FSI INTERNATIONAL, INC. Patent applications |
Patent application number | Title | Published |
20130037511 | METHOD AND APPARATUS FOR TREATING A WORKPIECE WITH ARRAYS OF NOZZLES - The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. | 02-14-2013 |
20130032182 | BARRIER STRUCTURE AND NOZZLE DEVICE FOR USE IN TOOLS USED TO PROCESS MICROELECTRONIC WORKPIECES WITH ONE OR MORE TREATMENT FLUIDS - The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. | 02-07-2013 |
20130032172 | METHOD OF REMOVING LIQUID FROM A BARRIER STRUCTURE - The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. | 02-07-2013 |
20100124410 | SYSTEM FOR SUPPLYING WATER VAPOR IN SEMICONDUCTOR WAFER TREATMENT - A system for supplying water vapor in a process for treatment of a semiconductor wafer, comprising a treatment chamber having an interior for receiving at least one semiconductor wafer and a water vapor dispenser. The water vapor dispenser comprises
| 05-20-2010 |
20090304995 | HYDROPHILIC FLUOROPOLYMER MATERIALS AND METHODS - An initially hydrophobic surface comprising fluoropolymer is treated to provide the surface with hydrophilic properties. A hydrophobic surface comprising fluoropolymer is physically treated to impart a rough texture thereto, thereby providing the surface with hydrophilic properties. In an alternative method, a roughened surface is treated with a sulfur-based acid, thereby providing the surface with hydrophilic properties | 12-10-2009 |
20090286334 | PROCESS FOR TREATMENT OF SEMICONDUCTOR WAFER USING WATER VAPOR CONTAINING ENVIRONMENT - A process is provided for treating a semiconductor wafer at a target wafer temperature. This process includes the following steps: | 11-19-2009 |