of gaps between the edge portions of the first shell and the edge portions of the second shell, respectively. | 10-25-2012 |
20120255761 | ADHESIVE FILM AND FLAT CABLE USING SAME - The adhesive film includes an insulating film, an adhesive layer provided over one side of the insulating film, and an anchor coat layer provided between the one side of the insulating film and the adhesive layer. The adhesive layer is a copolymer polyamide resin which is soluble in a solvent at 25 degrees Celsius and has a melting point of 100 degrees Celsius or more and 150 degrees Celsius or less. The anchor coat layer enhances the adhesion between the insulating film and the adhesive layer. | 10-11-2012 |
20120248611 | INTERCONNECTING STRUCTURE PRODUCTION METHOD, AND INTERCONNECTING STRUCTURE - An interconnecting structure production method includes providing a substrate, forming a semiconductor layer on the substrate, forming a doped semiconductor layer on the semiconductor layer, the doped semiconductor layer containing a dopant, forming an oxide layer in a surface of the doped semiconductor layer by heating the surface of the doped semiconductor layer in atmosphere of an oxidizing gas with a water molecule contained therein, forming an alloy layer on the oxide layer, and forming an interconnecting layer on the alloy layer. | 10-04-2012 |
20120248592 | LEAD COMPONENT AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE - To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer. | 10-04-2012 |
20120244755 | CONNECTOR - A connector includes a first terminal housing for housing a plurality of first connecting terminals aligned, a second terminal housing for housing a plurality of second connecting terminals aligned, a plurality of insulating members aligned and housed in the second terminal housing, a resin molded body provided in the second terminal housing, and an insulating member assembly formed by assembling the plurality of insulating members. The resin molded body includes at least one pair of restricting protrusions in order to restrict expanding movement of the insulating member assembly in the lamination direction when inserting the first connecting terminals into a gap between the second connecting terminals and the insulating members. The insulating member assembly includes a terminal protecting member to interfere with a rim of the first terminal housing to prevent the first terminal housing from being erroneously inserted into the gap. | 09-27-2012 |
20120243834 | Cable with a connector used for transmission of an electrical signal, an optical signal, and the like - Provided is a cable with a connector ( | 09-27-2012 |
20120241191 | INSULATING COATING MATERIAL AND INSULATED WIRE USING THE SAME - An insulating coating material includes a polyamide-imide resin insulating coating material, and surface-treated inorganic fine particles dispersed in the polyamide-imide resin insulating coating material. A viscosity measured by an E-type viscometer is 1000 to 4000 mPa·s at 30° C. and at a shear rate of 200 s-1 and 4000 to 12000 mPa·s at 30° C. and at a shear rate of 1 s-1. An insulated wire includes a rectangular conductor, and an insulating layer formed on the rectangular conductor and including the insulating coating material. | 09-27-2012 |
20120228437 | ARTICULATED CABLE PROTECTION AND GUIDE APPARATUS - There is provided an articulated cable protection and guide apparatus that can securely and stably guide a large number of cables, can assure durability of articulated supporting members that operate between straight and bending postures for a long period of time, and can be easily disassembled and assembled at a machine frame-side stationary end-side connector unit or at a moving end-side connector unit. The articulated cable protection and guide apparatus comprises: a stationary end-side connector unit for affixing each stationary end of articulated supporting members, cables and a flexible belt member integrally to a machine frame-side stationary end area; a moving end-side connector unit for affixing each moving end of the articulated supporting members, cables and a flexible belt member integrally to a movable-side moving end area. | 09-13-2012 |
20120224814 | PHOTOELECTRIC TRANSMISSION MODULE - A photoelectric transmission module being connected to a terminal of a composite cable including an optical fiber and an electrical cable, includes a substrate connected to the electrical cable drawn from the composite cable, a flexible printed circuit board including one end connected to a connector on the substrate and an other end connected to the optical fiber drawn from the composite cable, and an optical waveguide member formed along an outer surface of the flexible printed circuit board and connected to the optical fiber. The flexible printed circuit board further includes a displacement permitting area formed in a section from a connection end of the connector to a connection end of the optical fiber to allow the connection end of the connector and the connection end of the optical fiber to be relatively displaced in a direction along the substrate. | 09-06-2012 |
20120224169 | OPTICAL FIBER VIBRATION SENSOR - A Sagnac interference type optical fiber vibration sensor includes two optical fiber loops arranged along a structure, and a vibration sensor main body which detects the vibration caused to the structure via the two optical fiber loops. A sensitivity of one of the two optical fiber loops for detecting a vibration decreases with a distance from one end to an other end, while a sensitivity of an other of the two optical fiber loops increases with a distance from the one end to the other end. The main body includes a portion for determining whether the vibration occurred to the structure based on a sum of outputs produced via the two optical fiber loops, and a portion for determining a position where the vibration occurred based on an output ratio which is a difference between the outputs produced which is divided by the sum of the outputs produced. | 09-06-2012 |
20120218555 | OPTICAL INGREDIENT-MEASURING APPARATUS - An optical ingredient-measuring apparatus is provided for measuring a concentration of an optically rotative substance. The apparatus includes a sensor main body which detects a phase difference between linear polarized light beams that propagate through an optical fiber loop in opposite directions, a circular polarized input component interposed in the middle of the optical fiber loop having first and second converters that convert the linear polarized light propagating through the optical fiber loop into left-hand and right-hand circular polarized light, and a concentration detector, installed in the sensor main body, which calculates the concentration of the substance in the sample based on the detected phase difference. | 08-30-2012 |
20120217035 | Shielded insulated electric cable - A shielded insulated electric cable includes an insulation layer that is in contact with a metal braid. The insulation layer includes a halogen-free cross-linked rubber that includes 100 parts by weight of a halogen-free rubber excluding a silicone rubber, and 1 to 20 parts by weight of a hindered phenol compound and a thioether compound. | 08-30-2012 |
20120213246 | Method for Evaluating Life of Cable Insulating Coating Material - Disclosed is a method for estimating, within a short time, the life of a cable insulating coating material containing an antioxidant in a suitable concentration based on the rate of decrease of the antioxidant and on the critical concentration of the antioxidant at which oxidative degradation rapidly proceeds. The method tests the coating material to examine its life, the coating material including a base polymer, and an antioxidant having a functional group suppressing an oxidative deteriorative reaction of the base polymer. The method includes performing a thermal degradation test on the coating material; determining the degradation levels and degradation rates of the coating material at two or more time points in the thermal degradation test, based on the ratio of the absorbance of the functional group of the antioxidant to the absorbance of the base polymer; and thereby evaluating the life of the coating material. | 08-23-2012 |
20120211258 | POLYAMIDE-IMIDE RESIN INSULATING COATING MATERIAL AND INSULATED WIRE USING THE SAME - A polyamide-imide resin insulating coating material includes a polyamide-imide resin produced by reacting an aromatic diisocyanate component with a composition obtained by a synthesis reaction of a diamine component with an acid component that includes an aromatic tricarboxylic acid anhydride component (A) and an aromatic tetracarboxylic dianhydride component (B). The aromatic tetracarboxylic dianhydride component (B) includes an aromatic tetracarboxylic dianhydride component (B-1) having not less than four aromatic rings. | 08-23-2012 |
20120211213 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a laminated body disposed in a flow path for circulating a refrigerant. The laminated body includes a metallic tube body enclosing the flow path therein, an insulation layer formed on a periphery of the tube body, and a conductor that is formed on a periphery of the insulation layer and includes a bonding surface bonded to an electrode of a semiconductor device to be cooled. | 08-23-2012 |
20120207438 | FLEXIBLE FLAT OPTICAL CABLE - A flexible flat optical cable includes two flexible base sheets, one or more optical fiber core wires arranged between the base sheets and each comprising at least an optical fiber, and an adhesive layer provided between the base sheets to bond the base sheets. A non-adhesive region is formed on a surface of the base sheets or the adhesive layer adjacent, in a thickness direction of the base sheets, to at least a portion of the optical fiber core wires for allowing a portion of the optical fiber core wires to move in a direction intersecting with an axial direction of the optical fiber core wires. | 08-16-2012 |
20120207065 | Radio communication system and a repeater - A radio communication system for a communication between a base station and a mobile terminal. The radio communication system repeats a signal transmitted from the base station at repeaters that are multistage-connected by a leaky coaxial cable. Each repeater converts a frequency of an input signal into a different frequency and outputs the frequency-converted signal to the leaky coaxial cable connected to the repeater. The repeaters are provided between the leaky coaxial cables connected in series. | 08-16-2012 |
20120201494 | OPTICAL SWITCH - An optical switch includes a first connector holding an end of at least one optical fiber and a second connector holding respective ends of at least two optical fibers. The optical switch further includes a sliding mechanism faces a connecting surface of the first connector and a connecting surface of the second connector each other, to optically connect between the at least one optical fiber held in the first connector and one of the at least two optical fibers held in the second connector, and slides the connecting surface of the first connector and the connecting surface of the second connector relative to each other with keeping a facing state, and a spacer mechanism for preventing the respective end faces of the facing optical fibers held in the first and second connectors from contacting each other, or from contacting the connecting surfaces of the first and second connectors, respectively. | 08-09-2012 |
20120199390 | Three-conductor cable - A three-conductor cable includes three cables disposed in a triangular form in a cross sectional view thereof, and a first refrigerant path at a cable center portion surrounded by the three cables along a longitudinal direction of the three cables for flowing a refrigerant for cooling the three cables therethrough. The first refrigerant path is formed along a part of each of the three cables in a cross sectional view thereof. | 08-09-2012 |
20120195545 | PHOTOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes: a photoelectric conversion element and an IC chip mounted on a mounting surface of a substrate; and an electrode provided on a side surface of the substrate, electrically connected to the IC chip, and having a concave shape sunk deeper than other portions of the side surface of the substrate. | 08-02-2012 |
20120193742 | PHOTOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film. | 08-02-2012 |
20120193122 | Differential signal transmission cable and method for fabricating the same - A differential signal transmission cable has a pair of insulated wires, a first tape and a second tape. Each of the first and second tapes is made of a base material having an electrical insulating property and an electrical conductive film formed on at least one surface of the base material. The first tape is spirally wound around the insulated wires such that the electrical conductive film is provided outside. The second tape is spirally wound around the first tape such that the electrical conductive film of the second tape contacts with the electrical conductive film of the first tape. Among angles made by an upper edge of the insulated wires and an edge of the first tape in a side view in which a longitudinal direction of the pair of insulated wires is a horizontal direction, a first angle made on one end side of the insulated wires is an acute angle in the first tape. Among angles made by the upper edge of the pair of insulated wires and an edge of the second tape in the side view, a second angle made on the one end side of the insulated wires is an obtuse angle in the second tape. | 08-02-2012 |
20120190555 | CONSTRUCTION OF SUPERCONDUCTING MULTI-CORE BILLET AND METHOD FOR MANUFACTURING SUPERCONDUCTING MULTI-CORE WIRES - A physical construction of a superconducting multi-core billet is provided together with a method for manufacturing a superconducting multi-core wire to offer reduction of manufacturing time (cost) and low frequency of occurrence of wire break during diameter-reduction drawing. The superconducting multi-core billet by the present invention has such a construction that a plurality of vertical holes are made in a billet | 07-26-2012 |
20120187547 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE WAFER - A semiconductor wafer having a disc shape includes a chamfer provided around a circumferential edge of the wafer, and an anti-cracking and chipping groove provided in one or more areas around one circumference of an end face of the wafer along a circumferential direction of the end face. The anti-cracking and chipping groove is configured to prevent cracking or chipping of the end face in back grinding. | 07-26-2012 |
20120186850 | Differential signal transmission cable - A differential signal transmission cable has a pair of conductors arranged to be distant from each other and parallel to each other, an insulator covering the pair of conductors, and a shield conductor wound around the insulator. The insulator has an outer periphery shape of a transversal cross section in that a plurality of curved lines with different curvature radiuses are combined. The shield conductor has an inner periphery shape of a transversal cross section in that the plurality of curved lines are combined in accordance with the outer periphery shape of the insulator. | 07-26-2012 |
20120186845 | Conducting path - A conducting path includes a plurality of cables, and a cable clamp for clamping the plurality of cables together. The cable clamp includes a single metal plate molded along a perimeter of the plurality of cables, an attachment flange formed by overlapping both ends of the metal plate, and a cable supporting member for supporting the plurality of cables between the cable supporting member and the metal plate. The cable supporting member includes a coolant passage formed therein for passing a coolant to cool the plurality of cables in a longitudinal direction of the plurality of cables. | 07-26-2012 |
20120184152 | CONNECTOR - A connector includes a first terminal housing for housing a plurality of first connecting terminals aligned, a second terminal housing for housing a plurality of second connecting terminals aligned, a plurality of insulating members aligned and housed in the first or second terminal housing, and a connecting member for collectively fixing and electrically connecting the plurality of first connecting terminals and the plurality of second connecting terminals at each contact point by pressing the plurality of first connecting terminals and the plurality of second connecting terminals. The connecting member includes a ring-shaped support fixed to the first terminal housing, a rotating portion an upper portion of which is inserted into a hollow formed inside the ring-shaped support so as to be pivotally supported by the support, and a pressing portion to move in a vertical direction relative to the rotating portion by turning the rotating portion. | 07-19-2012 |
20120184149 | Connector - A connector includes a first terminal housing for housing three first connecting terminals aligned, a second terminal housing for housing three second connecting terminals aligned, a plurality of insulating members that are aligned and housed in the second terminal housing, and a connecting member for collectively fixing and electrically connecting the three first connecting terminals and the three second connecting terminals at each contact point by pressing one of the plurality of insulating members adjacent to the connecting member. The three first connecting terminals and the three second connecting terminals are each arranged in a form of a triangle when viewed in the fitting direction. | 07-19-2012 |
20120184130 | Flat cable and connection structure between flat cable and printed wiring board - A flat cable includes a plurality of conductors arranged in parallel and exposed at both end portions in a longitudinal direction thereof, an insulation film covering the plurality of conductors except the exposed both end portions, and a reinforcing member that covers the plurality of conductors along a width direction of the plurality of conductors, is provided on a surface of the insulation film in a part of a region including an edge of the insulation film, and includes a metal plate and an insulative covering layer for covering the metal plate. | 07-19-2012 |
20120184125 | CONNECTOR - A connector includes a first terminal housing for housing plural first connecting terminals aligned, a second terminal housing for housing plural second connecting terminals aligned, plural insulating members, a connecting member for collectively fixing and electrically connecting the plural first connecting terminals and the plural second connecting terminals at each contact point by pressing the plural first connecting terminals and the plural second connecting terminals. The connecting member includes a ring-shaped support fixed to the first terminal housing and a pressing portion an upper part of which is inserted into a hollow formed inside the ring-shaped support so as to be pivotally supported by the support. The pressing portion is configured to turn relative to the support by turning the upper part of the pressing portion and to move relative to the support with the turning of the pressing portion in a vertical direction. | 07-19-2012 |
20120184123 | CONNECTOR - A connector includes a first terminal housing for housing a plurality of first connecting terminals aligned, a second terminal housing for housing a plurality of second connecting terminals aligned, a plurality of insulating members aligned and housed in the first or second terminal housing, and a plurality of device side connecting terminals each integrated with the plurality of first connecting terminals at a base end side of the plurality of first connecting terminals, and electrically connected to a device to which the first terminal housing is attached. The plurality of device side connecting terminals are each plate-shaped and each include a surface parallel to a lamination direction of the laminated structure and to a fitting direction of the first and second terminal housings. The first terminal housing includes a terminal block for holding the plurality of device side connecting terminals to be aligned in the lamination direction. | 07-19-2012 |
20120183253 | PHOTOELECTRIC CONVERSION MODULE - A photoelectric conversion module includes: an IC chip and a photoelectric conversion element mounted on one surface of a circuit board having a light transmitting property and flexibility; an optical fiber having a tip portion disposed in a holding groove formed in a resin layer provided on another surface of the circuit board; a reinforcing member covering the holding groove; and an optical element optically coupling a tip of the optical fiber and the photoelectric conversion element via the circuit board. The holding groove has an open end at an end of the resin layer, the end of the resin layer being located on the IC chip side in terms of an arrangement direction of the IC chip and the photoelectric conversion element, and at least part of the tip portion of the optical fiber extends along the IC chip. | 07-19-2012 |
20120182117 | POSITION SENSOR CORD, POSITION SENSOR AND PLANAR POSITION SENSOR - A position sensor cord includes a hollow insulator formed of a restorable rubber or a restorable plastic, and two linear resistive members. Each of the two linear resistive members includes a linear insulator and a conductive layer provided around a circumference of the linear insulator. The conductive layer is formed of a conductive rubber or a conductive plastic. The two linear resistive members are arranged in no electrical contact with each other and along an inner surface of the hollow insulator. One of the two linear resistive members may be replaced with one linear conductive member. | 07-19-2012 |
20120181535 | PHOTOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING THE SAME - A photoelectric conversion module includes a circuit board including a plurality of first board-side electrodes and a plurality of second board-side electrodes that are alternately arranged on a mounting surface of the circuit board in an array direction and each extend into strips in a direction orthogonal to the array direction, a photoelectric conversion array element mounted on the circuit board and including, on a surface facing the mounting surface, a plurality of light receiving/emitting portions, first element-side electrodes connected to the first board-side electrodes and second element-side electrodes connected to the second board-side electrodes, and an IC chip mounted on the circuit board. The circuit board further includes, on the mounting surface, a connecting portion for connecting the first board-side electrodes to each other and a first electrode land portion connected to the first board-side electrode or the connecting portion to contact with a first test electrode probe. | 07-19-2012 |
20120175146 | CABLE WITH LESS RESIDUAL BEND - A cable with less residual bend includes a sheath as an outermost layer; and a thread for correcting a residual bend. The thread is provided inside the sheath and disposed in parallel with a center axis of the cable along a longitudinal direction of the cable. | 07-12-2012 |
20120170901 | OPTICAL FIBER END PROCESSING METHOD AND OPTICAL FIBER END PROCESSING APPARATUS AND OPTICAL FIBER END - An optical fiber end processing method includes fixing two portions of an optical fiber, heating and fusing the optical fiber between the two fixed portions, to form a first heat fusion region, heating and fusing the optical fiber fixed between the two fixed portions unit while fixing the two fixed portions, moving a heat fusion unit from a side of the first heat fusion region toward a base end side of the optical fiber, and pushing a heat fusion portion of the optical fiber in a direction of shortening a length of the heat fusion portion, to form a second heat fusion region continuous to the first heat fusion region and in which the air holes of the optical fiber disappear; and removing the first heat fusion region by cutting the optical fiber within the second heat fusion region after the second heat fusion forming. | 07-05-2012 |
20120163759 | RESIN COATED OPTICAL FIBER - There is provided a resin coated optical fiber, comprising at least: a glass optical fiber composed of a core and a clad for coating the core; a primary layer made of UV-curing resin in contact with the glass optical fiber; and a secondary layer made of the UV-curing resin disposed on an outer periphery of the primary layer, wherein the primary layer has a two-layer structure of an inner layer in contact with a surface of the clad, and an outer layer for coating the inner layer, wherein the UV-curing resin of the inner layer has Young's modulus of 0.9 MPa or more and 3.0 MPa or less at room temperature in a film state based on JIS standard K7113, and the UV-curing resin of the outer layer has Young's modulus of 0.1 MPa or more and 0.7 MPa or less at room temperature in a film state based on JIS standard K7113. | 06-28-2012 |
20120156916 | CONNECTOR - A connector includes a first terminal housing for housing a plurality of first connecting terminals aligned, a second terminal housing for housing a plurality of second connecting terminals aligned, a plurality of insulating members that are aligned and housed in the first terminal housing, a connecting member for collectively fixing and electrically connecting the plurality of first connecting terminals and the plurality of second connecting terminals at each contact point by pressing one of the plurality of insulating members adjacent to the connecting member, and an insulating member assembly including the plurality of insulating members assembled such that the plurality of insulating members are each restricted from moving in a fitting direction thereof, and moving in a width direction perpendicular to a lamination direction of the laminated structure and to the fitting direction. | 06-21-2012 |
20120152589 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A differential signal transmission cable includes a pair of insulated electric wires disposed to be parallel with each other, and a shield layer formed of a metal foil composite tape spirally wound around the pair of insulated electric wires collectively. The shield layer is formed by folding the metal foil composite tape along a longitudinal direction of the metal foil composite tape such that a surface on which a metal foil is provided is located outside to provide a folded portion, and winding the metal foil composite tape around the pair of insulated electric wires such that at least a part of the folded portion is located at a spiral overlapped region of the metal foil composite tape. | 06-21-2012 |
20120149579 | Precursor for a Nb3Sn superconductor wire, method for manufacturing the same, Nb3Sn superconductor wire, and superconducting magnet system - A precursor for a Nb | 06-14-2012 |
20120147931 | Frequency Converter and Wireless Repeater Using the Same, and Wireless Repeating System Using the Same - According to a wireless repeating system of the invention, a first analog signal is digitally converted at a first sampling frequency, a converted original digital signal is oversampled at a second sampling frequency higher than the first sampling frequency, an image digital signal occupying a specific frequency band out of plural image digital signals generated by zero-interpolation is extracted via a digital filter, and the image digital signal is input to a delta-sigma demodulator to convert to a second analog signal and output the second analog signal. | 06-14-2012 |
20120146067 | LIGHT EMITTING DEVICE - A light emitting device includes a supporting substrate, a first conductivity type layer of a first conductivity type provided on the supporting substrate, an active layer provided on the first conductivity type layer, a second conductivity type layer of a second conductivity type provided on the active layer, a first electrode being in contact with a part of the surface of the first conductivity type layer, and a second electrode being in contact with a part of the surface of the second conductivity type layer. The first electrode is in contact with a surface of the first conductivity type layer, and the surface is different from a surface of the first conductivity type layer corresponding to a region located directly above or below the active layer. | 06-14-2012 |
20120145433 | RESIN COMPOSITION AND FOAM INSULATED WIRE - A resin composition includes a polyolefin resin. A viscosity of the resin composition is within a range of not less than 500 Pa·s and not more than 2300 Pa·s under measurement conditions of a measurement temperature of 170° C. and a measurement frequency of 1 Hz. A strain hardening rate of the resin composition in uniaxial elongational viscosity measured under measurement conditions of a measurement temperature of 150° C. and a strain rate of 3.0 s | 06-14-2012 |
20120128915 | GaAs Wafer And Method For Manufacturing The GaAs Wafer - There is provided a method for manufacturing a GaAs wafer comprising: growing a GaAs single crystal by an LEC method; and fabricating a GaAs wafer by slicing the GaAs single crystal obtained by growing the GaAs single crystal, wherein in growing the GaAs single crystal, a crystal-melt interface between the GaAs single crystal and a raw material melt is formed into a convex-shape toward the raw material melt side, and a ratio T | 05-24-2012 |
20120128005 | NETWORK RELAY SYSTEM AND METHOD OF AUTOMATICALLY SETTING A NETWORK RELAY SYSTEM | 05-24-2012 |
20120127853 | NETWORK RELAY SYSTEM AND METHOD OF CONTROLLING A NETWORK RELAY SYSTEM - A network relay system ( | 05-24-2012 |
20120126259 | LIGHT EMITTING DIODE - A light emitting diode, comprising: a transparent substrate; a wiring layer; and a semiconductor light emitting element structure part between the transparent substrate and the wiring layer, the semiconductor light emitting element structure part further comprising: a semiconductor light emitting layer; a transparent conductive layer provided on the wiring layer side of the semiconductor light emitting layer; a transparent insulating film; a metal reflection layer; and a first electrode part and a second electrode part provided on the wiring layer side of the transparent insulating film, to be electrically connected to the wiring layer, wherein the first electrode part is electrically connected to the first semiconductor layer via a first contact part which is provided to pass through the transparent insulating film, and the second electrode part is electrically connected to the second semiconductor layer by a second contact part provided to pass through the transparent insulating film, the transparent conductive layer, the first semiconductor layer, and the active layer. | 05-24-2012 |
20120115548 | Mobile communication base station antenna and mobile communication base station antenna system - A mobile communication base station antenna has two array antennas juxtaposed in a horizontal direction. Each of the array antennas includes a plurality of antenna element pairs arranged in a vertical direction. Each of the antenna element pairs includes two antenna elements having polarization characteristics perpendicular to each other. A shield plate is provided between the two array antennas. The plurality of antenna element pairs of each of the two array antennas are classified into a first group of M-antenna element pairs, a second group of N-antenna element pairs, and a third group of P-antenna element pairs from one end to another end of the two array antennas (M, N, and P are positive integers, respectively). The electric power is fed from one feeding point to the antenna elements of the first and third group of one of the two array antennas and the antenna elements of the second group of another of the two array antennas, and a tilt angle of the two array antennas with respect to a horizontal plane is set to be a predetermined tilt angle by electrical tilting. | 05-10-2012 |
20120112014 | Cable clamp - A cable clamp includes a single metal plate shaped along an outer periphery of three cables that are triangularly arranged when viewed in cross-section, a mounting flange portion formed with both end portions of the metal plate overlapped each other, and a cable support member inserted between at least two of the three cables so as to support the at least two cables between itself and the metal plate. The cable support member is inserted between two horizontally arranged cables in a direction perpendicular to the horizontal direction as well as perpendicular to a longitudinal direction of the two horizontally arranged cables. The cable support member has a tapered shape on an end side in an insertion direction thereof for facilitating an insertion thereof into a gap between the two horizontally arranged cables. | 05-10-2012 |
20120111604 | Conducting path - A conducting path includes three cables, and a cable clamp for fixing the three cables. The cable clamp includes a metal plate formed along an outer periphery of the three cables that are triangularly arranged when viewed in cross-section and a mounting flange portion formed with both end portions of the metal plate overlapped each other, and two of the three cables are integrated to form an integral cable. | 05-10-2012 |
20120111600 | AQUEOUS ABSORPTIVE POLYMER-CONTAINING RESIN COMPOSITION-PRODUCING METHOD, AQUEOUS ABSORPTIVE POLYMER-CONTAINING RESIN COMPOSITION, AND POROUS SUBSTANCE-PRODUCING METHOD USING SAME AND POROUS SUBSTANCE, INSULATED ELECTRIC CABLE-PRODUCING METHOD, INSULATED ELECTRIC CABLE AND COAXIAL CABLE - A method for producing an aqueous absorptive polymer-containing resin composition in which a resin composition is doped with an aqueous absorptive polymer includes causing the aqueous absorptive polymer to absorb and be swollen by water beforehand, and milling and microparticulating the water-absorbed and -swollen absorptive polymer at an ultrasonic flow pressure of not less than 50 MPa. | 05-10-2012 |
20120111125 | PRESSURE-SENSITIVE SENSOR PRODUCTION METHOD AND PRESSURE-SENSITIVE SENSOR - Two electrode wires longitudinally provided along the inner surface of an elastic insulating member having a hollow portion are exposed from said elastic insulating member, the resistive element comprising a resistor body and the resistive element's lead wires is formed into a U-letter shape, said two electrode wires exposed from said elastic insulating member and said resistive element's lead wires are electrically connected via one metal plate, and a portion wherein one of said two electrode wires and one of the lead wires extending from both ends of said resistor body are electrically connected and a portion wherein the other one of said two electrode wires and the other one of the lead wires extending from both ends of said resistor body are electrically connected are separated by cutting said one metal plate. | 05-10-2012 |
20120108437 | Precursor for Nb3Sn superconductor wire, superconductor wire using the same and method for manufacturing Nb3Sn superconductor wire - A precursor for a Nb | 05-03-2012 |
20120104557 | Method for manufacturing a group III nitride crystal, method for manufacturing a group III nitride template, group III nitride crystal and group III nitride template - A method for manufacturing a group III nitride crystal includes a step of mixing a group III source material and ammonia in a reactor including quartz, and growing a group III nitride crystal on a support substrate by a vapor deposition. The group III source material is an organic metal source material containing Al. The organic metal source material is mixed with a hydrogen halide gas and the mixture of the organic metal source material and the hydrogen halide gas is supplied to the reactor. | 05-03-2012 |
20120100390 | Weldment and method of manufacturing the same - A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element, | 04-26-2012 |