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IBM CORPORATION (YORKTOWN)
YORKTOWN HEIGHTS, NY US
1. 20090011577 METHOD OF MAKING PHASE CHANGE MATERIALS ELECTROCHEMICAL ATOMIC LAYER DEPOSITION 01-08-20092. 20080286701 METHOD FOR KINETICALLY CONTROLLED ETCHING OF COPPER 11-20-2008
3. 20080284052 VACUUM EXTRUSION METHOD OF MANUFACTURING A THERMAL PASTE 11-20-2008
4. 20080261066 FABRICATING A CONTACT RHODIUM STRUCTURE BY ELECTROPLATING AND ELECTROPLATING COMPOSITION 10-23-2008
5. 20080220998 REVERSIBLE THERMAL THICKENING GREASE - for microelectronic packages in which the grease contains filler particles 09-11-2008