ITEQ CORPORATION Patent applications |
Patent application number | Title | Published |
20150038039 | ORGANIC-INORGANIC HYBRID MATERIAL FILM AND METHOD FOR MANUFACTURING THE SAME - The invention provides a method for manufacturing an organic-inorganic hybrid material film. The method mainly comprises hybridization of polymaleic anhydride-polyimide and silica by sol-gel route and by using a silane coupling agent to produce a structure of polymaleic anhydride-polyimide having silane, then casting and curing to form a material film. Also, the invention provides a polymaleic anhydride-polyimide-silica organic-inorganic hybrid material film. | 02-05-2015 |
20140275377 | DIELECTRIC MATERIAL WITH LOW DIELECTRIC LOSS - The invention provides a dielectric material with low dielectric loss. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df. | 09-18-2014 |
20140275335 | CIRCUIT BOARD - The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df. | 09-18-2014 |
20140093722 | ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE - The electromagnetic interference shielding structure disclosed comprises a first metal layer, a second metal layer, a dielectric layer inter-disposed between the first metal layer and the second metal layer, an adhesive layer located on the second metal layer, and a release film located on the adhesive layer. The electromagnetic interference shielding film prevent the neighbouring circuits and components from the electromagnetic wave interference, the theories applied are reflections of the electromagnetic waves, and absorption of the electromagnetic waves. | 04-03-2014 |
20110097587 | VARNISH, PREPREG, AND SUBSTRATE THEREOF - A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness. | 04-28-2011 |
20100159765 | PREPREG AND RESIN FOR PREPARING THE SAME - A composition for preparing a resin is provided. The composition includes a brominated epoxy resin, a urethane-modified copolyester, a curing agent and a solvent. A prepreg is also provided. The prepreg includes a glass fabric and a resin layer on the glass fabric. The resin layer is made from the foregoing resin. | 06-24-2010 |
20100155123 | HALOGEN-FREE PREPREG AND RESIN FOR PREPARING THE SAME - A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin. | 06-24-2010 |
20100046103 | BRIGHTNESS ENHANCEMENT COMPONENT - A brightness enhancement component includes a substrate and a plurality of prism elements. The prism elements are serially disposed on the substrate. A V-shaped trough is formed between each immediately-adjacent two prism elements. All the V-shaped troughs have their bottom ends disposed within a reference plane. A first prism element group each has a relatively high crest higher than the reference plane by a first height. A second prism element group each has a relatively low crest higher than the reference plane by a second height, wherein each of the first prism element group and each of the second prism element group are alternately arranged on the substrate, the first height is larger than the second height. | 02-25-2010 |
20090280984 | Method of Inhibiting the Growth of Algae - To inhibit the growth of algae, glucosamine and chitosan are added into water needed to be treated wherein the concentration of glucosamine and chitosan in the treated water is in a ratio from 1:9 to 9:1. | 11-12-2009 |
20090231859 | Brightness Enhancement Component - A brightness enhancement component includes a substrate and a plurality of prism elements. The prism elements are disposed on the substrate, and each element prism has a relatively high crest and at least one relatively low crest. A crest line of the relatively low crest is equal to or shorter than a crest line of the relatively high crest in length. All of the relatively high crests have their crest lines in parallel with one another, or all of the relatively high and relatively low crests have their crest lines in parallel with one another. | 09-17-2009 |
20090124575 | Method of Inhibition the Growth of Algae - To inhibit the growth of algae, glucosamine is added into water needed to be treated. | 05-14-2009 |