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VISHAY-SILICONIX
SANTA CLARA, CA US
1. 20090256246 SEMICONDUCTOR PACKAGING TECHNIQUES - semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die 10-15-20092. 20090200578 SELF-REPAIRING FIELD EFFECT TRANSISITOR - self repairing field effect transistor device, in accordance with one embodiment, includes a plurality of FET 08-13-2009
3. 20090174055 Leadless Semiconductor Packages - encapsulation technique for leadless semiconductor packages entails: attaching a plurality of dice to die pads in 07-09-2009
4. 20090090967 MOSFET ACTIVE AREA AND EDGE TERMINATION AREA CHARGE BALANCE 04-09-2009
5. 20090050960 Stacked Trench Metal-Oxide-Semiconductor Field Effect Transistor Device 02-26-2009
6. 20080258212 TRENCH METAL OXIDE SEMICONDUCTOR WITH RECESSED TRENCH MATERIAL AND REMOTE CONTACTS 10-23-2008
7. 20080246081 Self-Aligned Trench MOSFET and Method of Manufacture 10-09-2008
8. 20080220571 HIGH MOBILITY POWER METAL-OXIDE SEMICONDUCTOR FIELD-EFFECT TRANSISTORS 09-11-2008