WHITE ELECTRONIC DESIGNS CORPORATION Patent applications |
Patent application number | Title | Published |
20100176501 | Method and Apparatus for Stacked Die Package with Insulated Wire Bonds - A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First bond wires are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first bond wires include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first bond wires. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second bond wires are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second bond wires include an electrically insulative coating formed over the shaft of the second bond wires that covers a portion of a surface of a bumped end of the second bond wires. | 07-15-2010 |
20100117243 | METHOD AND APPARATUS FOR STACKED DIE PACKAGE WITH INSULATED WIRE BONDS - A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First wire bonds are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first wire bonds include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first wire bonds. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second wire bonds are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second wire bonds include an electrically insulative coating formed over the shaft of the second wire bonds that covers a portion of a surface of a bumped end of the second wire bonds. | 05-13-2010 |
20100045190 | LED BACKLIGHT - An LED backlight controller is disclosed. One embodiment comprises a luminance regulator to generate a luminance control signal to adjust a luminance level in a LED backlight assembly, a timing controller to generate a dimming control signal to adjust a dimming level in the LED backlight assembly, wherein the dimming control signal is a pulse width modulated signal, and an LED driver circuit to receive the luminance control signal and the dimming control signal, the LED driver circuit further to generate an LED driver signal to provide to the LED backlight assembly, wherein the LED driver circuit is configured to control luminance by adjusting the current of the LED driver signal, and wherein the LED driver circuit is configured to adjust a dimming level in the LED backlight assembly by a change in the duty cycle for the dimming control signal. Other embodiments are described herein. | 02-25-2010 |
20100031349 | Method and Apparatus for Secure Data Storage System - A secure storage system includes a storage device having a communication device and a memory. The communication device is for polling a communication medium. A security token is received from the communication medium via the communication device of the storage device. The security token received from the communication medium is compared to a second security token stored on the storage device. In one embodiment, a current location of the storage device is determined. The current location of the storage device is compared to an approved security zone. Access to the memory is provided if the security token received from the communication medium matches the second security token stored on the storage device and the current location of the storage device lies within the approved security zone. A time-out counter is set to a non-zero value after access to the memory is provided. | 02-04-2010 |