Bridgelux, Inc. Patent applications |
Patent application number | Title | Published |
20150285461 | OPTICS FOR CHIP-ON-BOARD LIGHTING HAVING A PROTRUSION - A cover for a light source for use in a lamp or luminaire. An outer surface of the cover, opposite the light source, comprises a rounded shape and includes a protrusion extending from the cover. The protrusion extends substantially in a light emission direction and is shaped the protrusion to direct light emitted from the light source in a desired direction. | 10-08-2015 |
20150276172 | LIGHT-EMITTING DEVICE WITH REFLECTIVE CERAMIC SUBSTRATE - A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure. | 10-01-2015 |
20150276144 | Low-Profile Outdoor Lighting Module With Light Emitting Diodes - A low-profile lighting module with light-emitting diodes (LEDs) has a water-tight seal between a molded-plastic cover and a printed circuit board (PCB). A substrate with the LEDs fits up into an indentation in the lower surface of the PCB. Landing pads on the top of the substrate attach to contact pads in the indentation that are extensions of a conductor of the PCB which is electrically coupled through the landing pads to the LEDs. A lens with a curved optical portion surrounded by a flat lip fits into another indentation on the upper surface of the PCB. A highly reflective sheet is disposed between the planar lower surface of the lens and bottom of the indentation in the upper surface. A double-sided adhesive sheet is disposed under the inside surface of the molded-plastic cover and over both the upper surface of the PCB and the flat lip of the lens. | 10-01-2015 |
20150263255 | LAMINATED ELECTRICAL TRACE WITHIN AN LED INTERCONNECT - Various apparatuses and methods are disclosed. An interconnect may include molding material configured to support a light-emitting device, and an electrical trace arranged with the molding material to electrically couple the light-emitting device to a power source, wherein the electrical trace has an electrical insulator on at least a portion thereof. A light-emitting apparatus may include a light-emitting device, molding material supporting the light-emitting device, and an electrical trace arranged with the molding material to electrically couple the light-emitting device to a power source, wherein the electrical trace has an electrical insulator on at least a portion thereof. A method of manufacturing may include providing an electrical trace having an electrical insulator on at least a portion thereof, and forming molding material capable of supporting a light-emitting device, wherein the molding material is formed with the electrical trace configured to electrically couple the light-emitting device to a power source. | 09-17-2015 |
20150249071 | METHOD AND APPARATUS FOR PROVIDING HIGH-TEMPERATURE MULTI-LAYER OPTICS - A solid-state light-emitting device (“SLD”) converting electrical energy to photon energy using a light emitter diode (“LED”) and high-temperature multi-layer optics (“HMO”) is disclosed. The SLD, in one aspect, includes a chip-on-board (“COB”), a silicone inner layer (“SIL”), and a Poly methyl methacrylate (“PMMA”) layer. The COB includes a first surface and a second surface wherein the first surface includes at least one LED. The LED converts electrical energy to optical light and the light subsequently leaves the LED becoming visible light. The SIL includes a first silicone surface and a second silicone surface wherein the second silicone surface is in contact with the first surface of COB and the second silicone surface is in contact with the PMMA layer. The operating temperature of PMMA layer is lower than the operating temperature of SIL. | 09-03-2015 |
20150204512 | OPTICS FOR CHIP-ON-BOARD ROAD AND AREA LIGHTING - A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having an indented cusp substantially over the light source. A lamp includes an extended planar light source, and an optical element arranged with the light source, wherein the optical element comprises an outer surface having a portion at a peripheral edge comprising a curvature configured to redirect light emitted from the light source by total internal reflection. | 07-23-2015 |
20150097203 | DIE EMITTING WHITE LIGHT - Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die. | 04-09-2015 |
20150022101 | LED Array Member and Integrated Control Module Assembly with Built-In Switching Converter - A LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a built-in switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs. | 01-22-2015 |
20150022088 | LED Array Member and Thermally Decoupled Integrated Control Module Assembly - A LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). In a first aspect, active circuitry is embedded in the ICM. The circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. A thermal insulator is disposed between the ICM and a heat sink outside the lateral boundary of the LAM. In a second aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third aspect, the ICM includes a built-in switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs. | 01-22-2015 |
20150021629 | Using An LED Die To Measure Temperature Inside Silicone That Encapsulates An LED Array - An LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs. | 01-22-2015 |
20140374758 | System for Wafer-Level Phosphor Deposition - System for wafer-level phosphor deposition. A method for phosphor deposition on a semiconductor wafer that has a plurality of LED dies includes the operations of covering the semiconductor wafer with a selected thickness of photo resist material, removing portions of the photo resist material to expose portions of the semiconductor wafer so that electrical contacts associated with the plurality of LED dies remain unexposed, and depositing phosphor on the exposed portions of the semiconductor wafer. | 12-25-2014 |
20140252384 | White LED Assembly With LED String And Intermediate Node Substrate Terminals - A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery. | 09-11-2014 |
20140201978 | GRADIENT OPTICS FOR EVEN LIGHT DISTRIBUTION OF LED LIGHT SOURCES - Gradient optics for even light distribution of LED light sources. In an aspect, an apparatus is provided for uniform distribution of light emitted from a light source. The apparatus includes a panel coupled to receive the light emitted from the light source, and gradient optics disposed on the panel, the gradient optics providing a matching transparency gradient that is aligned with the light source to evenly distribute the emitted light. In another aspect, an apparatus includes means for receiving the light emitted from the light source, and means for providing a matching transparency gradient that is aligned with the light source to evenly distribute the emitted light. | 07-24-2014 |
20140197430 | SUBSTRATE FREE LED PACKAGE - A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies. | 07-17-2014 |
20140183566 | MULTI-CHIP LED DIODE APPARATUS - In one aspect, there is an apparatus that comprises a plurality of light emitting chips that each have active areas that have elongated aspect ratios. This chips are mounted in a generally rectangular package. The chips are each arranged around a periphery of the package so that each narrow side of each chip abuts either a sidewall forming the periphery of the package or a long side another of the chips. Some of the chips receive a biasing voltage through one or more other of the chips. | 07-03-2014 |
20140159612 | Method and Apparatus for Providing a Passive Color Control Scheme Using Blue and Red Emitters - A lighting device capable of generating warm or neutral white light using blue light-emitting diodes (“LEDs”), red LEDs, and/or luminescent material that responds to blue LED emission is disclosed. The lighting device includes multiple first solid-state light-emitting structures (“SLSs”), second SLSs, and balancing resistor element. The first SLS such as a string of blue LED dies connected in series is able to convert electrical energy to blue optical light, which is partially turned into longer wavelength emission by the luminescent material. The second SLS such as a red LED die is configured to convert electrical energy to red optical light, wherein the second SLSs are connected in series. While the first SLSs and second SLSs are coupled in parallel, the balancing resistor element provides load balance for current redistribution between the first and second SLSs in response to fluctuation of operating temperature. | 06-12-2014 |
20140140065 | LIGHTING MODULE - A street light may include a pole and a head attached to the pole. The head may include a lighting module. The lighting module may include a light-emitting device configured to emit light, a thermal interface configured to conduct heat away from the light-emitting device, an optical element configured to transmit the emitted light in a light distribution pattern on an area located a distance away from the lighting module, and a reflective surface configured to redirect a portion of the light transmitted by the optical element. | 05-22-2014 |
20140138715 | LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION - Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another. | 05-22-2014 |
20140131747 | Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure - Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer. | 05-15-2014 |
20140124806 | Light Emitter with Coating Layers - An AlInGaN light emitting device having a coating is used to improve the extraction of light from a device. A coating has a very low optical loss and an index of refraction greater than 2, preferably having an index of refraction close to or greater than the index of refraction of GaN. The coating can be made from Ta | 05-08-2014 |
20140092609 | Low Profile Heat Sink With Attached LED Light Source - An LED light source with an attached heat sink includes larger fins, smaller fins, a mounting platform and light emitting diodes attached to the mounting platform. The larger fins are oriented parallel to the smaller fins. The larger fins are integrally formed with a first base, and the smaller fins are integrally formed with a second base. The bottom surface of the second base contacts the larger fins, which are more than twice as tall as the smaller fins. There are more than twice as many smaller fins than larger fins per distance perpendicular to the fins. Ducts are formed between the larger fins and the bottom surface of the second base. Intake holes pass through the first base into each duct near the end of the duct that is blocked by an end wall. The mounting platform with the LEDs is attached to the bottom of the first base. | 04-03-2014 |
20140077235 | Substrate Free LED Package - A method of fabricating a substrate free light emitting diode (LED), includes arranging LED dies on a tape to form an LED wafer assembly, molding an encapsulation structure over at least one of the LED dies on a first side of the LED wafer assembly, removing the tape, forming a dielectric layer on a second side of the LED wafer assembly, forming an oversized contact region on the dielectric layer to form a virtual LED wafer assembly, and singulating the virtual LED wafer assembly into predetermined regions including at least one LED. The tape can be a carrier tape or a saw tape. Several LED dies can also be electrically coupled before the virtual LED wafer assembly is singulated into predetermined regions including at the electrically coupled LED dies. | 03-20-2014 |
20140049940 | LIGHT EMITTING DIODE LAMP - A light emitting apparatus includes a housing having a transparent portion, at least one LED positioned within the housing to emit light through the transparent portion, and a fan positioned within the housing to cool said at least one LED. | 02-20-2014 |
20140048832 | Micro-Bead Blasting Process for Removing a Silicone Flash Layer - Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate. | 02-20-2014 |
20140043834 | LIGHT EMITTING DIODE LUMINAIRE - A luminaire includes a light fixture having a heat conductive shell having an opening and at least one LED positioned on a plate within the heat conductive shell to emit light through the opening, wherein the heat conductive shell further comprises an ionic wind fan positioned on the plate so as to directly cool said at least one LED by moving air heated by the at least one LED through the opening. | 02-13-2014 |
20130341669 | Phosphor Placement In White Light Emitting Diode Assemblies - A white LED assembly includes a blue LED die attached to a substrate. A first volume of a first luminescent material surrounds the blue LED die in a lateral dimension such that none of the first luminescent material is disposed directly over the blue LED die. The first luminescent material includes a relatively inefficient phosphor having a peak emission wavelength longer than 620nm and includes substantially no phosphor having a peak emission wavelength shorter than 620nm. A second volume of a second luminescent material is disposed over the first volume and the blue LED die. The second luminescent material includes a relatively efficient phosphor having a peak emission wavelength shorter than 620nm and includes substantially no phosphor having a peak emission wavelength longer than 620nm. Placement of the first and second luminescent materials in this way promotes removal of heat from the inefficient phosphor and reduces the likelihood of interabsorption. | 12-26-2013 |
20130337592 | MICRO-BEAD BLASTING PROCESS FOR REMOVING A SILICONE FLASH LAYER - Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate. | 12-19-2013 |
20130319607 | SYSTEM FOR FLASH-FREE OVER-MOLDING OF LED ARRAY SUBSTRATES - A system for flash-free over-molding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate. | 12-05-2013 |
20130273676 | System for Wafer-Level Phosphor Deposition - System for wafer-level phosphor deposition. In an aspect, a semiconductor wafer is provided that includes a plurality of LED dies wherein at least one die includes an electrical contact, a photo-resist post covering the electrical contact, and a phosphor deposition layer covering the semiconductor wafer and surrounding the photo-resist post. In another aspect, a semiconductor wafer is provided that comprises a plurality of LED dies wherein at least one die comprises an electrical contact, a phosphor deposition layer covering the semiconductor wafer, and a cavity in the phosphor deposition layer exposing the at least one electrical contact. | 10-17-2013 |
20130270573 | LEDs with Efficient Electrode Structures - Aspects include Light Emitting Diodes that have a GaN-based light emitting region and a metallic electrode. The metallic electrode can be physically separated from the GaN-based light emitted region by a layer of porous dielectric, which provides a reflecting region between at least a portion of the metallic electrode and the GaN-based light emitting region. | 10-17-2013 |
20130252357 | THIN-FILM LED WITH P AND N CONTACTS ELECTRICALLY ISOLATED FROM THE SUBSTRATE - A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode. | 09-26-2013 |
20130242535 | AC LED ARRAY MODULE FOR STREET LIGHT APPLICATIONS - A street light includes a pole, arm and a head attached to the pole, wherein the head comprises a light source having a plurality of solid state light emitting devices and an optical element configured to produce a light distribution pattern from light emitted from the solid state light emitting devices, wherein the light source is configured to be powered directly from an AC source. | 09-19-2013 |
20130235588 | HIGHLY EFFICIENT LED ARRAY MODULE WITH PRE-CALCULATED NON-CIRCULAR ASYMMETRICAL LIGHT DISTRIBUTION - A light module includes a light emitting diode (LED) array and a double-reflective assembly coupled to the LED array. The double-reflective assembly includes a lower member having a frame. The frame has an opening corresponding to the LED array. The frame and LED array are located in the same plane. The light module further includes a left bottom reflector and a right bottom reflector. The light module further includes an upper member which includes a left top reflector; and a right top reflector, wherein the left top reflector is attached to the left bottom reflector, and right top reflector is attached to the right bottom reflector, each forming an arbitrary left and right double-reflective assembly. A shape geometry and profile of each double-reflective assembly provides a pre-calculated combined non-circular asymmetrical intensity distribution pattern. The intensity distribution pattern is a superposition of light reflected from the bottom reflectors, light reflected from the top reflectors, light doubly reflected from both the top and bottom reflectors, and light directed into the intensity distribution pattern directly from the LED array. | 09-12-2013 |
20130194815 | Circuit Board for LED Applications - Circuit boards are designed and configured for mounting light emitting devices (LEDs), such as for LED light bulb and LED light tube applications, and are capable of passing a non-isolated, mains powered, electrical strength test. | 08-01-2013 |
20130193465 | PHOSPHOR PLACEMENT IN WHITE LIGHT EMITTING DIODE ASSEMBLIES - A white LED assembly includes a blue LED die attached to a substrate. A first volume of a first luminescent material surrounds the blue LED die in a lateral dimension such that none of the first luminescent material is disposed directly over the blue LED die. The first luminescent material includes a relatively inefficient phosphor having a peak emission wavelength longer than 620 nm and includes substantially no phosphor having a peak emission wavelength shorter than 620 nm. A second volume of a second luminescent material is disposed over the first volume and the blue LED die. The second luminescent material includes a relatively efficient phosphor having a peak emission wavelength shorter than 620 nm and includes substantially no phosphor having a peak emission wavelength longer than 620 nm. Placement of the first and second luminescent materials in this way promotes removal of heat from the inefficient phosphor and reduces the likelihood of interabsorption. | 08-01-2013 |
20130161655 | WHITE LED ASSEMBLY WITH LED STRING AND INTERMEDIATE NODE SUBSTRATE TERMINALS - A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery. | 06-27-2013 |
20130134459 | Micro-Bead Blasting Process for Removing a Silicone Flash Layer - Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate. | 05-30-2013 |
20130121006 | Low profile heat sink with attached LED light source - An LED light source with an attached heat sink includes larger fins, smaller fins, a mounting platform and light emitting diodes attached to the mounting platform. The larger fins are oriented parallel to the smaller fins. The larger fins are integrally formed with a first base, and the smaller fins are integrally formed with a second base. The bottom surface of the second base contacts the larger fins, which are more than twice as tall as the smaller fins. There are more than twice as many smaller fins than larger fins per distance perpendicular to the fins. Ducts are formed between the larger fins and the bottom surface of the second base. Intake holes pass through the first base into each duct near the end of the duct that is blocked by an end wall. The mounting platform with the LEDs is attached to the bottom of the first base. | 05-16-2013 |
20130113016 | PACKAGING PHOTON BUILDING BLOCKS WITH TOP SIDE CONNECTIONS AND INTERCONNECT STRUCTURE - Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks. | 05-09-2013 |
20130105837 | JETTING A HIGHLY REFLECTIVE LAYER ONTO AN LED ASSEMBLY | 05-02-2013 |
20130102095 | Light Emitting Diodes with Smooth Surface for Reflective Electrode - A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are separately disposed on the epitaxial layer structure, and the epitaxial layer structure has a root-means-square (RMS) roughness less than about 3 at a surface whereon the first electrode is formed. | 04-25-2013 |
20130082290 | LIGHT EMITTING DEVICES HAVING LIGHT COUPLING LAYERS WITH RECESSED ELECTRODES - A light emitting device comprises a first layer of an n-type semiconductor material, a second layer of a p-type semiconductor material, and an active layer between the first layer and the second layer. A light coupling structure is disposed adjacent to one of the first layer and the second layer. In some cases, the light coupling structure is disposed adjacent to the first layer. An orifice formed in the light coupling structure extends to the first layer. An electrode formed in the orifice is in electrical communication with the first layer. | 04-04-2013 |
20130082274 | LIGHT EMITTING DEVICES HAVING DISLOCATION DENSITY MAINTAINING BUFFER LAYERS - A method for forming a light emitting device comprises forming a buffer layer having a plurality of layers comprising a substrate, an aluminum gallium nitride layer adjacent to the substrate, and a gallium nitride layer adjacent to the aluminum gallium nitride layer. During the formation of each of the plurality of layers, one or more process parameters are selected such that an individual layer of the plurality of layers is strained. | 04-04-2013 |
20130082273 | P-TYPE DOPING LAYERS FOR USE WITH LIGHT EMITTING DEVICES - A light emitting diode (LED) comprises an n-type Group III-V semiconductor layer, an active layer adjacent to the n-type Group III-V semiconductor layer, and a p-type Group III-V semiconductor layer adjacent to the active layer. The active layer includes one or more V-pits. A portion of the p-type Group III-V semiconductor layer is in the V-pits. A p-type dopant injection layer provided during the formation of the p-type Group III-V layer aids in providing a predetermined concentration, distribution and/or uniformity of the p-type dopant in the V-pits. | 04-04-2013 |
20130082236 | LIGHT EMITTING REGIONS FOR USE WITH LIGHT EMITTING DEVICES - A light emitting device comprises a first layer having an n-type Group III-V semiconductor, a second layer adjacent to the first layer, the second layer comprising an active material that generates light upon the recombination of electrons and holes. The active material in some cases has one or more V-pits at a density between about 1 V-pit/μm | 04-04-2013 |
20130058102 | Distributed Bragg Reflector for Reflecting Light of Multiple Wavelengths from an LED - A blue LED device has a transparent substrate and a reflector structure disposed on the backside of the substrate. The reflector structure includes a Distributed Bragg Reflector (DBR) structure having layers configured to reflect yellow light as well as blue light. In one example, the DBR structure includes a first portion where the thicknesses of the layers are larger, and also includes a second portion where the thicknesses of the layers are smaller. In addition to having a reflectance of more than 97.5 percent for light of a wavelength in a 440 nm-470 nm range, the overall reflector structure has a reflectance of more than 90 percent for light of a wavelength in a 500 nm-700 nm range. | 03-07-2013 |
20130056745 | Buffer Layer for GaN-on-Si LED - A buffer layer of zinc telluride (ZnTe) or titanium dioxide (TiO | 03-07-2013 |
20130032847 | DISTRIBUTED CURRENT BLOCKING STRUCTURES FOR LIGHT EMITTING DIODES - An LED device includes a strip-shaped electrode, a strip-shaped current blocking structure and a plurality of distributed current blocking structures. The current blocking structures are formed of an insulating material such as silicon dioxide. The strip-shaped current blocking structure is located directly underneath the strip-shaped electrode. The plurality of current blocking structures may be disc shaped portions disposed in rows adjacent the strip-shaped current blocking structure. Distribution of the current blocking structures is such that current is prevented from concentrating in regions immediately adjacent the electrode, thereby facilitating uniform current flow into the active layer and facilitating uniform light generation in areas not underneath the electrode. In another aspect, current blocking structures are created by damaging regions of a p-GaN layer to form resistive regions. In yet another aspect, current blocking structures are created by etching away highly doped contact regions to form regions of resistive contact between conductive layers. | 02-07-2013 |
20130032846 | NON-REACTIVE BARRIER METAL FOR EUTECTIC BONDING PROCESS - A eutectic metal layer (e.g., gold/tin) bonds a carrier wafer structure to a device wafer structure. In one example, the device wafer structure includes a silicon substrate upon which an epitaxial LED structure is disposed. A layer of silver is disposed on the epitaxial LED structure. The carrier wafer structure includes a conductive silicon substrate covered with an adhesion layer. A layer of non-reactive barrier metal (e.g., titanium) is provided between the silver layer and the eutectic metal to prevent metal from the eutectic layer (e.g., tin) from diffusing into the silver during wafer bonding. During wafer bonding, the wafer structures are pressed together and maintained at more than 280° C. for more than one minute. Use of the non-reactive barrier metal layer allows the total amount of expensive platinum used in the manufacture of a vertical blue LED manufactured on silicon to be reduced, thereby reducing LED manufacturing cost. | 02-07-2013 |
20130032845 | HIGH TEMPERATURE GOLD-FREE WAFER BONDING FOR LIGHT EMITTING DIODES - A vertical GaN-based LED is made by growing an epitaxial LED structure on a silicon wafer. A silver layer is added and annealed to withstand >450° C. temperatures. A barrier layer (e.g., Ni/Ti) is provided that is effective for five minutes at >450° C. at preventing bond metal from diffusing into the silver. The resulting device wafer structure is then wafer bonded to a carrier wafer structure using a high temperature bond metal (e.g., AlGe) that melts at >380° C. After wafer bonding, the silicon is removed, gold-free electrodes (e.g., Al) are added, and the structure is singulated. High temperature solder (e.g., ZnAl) that is compatible with the electrode metal is used for die attach. Die attach occurs at >380° C. for ten seconds without melting the bond metal or otherwise damaging the device. The entire LED contains no gold, and consequently is manufacturable in a high-volume gold-free semiconductor fabrication facility. | 02-07-2013 |
20130032836 | N-TYPE GALLIUM-NITRIDE LAYER HAVING MULTIPLE CONDUCTIVE INTERVENING LAYERS - A vertical GaN-based blue LED has an n-type layer comprising multiple conductive intervening layers. The n-type layer contains a plurality of periods. Each period of the n-type layer includes a gallium-nitride (GaN) sublayer and a thin conductive aluminum-gallium-nitride (AlGaN:Si) intervening sublayer. In one example, each GaN sublayer has a thickness substantially more than 100 nm and less than 1000 nm, and each AlGaN:Si intervening sublayer has a thickness less than 25 nm. The entire n-type layer is at least 2000 nm thick. The AlGaN:Si intervening layer provides compressive strain to the GaN sublayer thereby preventing cracking. After the epitaxial layers of the LED are formed, a conductive carrier is wafer bonded to the structure. The silicon substrate is then removed. Electrodes are added and the structure is singulated to form a finished LED device. Because the AlGaN:Si sublayers are conductive, the entire n-type layer can remain as part of the finished LED device. | 02-07-2013 |
20130032834 | LED HAVING A LOW DEFECT N-TYPE LAYER THAT HAS GROWN ON A SILICON SUBSTRATE - A vertical GaN-based blue LED has an n-type GaN layer that was grown directly on Low Resistance Layer (LRL) that in turn was grown over a silicon substrate. In one example, the LRL is a low sheet resistance GaN/AlGaN superlattice having periods that are less than 300 nm thick. Growing the n-type GaN layer on the superlattice reduces lattice defect density in the n-type layer. After the epitaxial layers of the LED are formed, a conductive carrier is wafer bonded to the structure. The silicon substrate is then removed. Electrodes are added and the structure is singulated to form finished LED devices. In some examples, some or all of the LRL remains in the completed LED device such that the LRL also serves a current spreading function. In other examples, the LRL is entirely removed so that no portion of the LRL is present in the completed LED device. | 02-07-2013 |
20130032810 | LED ON SILICON SUBSTRATE USING ZINC-SULFIDE AS BUFFER LAYER - A vertical GaN-based blue LED has an n-type GaN layer that was grown over a ZnS layer that in turn was grown directly on a silicon substrate. In one example, the ZnS layer is a transitional buffer layer that is 50 nm thick, and the n-type GaN layer is at least 2000 nm thick. Growing the n-type GaN layer on the ZnS buffer layer reduces lattice defect density in the n-type layer. The ZnS buffer layer provides a good lattice constant match with the silicon substrate and provides a compound polar template for subsequent GaN growth. After the epitaxial layers of the LED are formed, a conductive carrier is wafer bonded to the structure. The silicon substrate and the ZnS buffer layer are then removed. Electrodes are added and the structure is singulated to form finished LED devices. | 02-07-2013 |
20130026482 | Boron-Containing Buffer Layer for Growing Gallium Nitride on Silicon - A silicon wafer used in manufacturing GaN for LEDs includes a silicon substrate, a buffer layer of boron aluminum nitride (B | 01-31-2013 |
20130026480 | Nucleation of Aluminum Nitride on a Silicon Substrate Using an Ammonia Preflow - A silicon wafer used in manufacturing crystalline GaN for light emitting diodes (LEDs) includes a silicon substrate, a buffer layer of aluminum nitride (AlN) and an upper layer of GaN. The silicon wafer has a diameter of at least 200 millimeters and an Si(111)1×1 surface. The AlN buffer layer overlies the Si(111) surface. The GaN upper layer is disposed above the buffer layer. Across the entire wafer substantially no aluminum atoms of the AlN are present in a bottom most plane of atoms of the AlN, and across the entire wafer substantially only nitrogen atoms of the AlN are present in the bottom most plane of atoms of the AlN. A method of making the AlN buffer layer includes preflowing a first amount of ammonia equaling less than 0.01% by volume of hydrogen flowing through a chamber before flowing trimethylaluminum and then a subsequent amount of ammonia through the chamber. | 01-31-2013 |
20130009130 | LATERALLY CONTACTED BLUE LED WITH SUPERLATTICE CURRENT SPREADING LAYER - A laterally contacted blue LED device involves a PAN structure disposed over an insulating substrate. The substrate may be a sapphire substrate that has a template layer of GaN grown on it. The PAN structure includes an n-type GaN layer, a light-emitting active layer involving indium, and a p-type GaN layer. The n-type GaN layer has a thickness of at least 500 nm. A Low Resistance Layer (LRL) is disposed between the substrate and the PAN structure such that the LRL is in contact with the bottom of the n-layer. In one example, the LRL is an AlGaN/GaN superlattice structure whose sheet resistance is lower than the sheet resistance of the n-type GnA layer. The LRL reduces current crowding by conducting current laterally under the n-type GaN layer. The LRL reduces defect density by preventing dislocation threads in the underlying GaN template from extending up into the PAN structure. | 01-10-2013 |
20120319573 | Phosphor Layer Arrangement for Use With Light Emitting Diodes - Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. | 12-20-2012 |
20120187430 | Packaging Photon Building Blocks Having Only Top Side Connections in a Molded Interconnect Structure - Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer. | 07-26-2012 |
20120175643 | Packaging Photon Building Blocks Having Only Top Side Connections in an Interconnect Structure - Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks. | 07-12-2012 |
20120153322 | LIGHT EMITTING DIODE SOURCE WITH PROTECTIVE BARRIER - An apparatus having a substrate, an LED light source attached to the substrate, an electrical connector attached to the substrate and electrically connected to the LED light source, a potting material on the substrate and covering at least a portion of the electrical connector; and a barrier separating the potting material from the LED light source, the barrier having a height that exceeds the thickness of the potting material on the substrate. | 06-21-2012 |
20120153316 | LIGHT EMITTING DEVICE HAVING A TRANSPARENT THERMALLY CONDUCTIVE LAYER - A light emitting device and method of producing the same is disclosed. The light emitting device includes a transparent thermally conductive layer, a phosphor layer provided on the transparent thermally conductive layer, wherein the phosphor layer is not enclosed within any layers not containing phosphor, and at least one light emitting semiconductor arranged to emit light toward the transparent thermally conductive layer and the phosphor layer. | 06-21-2012 |
20120138987 | OPTICAL PLATFORM TO ENABLE EFFICIENT LED EMISSION - An integrated multi-layer apparatus and method of producing the same is disclosed. The apparatus comprises an LED, a beam shaping layer, and a refracting layer between the beam shaping layer from the LED. The refracting layer may have an index of refraction lower than the index of refraction of the LED and the beam shaping layer. | 06-07-2012 |
20120126281 | SYSTEM FOR FLASH-FREE OVERMOLDING OF LED ARRAY SUBSTRATES - System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate. | 05-24-2012 |
20120120664 | APPARATUS PROVIDING BEAMFORMING AND ENVIRONMENTAL PROTECTION FOR LED LIGHT SOURCES - Apparatus providing beamforming and environmental protection for LED light sources. A lens apparatus is provided to protect an LED mounted on a substrate. The lens apparatus includes an alignment feature configured to align the LED to a selected position and a focusing region configured to form a selected beam pattern from light emitted from the LED when located at the selected position. The lens apparatus also includes a compression surface configured to compress the substrate to a heat sink to facilitate heat dissipation from the LED and a fastening feature configured to fasten the lens apparatus to the heat sink to provide an environmentally protective seal, so that when the lens apparatus is fastened to the heat sink the alignment feature aligns the LED to the selected position, the compression surface compresses the substrate to the heat sink, and the protective seal protects the LED from environmental conditions. | 05-17-2012 |
20120120655 | AC LED ARRAY MODULE FOR STREET LIGHT APPLICATIONS - A street light includes a pole, arm and a head attached to the pole, wherein the head comprises a light source having a plurality of solid state light emitting devices and an optical element configured to produce a light distribution pattern from light emitted from the solid state light emitting devices, wherein the light source is configured to be powered directly from an AC source. | 05-17-2012 |
20120113641 | LIGHT MODULES CONNECTABLE USING HEAT PIPES - An illumination apparatus includes one or more solid state light emitting sources and a radiator thermally coupled to the one or more light emitting light sources, wherein the radiator is configured to be connectable to a second apparatus. The second apparatus may be a second solid state light emitting source or a second radiator. | 05-10-2012 |
20120112220 | LED-Based Light Source Utilizing Asymmetric Conductors - A light source includes LED dies that are flip-chip mounted on a flexible plastic substrate. The LED dies are attached to the substrate using an asymmetric conductor material with deformable conducting particles sandwiched between surface mount contacts on the LED dies and traces on the substrate. A diffusively reflective material containing light scattering particles is used instead of expensive reflective cups to reflect light upwards that is emitted sideways from the LED dies. The diffusively reflective material is dispensed over the top surface of the substrate and contacts the side surfaces of the dies. The light scattering particles are spheres of titanium dioxide suspended in silicone. The light source is manufactured in a reel-to-reel process in which the asymmetric conductor material and the diffusively reflective material are cured simultaneously. A silicone layer of molded lenses including phosphor particles is also added over the mounted LED dies in the reel-to-reel process. | 05-10-2012 |
20120106137 | THERMAL PIPE CAP - A light fixture includes a body, a hollow arm extending out from the body, a pipe cap at a distal end of the arm, and one or more solid state light emitting devices supported by the pipe cap. The pipe cap thermally couples the one or more solid state light emitting devices to the arm. | 05-03-2012 |
20120106136 | THERMAL HEAT TRANSFER WIRE - A light fixture includes a body, a hollow arm extending out from the body, a pipe cap at a distal end of the arm, and one or more solid state light emitting devices supported by the pipe cap. The pipe cap thermally couples the one or more solid state light emitting devices to the arm. | 05-03-2012 |
20120099321 | AC LED ARRAY MODULE FOR STREET LIGHT APPLICATIONS - A street light includes a pole, arm and a head attached to the pole, wherein the head comprises a light source having a plurality of solid state light emitting devices and an optical element configured to produce a light distribution pattern from light emitted from the solid state light emitting devices, wherein the light source is configured to be powered directly from an AC source. | 04-26-2012 |
20120099314 | SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN - A solid state lighting device includes a light source having one or more solid state light emitting cells and a substrate supporting the one or more solid state light emitting cells. The solid state lighting device also includes a fan integrated with the light source. | 04-26-2012 |
20120099311 | LED LIGHT USING INTERNAL REFLECTOR - A street light includes a pole and a head attached to the pole. The head includes a light emitting element comprising a plurality of solid state light emitting devices, an optical element, and a reflector configured to reflect light emitted by the solid state light emitting devices to the optical element to produce a light distribution pattern from the head. The light emitted from the solid state emitting devices may be Lambertian patterned light. The Lambertian patterned light may be used to illuminate the reflector. The reflector may be used to transform the Lambertian patterned light to collimated light and direct the collimated light towards the optical element. The optical element may be configured to produce the light distribution pattern from the collimated light. | 04-26-2012 |
20120092871 | RETROFITTABLE LED MODULE WITH HEAT SPREADER - A light source includes one or more solid state light emitting devices, a heat spreader thermally coupled to the one or more light emitting devices, and a mounting carriage configured to mount the one or more solid state light emitting devices in a lighting fixture light and thermally couple the heat spreader to the lighting fixture. | 04-19-2012 |
20120092865 | DRIVER-FREE LIGHT-EMITTING DEVICE - A light source includes a plurality of solid state light emitters configured to be powered directly from an AC source, and means for providing an electrically insulating and thermally conductive attachment between the solid state light emitters and a heat sink. | 04-19-2012 |
20120088321 | Efficient LED Array - An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. | 04-12-2012 |
20120058580 | Surface-Textured Encapsulations for Use With Light Emitting Diodes - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light. | 03-08-2012 |
20120057336 | GRADIENT OPTICS FOR EVEN LIGHT DISTRIBUTION OF LED LIGHT SOURCES - Gradient optics for even light distribution of LED light sources. In an aspect, an apparatus is provided for uniform distribution of light emitted from a light source. The apparatus includes a panel coupled to receive the light emitted from the light source, and gradient optics disposed on the panel, the gradient optics providing a matching transparency gradient that is aligned with the light source to evenly distribute the emitted light. In another aspect, an apparatus includes means for receiving the light emitted from the light source, and means for providing a matching transparency gradient that is aligned with the light source to evenly distribute the emitted light. | 03-08-2012 |
20110256647 | METHODS OF MANUFACTURING ELONGATED LENSES FOR USE IN LIGHT EMITTING APPARATUSES - A method of manufacturing an elongated lens for a light emitting apparatus includes forming an elongated lens having an exterior surface, and applying a photoluminescent material to the exterior surface of the lens. | 10-20-2011 |
20110254042 | ELONGATED LENSES FOR USE IN LIGHT EMITTING APPARATUSES - A light emitting apparatus includes one or more light emitting semiconductors, and an elongated lens encapsulating the one or more light emitting semiconductors. The elongated lens comprises an exterior surface having a photoluminescent material thereon. | 10-20-2011 |
20110249437 | HIGHLY EFFICIENT LED ARRAY MODULE WITH PRE-CALCULATED NON-CIRCULAR ASYMMETRICAL LIGHT DISTRIBUTION - A light module includes a light emitting diode (LED) array and a double-reflective assembly coupled to the LED array. The double-reflective assembly includes a lower member having a frame. The frame has an opening corresponding to the LED array. The frame and LED array are located in the same plane. The light module further includes a left bottom reflector and a right bottom reflector. The light module further includes an upper member which includes a left top reflector; and a right top reflector, wherein the left top reflector is attached to the left bottom reflector, and right top reflector is attached to the right bottom reflector, each forming an arbitrary left and right double-reflective assembly. A shape geometry and profile of each double-reflective assembly provides a pre-calculated combined non-circular asymmetrical intensity distribution pattern. The intensity distribution pattern is a superposition of light reflected from the bottom reflectors, light reflected from the top reflectors, light doubly reflected from both the top and bottom reflectors, and light directed into the intensity distribution pattern directly from the LED array. | 10-13-2011 |
20110203522 | METHOD AND SYSTEM FOR DYNAMIC IN-SITU PHOSPHOR MIXING AND JETTING - A system and method for depositing a phosphor composition onto a light emitting device improves manufacturing yield, simplifies conventional processes, and decreases costs. For example, a method of dispensing a phosphor composition onto a light emitting device includes dispensing a portion of the phosphor composition onto the light emitting device utilizing a plurality of colored phosphor dispensers each for dispensing a respective type of phosphor. Power is applied to the light emitting device to emit light, and a characteristic the light emitted by the light emitting device is detected. Phosphor mixing and phosphor dispensing are dynamically controlled. Therefore the color characteristics of phosphor dispensed on LEDs are consistent. The system and method may also reduce the difference between detected characteristic of the light and a desired characteristic of the light. | 08-25-2011 |
20110181194 | Reconfigurable LED Array and Use in Lighting System - A light-emitting device capable of being powered by an AC power supply or an unregulated DC power supply is disclosed. The light-emitting device, in an aspect, is coupled to a controller, a light-emitting diode (“LED”) array, and a power supply, wherein the power supply can be an AC power source or an unregulated DC power source. While the power supply provides electrical power, the controller generates various LED control signals in response to power fluctuation of the electrical power. The LED array allows at least a portion of LEDs to be activated in accordance with the logic states of the LED control signals. | 07-28-2011 |
20110169431 | Method and Apparatus for Providing Omnidirectional Illumination Using LED Lighting - A light-emitting device capable of generating omnidirectional light utilizing a reflector is disclosed. The light-emitting device, in one aspect, includes a light emitting diode (“LED”) package, a light reflector, and a shell. The LED package, which is mounted on a plate, generates a forward light cone by converting electrical energy to optical energy. The light reflector can be formed with various different shapes that can be placed adjacent to the LED package. A function of the light reflector is to redistribute at least a portion of the forward light cone whereby the overall light illuminated by the light-emitting device complies with LM79 specifications. The shell is used to enclose the LED package and the light reflector and configured to illuminate light in omnidirectional radiation in response to the forward light cone. | 07-14-2011 |
20110169417 | Reconfigurable LED Array and Use in Lighting System - A light-emitting device capable of being powered by an AC power supply or an unregulated DC power supply is disclosed. The light-emitting device, in an aspect, is coupled to a controller, a light-emitting diode (“LED”) array, and a power supply, wherein the power supply can be an AC power source or an unregulated DC power source. While the power supply provides electrical power, the controller generates various LED control signals in response to power fluctuation of the electrical power. The LED array allows at least a portion of LEDs to be activated in accordance with the logic states of the LED control signals. | 07-14-2011 |
20110140125 | LIGHT EMITTING DIODES WITH SMOOTH SURFACE FOR REFLECTIVE ELECTRODE - A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are disposed on one side of the epitaxial layer structure. The epitaxial layer structure includes a transparent ohmic contact layer having a root-means-square (RMS) roughness less than about 3 nm at a surface whereon the second electrode is formed. The epitaxial layer structure includes a p-type epitaxial layer and a n-type epitaxial layer, wherein the n-type epitaxial layer is coupled between the first electrode and the p-type epitaxial layer, and the p-type epitaxial layer is between the second electrode and the n-type epitaxial layer. The first electrode is located on the n-type epitaxial layer. | 06-16-2011 |
20110101395 | LIGHT EMITTING DIODE WITH THIN MULTILAYER PHOSPHOR FILM - A multiple layer film and a method of manufacturing the same, the film having a phosphor bearing layer including phosphor and a carrier, and a rigid protective layer. In some embodiments a mixture including phosphor and an uncurable fluid are dispensed onto a surface, and the mixture is at least partially dried. A curable fluid is dispensed onto the at least partially dried mixture, and the curable fluid is cured. | 05-05-2011 |
20110092003 | PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES - Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. | 04-21-2011 |
20110090706 | AUTOMATIC ELECTRICAL CONNECTION ASSEMBLY FOR LIGHT MODULES - An illumination apparatus includes a solid state light emitting source and a first radiator thermally coupled to the solid state light emitting source, wherein the radiator is configured to be connectable to a second apparatus. The illumination apparatus further includes a one or more electrical conductors coupled to the radiator, wherein the electrical conductors are adapted to couple electrically to the solid state light emitting source. | 04-21-2011 |
20110090690 | UNIVERSAL MOUNTING CARRIER FOR SOLID STATE LIGHT EMITTING DEVICE ARRAYS - A light source includes one or more solid state light emitting devices, and a universal mounting carrier supporting the one or more solid state light emitting devices, wherein the universal mounting carrier is adapted for mounting into any of a plurality of street lights in place of a non-solid state light source, each of the street lights having at least one different physical dimension from the others. | 04-21-2011 |
20110089457 | SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light. | 04-21-2011 |
20110089454 | SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light. | 04-21-2011 |
20110089437 | CROSS FLOW CVD REACTOR - A cross flow chemical vapor deposition chamber can comprise an inlet duct having a generally rectangular cross-section and an outlet duct having a generally rectangular cross-section. The rectangular inlet duct and the rectangular outlet duct can facilitate laminar flow of reactant gases over a susceptor. Movable partitions can be configured to define a plurality of zones within the chamber. Each zone can contain a different reactant gas, concentration of reactant gas, and/or flow rate of reactant gas. Enhanced laminar flow can be provided, undesirable depletion of reactant gas can be mitigated, and enhanced control of reactant gases can be facilitated. | 04-21-2011 |
20110073896 | System for Wafer-Level Phosphor Deposition - System for wafer-level phosphor deposition. A method for phosphor deposition on a semiconductor wafer that has a plurality of LED dies includes the operations of covering the semiconductor wafer with a selected thickness of photo resist material, removing portions of the photo resist material to expose portions of the semiconductor wafer so that electrical contacts associated with the plurality of LED dies remain unexposed, and depositing phosphor on the exposed portions of the semiconductor wafer. | 03-31-2011 |
20110073882 | System for Wafer-Level Phosphor Deposition - System for wafer-level phosphor deposition. In an aspect, a semiconductor wafer is provided that includes a plurality of LED dies wherein at least one die includes an electrical contact, a photo-resist post covering the electrical contact, and a phosphor deposition layer covering the semiconductor wafer and surrounding the photo-resist post. In another aspect, a semiconductor wafer is provided that comprises a plurality of LED dies wherein at least one die comprises an electrical contact, a phosphor deposition layer covering the semiconductor wafer, and a cavity in the phosphor deposition layer exposing the at least one electrical contact. | 03-31-2011 |
20110069503 | Shape Forming Heat Sink With Flexible Heat Rod - A conforming heat dissipating structure transfers heat to an irregular surface from a heat source mounted on its bottom surface. The heat dissipating structure includes an open container filled with metal shavings and balls covered by a flexible retainer. The shavings and balls beneath the flexible retainer are pressed against the irregular surface and conform to its irregular shape. In one application, light emitting diodes are mounted to the bottom of the heat dissipating structure, and the shavings are compressed against the inside cover of a street light. A flexible heat rod enables heat to be transferred over a flexible path from a heat source on one heat dissipating structure to a heat sink pressed against another heat dissipating structure. The many strands that make up the flexible heat rod are spread out inside each open container and are pressed between the metallic shavings to achieve a good thermal contact. | 03-24-2011 |
20110069474 | Method and Apparatus for Generating White Light from Solid State Light Emitting Devices - An optical device capable of generating warm light using an array of phosphor islands situated over a phosphor layer is disclosed. The device includes a solid state light emitter, a phosphor layer, and phosphor islands. The solid state light emitter, in an aspect, is a light emitting diode (“LED”) capable of converting electrical energy to optical light. The phosphor layer is disposed over the solid state light emitter for generating luminous cool light in response to the optical light. Multiple phosphor islands are disposed on the phosphor layer for converting cool light to warm light, wherein the phosphor islands are evenly distributed over the phosphor layer. | 03-24-2011 |
20110068695 | Method and Apparatus for Providing LED Package with Controlled Color Temperature - An optical device capable of illuminating visual light with adjusting color temperature after fabrication is disclosed. The optical device includes a solid state light emitter and a phosphor layer, which is formed over the solid state light emitter. The solid state light emitter, which can be a light emitter diode (“LED”), converts electrical energy to blue light. The phosphor layer subsequently converts first light with a first wavelength to second light with a second wavelength. In one example, the first light is blue light while the second light is white light. A portion of the phosphor layer is adjusted after the phosphor layer is formed for adjusting color of the white light in accordance with color quality of the light detected by a light detector. | 03-24-2011 |
20110065218 | PRE-THERMAL GREASED LED ARRAY - An apparatus includes a backing material and a solid state component. The backing material carries a thermally conductive non-solid substance. The solid state component is set into the thermally conductive non-solid substance. The backing material is arranged with the solid state component so that the backing material may be removed from the apparatus leaving at least a portion of the thermally conductive non-solid substance on the solid state component for mounting to a heat sink. | 03-17-2011 |
20110063837 | LED ARRAY MODULE AND LED ARRAY MODULE FRAME - A solid state light emitter module frame includes a supporting member, legs, and arms. The supporting member is configured to support a reflector. The legs are coupled to the supporting member. The arms are coupled to the supporting member and extend inwardly towards an inner edge of the supporting member. Each of the arms has an attachment mechanism for attaching to an solid state light emitter array. | 03-17-2011 |
20110062482 | Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces - A light-emitting device having multiple light-emitting diode (“LED”) dice organized in an array capable of configuring LED dice in series, parallel, and/or a combination of series and parallel via metal traces is disclosed. In one aspect, the light-emitting device includes a substrate, a dielectric layer, an LED array, and a metal trace. The dielectric layer, which is disposed over the substrate, provides electric insulation. The LED array capable of generating light is able to enhance flexibility of LED connections using a metal trace. The metal trace has a predefined shape configured to travel through the LED array for facilitating electric connections. | 03-17-2011 |
20110045614 | Method and Apparatus for Providing LED Package with Controlled Color Temperature - An optical device capable of illuminating visual light with adjusting color temperature after fabrication is disclosed. The optical device includes a solid state light emitter and a phosphor layer, which is formed over the solid state light emitter. The solid state light emitter, which can be a light emitter diode (“LED”), converts electrical energy to blue light. The phosphor layer subsequently converts first light with a first wavelength to second light with a second wavelength. In one example, the first light is blue light while the second light is white light. A portion of the phosphor layer is adjusted after the phosphor layer is formed for adjusting color of the white light in accordance with color quality of the light detected by a light detector. | 02-24-2011 |
20110039471 | PHOSPHOR HOUSING FOR LIGHT EMITTING DIODE LAMP - A light emitting apparatus includes a housing having a transparent bulb with phosphor, and at least one LED positioned within the housing to excite the phosphor and emit light through the transparent bulb. | 02-17-2011 |
20110031508 | Method and Apparatus for Manufacturing LED Devices using Laser Scribing - A method of manufacturing a light-emitting device using laser scribing to improve overall light output is disclosed. Upon placing a semiconductor wafer having light emitting diode (“LED”) devices separated by streets on a wafer chuck, the process arranges a first surface of semiconductor wafer containing front sides of the LED devices facing up and a second surface of semiconductor wafer containing back sides of the LED devices facing toward the wafer chuck. After aligning a laser device over the first surface of the semiconductor wafer above a street, the process is configured to focus a high intensity portion of a laser beam generated by the laser device at a location in a substrate closer to the back sides of the LED devices. | 02-10-2011 |
20110026263 | SURFACE-TEXTURED ENCAPSULATIONS FOR USE WITH LIGHT EMITTING DIODES - Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon the light emitting diode and having a surface texture configured to extract light. In an aspect, a method includes encapsulating a light emitting diode with an encapsulation having a surface texture configured to extract light. In an aspect, a light emitting diode lamp is provided that includes a package, at least one light emitting diode disposed within the package, and an encapsulation formed upon the at least one light emitting diode having a surface texture configured to extract light. In another aspect, a method includes determining one or more regions of an encapsulation, the encapsulation configured to cover a light emitting diode, and surface-texturing each region of the encapsulation with one or more geometric features that are configured to extract light. | 02-03-2011 |
20110025191 | Method and Apparatus for Generating Phosphor Film with Textured Surface - An optical device deploring a phosphor layer having a textured surface to improve output of visual light is disclosed. A light emitting device includes a solid state light emitter and a phosphor layer. The solid state light emitter, for example, is configured to convert electrical energy to optical light. The phosphor layer includes a first surface and a second surface, wherein the first surface, for example, is the top surface while the second surface is the bottom surface. The phosphor layer is disposed over the solid state light emitter for generating luminous light in response to the optical light. The first surface of the phosphor layer, in one embodiment, is configured to include a texture, which has similarly shaped uniform configurations, capable of reducing total internal reflection. | 02-03-2011 |
20110012157 | TRANSPARENT HEAT SPREADER FOR LEDS - A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided. | 01-20-2011 |
20110008923 | LIGHT EMITTING DIODES WITH SMOOTH SURFACE FOR REFLECTIVE ELECTRODE - A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are separately disposed on the epitaxial layer structure, and the epitaxial layer structure has a root-means-square (RMS) roughness less than about 3 at a surface whereon the first electrode is formed. | 01-13-2011 |
20110007515 | LIGHT-EMITTING DEVICE MOUNTING FIXTURE - A light-emitting device mounting fixture comprising a first means for attaching a light-emitting device to the mounting fixture in a defied position, and a second means for attaching the mounting fixture to a heat sink, wherein a distance between the light-emitting device and the location of the second means is determined in accordance with a testing voltage is disclosed. Additionally the disclosed light-emitting device mounting fixture may comprise means for attaching lead wires to electrically conducting contacts, the electrically conducting contacts providing power to the light emitting device to be inserted into the mounting fixture. Furthermore the disclosed light-emitting device mounting fixture may comprise means for disassemble able attachment of a reflector. | 01-13-2011 |
20100328923 | MULTIPLE LAYER PHOSPHOR BEARING FILM - A multiple layer phosphor bearing film having a phosphor bearing layer comprising phosphor. The film may also have an optical layer having a refractive index that is higher than a refractive index for the phosphor bearing layer. The phosphor beraing layer may be adhesive to enable the film to be applied to a light source. | 12-30-2010 |
20100327733 | MULTIPLE LAYER PHOSPHOR BEARING FILM - A multiple layer phosphor bearing film having a phosphor bearing layer comprising phosphor, a transparent protective layer, and an adhesive configured to adhere the film to a light source. | 12-30-2010 |
20100323466 | LIGHT EMITTING DIODE LAMP WITH PHOSPHOR COATED RELECTOR - A light emitting apparatus includes a lamp reflector having phosphor, wherein the lamp reflector further includes an aperture, and an LED light source arranged with the lamp reflector to excite the phosphor and to emit light through the aperture of the lamp reflector. | 12-23-2010 |
20100314651 | THIN-FILM LED WITH P AND N CONTACTS ELECTRICALLY ISOLATED FROM THE SUBSTRATE - A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode. | 12-16-2010 |
20100314649 | THIN-FILM LED WITH P AND N CONTACTS ELECTRICALL ISOLATED FROM THE SUBSTRATE - A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode. | 12-16-2010 |
20100314643 | Thin-film LED with P and N contacts electrically isolated from the substrate - A thin-film LED includes an insulating substrate, an electrode on the insulating substrate, and an epitaxial structure on the electrode. | 12-16-2010 |
20100301728 | LIGHT SOURCE HAVING A REFRACTIVE ELEMENT - A light emitting apparatus includes a substrate, a plurality of solid state light emitting cells having a planar arrangement on the substrate, and a refractive element arranged with the solid state light emitting cells so that light emitted from the light source has a substantially spherical emission pattern. The refractive element may also be arranged with the solid state light emitting cells to mix the emitted light. | 12-02-2010 |
20100301726 | LIGHT SOURCE WITH OPTICS TO PRODUCE A SPHERICAL EMISSION PATTERN - A light emitting apparatus includes a substrate, a plurality of solid state light emitting cells having a planar arrangement on the substrate, and one or more reflectors arranged with the solid state light emitting cells so that light emitted from the light source has a substantially spherical emission pattern. | 12-02-2010 |
20100301356 | LIGHT SOURCE HAVING LIGHT EMITTING CELLS ARRANGED TO PRODUCE A SPHERICAL EMISSION PATTERN - A light source includes a mount having first and second opposite surfaces, a first light emitting element having one or more solid state light emitting cells arranged to emit light from the first surface of the mount, and a second light emitting element having one or more solid state light emitting cells arranged to emit light from the second surface of the mount. The first and second light emitting elements are arranged such that the light emitted from the light source produces a substantially spherical emission pattern. | 12-02-2010 |
20100297794 | EFFICIENT LED ARRAY - An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. | 11-25-2010 |
20100279575 | METHOD AND SYSTEM FOR DYNAMIC IN-SITU PHOSPHOR MIXING AND JETTING - A system and method for depositing a phosphor composition onto a light emitting device improves manufacturing yield, simplifies conventional processes, and decreases costs. For example, a method of dispensing a phosphor composition onto a light emitting device includes dispensing a portion of the phosphor composition onto the light emitting device utilizing a plurality of colored phosphor dispensers each for dispensing a respective type of phosphor. Power is applied to the light emitting device to emit light, and a characteristic the light emitted by the light emitting device is detected. Phosphor mixing and phosphor dispensing are dynamically controlled. Therefore the color characteristics of phosphor dispensed on LEDs are consistent. The system and method may also reduce the difference between detected characteristic of the light and a desired characteristic of the light. | 11-04-2010 |
20100277048 | SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN - A solid state lighting device includes a light source having one or more solid state light emitting cells and a substrate supporting the one or more solid state light emitting cells. The solid state lighting device also includes a fan integrated with the light source. | 11-04-2010 |
20100253248 | PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES - Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. | 10-07-2010 |
20100236483 | CHEMICAL VAPOR DEPOSITION REACTOR HAVING MULTIPLE INLETS - A chemical vapor deposition reactor has a wafer carrier which cooperates with a chamber of the reactor to facilitate laminar flow of reaction gas within the chamber and a plurality of injectors configured in flow controllable zones so as to mitigate depletion. | 09-23-2010 |
20100213486 | TRANSPARENT HEAT SPREADER FOR LEDS - A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided. | 08-26-2010 |
20100142196 | EFFICIENT LED ARRAY - An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. | 06-10-2010 |
20100141182 | PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES - Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. | 06-10-2010 |
20100140630 | Method And Apparatus For Manufacturing LED Devices Using Laser Scribing - A method of manufacturing a light-emitting device using laser scribing to improve overall light output is disclosed. Upon placing a semiconductor wafer having light emitting diode (“LED”) devices separated by streets on a wafer chuck, the process arranges a first surface of semiconductor wafer containing front sides of the LED devices facing up and a second surface of semiconductor wafer containing back sides of the LED devices facing toward the wafer chuck. After aligning a laser device over the first surface of the semiconductor wafer above a street, the process is configured to focus a high intensity portion of a laser beam generated by the laser device at a location in a substrate closer to the back sides of the LED devices. | 06-10-2010 |
20100136728 | LIGHT-EMITTING DIODE CHIP WITH HIGH LIGHT EXTRACTION AND METHOD FOR MANUFACTURING THE SAME - This invention provides a light-emitting diode chip with high light extraction, which includes a substrate, an epitaxial-layer structure for generating light by electric-optical effect, a transparent reflective layer sandwiched between the substrate and the epitaxial-layer structure, and a pair of electrodes for providing power supply to the epitaxial-layer structure. A bottom surface and top surface of the epitaxial-layer structure are roughened to have a roughness not less than 100 nm root mean square (rms). The light generated by the epitaxial-layer structure is hence effectively extracted out. A transparent reflective layer not more than 5 μm rms is formed as an interface between the substrate and the epitaxial-layer structure. The light toward the substrate is more effectively reflected upward. The light extraction and brightness are thus enhanced. Methods for manufacturing the light-emitting diode chip of the present invention are also provided. | 06-03-2010 |
20100136725 | THERMAL MANAGEMENT FOR LED - A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED. | 06-03-2010 |
20100133581 | TOP CONTACT LED THERMAL MANAGEMENT - An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs. | 06-03-2010 |
20100133575 | LOW OPTICAL LOSS ELECTRODE STRUCTURES FOR LEDS - An electrode structure is disclosed for enhancing the brightness and/or efficiency of an LED. The electrode structure can have a metal electrode and an optically transmissive thick dielectric material formed intermediate the electrode and a light emitting semiconductor material. The electrode and the thick dielectric cooperate to reflect light from the semiconductor material back into the semiconductor so as to enhance the likelihood of the light ultimately being transmitted from the semiconductor material. Such LED can have enhanced utility and can be suitable for uses such as general illumination. | 06-03-2010 |
20100133556 | LED ARRAY PACKAGE COVERED WITH A HIGHLY THERMAL CONDUCTIVE PLATE - A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate. | 06-03-2010 |
20100127289 | Method and Apparatus for Providing LED Package with Controlled Color Temperature - An optical device capable of illuminating visual light with adjusting color temperature after fabrication is disclosed. The optical device includes a solid state light emitter and a phosphor layer, which is formed over the solid state light emitter. The solid state light emitter, which can be a light emitter diode (“LED”), converts electrical energy to blue light. The phosphor layer subsequently converts first light with a first wavelength to second light with a second wavelength. In one example, the first light is blue light while the second light is white light. A portion of the phosphor layer is adjusted after the phosphor layer is formed for adjusting color of the white light in accordance with color quality of the light detected by a light detector. | 05-27-2010 |
20100066236 | Method and Apparatus for Generating Phosphor Film with Textured Surface - An optical device deploring a phosphor layer having a textured surface to improve output of visual light is disclosed. A light emitting device includes a solid state light emitter and a phosphor layer. The solid state light emitter, for example, is configured to convert electrical energy to optical light. The phosphor layer includes a first surface and a second surface, wherein the first surface, for example, is the top surface while the second surface is the bottom surface. The phosphor layer is disposed over the solid state light emitter for generating luminous light in response to the optical light. The first surface of the phosphor layer, in one embodiment, is configured to include a texture, which has similarly shaped uniform configurations, capable of reducing total internal reflection. | 03-18-2010 |
20100059765 | Light-Emitting Device With Improved Electrode Structures - A light-emitting device includes first and second semiconductor layers and a light-emitting layer between the first and second semiconductor layers. The light-emitting device also includes an improved electrode structures. | 03-11-2010 |
20090296369 | Method and Apparatus for Generating White Light From Solid State Light Emitting Devices - An optical device capable of generating warm light using an array of phosphor islands situated over a phosphor layer is disclosed. The device includes a solid state light emitter, a phosphor layer, and phosphor islands. The solid state light emitter, in an aspect, is a light emitting diode (“LED”) capable of converting electrical energy to optical light. The phosphor layer is disposed over the solid state light emitter for generating luminous cool light in response to the optical light. Multiple phosphor islands are disposed on the phosphor layer for converting cool light to warm light, wherein the phosphor islands are evenly distributed over the phosphor layer. | 12-03-2009 |