SAE MAGNETICS (H.K.) LTD. Patent applications |
Patent application number | Title | Published |
20160131861 | WAFER LEVEL PACKAGED OPTICAL SUBASSEMBLY AND TRANSCEIVER MODULE HAVING SAME - An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer. | 05-12-2016 |
20150332717 | THERMAL ASSISTED MAGNETIC RECORDING HEAD WITH PROTRUSION ON LEADING SIDE OF PLASMON GENERATOR - A thermal assisted magnetic recording head of the present invention has an air bearing surface (ABS) opposite to a magnetic recording medium, a core that can propagate laser light as propagating light, a plasmon generator that includes a generator front end surface facing the ABS, and a main pole that faces the ABS and emits magnetic flux to the magnetic recording medium. The plasmon generator is opposite to a part of the core and extends to the generator front surface, is coupled with a portion of the propagating light that propagates through the core in the surface plasmon mode to generate a surface plasmon, propagates the surface plasmon to the generator front end surface, and generates near-field light (NF light) at the generator front end surface to irradiate the NF light to the magnetic recording medium. The ABS has a protrusion that is closer to the leading side than the generator front end surface in the down track direction, and that protrudes more toward the magnetic recording medium than the generator front end surface upon operation of the thermal assisted magnetic recording head. | 11-19-2015 |
20150262593 | THERMALLY-ASSISTED MAGNETIC RECORDING HEAD INCLUDING A PLASMON GENERATOR - A return path section includes first and second yoke portions and first, second and third columnar portions. The first and second yoke portions and the first columnar portion are located on the front side in the direction of travel of a recording medium relative to a waveguide core. The second and third columnar portions are located on opposite sides of a plasmon generator and connected to a shield. The first yoke portion connects a main pole to the first columnar portion. The second yoke portion connects the first columnar portion to the second and third columnar portions. A coil is wound around the first columnar portion. A heater and an expansion layer are located on the rear side in the direction of travel of the recording medium relative to the core. | 09-17-2015 |
20150255096 | NEAR-FIELD LIGHT GENERATOR INCLUDING A WAVEGUIDE AND A PLASMON GENERATOR - A plasmon generator includes a first portion and a second portion. A core of a waveguide includes a main body portion and a protruding portion. The main body portion has a first surface and a second surface parallel to each other. The protruding portion lies on the first surface. A cladding of the waveguide includes a receiving-portion-forming layer lying on the first surface. At least part of the first portion of the plasmon generator is received in a receiving portion defined by the protruding portion and the receiving-portion-forming layer. | 09-10-2015 |
20150247722 | METHOD OF MANUFACTURING THERMALLY-ASSISTED MAGNETIC HEAD AND ALIGNMENT APPARATUS THEREOF - A method of manufacturing a thermally-assisted magnetic head includes providing a light source unit including a laser diode; providing a reflection board, and a photo detector; driving the laser diode to emit a light beam towards the reflection board; performing an alignment between the light source unit and the thermally-assisted magnetic recording head section, based on a reflected light of the light beam reflected by the reflection board, then passed through the optical waveguide and finally detected by the photo detector obtaining the maximum power in a LED emission state of the laser diode; and bonding the light source unit to the slider after the alignment is completed. It improves alignment accuracy between a light source unit and a slider during a bonding process therebetween, prevents a laser diode of the light source unit instability, and improves performance of the thermally-assisted magnetic head finally. | 09-03-2015 |
20150235870 | WAFER-LEVEL PACKAGED OPTICAL SUBASSEMBLY AND TRANSCEIVER MODULE HAVING SAME - A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts. | 08-20-2015 |
20150235659 | MAGNETIC HEAD INCLUDING TWO CONTACT SENSORS - A magnetic head includes a medium facing surface, a read head unit, a write head unit, and a protrusion device. The protrusion device causes part of the medium facing surface to protrude toward a recording medium. The read head unit has a first end face located in the medium facing surface and includes a first contact sensor for detecting contact of the first end face with the recording medium. The write head unit has a second end face located in the medium facing surface and includes a second contact sensor for detecting contact of the second end face with the recording medium. The first end face and the second end face are located at positions different from each other in a direction of travel of the recording medium. | 08-20-2015 |
20150138671 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING INCLUDING A HEATER - A magnetic head includes a main pole, an expansion member, and a heater. The main pole has an end face located in a medium facing surface. The expansion member is located farther from the medium facing surface than is the main pole and adjacent to the main pole in a direction perpendicular to the medium facing surface. The heater heats the expansion member. The expansion member has a linear expansion coefficient higher than that of the main pole. | 05-21-2015 |
20150124575 | NEAR-FIELD LIGHT GENERATOR INCLUDING A WAVEGUIDE AND A PLASMON GENERATOR - A plasmon generator includes a first portion and a second portion that are adjacent in a first direction orthogonal to the direction of travel of light propagating through a core. The second portion includes a front end face located in a medium facing surface of a magnetic head. The core has a concave portion recessed from the top surface of the core. At least part of the first portion is received in the concave portion. The concave portion has a surface including an evanescent light generating portion. The first portion includes a plasmon exciting portion opposed to the evanescent light generating portion. The evanescent light generating portion is inclined relative to a first surface. | 05-07-2015 |
20150124417 | ELECTRONIC COMPONENT PACKAGE - An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules. | 05-07-2015 |
20150098154 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a leading shield part opposing the main magnetic pole layer on the substrate side of the main magnetic pole layer, a substrate side shield part has contact with the leading shield part. The thin-film coil has a substrate side coil layer between the main magnetic pole layer and substrate. The spaces to the substrate about a leading lower end face of the leading shield part, a shield upper end face of the substrate side shield part, and coil upper end face of the substrate side coil layer are formed to be equal to each other. The depth of the leading shield part is formed to be smaller than the depth of the substrate side shield part. | 04-09-2015 |
20150085629 | THERMALLY ASSISTED MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a laminated structure in which a first thin-film metal layer formed in a thin film form along a direction intersecting the medium-opposing surface and a second thin-film metal layer formed in a thin film form and formed using a second metal larger in hardness than a first metal forming the first thin-film metal layer are alternately laminated. Further, in the second thin-film metal layer, a defect part is formed, the defect part is a part smaller in thickness than another part or is a hole part, and a flat layer part other than the defect part surrounds the defect part. | 03-26-2015 |
20150078410 | VERTICAL CAVITY SURFACE EMITTING LASER DEVICE - A vertical cavity surface emitting laser (VCSEL) device includes a bottom distributed Bragg reflector (DBR); a top DBR; an optical cavity with an active layer stack formed between the bottom DBR and the top DBR, arranged for generating light with a predetermined emission wavelength; a top electrode layer with a first window formed above the top DBR; and a first heat dissipation layer sandwiched between the top DBR and the top electrode layer. The VCSEL device utilizes thicker, heavily doped semiconductor contact window for efficient heat dissipation from active region. Besides heat dissipation on the top side of VCSEL device, it also increases the bandwidth of VCSEL through top DBR reflectivity changes that reduce the photon lifetime via a surface relief structure etching on the top side of VCSEL device. Further, the invented VCSEL contains adjusted Aluminium molefractions in multiple sections of top and bottom DBRs to effectively dissipate heat from active region of VCSEL. Thus, proposed VCSEL device maintains lower junction temperature for achieving stable high-speed operations at high ambient temperature, thereby improving its performance. | 03-19-2015 |
20150015990 | HEAD STACK ASSEMBLY, HARD DISK DRIVE, AND METHOD OF CONNECTING A HEAD GIMBAL ASSEMBLY TO A FLEXIBLE PRINTED CIRCUIT ASSEMBLY IN A HEAD STACK ASSEMBLY - A head stack assembly includes at least one head gimbal assembly and a flexible printed circuit assembly. A flexure tail of the head gimbal assembly includes a row of first bonding pads, a first dual stage actuator pad and a first dummy pad arranged at two sides of said row of first bonding pads, and the first dual stage actuator pad and the first dummy pad are connected together via a jumping lead. The flexible printed circuit assembly includes at least one row of second bonding pads, at least one second dual stage actuator pad and at least one second dummy pad arranged for connecting with the row of first bonding pads, the first dual stage actuator pad and the first dummy pad respectively. The connection way between the head gimbal assembly and the flexible printed circuit assembly is simple, thereby less cross talk is generated on the preamplifier. | 01-15-2015 |
20140314378 | OPTICAL MODULE PACKAGE - An optical module package is provided, the optical module package including a housing main body, a cover body, first and second holding members, and a fiber unit. The first and second holding members may form, inside thereof, a unit accommodating part according to the outer size of a fiber unit in a direct opposing state. The housing main body has locking projections set an arrangement interval between two opposing surfaces of outer surface of the first and second holding members arranged to oppose each other, and a space sandwiched between locking projections is set as an accommodating space for the first and second holding members. | 10-23-2014 |
20140294030 | MULTIMODE VERTICAL CAVITY SURFACE EMITTING LASER HAVING NARROW LASER LIGHT EMITTING ANGLE - The protective film that covers the top distributed Bragg reflecting mirror has a central region and a peripheral region. The central region has a protrusion that projects relative to the peripheral region in a direction in which the laser light is emitted. The VCSEL satisfies relations below: | 10-02-2014 |
20140269237 | MULTILAYER PLASMON GENERATOR - A plasmon generator has a front end face, a first metal layer, a second metal layer, and an intermediate layer. The front end face generates near-field light based on a surface plasmon. The intermediate layer is interposed between the first metal layer and the second metal layer. Each of the first metal layer, the second metal layer and the intermediate layer has an end located in the front end face. Each of the first and second metal layers is formed of a metal material. The intermediate layer is formed of a material higher in Vickers hardness than the metal material used to form the first metal layer and the metal material used to form the second metal layer. | 09-18-2014 |
20140241138 | MAGNETIC HEAD COMPRISING RECORDING PART, READING PART, HEATER FOR EXPANSION OF THE RECORDING PART, AND HEATER FOR EXPANSION OF THE READING PART - A magnetic head includes a reading part, a recording part that is laminated on the reading part in a planer view, a recording part expansion heater, a reading part expansion heater, and a thermal expansion promoting layer that is prepared at a position closer to the reading part than to the recording part and extends to an air bearing surface. | 08-28-2014 |
20140209664 | METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again. | 07-31-2014 |
20140198411 | MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME, AND MANUFACTURING METHOD THEREOF - A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed. | 07-17-2014 |
20140185638 | OPTICAL MODULE - There are provided an optical module including a semiconductor laser including a P-side electrode and an N-side electrode, and a semiconductor laser driver circuit that drives the semiconductor laser so as to output an optical signal from the semiconductor laser according to a pattern of a differentially transmitted digital electric signal, and the semiconductor laser driver circuit includes a positive-side terminal and a negative-side terminal for differentially transmitted non-inverted data, and a positive-side terminal and a negative-side terminal for differentially transmitted inverted data, and one terminal for the non-inverted data is electrically connected to one electrode of the semiconductor laser, and the other terminal for the non-inverted data, one terminal for the inverted data and the other terminal for the inverted data each are connected to the other electrode of the semiconductor laser. | 07-03-2014 |
20140156879 | ACTIVE CABLE WITH INDICATORS SHOWING OPERATING MODES AND LINKING STATUS - An active cable includes: a cable body with two ends and two cable plugs being connected to the two ends of the cable body respectively. Each cable plug includes: an electrical connector configured for transmitting and receiving power, high speed data and low speed control signals; a transceiver circuitry connected with the electrical connector and the cable body and configured to transmit and receive the high speed data between the electrical connector and the cable body; an indicator; a driving circuitry connected with the indicator and configured to drive the indicator; and a cable controller connected with the electrical connector, the transceiver circuitry and the driving circuitry and configured to determine an operating mode and linking status of the active cable and transmit an internal control signal to the driving circuitry accordingly. | 06-05-2014 |
20140131309 | WRITE ELEMENT, THERMALLY ASSISTED MAGNETIC HEAD SLIDER, HEAD GIMBAL ASSEMBLY, HARD DISK DRIVE WITH THE SAME, AND MANUFACTURING METHOD THEREOF - A write element for a thermally assisted magnetic head slider includes an air bearing surface facing to a magnetic recording medium; a first magnetic pole, a second magnetic pole, and coils sandwiched between the first and the second magnetic poles; a waveguide for guiding light generated by a light source module mounted on a substrate; and a plasmon unit provided around the first magnetic pole and the waveguide, which has a near-field light generating surface for propagating near-field light to the air bearing surface. The near-field light generating surface of the plasmon unit is apart from the air bearing surface with a first predetermined distance to form a first recess, and the first recess is filled in with a protective layer. The thermally assisted magnetic head slider can prevent the plasmon unit from protruding over the air bearing surface, thereby improving the performance of thermally assisted magnetic head. | 05-15-2014 |
20140124959 | MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip. | 05-08-2014 |
20140097327 | FINGER NAVIGATION MODULE WITH INTEGRATED AMBIENT LIGHT SENSOR - An optical finger navigation module includes a light source configured for emitting light in a first spectrum; a cover housing disposed above the light source, the cover housing including a window plate that is configured to transmit light in at least the first spectrum, and a light guiding structure that is configured to transmit light in at least a second spectrum; a first light sensor configured to sense light in the first spectrum originally emitted by the light source, reflected by an object, and then transmitted through the window plate; a second light sensor configured to sense light in the second spectrum transmitted through the light guiding structure or the window plate; and a substrate. The light source, the cover housing, the first light sensor and the second light sensor are coupled and mounted to the substrate. | 04-10-2014 |
20140036384 | ABS Design for Uniform Touch-Down and Back-Off in DFH Applications - A DFH (Dynamic Flying Height) type slider ABS design has significantly improved DFH efficiency and back-off efficiency as well as uniform touchdown detectability. This is the result of decoupling the local pressure variations at the read/write head that result from skew angle variations across a disk, from local stiffness due to ABS protrusion caused by heater activation. The decoupling, which allows the heater activation stiffness to be carefully tuned, is a result of the effects of airflow channeled by a wide down-track channel onto a narrow down-track channel formed in an extended finger of the central pad of the slider. Airflow impinges on the finger channel in a manner that eliminates variations in air pressure at the central pad due to variations in skew angle. | 02-06-2014 |
20140008336 | APPARATUS FOR DISCONNECTING SOLDER JOINTS BETWEEN TWO WELDED SURFACES - An apparatus for disconnecting solder joints between two welded surfaces includes a laser device for emitting laser beams to a solder joint, and a solder material removal device. And the solder material removal device includes a nozzle device having a first passage, a holder holding the nozzle device and having a second passage communicated with the first passage, and at least two pumping devices connected to the holder to pump the melted solder material out from the nozzle device and the holder. The laser device and the solder material removal device are separated, a glass cover with a hole formed thereon is covered on the top of the holder, and the laser device is located above the glass cover and separated from the holder. The present invention can shorten maintenance time and maintenance workload and improve work efficiency, furthermore reduce and stabilize the laser energy. | 01-09-2014 |
20130323534 | FERROELECTRIC CRYSTAL FILM, ELECTRONIC COMPONENT, MANUFACTURING METHOD OF FERROELECTRIC CRYSTAL FILM, AND MANUFACTURING APPARATUS THEREFOR - There is provided a manufacturing method of a ferroelectric crystal film in which an orientation of a seed crystal film is transferred preferably and a film deposition rate is suitable for volume production. | 12-05-2013 |
20130283601 | METHOD OF MANUFACTURING MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A RETURN PATH SECTION - A method of manufacturing a magnetic head includes the step of forming an accommodation part and the step of forming a return path section. The return path section lies between a main pole and a top surface of a substrate, and connects a shield and part of the main pole away from a medium facing surface to each other so that a space through which part of a coil passes is defined. The accommodation part accommodates at least part of the return path section. The step of forming the return path section forms first to third portions simultaneously. The first portion is located closer to the top surface of the substrate than is the space. The second portion is located closer to the medium facing surface than is the space. The third portion is located farther from the medium facing surface than is the space. | 10-31-2013 |
20130279860 | OPTOELECTRONIC ASSEMBLY AND ACTIVE OPTICAL CABLE USING SAME - An optoelectronic assembly includes a substrate subassembly and a cable subassembly. The substrate assembly includes a substrate, a holder disposed on the substrate, an optoelectronic interface IC, and a plurality of optoelectronic components. The cable subassembly includes a lens cover and a plurality of fiber cables bonded to the lens cover. The optoelectronic interface IC and the optoelectronic components are disposed in a cavity formed by side walls of the holder. The optoelectronic components include at least one laser source and a plurality of photodiodes. The lens cover is inserted into the cavity and thereby fixedly engaged with the holder. | 10-24-2013 |
20130279044 | THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF, MICRO-ACTUATOR, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME - A thin film piezoelectric element of the present invention includes a substrate and a piezoelectric thin film stack formed on the substrate. The piezoelectric thin film stack includes a top electrode layer, a bottom electrode layer and a piezoelectric layer sandwiched between the top electrode layer and the bottom electrode layer, wherein the piezoelectric layer includes a first piezoelectric layer and a second piezoelectric layer whose compositions have different phase structures. The present invention can obtain high piezoelectric constants, enhanced coercive field strength, thereby enabling larger applied field strength without depolarization and achieving a large stroke for its applied device. | 10-24-2013 |
20130279042 | THIN FILM PIEZOELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF, MICRO-ACTUATOR, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME - A thin film piezoelectric element of the present invention includes a substrate and a piezoelectric thin film stack formed on the substrate. The piezoelectric thin film stack includes a top electrode layer, a bottom electrode layer and a piezoelectric layer sandwiched between the top electrode layer and the bottom electrode layer, wherein the piezoelectric layer includes a first piezoelectric layer and a second piezoelectric layer whose compositions have different phase structures. The present invention can obtain high piezoelectric constants, enhanced coercive field strength and good thermal stability, thereby enabling larger applied field strength without depolarization and achieving a large stroke for its applied device. | 10-24-2013 |
20130270584 | OPTOELECTRONIC PACKAGE AND METHOD FOR MAKING SAME - An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided. | 10-17-2013 |
20130270232 | APPARATUS AND METHOD OF MANUFACTURING LAZER DIODE UNIT UTILIZING SUBMOUNT BAR - A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member. | 10-17-2013 |
20130258823 | LIGHT SOURCE CHIP AND A THERMALLY ASSISTED HEAD WITH THE SAME, AND MANUFACTURING METHODS THEREOF - A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off. | 10-03-2013 |
20130256277 | APPARATUS AND METHOD FOR FORMING ELECTRICAL SOLDER CONNECTIONS IN A DISK DRIVE UNIT - An apparatus for forming electrical solder connections in a disk drive unit includes: a nozzle device for carrying out soldering on two pre-welding surfaces; a solder ball feeding device for transferring a single solder ball to the nozzle device; a gas pump device for supplying pressurized gases to the nozzle device; a laser device for emitting laser beams to the solder ball,; and a control device including at least one sensor for at least detecting status of the solder ball or pressure in the nozzle device or distance between the nozzle device and the pre-welding surfaces, and a control unit connected with the at least one sensor. The present invention can easily control the solder ball, the pressurized gases and the laser beams, thereby keeping the pressure of the nozzle device and the laser energy stable and, in turn improving the soldering result. | 10-03-2013 |
20130250742 | THERMALLY-ASSISTED MAGNETIC RECORDING HEAD, HEAD GIMBALS ASSEMBLY, HEAD ARM ASSEMBLY, MAGNETIC DISK UNIT, AND LIGHT TRANSMISSION UNIT - The thermally-assisted magnetic recording head includes: a laser light source having an emission surface, the emission surface allowing laser light to be emitted therefrom; a waveguide having a core and a cladding, the core allowing the laser light emitted from the laser light source to propagate therethrough, and the cladding surrounding the core; a magnetic pole; and a plasmon generator. Each of the core and the cladding has an end surface facing the emission surface, and the end surface of the cladding suppresses returning of the laser light to the laser light source. | 09-26-2013 |
20130250455 | Measurement of Spacing Fluctuation by HDI Sensor - A method for determining the surface distortions of a disk in a spin-stand or single or multiple disk hard disk drive (HDD) utilizing a DFH type write head. A stepwise power curve is supplied to the DFH head, the head is flown over a chosen track on the disk, and the high frequency signal from a HDI sensor is analyzed in order to determine the step of an initial touchdown power and the step of a complete touchdown power as a function of individual sectors in a sector subdivision along a chosen track. The HDI sensor signal is averaged within each step of the power curve between these two steps and a Ratio variable, | 09-26-2013 |
20130250446 | Spacing Fluctuation Compensation - A method to compensate for spacing variations between a dynamic fly height (DFH) controlled read/write head and a rotating disk surface. Using a HDI sensor or equivalent indicator of touchdowns, a power profile is calculated for an arbitrary track on a disk. The profile tracks disk topography by recording touchdown power at each of a series of sectors into which the track is subdivided. The resulting power profile, smoothed and expressed as a function of sector position, substitutes for the usual constant TD power setting that provides only an uncompensated range of spacing variations. A fixed back-off spacing power is added to the power profile enabling the head to fly over the track at a constant spacing. The power profile can be calculated to account for various temperature and pressure conditions. | 09-26-2013 |
20130244485 | SERIAL ELECTRICAL CONNECTOR - A serial electrical connector includes a connector plug and a connector jack. The connector plug includes an audio plug with a hollow cylindrical space formed in the center thereof; a coaxial cable being inserted into and filling the space; and an engagement element being disposed at a tip of the audio plug and configured to electrically connect the audio plug to the connector jack. | 09-19-2013 |
20130241081 | COMBINATION FOR COMPOSITE LAYERED CHIP PACKAGE - A main package includes a plurality of stacked semiconductor chips and a plurality of first terminals associated with different ones of the semiconductor chips. An additional package includes an additional semiconductor chip and at least one second terminal electrically connected to the additional semiconductor chip. The additional semiconductor chip is to substitute for one of the plurality of semiconductor chips in the main package. The main package and the additional package are arranged in one of a plurality of relative positional relationships that is selected according to which one of the plurality of semiconductor chips in the main package is to be substituted with the additional semiconductor chip. | 09-19-2013 |
20130236188 | ACTIVE OPTICAL CABLE CONNECTOR PLUG AND ACTIVE OPTICAL CABLE USING SAME - An active optical cable connector plug includes: an electrical interface configured to connect to a first electronic device; an optical interface configured to connect to an optical cable, the optical cable being configured to connect to a second electronic device; an electrical-to-optical circuitry being connected with the electrical interface and the optical interface and configured to convert a received electrical signal to an optical signal; an optical-to-electrical circuitry being connected with the electrical interface and the optical interface and configured to convert a received optical signal to an electrical signal; a plug-in detection block being connected to the electrical interface and configured to detect the electrical properties of the first electronic device; a plug-in emulation block being connected to the electrical interface and configured to emulate the electrical properties of the second electronic device. | 09-12-2013 |
20130230278 | PLUGGABLE OPTICAL TRANSCEIVER - A pluggable optical transceiver includes: a top housing; a bottom housing; and an optical-electrical assembly enclosed by the top housing and the bottom housing. The optical-electrical assembly includes a substrate; at least a transmitting optoelectronic component disposed on the substrate; at least a receiving optoelectronic component disposed on the substrate; interface integrated circuits disposed on the substrate; a pluggable electrical interface disposed on the substrate and electrically connected with the interface integrated circuits; and a coupling optical system. | 09-05-2013 |
20130228366 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first conductive layer that includes a first transmission line portion and two soldering pads, a first insulating layer disposed under the first conductive layer, a fourth conductive layer disposed under the first insulating layer and including a second transmission line portion, two through-hole vias respectively disposed across the first insulating layer, and two capacitors respectively connecting the first transmission line portion and the two soldering pads. The two through-hole vias are directly connected with the two soldering pads and extending the connection to the second transmission line portion respectively. | 09-05-2013 |
20130219699 | MANUFACTURING METHOD OF A SLIDER AND MANUFACTURING APPARATUS THEREOF - A manufacturing method of a slider includes steps of: (a) providing a row bar with a plurality of slider elements connecting together; (b) lapping surfaces of the row bar so as to obtain a predetermined requirement; (c) lowering the temperature of the surfaces lapped in the step (b) before and/or during lapping; and (d) cutting the row bar into a plurality of sliders. The present invention can prevent a local high temperature generated on the magnetic head during lapping so that the performance of the magnetic head is improved. | 08-29-2013 |
20130219698 | METHOD OF MANUFACTURING THERMALLY-ASSISTED MAGNETIC RECORDING HEAD - A method of manufacturing a thermally-assisted magnetic recording head includes: providing a bar and a plurality of light source units, the bar including a plurality of thermally-assisted magnetic recording head sections arranged in a first direction, and each of the light source units including a substrate and a light source; and bonding a second surface of the substrate to the bar with an adhesive layer in between, where the plurality of light source units are so aligned to the respective thermally-assisted magnetic recording head sections on the bar, as to allow a first surface of the substrate, which supports the light source, to be parallel to the first direction, the bonding allowing the substrates of the light source units to be irradiated with a first laser beam and allowing the bar to be irradiated with a second laser beam, to thereby allow the adhesive layer to be melted. | 08-29-2013 |
20130212871 | MANUFACTURING METHOD OF A SLIDER AND MANUFACTURING APPARATUS THEREOF - A manufacturing method of a slider includes steps of (a) providing a row bar with a plurality of slider elements connecting together, the row bar having an air bearing surface, a back surface opposite the air bearing surface, a bonding surface and a bottom surface opposite the bonding surface; (b) grinding the bottom surface of the row bar; (c) lapping the air bearing surface of the row bar so as to obtain a predetermined requirement, and applying a first magnetic field with a first direction during lapping the air bearing surface, and the first direction being parallel to the air bearing surface and the bonding surface; and (d) cutting the row bar into a plurality of individual sliders. The present invention can maintain a good performance of a magnetic head during the manufacturing process. | 08-22-2013 |
20130204590 | SPECTRAL SIMULATION METHOD DURING NOISE TESTING FOR A MAGNETIC HEAD, AND NOISE-TESTING METHOD FOR A MAGNETIC HEAD BY USING THE SAME - A spectral simulation method during a noise testing for a magnetic head, includes steps of (a1) detecting several first noise profiles for several magnetic head samples under a first frequency bandwidth range by a dynamic testing machine; (b1) separating each first noise profile into at least two noise curves including a first noise curve and a second noise curve at a predetermined frequency bandwidth, wherein the first noise curve has a frequency bandwidth range lower than that of the second noise curve; (c1) fitting several mathematical equations according to the second noise curves; and (d1) establishing a correlative equation among the mathematical equations, so as to simulate the second noise curve for each magnetic head. The present invention can simulate a second noise curve of the noise profile in a higher frequency bandwidth and establishing the correlative equation according to the second noise curve. | 08-08-2013 |
20130176644 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, a thin-film coil and a shield magnetic layer are laminated on a substrate. The thin-film magnetic head has a shield magnetic layer. This thin-film magnetic head has a hard guard frame layer surrounding an equidistant coil part, disposed at a position equidistant from the substrate, from outside and being in direct contact with almost a whole outside surface defining an outer shape of the equidistant coil part. | 07-11-2013 |
20130170073 | ANTI-SHOCK METHOD FOR HEAD STACK ASSEMBLY - The present invention directs an anti-shock method for head stack assembly which carries a slider for flying on a disk for operation, and the anti-shock method includes: inputting a constant current to a head disk interface sensor which is deposited in the slider; obtaining a changing voltage of the head disk interface sensor, which is changed with the temperature of the head disk interface sensor as the slider is shocked; outputting the changing voltage to a controller with a threshold set therein; if the changing voltage is bigger than the threshold for a specified number of times, the controller is triggered to control the head stack assembly to stop operating and load on a ramp beside the disk; while if the changing voltage is small than the threshold for said specified number of times, the controller is not be triggered and the head stack assembly still operates. | 07-04-2013 |
20130169386 | ATTENUATOR - An attenuator includes: a first portion including a first insulating substrate and a resistor section formed on the first insulating substrate; and a second portion including a second insulating substrate and a terminal section, the second insulating substrate being separated from the first insulating substrate, and the terminal section being formed on the second insulating substrate to be connected to the resistor section. | 07-04-2013 |
20130139378 | METHOD OF MANUFACTURING THERMALLY-ASSISTED MAGNETIC RECORDING HEAD AND ALIGNMENT APPARATUS - A method of manufacturing a thermally-assisted magnetic recording head includes: providing a light source unit including a light source; providing a substrate having a thermally-assisted magnetic recording head section thereon, the thermally-assisted magnetic recording head section including a magnetic pole, a plasmon generator, and an optical waveguide; inserting a metal between the light source unit and the substrate, and thus allowing the metal to be melted; and performing alignment between the light source unit and the thermally-assisted magnetic recording head section under application of pressure in a direction that allows the light source unit and the substrate to approach each other, while maintaining the metal melted. | 06-06-2013 |
20130136885 | LIGHT SOURCE CHIP AND A THERMALLY ASSISTED HEAD WITH THE SAME, AND MANUFACTURING METHODS THEREOF - A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. | 05-30-2013 |
20130121648 | ACTIVE OPTICAL CONNECTOR USING AUDIO PORT - An active optical connector using an audio port includes a plug insertable into a jack having an optical transceiver module. A conductor is mounted on the plug. Optical fibers extend through a central bore of the plug and have front ends held in a fiber ferrule. The jack has a terminal for contacting the conductor on the plug. The optical transceiver module has a receptacle for receiving the fiber ferrule. A light source emits light to an optical fiber, and a photo-detector receives light from another optical fiber. A controller chip has a converting circuit configured to convert electrical signals into optical signal and optical signals into electrical signals. | 05-16-2013 |
20130114387 | MEASURING METHOD OF A MAGNETIC HEAD AND MEASURING APPARATUS THEREOF - Measuring method of a magnetic head includes (a) placing the magnetic head at normal position, defining a first direction parallel to an air bearing surface and two shielding layers of the magnetic head, and defining a second direction perpendicular to the first direction; (b) tilting the magnetic head at an angle to the second direction, applying a plurality of first magnetic fields with different intensities in the first direction, and measuring out a first output parameter curve; (c) repeating the step (b) with different angles and measuring out a plurality of first output parameter curves; (d) calculating a plurality of pinned direction tilt ratios that a pinned direction of a pinned layer of the magnetic head tilts towards the second direction according to the parameter curves; and (e) calculating a pinned direction tilt angle that the pinned direction tilts towards the second direction according to the pinned direction tilting ratios. | 05-09-2013 |
20130100555 | METHOD OF MANUFACTURING THE THIN-FILM MAGNETIC HEAD, THE THIN-FILM MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a lower shield layer, an upper shield layer and a thin-film coil are laminated on a substrate. A method of manufacturing the thin-film magnetic head has a lower shield layer forming step. This step comprises a step of forming a first lower shield part in a lower shield planned area, including a planned line along the medium-opposing surface, a step of forming a partial lower seed layer having a partial arrangement structure in which the partial lower seed layer is arranged on a lower formation zone except a lower exception zone including the planned line, a step of forming a second lower shield part on the partial lower seed layer. | 04-25-2013 |
20130094104 | Head DFH protrusion shape calibration by HDI sensor - Dynamic fly height (DFH) controlled read/write heads using multiple heaters have their heater powers set within a range of ratios that allows minimum clearances to be set between the read-gap and the write-gap and the surface of a disk, thereby providing improved touch-down detection. Determining the correct range of power ratios requires varying the ratio to create an adjustable protrusion profile for the read and write elements in the head and measuring values of the ratio and corresponding values of read gap and write gap clearances that create points of minimum clearance. By adjusting the ratio of power supplied to the heaters, different protrusion profiles can be produced, clearance control for sigma reduction can be obtained and read/write readiness and operation consistency and reliability can be improved. | 04-18-2013 |
20130091695 | METHOD OF MANUFACTURING A THERMALLY-ASSISTED MAGNETIC RECORDING HEAD THAT SUPPRESSES PROTRUSION OF A PLASMON GENERATOR - A method of manufacturing a thermally-assisted magnetic recording head includes the steps of: forming a preliminary head section that has a surface to be polished and includes a magnetic pole, a waveguide, and a preliminary plasmon generator; causing a volumetric expansion of the preliminary plasmon generator with heat by introducing light into the core of the waveguide of the preliminary head section; and polishing the surface to be polished of the preliminary head section into a medium facing surface. The preliminary plasmon generator has an end face located in the surface to be polished. In the step of polishing the surface to be polished, the surface to be polished is subjected to polishing with the preliminary plasmon generator expanded in volume, whereby the end face of the preliminary plasmon generator is polished into the front end face, and the preliminary plasmon generator thereby becomes the plasmon generator. | 04-18-2013 |
20130075935 | COMPOSITE LAYERED CHIP PACKAGE - A composite layered chip package includes first and second subpackages that are stacked. Each subpackage includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface; first terminals disposed on the top surface of the main part; and second terminals disposed on the bottom surface of the main part. The first and second terminals are electrically connected to the wiring. The first and second subpackages are arranged in a specific relative positional relationship, different from a reference relative positional relationship, with each other. | 03-28-2013 |
20130070369 | SUSPENSION HAVING BONDING PADS WITH SOLDER LAYERS, MANUFACTURING METHOD OF A SUSPENSION, AND CONNECTING METHOD BETWEEN A SUSPENSION AND A SLIDER - A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider. | 03-21-2013 |
20130070364 | THIN FILM MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF - A thin film magnetic head of the present invention is configured to include a main pole layer; a main pole direct junction magnetic layer that has an auxiliary pole layer and an auxiliary yoke layer, the main pole direct junction magnetic layer being directly joined to the main pole layer in a state where a recording gap layer is partially intervened near an air bearing surface (ABS) with respect to the main pole layer; and a first magnetic recording exciting coil that is buried between the auxiliary pole layer and the auxiliary yoke layer configuring the main magnetic direct junction magnetic layer with an insulating layer therebetween. Thereby, an effective magnetic path length can be shortened in order to improve the high-frequency characteristics, and furthermore, simplification of the manufacturing processes becomes possible. | 03-21-2013 |
20130057987 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head has a leading shield part opposing the main magnetic pole layer on the substrate side of the main magnetic pole layer. The thin-film magnetic head has a substrate side coil layer disposed between the main magnetic pole layer and the substrate. In the thin-film magnetic head, a space between a lower end face of the leading shield part and the substrate and a space between an upper end face in the substrate side coil layer and the substrate are formed equal to each other. | 03-07-2013 |
20130050877 | SLIDER, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME - A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit. | 02-28-2013 |
20130038966 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDINGHAVING A MAIN POLE, A SHIELD AND A COIL CORE PART SETBACK AWAY FROM THE MEDIUM FACING SURFACE A SPECIFIED DISTANCE - A magnetic head includes: a main pole; a coil; a first shield having an end face that is located in a medium facing surface at a position forward of an end face of the main pole along a direction of travel of a recording medium; and a first return path section disposed forward of the main pole along the direction of travel of the recording medium. The first return path section connects part of the main pole away from the medium facing surface to the first shield so that a first space is defined. The coil includes a first portion having a planar spiral shape and wound around a core part of the first return path section. The first portion includes first and second coil elements that each extend through the first space. No part of the coil other than the first and second coil elements exists in the first space. | 02-14-2013 |
20130033785 | SUSPENSION, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME - A suspension for a head gimbal assembly includes a flexure having a laminated structure including a substrate layer, an insulating layer formed on the substrate layer, and a conducting layer formed on the insulating layer. And first bonding pads are formed on the conducting layer at a first surface of the flexure, so as to electrically connect with a slider via solder balls, and second bonding pads are formed on the substrate layer at a second surface of the flexure opposite to the first surface, so as to electrically connect with extra components formed at the second surface via solder balls. The suspension can connect slider and other extra components at two opposite surfaces of the flexure with a simplified and compacted structure and a reduced cost. | 02-07-2013 |
20130020723 | COMPOSITE LAYERED CHIP PACKAGE - A composite layered chip package includes a plurality of subpackages stacked on each other. Each subpackage includes a main body and wiring. The main body includes a main part including a plurality of layer portions, and further includes first terminals and second terminals that are disposed on top and bottom surfaces of the main part, respectively. The wiring is electrically connected to the first and second terminals. The number of the plurality of layer portions included in the main part is the same for all the plurality of subpackages, and the plurality of layer portions in every subpackage include at least one first-type layer portion. In each of at least two of the subpackages, the plurality of layer portions further include at least one second-type layer portion. The first-type layer portion includes a semiconductor chip connected to the wiring, whereas the second-type layer portion includes a semiconductor chip not connected to the wiring. | 01-24-2013 |
20130012052 | PLUGGABLE MODULE FOR ENGAGING WITH A CAGE MOUNTED ON A PRINTED CIRCUIT BOARD - A pluggable module includes a base, a cover assembled with the base to form a housing and a latching mechanism at least partially disposed within the housing. The latching mechanism includes an actuating portion and a single sliding portion which is connected with the actuating portion and disposed within the housing, the single sliding portion including a flat board and two sliding legs respectively extending from two opposite sides of the flat board, each sliding leg having a latching protrusion formed thereon and exposed outside the housing for latching with and detaching from the cage. The present invention uses a single sliding portion to replace two sliding arms thereby simplifying the manufacturing and assembling process, in turn, reducing the manufacturing and assembling cost. | 01-10-2013 |
20130009046 | Side Mounting Optical Navigation Module - An optical navigation module for receiving control from an object disposed on an operation plane is provided. The optical navigation module includes a substrate defining a base plane that is perpendicular to the operation plane; a light source installed on the base plane of the substrate and configured to emit light to a side of the substrate; an optical structure installed at the side of the substrate; a light sensor installed on the base plane of the substrate; a light shield installed on the base plane of the substrate spatially separating the light source and the light sensor so that light emitted by the light source is not directly shed on the light sensor, the light shield having an aperture formed thereon; and a tactile switch for executing a command installed at a side of the light source that is opposite to the side facing the operation plane. The optical structure is configured to guide the light emitted from the light source to the object so that at least a portion of the light scattered by the object passes to the light sensor through the aperture on the light shield and forms a light intensity pattern on the light sensor. | 01-10-2013 |
20130008022 | ELECTRICAL CURRENT SENSOR DEVICE - An electrical current sensor device includes a first printed circuit board assembly, a second printed circuit board assembly positioned opposite to the first printed circuit board assembly, and a holder holding the first and second printed circuit board assemblies and providing a passage to allow an electrical conductor to pass through. The first printed circuit board assembly includes a first sensing circuit having a first element pair that includes two magnetoresistive elements with a first pinning direction, the second printed circuit board assembly comprises a second sensing circuit with a second element pair that includes having two magnetoresistive elements with a second pinning direction that is opposite to the first pinning direction, and the first and second pinning directions are perpendicular to a current direction of a current passing through the electrical conductor, the first sensing circuit electrically connects with the second sensing circuit to form a Wheatstone bridge circuit. | 01-10-2013 |
20120314323 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDINGHAVING A MAIN POLE AND A SHIELD AND SPECIFICALLY STRUCTURED AND LOCATED COIL ELEMENTS AND MAGNETIC COUPLING LAYERS - A magnetic head includes a coil, a main pole, a gap part, a write shield, and a return path section. The return path section includes a yoke part and first and second coupling layers. The first coupling layer is connected to the write shield. The second coupling layer magnetically couples the first coupling layer to the yoke part, and has an end face facing toward a medium facing surface and located away from the medium facing surface. The coil includes a first coil element and a plurality of second coil elements that each extend to pass through a space defined by the main pole, the gap part, the write shield, and the return path section. The first coil element is disposed with the first coupling layer interposed between the medium facing surface and the first coil element. The second coil elements are disposed with the second coupling layer interposed between the medium facing surface and the second coil elements, and with the first coil element interposed between the main pole and the second coil elements. The second coil elements are aligned perpendicularly to the medium facing surface. | 12-13-2012 |
20120313259 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body has a main part. The main part has a top surface and a bottom surface and includes a plurality of layer portions that are stacked. The wiring includes a plurality of lines passing through all the plurality of layer portions. Each layer portion includes a semiconductor chip and a plurality of electrodes. The semiconductor chip has a first surface, and a second surface opposite thereto. The plurality of electrodes are disposed on a side of the first surface of the semiconductor chip. The plurality of layer portions include two or more pairs of first and second layer portions in each of which the first and second layer portions are arranged so that the first or second surfaces of the respective semiconductor chips face each other. The plurality of electrodes include a plurality of first connection parts and a plurality of second connection parts. In the first layer portion, the plurality of first connection parts are in contact with the plurality of lines. In the second layer portion, the plurality of second connection parts are in contact with the plurality of lines. | 12-13-2012 |
20120306487 | ELECTRICAL CURRENT SENSING CIRCUIT, PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRICAL CURRENT SENSOR DEVICE WITH THE SAME - An electrical current sensing circuit of the present invention comprises a Wheatstone bridge circuit having at least four magnetoresistive elements connecting and a pair of output terminals, the magnetoresistive elements adapted for sensing an external magnetic field with a first direction generated by a carrying-current electrical conductor, and outputting a differential signal; and a negative feedback circuit connecting with the output terminals, actuated by the differential signal and generated a magnetic field with a second direction that is opposite to the first direction, thereby decreasing the impact of the temperature drift to the magnetoresistive element character. The present invention can eliminate the temperature drift under a changing environment and, in turn obtain an accurate output voltage. | 12-06-2012 |
20120300345 | VOICE COIL MOTOR AND DISK DRIVE UNIT WITH THE SAME - A voice coil motor for a disk drive unit includes an external magnet and an actuator coil movably located above the external magnet. The external magnet has a main body with a magnetic north pole, a magnetic south pole and a transition surface therebetween, and further has a protrusion extending from the center part of the main body for increasing torque force, thereby improving the performance of the voice coil motor. The invention also discloses a disk drive unit including the same. | 11-29-2012 |
20120287534 | Reader sensor, magnetic head, head gimbal assembly and disk drive unit with the same - A reader sensor comprises a first shielding layer, a second shielding layer, a read element formed therebetween, and a pair of permanent magnet layer respectively placed on two sides of the read element; and it further comprises a magnetic field generating means formed beside the read element and arranged for providing a magnetic field with a direction perpendicular to the first shielding layer and the second shielding layer, thereby stabilizing the reading performance of the reader sensor. The invention can stabilize the reading performance, ameliorate the unstable defective reader sensor, and decrease the waste and the manufacturing cost. The present invention also discloses a magnetic head, a HGA and a disk drive unit. | 11-15-2012 |
20120287529 | Close loop method for measuring head SNR and media SNR - A close loop method for measuring head SNR, for a storage device comprising a storage media and a head, comprising steps of: (a) loading the head on the media with a dynamic fly height; (b) measuring an initial environmental temperature value Ti and measuring the head signal signal | 11-15-2012 |
20120282492 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head includes a return magnetic pole layer and a connecting magnetic layer. The return magnetic pole layer is formed at a position distanced from the medium-opposing surface on the side opposite to the write shield layer with the main magnetic pole layer intervening therebetween. The connecting magnetic layer is formed using a magnetic material so as to connect the return magnetic pole layer to the write shield layer on the side closer to the medium-opposing surface than is the thin-film coil. The thin-film coil is wound as a flat spiral around the write shield layer. A part of the thin-film coil wound as the flat spiral is disposed only at a position distanced from the substrate than is the main magnetic pole layer. | 11-08-2012 |
20120275047 | Method of testing anti-high temperature performance of a magnetic head and apparatus thereof - A method of testing anti-high temperature performance of a magnetic head comprises applying a plurality of second magnetic fields with different intensities in a second direction to the magnetic head, and measuring a second output parameter curve, and judging whether a variation that is beyond an allowable value is presented on the second output parameter curve, therein the second direction passes through the ABS and at an angle whose absolute value is an acute angle to the ABS. The present invention can screen out defective magnetic heads that possess poor anti-high temperature performance without heating the magnetic head. | 11-01-2012 |
20120274317 | Method of testing anti-high temperature performance of a magnetic head and apparatus thereof - A method of testing anti-high temperature performance of a magnetic head comprises applying a second magnetic field with different intensities in a second direction and the changing first magnetic fields in a first direction, and measuring a plurality of second output parameter curves; and judging whether a variation that is beyond an allowable value is presented on the second output parameter curves, thereby screening out a defective magnetic head, therein the first direction is perpendicular to the air bearing surface of the magnetic head, and the second direction is perpendicular to the shielding layers of the magnetic head. The present invention can screen out defective magnetic heads that possess poor anti-high temperature performance without heating the magnetic head and with high precision. | 11-01-2012 |
20120262825 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The write shield layer has an opposing shield part opposing the main magnetic pole layer and a front shield part. The front shield part is connected to the opposing shield part without straddling the thin-film coil. Besides, the front shield part has a shield front end face disposed in the medium-opposing surface and a shield upper end face formed distanced from the medium-opposing surface. Further, the front shield part has a shield connecting part. The shield front end face is connected to the shield upper end face by the shield connecting part. | 10-18-2012 |
20120257304 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND A SHIELD - A magnetic head includes a coil, a main pole, a write shield, and first and second yoke layers. The first and second yoke layers are magnetically connected to the write shield and aligned along the direction of travel of a recording medium such that the main pole is interposed therebetween. The coil includes a winding portion of planar spiral shape that is formed in one or more layers. The magnetic head further includes: a first coupling part located away from the medium facing surface and magnetically coupling the main pole and the second yoke layer to each other; and a second coupling part located away from the medium facing surface and magnetically coupling the first yoke layer and the second yoke layer to each other without touching the main pole. The winding portion is wound around the first coupling part, and a part of the winding portion passes between the first and second coupling parts. | 10-11-2012 |
20120256321 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body includes a main part including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part. The wiring includes a plurality of lines electrically connected to the plurality of terminals. The plurality of lines include a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes: a plurality of common electrodes electrically connected to the plurality of common lines; a plurality of non-contact electrodes that are electrically connected to the layer-dependent lines and are not in contact with the semiconductor chip in the layer portion; and a selective connection electrode selectively electrically connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The layer-dependent lines are greater than the common lines in maximum width. | 10-11-2012 |
20120249130 | Method for measuring longitudinal bias magnetic field in a tunnel magnetoresistive sensor - A method for measuring longitudinal bias magnetic field in a tunnel magnetoresistive sensor of a magnetic head, the method includes the steps of: applying an external longitudinal time-changing magnetic field onto the tunnel magnetoresistive sensor; determining a shield saturation value of the tunnel magnetoresistive sensor under the application of the external longitudinal time-changing magnetic field; applying an external transverse time-changing magnetic field and an external longitudinal DC magnetic field onto the tunnel magnetoresistive sensor; determining a plurality of different output amplitudes under the application of the external transverse time-changing magnetic field and the application of different field strength values of the external longitudinal DC magnetic field; plotting a graph according to the different output amplitudes and the different field strength values; and determining the strength of the longitudinal bias magnetic field according to the graph and the shield saturation value. | 10-04-2012 |
20120248077 | Soldering device for forming electrical solder connections in a disk drive unit - A soldering device for forming electrical solder connections in a disk drive unit comprises a nozzle device comprising at least two separated movable housings that provides a passage, the upper ends of the housings form an entrance, and the lower ends of the housings form a nozzle; and an actuating device connecting with the nozzle device and arranged for controlling the housings of the nozzle device to move together or apart, thereby controlling the inner diameter size of the nozzle. The present invention provides movable housings of the nozzle device so as to make the size of the nozzle controllable, finally benefits to perform a solder connection. | 10-04-2012 |
20120229932 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING - A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface and a lower yoke layer. A first magnetic layer for flux concentration is connected to the lower yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the lower yoke layer. The lower yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer. | 09-13-2012 |
20120222885 | Transparent conductive film for optoelectronic device - A transparent conductive (TC) film includes a main transparent conductive layer and a plurality of conductors electrically contacting with the main transparent conductive layer. The conductors are disposed on the surface of the main transparent conductive layer separately from each other. The transparent conductive film of the present invention has numerous separate conductors to collect electrical current which flow in the TC film, thereby reducing the internal resistance of the TC film while keeping the light transmission unchanged. Furthermore, the new conductor layout reduces the risk of the TC film from high current density damages, thereby achieving better reliability. | 09-06-2012 |
20120218663 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A SENSOR FOR DETECTING CONTACT WITH A RECORDING MEDIUM - A magnetic head includes a main pole, a write shield, a return path section, a heater that generates heat for making part of a medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with a recording medium. The return path section includes: a yoke layer located backward of the main pole along the direction of travel of the recording medium; a first coupling part coupling the yoke layer and the write shield to each other; and a second coupling part located away from the medium facing surface and coupling the yoke layer and the main pole to each other. The first coupling part has an end face facing toward the yoke layer. This end face includes a middle portion spaced from the yoke layer and facing the yoke layer, and two side portions located on opposite sides of the middle portion in a track width direction and in contact with the yoke layer. The sensor is located between the middle portion and the yoke layer. | 08-30-2012 |
20120218662 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING THAT INCLUDES A SENSOR FOR DETECTING CONTACT WITH A RECORDING MEDIUM - A magnetic head for perpendicular magnetic recording includes a read head unit, a write head unit disposed forward of the read head unit along the direction of travel of a recording medium, a heater that generates heat for causing the medium facing surface to protrude in part, an expansion layer that makes part of the medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with the recording medium. The write head unit includes a main pole, a write shield, and a return path section. The return path section includes a yoke layer located backward of the main pole along the direction of travel of the recording medium, a first coupling part that couples the yoke layer and the write shield to each other, and a second coupling part that is located away from the medium facing surface and couples the yoke layer and the main pole to each other. | 08-30-2012 |
20120188666 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND A SHIELD - A magnetic head includes: a main pole; a coil; a first shield with an end face located in a medium facing surface at a position forward of an end face of the main pole along a direction of travel of a recording medium; a gap part including a portion located between the main pole and the first shield; and a first return path section disposed forward of the main pole along the direction of travel of the recording medium. The first return path section connects the first shield and the main pole to each other so that a first space is defined by the main pole, the gap part, the first shield, and the first return path section. The coil includes a plurality of first coil elements extending to pass through the first space and aligned in a row in the direction of travel of the recording medium. | 07-26-2012 |
20120187575 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A layered chip package includes a main body and wiring. The main body includes a main part including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part. The wiring includes a plurality of lines electrically connected to the plurality of terminals. The plurality of lines include a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes a plurality of common electrodes electrically connected to the plurality of common lines, and a selective connection electrode selectively electrically connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The selective connection electrode varies in shape depending on which of the layer-dependent lines it is electrically connected to. | 07-26-2012 |
20120187574 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller plate. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller plate. A plurality of opposing wiring electrodes are formed at an opposing surface of the controller plate. A plurality of outside wiring electrodes are formed on the rear side of the opposing surface. Connection electrodes connecting the opposing wiring electrodes and the outside wiring electrodes are formed on the side surface of the controller plate. The interposed chip has a plurality of interposed wiring electrodes. The plurality of interposed wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of the plurality of opposing wiring electrodes. The controller plate is laid on the interposed chip. | 07-26-2012 |
20120187080 | Processing method of row bar for manufacturing slider and bar mask for row bar processing - A method of row bar for manufacturing slider includes steps: providing a plurality of row bars arranged in rows, with each row bar having slider regions and bar grooves adjacent to the slider region; providing photoresist on the row bar; providing a bar mask, having slider cover and groove cover which is transparent, the slider cover having two extending portions and a ABS portion arranged therebetween with some transparent patterns formed thereon; arranging the ABS portion on the slider region of the third said row bar, with two extending portion being covered respectively on the slider region of the second row bar and the fourth row bar, then exposing the bar mask to the light, the bar groove being exposed to the light via the groove cover; carrying out the above step until the ABS portions are arranged on the last row bar; developing and etching the row bars. | 07-26-2012 |
20120186091 | GEOMAGNETIC SENSOR DEVICE AND DIGITAL COMPASS WITH THE SAME - A geomagnetic sensor device comprises a first geomagnetic sensor comprising a first Wheatstone bridge circuit and a second Wheatstone bridge circuit which are arranged in the same horizontal coordinate system, and a second geomagnetic sensor comprising a third Wheatstone bridge circuit and a fourth Wheatstone bridge circuit which are arranged in the same vertical coordinate system. Each of the Wheatstone bridge circuits comprises at least four magnetoresistive elements connecting and having power input terminals and signal output terminals. The present invention can obtains a stable and high output signal and achieves high measurement accuracy for the geomagnetic azimuth angle. The present invention also discloses a digital compass. | 07-26-2012 |
20120170156 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A MAIN POLE AND TWO SHIELDS - A magnetic head includes: a coil; a main pole; a first shield disposed backward of the main pole along a direction of travel of a recording medium; a first return path section connecting the first shield to the main pole; a second shield disposed forward of the main pole along the direction of travel of the recording medium; and a second return path section connecting the second shield to the main pole. An interface between the first return path section and the main pole has an end closest to a medium facing surface, and an interface between the second return path section and the main pole has an end closest to the medium facing surface, the latter being closer to the medium facing surface than the former. The second return path section includes a yoke layer located away from the medium facing surface and in contact with the main pole. The coil includes at least one coil element that passes between the second shield and the yoke layer. | 07-05-2012 |
20120170154 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film coil has a coil-layer. The coil-layer has a turn part arranged closer to an ABS than is a rear end part of the main magnetic pole layer farthest from the ABS. Regarding a substrate side coil-layer, arranged between the main magnetic pole layer and the substrate, of the coil-layer, a thickness of a non-corresponding magnetic pole part other than a magnetic pole corresponding part corresponding to an arrangement space of the main magnetic pole layer is larger than a thickness of the magnetic pole corresponding part. | 07-05-2012 |
20120170150 | Suspension with supporting pieces, head gimbal assembly and disk drive unit with the same - A suspension for a HGA comprises a flexure having a suspension tongue arranged for supporting a slider, which comprising a stainless steel layer and a dielectric layer formed thereon. The dielectric layer has a top surface and bottom surface, a plurality of bonding pads are formed on the top surface at a leading portion of the suspension tongue and arranged for connecting with the slider, and at least two separate supporting pieces are formed on the bottom surface and located at a corresponding position with the bonding pads, thereby releasing stress generated on the bonding pads. The invention also discloses a HGA and a disk drive unit with the same. The invention can release the stress generated on the bonding pads of the suspension, reduce the temperature impact to the suspension, and in turn, reduce thermal crown change of the slider, thereby improving the reading and writing performance. | 07-05-2012 |
20120158349 | Method for measuring the temperature rise induced by bias current/bias voltage in a magnetic tunnel junction - A method for measuring the temperature rise induced by bias current/bias voltage in a magnetic tunnel junction, the method includes the steps of: (a) applying an external time-changing magnetic field to the magnetic tunnel junction; (b) measuring different first outer pin flip field values under different temperature values; (c) calculating the correlation between the temperature and the outer pin flip field according to the temperature values and the first outer pin flip field values; (d) measuring different second outer pin flip field values under different bias current/bias voltage values; (e) calculating the correlation between the bias current/bias voltage and the outer pin flip field according to the bias current/bias voltage values and the second outer pin flip field values; (f) calculating the correlation between the temperature and the bias current/bias voltage according to the results produced by the steps (c) and (e). The method of the present invention can obtain the correlation between the temperature and the bias current/bias voltage, thereby determining what kind of TMR reader design providing more stable and reliable reading performance especially under higher operational temperature. | 06-21-2012 |
20120148190 | Optical module and optical transmission device using the same - There is provided an optical waveguide device including a light-emitting element having a light-emitting part for emitting a laser beam and a light-receiving element having a light-receiving part for receiving a laser beam, the elements being arranged on a mounting substrate in parallel with each other; and a first lens for optically coupling the laser beam emitted from the light-emitting part to a first optical waveguide core and a second lens for optically coupling the laser beam conducted through a second optical waveguide core to the light-receiving part, the lenses being arranged in parallel with each other, and in the optical waveguide device. The light-emitting element is a surface light-emitting semiconductor laser having a transparent semiconductor substrate laminated with an active layer as the light-emitting part, the surface light-emitting semiconductor laser emitting the laser beam from the active layer through the transparent semiconductor substrate. In the case where the surface light-emitting semiconductor laser and the light-receiving element are placed on a flat surface, when the active layer and the light-receiving part differ from each other in height with respect the flat surface, the optical waveguide device is configured so that the active layer is located at a focus position of the first lens and the light-receiving part is located at a focus position of the second lens. | 06-14-2012 |
20120147914 | Optical module - There are provided an optical module including a semiconductor laser including a P-side electrode and an N-side electrode, and a semiconductor laser driver circuit that drives the semiconductor laser so as to output an optical signal from the semiconductor laser according to a pattern of a differentially transmitted digital electric signal, and the semiconductor laser driver circuit includes a positive-side terminal and a negative-side terminal for differentially transmitted non-inverted data, and a positive-side terminal and a negative-side terminal for differentially transmitted inverted data, and one terminal for the non-inverted data is electrically connected to one electrode of the semiconductor laser, and the other terminal for the non-inverted data, one terminal for the inverted data and the other terminal for the inverted data each are connected to the other electrode of the semiconductor laser. | 06-14-2012 |
20120147501 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING WITH SHIELD AROUND MAIN POLE - A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section includes a yoke layer, and first and second coupling layers that magnetically couple the bottom shield and the yoke layer to each other. The first coupling layer is magnetically connected to the bottom shield. The second coupling layer magnetically couples the first coupling layer to the yoke layer. No end faces of the second coupling layer are exposed in the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other. | 06-14-2012 |
20120147500 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING HAVING A TAPERED MAIN POLE - A bottom end of a main pole includes first, second, and third portions that are contiguously arranged in order of increasing distance from the medium facing surface. A top surface of the main pole includes fourth, fifth, and sixth portions that are contiguously arranged in order of increasing distance from the medium facing surface. A distance from the top surface of the substrate to any given point on each of the first and second portions decreases with increasing distance from the given point to the medium facing surface. The second portion has an angle of inclination greater than that of the first portion with respect to a direction perpendicular to the medium facing surface. A distance from the top surface of the substrate to any given point on each of the fourth and fifth portions increases with increasing distance from the given point to the medium facing surface. The fifth portion has an angle of inclination greater than that of the fourth portion with respect to the direction perpendicular to the medium facing surface. | 06-14-2012 |
20120147499 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING WITH SHIELD AROUND MAIN POLE - A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section is magnetically connected to the bottom shield and is greater than the bottom shield in length in a direction perpendicular to the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other. The coil includes a first portion that passes through a space defined by the main pole and the first return path section, and a second portion that passes through a space defined by the main pole and the second return path section. | 06-14-2012 |
20120142146 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of stacked layer portions. A method of manufacturing the layered chip package includes the step of fabricating a layered substructure and the step of cutting the layered substructure. The layered substructure includes: a plurality of arrayed pre-separation main bodies; a plurality of accommodation parts disposed between two adjacent pre-separation main bodies; and a plurality of preliminary wires accommodated in the accommodation parts. The accommodation parts are formed in a photosensitive resin layer by photolithography. In the step of cutting the layered substructure, the plurality of pre-separation main bodies are separated from each other, and the wires are formed by the preliminary wires. | 06-07-2012 |
20120139419 | OPTICAL TRANSMISSION MODULE AND ITS TEMPERATURE ADJUSTMENT METHOD - An optical transmission module includes a light source element for emitting a predetermined light signal transmitted through an optical fiber, the light source element having lower characteristics in a low-temperature state than those in a high-temperature state, a driver circuit for driving the light source element, and a heat transfer member connected to each of the light source element and the driver circuit to transfer heat between the light source element and the driver circuit. The optical transmission module with such configuration can stably operate in a wide temperature range while achieving power saving and cost reduction. | 06-07-2012 |
20120126427 | MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip. | 05-24-2012 |
20120099227 | Magnetoresistive Sensor, magnetic head, head gimbal assembly and disk drive unit with the same - A MR sensor comprises a first shielding layer, a second shielding layer, a MR element and a pair of hard magnet layers sandwiched therebetween, and a non-magnetic insulating layer formed at a side of the MR element far from an air bearing surface of a slider. The MR sensor further comprises a first non-magnetic conducting layer formed between the first shielding layer and the MR element, and the first non-magnetic conducting layer is embedded in the first shielding layer and kept separate from the ABS. The MR sensor of the invention can obtain a narrower read gap to increase the resolution power and improve the reading performance, and obtain a strong longitudinal bias field to stabilize the MR sensor so as to increase the total sensor area and, in turn, get an improved reliability and performance. The present invention also discloses a magnetic head, a HGA and a disk drive unit. | 04-26-2012 |
20120099221 | Head stack assembly and hard disk drive with the same - An HSA comprises at least an HGA, a controlling circuit for controlling the HGA, and an actuator coil assembly comprising at least one top surface for mounting the HGA and a side surface for mounting the controlling circuit. The HGA has a first connection region parallel to the top surface, the first connection region has multiple first terminal pads formed thereon; the controlling circuit has a second connection region with multiple second terminal pads formed thereon, the second terminal pads are arranged in at least one row which is parallel to the top surface and the side surface, the first terminal pads are bonding to the corresponding second terminal pads to implement an electrical connection. The HSA has a compact structure as so to save space, and the connection way of the HGA and the controlling circuit is simple and solid. | 04-26-2012 |
20120098484 | Wireless charging system, battery with wireless charging function and electronic devices with the same - A battery adapted to a wireless charging system which comprises a coil, a PCB, a core, a shield and a case. The coil is configured to induce the magnetic power transmitted from the transmitter of the wireless charging system to generate inductive current. The PCB is electrically connected the coil to transform the inductive current of the coil into electrical power. The core is electrically connected the PCB to store the electrical power. The shield is sandwiched between the coil and the core to protect the core from magnetic power of the transmitter and enhance inductance of the coil; and the case is configured to enclose the coil, the PCB, the core, and the shield therein. The invention also discloses a wireless charging system with such a battery, a electronic device with wireless charging function. | 04-26-2012 |
20120096705 | Process tray for head stack assembly, shipping tool and manufacturing method for the same - A process tray for head stack assembly includes a main tray and at least one jig. Each jig has a main body with one set of locating holes formed thereon and two elastic arms respectively extending from two sides of the main body for providing force to hold the head stack assembly. The main tray has a main frame and a supporting frame disposed within and connected to the main frame for supporting the jig and/or the head stack assembly. The supporting frame has at least one set of locating bumps formed thereon for locating at least one jig on the main tray by respectively inserting the locating bumps into the locating holes formed on the jig. The process tray of the present invention can carry the head stack assembly during the whole head stack assembly manufacturing process, thereby simplifying the HSA manufacturing process, increasing productive efficiency and reducing the cost. | 04-26-2012 |
20120086130 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body. The main body includes a main part, and further includes first terminals and second terminals disposed on the top and bottom surfaces of the main part, respectively. The main part includes first and second layer portions, and through electrodes penetrating them. The through electrodes are electrically connected to the first and second terminals. Each of the layer portions includes a semiconductor chip having a first surface and a second surface opposite thereto, and further includes surface electrodes. The surface electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the surface electrodes of the first layer portion. The second terminals are formed by using the surface electrodes of the second layer portion. | 04-12-2012 |
20120084969 | METHOD OF MANUFACTURING THERMAL ASSISTED MAGNETIC WRITE HEAD - A method of manufacturing a thermally-assisted magnetic write head is provided. The method includes steps of: forming a laminate structure including the waveguide; the plasmon generator, and the magnetic pole in order; performing a first polishing process to planarize an end surface of the laminate structure; performing a first etching process to remove impurity attached on the end surface of the laminate structure, and to allow the plasmon generator to be recessed from the waveguide and the magnetic pole, thereby forming a recessed region on the end surface of the laminate structure; forming a protection layer on the end surface of the laminate structure such that at least the recessed region is filled; and performing a second polishing process on the end surface of the laminate structure formed with the protection layer until the plasmon generator is exposed, thereby completing the air bearing surface. | 04-12-2012 |
20120082178 | Vertical cavity surface emitting laser and method for manufacturing the same - A vertical cavity surface emitting laser capable of high-speed modulation and stabilized control of polarization direction of the laser light is provided, including a resonator which is formed by stacking a semiconductor substrate, a lower mirror layer formed on the upper side of the semiconductor substrate, an active layer formed on the upper side of the lower mirror layer, and an upper mirror layer including an oxidized layer formed on the upper side of the active layer, and a portion of which is formed in a mesa shape from a predetermined position to the upper surface in a height direction; an insulation layer covering the side surface of the mesa-shaped portion of the resonator, and the upper surface of the non-mesa-shaped portion of the resonator; and electrodes being wired on the upper surface of the upper mirror layer and on the lower surface of the semiconductor substrate, respectively. Further, a portion of the insulation layer formed on the side surface of the mesa-shaped portion of the resonator is formed to be uniformly thicker than another portion along the height direction of the mesa-shaped portion. | 04-05-2012 |
20120080782 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires. | 04-05-2012 |
20120075741 | Arm coil assembly, arm flexible cable assembly and disk drive unit with the same - An arm coil assembly includes a drive arm having at least two grounding pins formed on a mounting region thereof and a voice coil fixed on the tailing end of the drive arm for controlling the drive arm. The grounding pins are provided for electrically connecting with a flexible printed cable assembly by extending through at least two mounting holes formed on the flexible printed cable assembly. Each grounding pin has a slot formed thereon to clamp the flexible printed cable assembly. The arm coil assembly of the present invention having grounding pins with slot structure to clamp the flexible printed cable assembly which is mounted on the drive arm to form an arm flexible cable assembly, thus, the flexible printed cable assembly can be pre-mounted onto the arm coil assembly without using any additional fixtures or tools, therefore simplifying the mounting process and reducing the manufacturing cost thereof. The invention also discloses an arm flexible cable assembly and a disk drive unit including the same. | 03-29-2012 |
20120056333 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. Each layer portion includes a semiconductor chip having a first surface and a second surface opposite thereto, and includes a plurality of electrodes. The electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the electrodes of the first layer portion, and the second terminals are formed by using the electrodes of the second layer portion. | 03-08-2012 |
20120036706 | Row bar for forming sliders and method of manufacturing slider - A row bar for forming sliders has a row of slider forming portions, each slider forming portion having a slider to be cut from the row bar and a medial region adjacent the slider, each medial region having a first guide pad disposed thereon; wherein each slider has: a slider body; a magnetic writer and a magnetic reader disposed on the slider body; a second guide pad disposed on the slider body; two electrical lapping guides disposed on the slider body and electrically connecting to the first guide pad and the second guide pad respectively; a row of bonding pads formed on the slider body and electrically connecting to the magnetic reader and the magnetic writer; and a grounding pad disposed on the slider body and electrically connecting to the first guide pad and the second guide pad. The invention also discloses a method of manufacturing the slider. | 02-16-2012 |
20120032318 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. Each layer portion includes a semiconductor chip. The plurality of second terminals are positioned to overlap the plurality of first terminals as viewed in a direction perpendicular to the top surface of the main body. A plurality of pairs of first and second terminals that are electrically connected via the wires include a plurality of pairs of a first terminal and a second terminal that are positioned not to overlap each other. | 02-09-2012 |
20120025355 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have electromagnetic shielding layer formed in regions other than the scribe-groove parts using a ferromagnetic body. Further, in the laminated semiconductor substrate, a through hole which penetrates the plurality of semiconductor substrates laminated in a laminated direction is formed in the scribe-groove part, and the laminated semiconductor substrate has a through electrode penetrating the plurality of semiconductor substrates through the through hole. | 02-02-2012 |
20120025354 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have an electromagnetic shielding layer formed using a ferromagnetic body. The electromagnetic shielding layer is formed in a shielding region except the extending zone. The extending zone is set a part which the wiring electrode crosses, in a peripheral edge part of the device region. | 02-02-2012 |
20120019945 | Method and system for measuring noise of a magnetic head - A method for measuring noise of a magnetic head includes setting a plurality of threshold values, applying bias current or voltage to a read element of the magnetic head, applying an external transverse magnetic field to the magnetic head, amplifying output signal from the read element to produce an amplified signal, filtering the amplified signal to produce a filtered signal, generating an enable signal for each threshold value in a predetermined time window by a counting control means with input signals which include the filtered signal and the threshold value, measuring the cumulative time duration of each enable signal, making an amplitude-duration distribution according to the cumulative time durations and the threshold values, calculating a plurality of parameters according to the amplitude-duration distribution and analyzing the parameters with a plurality of predetermined criteria to determine the defects of the magnetic head. Accordingly, the invention also discloses a system for measuring noise of a magnetic head. | 01-26-2012 |
20120013025 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip. The plurality of wires include a plurality of common wires and a plurality of layer-dependent wires. In at least one of the layer portions, the semiconductor chip is electrically connected to the plurality of common wires and is selectively electrically connected to only the layer-dependent wire that the layer portion uses, among the plurality of layer-dependent wires. | 01-19-2012 |
20120013024 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip, and a plurality of electrodes that are electrically connected to the wires. The electrodes include a plurality of first electrodes that are intended to establish electrical connection to the semiconductor chip, and a plurality of second electrodes that are not in contact with the semiconductor chip. In at least one of the layer portions, the first electrodes are in contact with and electrically connected to the semiconductor chip. | 01-19-2012 |
20120011286 | Optical communication module, universal serial bus cable with the same and processing method of data transfer thereof - The present invention discloses an optical communication module comprising a second mode supporting a data transfer of USB 3.0 standard and a third mode supporting a data transfer of USB 2.0 standard, and the second mode comprises A mode and B mode with a different power consumption and supported data rate, and a detect unit operative to detect idle state of the data traffic on the data path of USB 3.0 standard to determine to stay on the A mode or enter to the B mode automatically during operation in the second mode. The control circuitry can work in different modes to support different status of devices attachment and removal, different data rate of USB 2.0 and 3.0 standards; and it can real time monitor the data traffic to switch different modes to save power consumption. The present invention also discloses a USB cable and a processing method of data transfer for an optical communication module. | 01-12-2012 |
20120002326 | Perpendicular Magnetic Write head and method of manufacturing the same - A perpendicular magnetic write head includes: a magnetic pole; a pair of nonmagnetic side gap layers provided on both sides in a track-width direction of the magnetic pole; a nonmagnetic trailing gap layer provided on a trailing side of the magnetic pole; a magnetic shield layer so provided as to surround the magnetic pole with both of the nonmagnetic side gap layer and the nonmagnetic trailing gap layer in between; and a magnetic seed layer formed between the nonmagnetic trailing gap layer and the magnetic shield layer, and having a saturation magnetic flux density higher than that of the magnetic shield layer. The magnetic seed layer is not formed between the nonmagnetic side gap layer and the magnetic shield layer. | 01-05-2012 |
20110316123 | Laminated semiconductor substrate, laminated chip package and method of manufacturing the same - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein, a first wiring electrode and a second wiring electrode extend to the inside of a interposed groove part from a first device region and a second device region respectively, and are separated from each other. In the laminated semiconductor substrate, a through hole which the first wiring electrode appears is formed. The laminated semiconductor substrate has a through electrode. The through electrode is contact with all of the first wiring electrodes appearing in the through hole. The laminated semiconductor substrate has a plurality of laminated chip regions. | 12-29-2011 |
20110299855 | Optical subassembly and manufacturing method thereof - An optical subassembly comprises a transmitter optical subassembly, a receiver optical subassembly, and an electronic assembly connected with the transmitter optical subassembly and the receiver optical subassembly respectively. The transmitter optical subassembly comprises an optical source and an optical source driver driving the optical source; the receiver optical subassembly comprises a photodetector and a control module connecting with the photodetector, and the control module is integrated with a transimpedance amplifier and a limiting amplifier; and the electronic assembly comprises a printed circuit board and a microcontroller formed thereon, and the microcontroller connects with the laser driver and the control module respectively. The present invention can achieve a high integration that is beneficial to the high speed transmission, simplify the layout design of the PCB, and decrease the manufacturing cost. | 12-08-2011 |
20110299195 | Row bar and wafer - A row bar having a plurality of slider forming areas collocated and slider cutting areas formed between two adjacent slider forming areas respectively, the slider forming areas are eventually cut into individual sliders along the slider cutting areas respectively, each slider having a pole tip embedded therein and an air bearing surface pattern on an air bearing surface facing to a disk, and at least a regular measuring pattern with straight line is formed on one of the slider cutting areas, to serve as a frame of reference for measuring the position of the pole tip and the air bearing surface pattern. The present invention can improve the measuring accuracy, decrease the measuring error and, in turn, improve the performance of the slider. | 12-08-2011 |
20110298715 | Optical navigation apparatus - An optical navigation apparatus comprises a substrate with a sensor integrated circuit and an infrared source formed thereon; a sensor cover shielding the sensor integrated circuit and the infrared source; at least one visible light source formed outside the sensor cover and electrically connected with the substrate; a light guide located outside the sensor cover and covering the visible light source; and an outer housing covering the light guide and the substrate, and the outer housing comprises an infrared window and a side wall capable of guiding visible light towards and illuminating a region of the outer housing. In such an arrangement, the outer housing of the present invention is not only used as a casing for protection, but also served as light guide and distribution structure to reflect and re-distribute light sufficiently to achieve a uniform illuminated character shape. | 12-08-2011 |
20110297780 | Automatic winding device for cell core - An automatic winding device for cell core includes a mounting seat, a locking cap mounted on one end of the mounting seat, a winding assembly driving mechanism mounted on the other end of the mounting seat and a winding assembly. The winding assembly comprises two winding needles and two winding plates. One end of the winding needle is fixed to the winding driving mechanism and the other end thereof opposite to the locking cap. One end of the winding plate is fixed to the winding driving mechanism and the other end thereof opposite to the locking cap. Two winding plates are disposed on both sides of the pair of winding needles respectively and contact to the pair of winding needles separably. One side of one winding needle has a concave portion and one side of the other winding needle has a convex portion that fits into the concave portion separably. A first protrusion is formed on the end of each winding needle opposite to the locking cap and a second protrusion is formed on the end of each winding plate opposite to the locking cap. A groove and a ring groove are formed in the locking cap in sequence, the first protrusion of the winding needle is locked in the groove and the second protrusion of the winding needle is locked in the ring groove. | 12-08-2011 |
20110296673 | Row bar with smart sensor for forming sliders and method of manufacturing slider - A row bar with smart sensor for forming sliders, which comprises a row of slider forming portions, each slider forming portion comprising a slider to be cut from the row bar and a medial region adjacent the slider; each slider comprises a slider body and a magnetic writer disposed in the slider body, with the magnetic writer having a main pole which includes a pole face for being lapped, and all the main poles are arranged in a row; the row bar has at least one smart sensor disposed therein, with the smart sensor having at least three dummy poles, whose structure is identical to that of said main pole, arranged in the row of the main poles, there is a space between every two adjacent dummy poles of said smart sensor, and there is a offset in the direction vertical with the pole face between every two adjacent dummy poles of said smart sensor. The invention also discloses a method of manufacturing the slider. | 12-08-2011 |
20110266692 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and a plurality of through electrodes. The main body includes a plurality of layer portions stacked and a plurality of through holes that penetrate all the plurality of layer portions. The plurality of through electrodes are provided in the plurality of through holes of the main body and penetrate all the plurality of layer portions. Each of the plurality of layer portions includes a semiconductor chip. At least one of the plurality of layer portions includes wiring that electrically connects the semiconductor chip to the plurality of through electrodes. The wiring includes a plurality of conductors that make contact with a through electrode that is exposed in the wall faces of any one of the plurality of through holes and passes through the through hole. | 11-03-2011 |
20110249363 | MAGNETIC HEAD INCLUDING SENSOR - A magnetic head disposed in a slider, that is arranged at an interval from a magnetic disk includes a sensor disposed in a position that is opposed to the magnetic disk, a heat conductive film that is positioned on an air bearing surface opposed to the magnetic disk, and that is formed so as to overlap the sensor, of which a height in a direction perpendicular to the air bearing surface is more than a height of the sensor, and that transfers a temperature change of the air bearing surface to the sensor, and a pair of lead films electrically connected to the sensor and not electrically connected to the heat conductive film. | 10-13-2011 |
20110243511 | Universal serial bus connector - A USB connector comprises a USB connector body and an optical module including an optical transmitter and an optical receiver engaging with the USB connector body. The USB connector body comprises a metal shell having a first opening adapted for connecting with an external plug; a second opening communicating with the first opening and adapted for accommodating the optical module; and a locking device adapted for locking the optical module within the USB connector body. The present invention can serve as an active optical transceiver, and simplify the structure and reduce manufacturing cost, further reduce the loss of optical signals and, in turn improve the transmission performance. | 10-06-2011 |
20110242703 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The thermally assisted magnetic head includes a base layer which a base groove part having a width gradually getting smaller along a depth direction and extending in an intersecting direction intersecting with the medium-opposing surface is formed. The near-field light generating layer has an in-groove generating layer formed inside of the base groove part. The in-groove generating layer is formed along an inner wall surface of the base groove part and has a thin-film like structure. | 10-06-2011 |
20110241707 | Method of measuring slider resistance of different types of row bar with a common tester - A method of measuring slider resistance of different types of row bar with a common tester comprises judging the type of the row bar, if the row bar is femto-type row bar, supplying a first voltage to the front pins, and supplying a second voltage that is unequal to the first voltage to the back pins, thereby obtaining resistances of the sliders; if the row bar is shunting-type row bar, supplying a third voltage to the front pins which contact the test pads, and supplying a fourth voltage that is unequal to the third voltage to the front pin that contacts the common test pad, thereby obtaining resistances of the sliders. The present invention can measure two different types of row bar with a same common tester, which can reduce the downtime of machine and the manpower, and prevent the probe card from being damaged without a frequent disassembly and switch. | 10-06-2011 |
20110241480 | Surface acoustic wave device - A surface acoustic wave device according to the present invention includes a piezoelectric monocrystal substrate | 10-06-2011 |
20110235214 | Magnetoresistive sensor, magnetic head, head gimbal assembly, and disk drive unit with the same - A MR sensor includes a first shielding layer, a second shielding layer, a MR element formed therebetween, and a pair of hard magnet layers respectively placed on two sides of the MR element. The MR element comprises an AFM layer formed on the first shielding layer, a pinned layer formed on the AFM layer and a free layer formed between the pinned layer and the second shielding layer. The free layer is funnel-shaped, which having a first edge facing the air bearing surface and a second edge opposite the first edge, and the first edge has a narrower width than that of the second edge. The structure of the MR sensor can improve MR height control performance, and improve the ESD performance and decrease the PCN and RTN and, in turn, get a more stable performance. The present invention also discloses a magnetic head, a HGA and a disk drive unit. | 09-29-2011 |
20110228426 | Suspension, head gimbal assembly and disk drive unit with the same - A suspension comprises a flexure and a plurality of electrical traces. The flexure has a leading portion and a tailing portion, and has a laminated structure comprising a substrate layer, a dielectric layer, and a grounding layer sandwiched therebetween. The electrical traces comprise at least one pair of write traces, each write trace has a bonding pad positioned on the leading portion, a terminal pad positioned on the tailing portion, and a write wire connecting the bonding pad and the terminal pad, the write wire has at least one portion being furcated into at least two sub wires. The present invention can lower the impedance and decrease the signal transmission loss, and widen the frequency bandwidth simultaneously. The invention also discloses a HGA and a disk drive unit. | 09-22-2011 |
20110221073 | Layered chip package with wiring on the side surfaces - A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include specific pairs of layer portions. Each of the specific pairs of layer portions includes a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. The specific pairs of layer portions are provided in an even number. | 09-15-2011 |
20110220611 | Method of manufacturing perpendicular magnetic write head - A method of manufacturing a perpendicular magnetic recording head capable of easily and accurately forming a main magnetic-pole layer having a shape suitable for concentrating a magnetic flux is provided. A nonmagnetic layer having a recessed section (a first recessed section and a second recessed section) is formed, and then an additional nonmagnetic layer is formed on an inner surface of the recessed section. Then, a magnetic layer is formed in the recessed section formed with the additional nonmagnetic layer, and then the magnetic layer is cut to form an air bearing surface, so as to form the main magnetic-pole layer. | 09-15-2011 |
20110211275 | Method of determining flying height of magnetic head - For obtaining a flying height of a magnetic head from a magnetic disk, the magnetic head being placed in a slider arranged at an interval with the magnetic disk, an initial setting process and a flying height detecting process are performed. In the initial setting process, driving power to a heater is increased gradually, from a state where the heater arranged at a position in proximity to the magnetic head in the slider is not driven, until the magnetic head makes contact with the magnetic disk. Then, in each stage, an electrical resistance value of the sensor arranged at a position in proximity to the magnetic head in the slider, which is increased due to the heat from heater, and either an approach distance of the magnetic head toward the magnetic disk or the flying height of the magnetic head from the magnetic disk are acquired. Then, basic data is prepared by obtaining the relationship between a variation of the electrical resistance value of the sensor and the flying height of the magnetic head from the magnetic disk, which is obtained in each stage or which calculated from the approach distance in each stage. In the flying height detecting process, an electrical resistance value of the sensor is determined, and a variation of the electrical resistance value is calculated from the determined values. Then, the flying height of the magnetic head from the magnetic disk in the state where the electrical resistance value was determined is obtained based on the basic data obtained in the initial setting process, using the calculated variation of the electrical resistance value. | 09-01-2011 |
20110211274 | HEAD ASSEMBLY, MAGNETIC DISK DRIVE APPARATUS AND ROTATION MECHANISM - A head assembly includes a slider having a head element, a load beam, a fulcrum formed at a top end section of the load beam, a slider support plate for supporting the slider to freely turn around the fulcrum, at least one drive element for applying a turning force to the slider support plate in a plane thereof, a first linear link part having at both ends a first top end joint part mechanically connected to the slider support plate, and a first base end joint part mechanically connected to the load beam, and a second linear link part having at both ends a second top end joint part mechanically connected to the slider support plate, and a second base end joint part mechanically connected to the load beam. Both of an extended line of the first linear link part and an extended line of the second linear link part travel toward a position of the fulcrum and intersect with each other. | 09-01-2011 |
20110201137 | Method of manufacturing layered chip package - A method of manufacturing a layered chip package that includes a main body, and wiring disposed on a side surface of the main body. The main body includes a plurality of layer portions. The method includes fabricating a plurality of substructures, and completing the layered chip package by fabricating the main body using the plurality of substructures and by forming the wiring on the main body. Each substructure is fabricated through the steps of: fabricating a pre-substructure wafer including a plurality of pre-semiconductor-chip portions aligned; distinguishing between a normally functioning pre-semiconductor-chip portion and a malfunctioning pre-semiconductor-chip portion among the plurality of pre-semiconductor-chip portions included in the pre-substructure wafer; and forming electrodes connected to the normally functioning pre-semiconductor-chip portion and having respective end faces located in the side surface of the main body on which the wiring is disposed, without forming any electrode connected to the malfunctioning pre-semiconductor-chip portion. | 08-18-2011 |
20110198014 | ADHESIVE BONDING METHOD - The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. | 08-18-2011 |
20110194209 | MAGNETIC RECORDING HEAD, HEAD GIMBAL ASSEMBLY, AND DISK DRIVE UNIT WITH THE SAME - A magnetic recording head includes a trailing surface and a plurality of bonding pads arranged on the trailing surface and in a row adapted for both bonding and testing. Each of the bonding pads has at least one side portion being coated with electrically conductive solder nonwettable coat to prevent short circuit between the adjacent bonding pads. The invention also discloses a head gimbal assembly with the magnetic recording head and a disk drive unit having such head gimbal assembly. | 08-11-2011 |
20110194208 | SLIDER, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME - A slider for a head gimbal assembly includes a trailing surface, a plurality of connection pads arranged on the trailing surface adapted for both bonding the slider to a suspension of the head gimbal assembly and testing the performance of the slider. At least a part of the connection pads each comprises a bonding portion and a testing portion electrically connected to the bonding portion and larger than the bonding portion, all the bonding portions and the rest part of the connection pads are arranged in a first row and the testing portions are arranged outside the first row. The slier of the present invention has a new pad layout to facilitate bonding of the connection pads and permit to provide additional pads thereon to connect the additional sensors therein for precise reading and writing, thereby improving the performance of the slider. The invention also discloses a head gimbal assembly and a disk drive unit including the same. | 08-11-2011 |
20110194186 | Method for manufacturing polymer miniature lens and collimator including the polymer miniature lens - A method for manufacturing a polymer miniature lens on a substrate with the lens forming pattern, and the liquid polymer is dispensed therein. The lens forming pattern having a periphery area and an interior area, most portion of the periphery area having a property of confining liquid polymer, while the interior area having at least one portion exposing the surface of the substrate; depositing liquid polymer onto the lens forming pattern; and curing the liquid polymer after the liquid polymer reaches equilibrium shape and is confined to the periphery area. The invention also discloses a collimator including the polymer miniature lens. | 08-11-2011 |
20110189822 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body and wiring. The main body includes a plurality of layer portions stacked. The wiring is disposed on at least one side surface of the main body. In the method of manufacturing the layered chip package, first, a plurality of substructures each of which includes an array of a plurality of preliminary layer portions are used to fabricate a layered substructure that includes a plurality of pre-separation main bodies arranged in rows. Next, the layered substructure is cut into a plurality of blocks each of which includes a row of a plurality of pre-separation main bodies, and the wiring is formed on the plurality of pre-separation main bodies included in each block simultaneously. The plurality of pre-separation main bodies are then separated from each other. Each of the plurality of blocks includes a row of three, four, or five pre-separation main bodies. | 08-04-2011 |
20110189820 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - In a method of manufacturing a layered chip package, a layered substructure is fabricated and used to produce a plurality of layered chip packages. The layered substructure includes first to fourth substructures stacked, each of the substructures including an array of a plurality of preliminary layer portions. In the step of fabricating the layered substructure, initially fabricated are first to fourth pre-polishing substructures each having first and second surfaces. Next, the first and second pre-polishing substructures are bonded to each other with the first surfaces facing each other, and then the second surface of the second pre-polishing substructure is polished to form a first stack. Similarly, the third and fourth pre-polishing substructures are bonded to each other and the second surface of the third pre-polishing substructure is polished to form a second stack. Then, the first and second stacks are bonded to each other. | 08-04-2011 |
20110186985 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof. | 08-04-2011 |
20110182559 | Assembly of optical fiber and optical fiber holder with end portion of optical fiber housed in recess - The present invention is directed to an assembly of an optical fiber and an optical fiber holder for holding the optical fiber, the optical fiber having an end surface formed at an end portion thereof, the end surface being configured to perform light coupling with a light emitting element or with a light receiving element. The optical fiber holder comprises; a throughhole which extends through the optical fiber holder and a recess that is positioned on a surface of the optical fiber holder and that is provided with an opening of the throughhole. The optical fiber is inserted through the throughhole and an adhesive is filled in a gap between an inner wall of the throughhole and an outer periphery of the optical fiber, the adhesive being used for adhering the optical fiber to the optical fiber holder. The end portion, on which is formed the end surface of the optical fiber, protrudes from the opening and terminates within the recess. | 07-28-2011 |
20110180932 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of semiconductor chips stacked, and a plurality of electrodes that electrically connect the semiconductor chips to the wires. A method of manufacturing the layered chip package includes the steps of: fabricating a substructure that includes an array of a plurality of pre-separation main bodies and a plurality of holes for accommodating a plurality of preliminary wires, the holes being formed between two adjacent pre-separation main bodies; forming the preliminary wires in the plurality of holes by plating; and cutting the substructure so that the plurality of pre-separation main bodies are separated from each other and the preliminary wires are split into two sets of wires of two separate main bodies, whereby a plurality of layered chip packages are formed. | 07-28-2011 |
20110176239 | Head stack assembly and disk drive unit with the same - Disclosed is a head stack assembly, which comprises a pivot bearing assembly having a main body which comprising a first end surface and a second end surface, and a flange extended from the main body and located between the first and second end surfaces, the flange having a first interface adjacent the first end surface of the main body and a second interface opposite to the first interface; a drive arm mounted on the main body and secured on the first interface of the flange; and a fantail spacer mounted on the main body and secured on the second interface of the flange. | 07-21-2011 |
20110174608 | Method for forming a diamond-like carbon layer on air bearing surface of a slider - A method for forming a diamond-like carbon (DLC) layer on air bearing surface (ABS) of a slider, comprises steps of: providing sliders arranged in arrays, each slider having an ABS; forming a mixing layer in the ABS of the slider by depositing a first DLC layer on the ABS, the mixing layer consisting of the slider material and the first DLC layer material; removing the first DLC layer to make the mixing layer exposed; forming a second DLC layer on the mixing layer. | 07-21-2011 |
20110170216 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING - A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface; and an upper yoke layer. A first magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the upper yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the upper yoke layer. The upper yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer. | 07-14-2011 |
20110164333 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a near-field light generating part in a triangle shape with the generating end part being one vertex, and is formed in a triangle pole shape. The optical waveguide is formed to be opposed to a ridge part of the near-field light generating layer via an interposed layer. The main magnetic pole layer is formed to be opposed to the generating end part via the interposed layer. The thermally assisted magnetic head further includes a heat radiating layer in contact with an opposite side of the near-field light generating layer from the optical waveguide. | 07-07-2011 |
20110146059 | Method of manufacturing head gimbal assembly - In a manufacturing method for a head gimbal assembly, before mounting a slider on a suspension, coating films each made of solder are formed on respective terminals of a plurality of leads to be connected to a plurality of electrode pads of the slider. After mounting the slider on the suspension, the coating films are heated with laser light to thereby melt the solder, with the respective terminals of the plurality of leads in contact with the corresponding electrode pads via the respective coating films, whereby the terminals are electrically and physically connected to the electrode pads. | 06-23-2011 |
20110115079 | Wafter and substructure for use in manufacturing electronic component packages - A wafer for electronic component packages is used for manufacturing a plurality of electronic component packages, each of the plurality of electronic component packages including: a base incorporating a plurality of external connecting terminals; and at least one electronic component chip bonded to the base and electrically connected to the plurality of external connecting terminals. The wafer has a plurality of sets of external connecting terminals corresponding to the plurality of electronic component packages, a retainer for retaining the plurality of sets of external connecting terminals, and a coupling portion for coupling the plurality of sets of external connecting terminals to one another. The wafer includes a plurality of pre-base portions that will each be subjected to bonding of the at least one electronic component chip thereto and will be subjected to separation from one another later so that each of them will thereby become the base. | 05-19-2011 |
20110096435 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror fixed to the laser diode. The laser diode has an emitting end face that includes an emission part for emitting laser light; a mounting surface that lies at an end in a direction perpendicular to the plane of an active layer and faces the slider; and a rear surface opposite to the mounting surface. The external mirror includes: a first to-be-fixed part disposed along the emitting end face; a second to-be-fixed part disposed along the rear surface; and a coupling part that couples the first and second to-be-fixed parts to each other. The first to-be-fixed part has a reflecting surface that reflects the laser light emitted from the emission part toward the waveguide. | 04-28-2011 |
20110095414 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a device region in contact with at least any one of the plurality of groove portions and having a semiconductor device formed therein; a surface insulating layer formed to cover the device region and constituting a surface layer of the semiconductor substrate; and a wiring electrode connected to the semiconductor device and formed in a protruding shape rising above a surface of the surface insulating layer. The semiconductor substrate can be manufactured by forming a plurality of groove portions along scribe lines; applying an insulating material to a surface on a side where the plurality of groove portions are formed to form a surface insulating layer; and forming a wiring electrode connected to the semiconductor device and in a protruding shape rising above a surface of the surface insulating layer, after the formation of the surface insulating layer. | 04-28-2011 |
20110095289 | Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package - In a laminated chip package, a plurality of semiconductor plates each having a semiconductor device and a wiring electrode connected to the semiconductor device are laminated. On a side surface for wiring of the laminated chip package, an end face of an inner electrode for examination formed inside the side surface for wiring in the semiconductor plate is formed. The laminated chip package further has an outer electrode for examination connecting the end faces of the inner electrodes for examination along a lamination direction of the semiconductor plates, only for two adjacent semiconductor plates among the semiconductor plates. | 04-28-2011 |
20110090601 | Suspension with flexure tail and manufacturing method thereof, head stack assembly and disk drive unit with the same - A suspension for a head stack assembly, comprises a flexure with a suspension tongue, a flexure tail and a plurality of conductive traces extending between the suspension tongue and the flexure tail, each of said conductive traces having one end thereof terminated to an electrical pad formed on the suspension tongue for electrical connection to a slider and the other end thereof terminated to a connection pad formed on the flexure tail for both testing and bonding such that the flexure has no additional testing pads. The suspension with a flexure tail able to make the bonding and the dynamic performance testing on the pad area and thus reduce suspension length and increase flexure density for low cost. The invention also discloses a manufacturing method of the suspension and a HSA with such an suspension and a disk drive unit having such an HSA. | 04-21-2011 |
20110090600 | SUSPENSION, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME - A suspension for a head gimbal assembly comprises a flexure having a suspension tongue and a welding portion separating from the suspension tongue, and a load beam supporting the suspension tongue and having a portion welded to the welding portion of the flexure so that the load beam and the flexure are connected together. A plurality of bonding pads is formed on the suspension tongue for electrical connection to a slider. The suspension tongue has a leading portion and a leading edge limiter formed at the leading portion, and the leading edge limiter hooks on to the load beam. The suspension can improve the shockproof performance of the flexure of the suspension and, in turn, protect the structure of the suspension. The invention also discloses a head gimbal assembly and a disk drive unit including the same. | 04-21-2011 |
20110090599 | Suspension having a short flexure tail, head gimbal assembly and disk drive unit with the same - A suspension for a head gimbal assembly comprises a flexure having a flexure having a tail with a plurality of electrical traces and a plurality of bonding terminals adapted for connecting with a flexible printed circuit formed thereon. Each of the bonding terminals comprises a connecting pad and a hole formed at one end of the connecting pad for electrically and mechanically connecting the connecting pad to the flexible printed circuit by bonding material. And the connecting pad has a bonding portion adjacent to the hole and an exposed portion for testing. The invention also discloses a head gimbal assembly and a disk drive unit with the same. | 04-21-2011 |
20110086182 | Magnetic device, perpendicular magnetic recording head, magnetic recording system, method of forming magnetic layer pattern, and method of manufacturing perpendicular magnetic recording head - Provided is a method of manufacturing a perpendicular magnetic recording head which can enhance accuracy and simplify the manufacturing process. The method includes: forming a photoresist pattern having an opening part (the inclination of an inner wall); forming a non-magnetic layer (the inclination of another inner wall) so as to narrow the opening part by a dry film forming method such as ALD method; stacking a seed layer and a plating layer so as to bury the opening part provided with the non-magnetic layer; and forming a main magnetic pole layer (a front end portion having a bevel angle) by polishing the non-magnetic layer, the seed layer, and the plating layer by CMP method until the photoresist pattern is exposed. The final opening width (the forming width of the front end portion) is unsusceptible to variations, thus reducing the number of the steps of forming the main magnetic layer. | 04-14-2011 |
20110068456 | Layered chip package and method of manufacturing same - A layered chip package includes a plurality of layer portions that are stacked, each of the layer portions including a semiconductor chip. The plurality of layer portions include at least one first-type layer portion and at least one second-type layer portion. The semiconductor chip has a circuit, a plurality of electrode pads electrically connected to the circuit, and a plurality of through electrodes. In every vertically adjacent two of the layer portions, the plurality of through electrodes of the semiconductor chip of one of the two layer portions are electrically connected to the respective corresponding through electrodes of the semiconductor chip of the other of the two layer portions. The first-type layer portion includes a plurality of wires for electrically connecting the plurality of through electrodes to the respective corresponding electrode pads, whereas the second-type layer portion does not include the wires. | 03-24-2011 |
20110063754 | Perpendicular magnetic write head - A perpendicular magnetic write head in which unintended erasure of information at the time of non-writing can be suppressed while keeping the capability of writing is provided. The perpendicular magnetic write head includes a magnetic pole tip portion, a first yoke portion connected to the magnetic pole tip portion, having a width larger than that of the magnetic pole tip portion, and having a recess portion in a center region thereof, and a second yoke portion embedded in the recess portion. The magnetic pole tip portion and the first yoke portion are integrally formed with a vapor deposition method, and the second yoke portion is formed with a plating method. Since the saturation flux density of the magnetic pole tip portion formed with the vapor deposition method becomes higher than that of the yoke portion, a magnetic flux intake capacity of the magnetic pole tip portion is ensured. In a magnetic domain structure of the yoke portion most of which is formed with the plating method, since an easy magnetization axis becomes likely to be directed in a direction perpendicular to an emitting direction of a magnetic flux, residual flux becomes less likely to leak out of the main magnetic pole layer at the time of non-writing. | 03-17-2011 |
20110041322 | Method of manufacturing magnetic head for perpendicular magnetic recording including two side shields - A magnetic head includes a pole layer, first and second side shields, and an encasing layer having a pole groove that accommodates the pole layer and first and second side shield grooves that accommodate the first and second side shields. In a manufacturing method for the magnetic head, the pole groove and first and second initial side shield grooves are formed in a nonmagnetic layer using an etching mask layer having first to third openings. In the manufacturing method, a wall face of the first initial side shield groove that is closer to the pole groove and a wall face of the second initial side shield groove that is closer to the pole groove are etched by dry etching to thereby complete the first and second side shield grooves. | 02-24-2011 |
20110019310 | Head gimbal assembly, suspension for the head gimbal assembly, and disk drive unit with the same - A HGA comprises a slider and a suspension with a flexure having a tongue region for supporting the slider. A read/write transducer and a piezoelectric element are formed oppositely. The connecting points of the curve beams and the inner tongue of the tongue region are in mirror positions to a center point of the inner tongue, and the connecting points of each curve beam are located at opposite sides of a center axis of the flexure. The slider has multiple electrical pads electrically connecting with the read/write transducer. The inner tongue has multiple electrical pads. The flexure has multiple inner leads electrically connected with the electrical pads of the inner tongue formed on the curve beams. The structure of the HGA prevents the read/write transducer from damaged and cause the manufacture of the HGA simpler. The present invention also discloses a suspension and a disk drive unit. | 01-27-2011 |
20100328820 | Dimple forming apparatus and dimple forming method - A dimple forming apparatus for forming dimple on a workpiece at a desired position comprises a base mould with a concave surface, a heating unit and a forming pin with a spherical surface. The base mould is configured to be positioned below the workpiece. The heating unit is configured to heat the desired position of the workpiece for enhancing tractility of the desired position of the workpiece, and the forming pin is configured to be positioned above workpiece with the spherical surface of the forming pin aiming toward the desired position of the workpiece heated by the heating unit. The heating unit successfully enhances the tractility of desired position of the workpiece before the desired position of the workpiece is punched by the forming pin, and produces low stress at the junction of the dimple formed by the forming pin punching and the workpiece of the workpiece. The present invention also discloses a dimple forming method, a head gimbal assembly and a method for manufacturing a head gimbal assembly. | 12-30-2010 |
20100315741 | Perpendicular magnetic recording head - A perpendicular magnetic write head capable of suppressing damage and corrosion of a magnetic pole to secure a stable writing performance is provided. | 12-16-2010 |
20100302685 | Magnetic head slider having ultra thin base layer with group 6A element and protective layer - A magnetic head slider according to the present invention comprises: a slider body including either a write head element or a read head element or both the write head element and the read head element; a seed layer provided on an air bearing surface of the slider body, the seed layer covering either the write head element or the read head element or both the write head element and the read head element, the seed layer having a film thickness that is less than 1 nm; and a protective film formed of diamond-like carbon, the protective film covering the seed layer. The seed layer is mainly formed of silicon and contains a 6A group element in a proportion of 2 atomic fractions or more and 30 atomic fractions or less. | 12-02-2010 |
20100302683 | Magnetic head slider having ultra thin base layer with group 6aelement and protective layer - A magnetic head slider according to the present invention comprises: a slider body including either a write head element or a read head element or both the write head element and the read head element; a seed layer provided on an air bearing surface of the slider body, the seed layer covering either the write head element or the read head element or both the write head element and the read head element, the seed layer having a film thickness that is less than 1 nm; and a protective film formed of diamond-like carbon, the protective film covering the seed layer. The seed layer is mainly formed of silicon and contains a 6A group element in a proportion of 2 atomic fractions or more and 30 atomic fractions or less. | 12-02-2010 |
20100302681 | Perpendicular magnetic recording head and method of manufacturing the same - A method of manufacturing a perpendicular magnetic write head capable of precisely narrowing a side gap is provided. A tip portion having a cross sectional geometry of an inverted trapezoid is formed in an opening portion of a non-magnetic layer and thereafter, the non-magnetic layer is etched with the tip portion as a mask. Thereby, a portion adjacent to the tip portion in a writing track width direction remains and an outermost edge portion of the tip portion in that direction is located on a plane which coincides with an etching face (side face) of the non-magnetic layer. When a gap layer is formed with a vapor phase growth such as a sputtering method to cover the side face of the non-magnetic layer and thereafter a side shield layer is formed adjacently to the tip portion therethrough, a thickness of the gap layer becomes extremely thin and is reproduced precisely. Therefore, the side gap is narrowed with high precision. | 12-02-2010 |
20100301835 | Current sensor - A current sensor includes, a current-measured wiring including parallel wiring sections in which portions of the same wiring are arranged in parallel such that electric current to be measured flows therein in opposite directions each other; a magnetism detection unit which is arranged between parallel wirings located in the parallel wiring sections and detects a magnetic field in a direction perpendicular to a plane formed by the parallel wirings; a current detection unit which detects electric current flowing in the current-measured wiring, based on the magnetic field detected by the magnetism detection unit; and a magnetic core surrounding the parallel wiring sections so as to intensify the magnetic field generated around the parallel wirings located in the parallel wiring sections when electric current flows in the wirings. The magnetic core has a pair of plates facing each other over a plane formed by the parallel wirings, the pair of plates having flat and parallel inner faces, and the magnetism detection unit is arranged between the pair of plates of the magnetic core. | 12-02-2010 |
20100301705 | PIEZOELECTRIC ACTUATOR AND METHOD OF MANUFACTURING THE SAME - A piezoelectric actuator includes a supporting substrate, a main body having a first piezoelectric laminate, a second piezoelectric laminate, and a displacement portion, and a first elastic layer. The first elastic layer is fixed to the main body so as to connect a lower surface of the first piezoelectric laminate, a lower surface of the second piezoelectric laminate, a side surface of the first piezoelectric laminate, and a side surface of the second piezoelectric laminate. A first region to fourth region of the first elastic layer is fixed to the principal surface of the supporting substrate by a first to fourth bonding portions. A non-bonding surface is not fixed to the principal surface of the supporting substrate. | 12-02-2010 |
20100291294 | Method of fabricating magnetic head slider including partial removal step of protecting film - The method of fabricating a magnetic head slider includes steps of: forming a first protective film on an air bearing surface of a magnetic head slider on which either a recording element or a reproduction element is formed or on which both a recording element and a reproduction element are formed; removing a portion of the first protective film to reduce the thickness of the first protective film and forming a second protective film over the first protective film that has been reduced in thickness; and forming an uneven portion for controlling the flying characteristics of the magnetic head slider on the air bearing surface of the magnetic head slider; wherein the formation of the uneven portion is carried out after the first protective film has been formed and before the second protective film is formed, or after the second protective film has been formed. | 11-18-2010 |
20100290159 | Common tray for head gimbal assembly and common tray assembly with the same - A common tray for HGA comprises a frame, a first inner bar, and a second inner bar parallel to and spaced from the first inner bar. Ends of the first and second inner bars connect to the opposite edges of the frame. A plurality of locating pillars and a plurality pairs of first bumps are uniformly-spaced formed on the first inner bar respectively. The first inner bar has portions between each said pair of first bumps recessed for forming spaces under the HGA. A plurality of second bumps are uniformly-spaced formed on the second inner bar for withstanding an edge of the base plate. The present common tray can replace five kinds of trays traditionally used in the HGA manufacturing process, and thus reduce the load/unload operations as well as the no-value stations and operators, thereby the productive efficiency is improved, and manufacturing cost is reduced. | 11-18-2010 |
20100232069 | METHOD FOR MANUFACTURING HEAD GIMBAL ASSEMBLY, METHOD FOR MANUFACTURING HARD DISK DRIVE, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A method for manufacturing an head gimbal assembly (HGA) according to the present invention is comprised of: a step for preparing a thin film piezoelectric actuator including a first piezoelectric laminate having a first piezoelectric layer, and a second piezoelectric laminate having a second piezoelectric layer; a step for preparing a suspension; a fixing step for fixing the thin film piezoelectric actuator to the suspension; a first repolarization treatment step for performing repolarization treatment to the first piezoelectric layer after the fixing step; and a second repolarization treatment step for performing repolarization treatment to the second piezoelectric layer after the fixing step. | 09-16-2010 |
20100226611 | Optical module - Provided is an optical module which includes: an optical fiber; and a holder which holds an end-face side of the optical fiber and also carries a lens for condensing light to the end face of the optical fiber. The holder includes a loading face for loading a side-face side of the optical fiber and an abutting face to which the end face of the optical fiber is abutted so as to locate the end face of the optical fiber at a position where the light is condensed by the lens, and an upper area of the loading face is opened so that the optical fiber can be moved and loaded from the above the loading face. | 09-09-2010 |
20100200977 | Layered chip package and method of manufacturing same - A layered chip package has a main body including a plurality of pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The plurality of pairs of layer portions include at least one specific pair of layer portions consisting of a first-type layer portion and a second-type layer portion. The first-type layer portion includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. A layered substructure formed of a stack of two substructures each of which includes a plurality of preliminary layer portions aligned is used to fabricate a stack of a predetermined two or greater number of pairs of layer portions, and the main body is fabricated by stacking an additional first-type layer portion together with the stack, the number of the additional first-type layer portion being equal to the number of the specific pair(s) of layer portions included in the stack. | 08-12-2010 |
20100200959 | SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE, SEMICONDUCTOR PLATE AND METHOD OF MANUFACTURING THE SAME - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming a plurality of groove portions along scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form insulating layers; and forming a wiring electrode including an extended terminal portion extended from a rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion. | 08-12-2010 |
20100200147 | Adhesive bonding method - The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. The invention also provides a plate installing device with a light concentrator, which can be installed by the adhesive bonding method above mentioned. | 08-12-2010 |
20100195264 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, an interdiginated pair of internal electrodes are arranged, on a substrate, perpendicular to a surface of the substrate, and a ceramic dielectric member is filled into a gap between this pair of internal electrodes. For this reason, the dimensions of the internal electrodes do not substantially change before and/or after the formation of the ceramic dielectric member, whereby the dimensions formed at the time of internal electrode can be maintained. According to this ceramic capacitor, since the internal electrode dimensions can be easily controlled like this, dimensional control of internal electrode spacing can also be easily carried out. | 08-05-2010 |
20100195262 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, the electrode strips of an internal electrode and the dielectric strips of a ceramic dielectric member are arranged perpendicularly to the surface of a substrate, and as such, the plurality of electrode strips and the plurality of dielectric strips are arranged alternately along a parallel direction relative to the substrate surface. That is, the electrode strips and the dielectric strips are multi-layered along a parallel direction relative to the substrate surface, thereby facilitating the realization of multi-layering in the ceramic capacitor by a known patterning technology. | 08-05-2010 |
20100192343 | METHOD OF MANUFACTURING CERAMIC CAPACITOR - In a method of manufacturing ceramic capacitor according to the present invention, a pair of interdigitated internal electrodes are arranged perpendicularly to the surface of the substrate, subsequent to which the respective end faces of this pair of internal electrodes are exposed, and a pair of external electrodes are formed at these exposed end faces. In this method of manufacturing ceramic capacitor, formation of the external electrodes on the end faces of the respective internal electrodes, with these internal electrodes being interdigitately integrally-formed and the end faces thereof being exposed, it possible to reliably and easily form the external electrodes. | 08-05-2010 |
20100182003 | MAGNETIC FILM SENSOR AND METHOD OF MANUFACTURING THE SAME - A magnetic film sensor comprises a magnetic film for generating a magnetostriction, and a magnetostrictive structure for generating a magnetostriction in the magnetic film. The magnetostrictive structure is constructed so as to generate a magnetostriction by curving the magnetic film, for example. The magnetostrictive structure is obtained, for example, by providing a depressed insulating layer having a surface formed with a depression and forming the magnetic film across the depression. | 07-22-2010 |
20100154198 | Sensing unit and method of making same - In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved. | 06-24-2010 |
20100147789 | METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT - A manufacturing method of the present invention comprises the step of epitaxially growing a PZT layer on a first electrode layer, and the step of processing the PZT layer to a desired shape using an etching solution after the growing step. The etching solution contains at least one acid from among hydrochloric acid and nitric acid in a concentration C | 06-17-2010 |
20100118438 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed. | 05-13-2010 |
20100109137 | Layered chip package with heat sink - A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a second portion coupled to the at least one first portion. The at least one first portion is adjacent to the top surface or the bottom surface of at least one of the layer portions. The second portion is adjacent to one of the side surfaces of each of at least two of the plurality of layer portions. | 05-06-2010 |
20100097724 | HEAD GIMBAL ASSEMBLY FOR HEAT-ASSISTED MAGNETIC RECORDING - Provided is an HGA with a radiation structure that can effectively get away the heat generated from a light source. The HGA comprises a suspension and a head comprising a slider and a light source unit. The suspension comprises an opening, and the light source unit projects through the opening to the opposite side to the slider in relation to the suspension. Further, the first and second pads are provided on the upper and lower surfaces of the suspension, respectively, the end surface opposite to the source-installation surface of the light source is connected to the first pad by the first connection member, and an electrode of the head part is connected to the second pad by the second connection member. Thus, heat flow paths can be provided from the light source to the opposed-to-medium surface to allow effective radiation of the heat generated from the light source. | 04-22-2010 |
20100097723 | THIN-FILM PIEZOELECTRIC DEVICE, PRODUCTION METHOD THEREOF, HEAD GIMBALS ASSEMBLY USING THE THIN-FILM PIEZOELECTRIC DEVICE, AND HARD DISK DRIVE USING THE HEAD GIMBALS ASSEMBLY - A method includes a step of stacking a first electrode layer, a piezoelectric layer, and a second electrode layer on a first substrate to form a first laminate; a step of stacking a support layer on a second substrate to form a second laminate; a step of bonding the first and second laminates through an adhesive layer to form a third laminate; a step of removing the first substrate from the third laminate; a step of processing the third laminate in a desired shape; and a step of removing the second substrate. A Young's modulus of the adhesive layer is smaller than a Young's modulus of the piezoelectric layer. Respective Young's moduli of the second electrode layer and the support layer are larger than the Young's modulus of the adhesive layer. The third laminate has no other piezoelectric layer except for the aforementioned piezoelectric layer. | 04-22-2010 |
20100044879 | Layered chip package and method of manufacturing same - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. The plurality of layer portions include at least one layer portion of a first type and at least one layer portion of a second type. The layer portions of the first and second types each include a semiconductor chip. The layer portion of the first type further includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the layer portion of the second type does not include any electrode connected to the semiconductor chip and having an end face located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end face of each of the plurality of electrodes. | 02-25-2010 |
20100003621 | Etching method for forming a multi-step surface on a substrate - An etching method for forming a multi-step surface on a substrate includes: (1) coating a first photo-resist layer on a predetermined surface of the substrate; (2) coating a second photo-resist layer on the first photo-resist layer, the second photo-resist layer having a characterization opposite to that of the first photo-resist layer; (3) exposing the second photo-resist layer through a first mask so as to form a first removal region; (4) developing the second photo-resist layer to remove the first removal region; (5) exposing the first photo-resist layer through a second mask so as to form a second removal region; (6) developing the first photo-resist layer to remove the second removal region; and (7) etching the predetermined surface of the substrate and the multi-step pattern to form a multi-step surface on the substrate. The present invention also discloses an etching method for forming features on an ABS of a slider. | 01-07-2010 |
20100000433 | Method for bonding slider row bars for photolithography process and method for manufacturing sliders - A method for bonding slider row bars for photolithography process includes steps of: (1) forming a holding device having a sticky surface; (2) providing a plurality of slider row bars each of which has a first surface for forming air bearing surface and a second surface opposite to the first surface, and attaching the slider row bars on the holding device with the first surfaces of the slider row bars facing to the sticky surface; (3) heating the holding device with the slider row bars attached thereon and pressing the second surfaces of the slider row bars to push the slider row bars into the sticky surface; (4) bonding the slider row bars together by an encapsulating glue to form a slider row bar assembly; (5) providing a carrier and bonding the carrier to the second surfaces of the slider row bars; and (6) removing the holding device. The invention also discloses a method for manufacturing sliders. | 01-07-2010 |
20090316306 | Thin film piezoelectric element and its manufacturing method, head gimbal assembly and disk drive unit with the same - A thin film piezoelectric element includes a piezoelectric thin film layer, a seed layer and an elastic substrate layer. The piezoelectric thin film layer is a laminated structure comprising a first electrode layer, a second electrode layer and a piezoelectric layer sandwiched between the first electrode layer and the second electrode layer. The seed layer is formed on the second electrode layer, and the elastic substrate layer is formed on the seed layer. The thin film piezoelectric element is a single layer structure and has an elastic substrate layer for supporting the single layer structure, thereby it has enough stiffness and flexibility to afford facilities for manufacture and assembly and to avoid film peeling and deformation, ultimately increasing the production efficiency and lowering the cost. The invention also discloses a method for manufacturing the thin film piezoelectric element, a head gimal assembly and a disk drive unit with the same. | 12-24-2009 |
20090296275 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film magnetic head has an equidistant two-stage structure in which a first turn part of a first conductor layer and a second turn part of a second conductor layer overlap vertically along the medium-opposing surface while having the same front distance from respective front side faces closer to the medium-opposing surface to the medium-opposing surface. | 12-03-2009 |
20090290271 | Multi-chip module package including external and internal electrostatic discharge protection circuits, and/or method of making the same - Certain example embodiments disclosed herein relate to multi-chip module (MCM) packages that include external and internal electrostatic discharge (ESD) protection circuits, and/or methods of making the same. In certain example embodiments, ESD protection circuits are located under the IO pads in the MCM package, the size of the internal dies' ESD circuits are reduced (e.g., by making them as small as possible in certain example implementations), and high-immunity ESD circuits are provided to the IO pads where they are exposed to the external environment. The external ESD protection circuits may provide a higher level of voltage protection than the internal ESD protection circuits. Thus, the external ESD protection circuits may provide shock protection from human body model shocks, whereas the internal ESD protection circuits may provide protection from machine or assembly model shocks. | 11-26-2009 |
20090290263 | Piezoelectric element and manufacturing method thereof, head gimbal assembly, and disk drive device with the same - A piezoelectric element comprises a first laminated structure body and a second laminated structure body. Side surfaces of the first and the second laminated structure bodies that are parallel to a laminating direction both have at least a portion etched to form a recess so that a step distance is formed between sides of the two adjacent electrode layers that are parallel to the laminating direction. The design of the step distance of the present invention increases insulation resistance between the two adjacent electrode layers on the opposite surfaces of the piezoelectric layer, lowers reject rate, and reduce manufacture cost. The first and the second laminated structure bodies are symmetrically laminated and bonded together, thus optimizing force balancing performance. The recess of the first and second laminated structure body may be filled with insulation resin, which also increases insulation resistance between the two adjacent electrode layers of the piezoelectric layer. The present invention also discloses a method of manufacturing a PZT element, a HGA with the PZT element and a disk drive unit having such HGA. | 11-26-2009 |
20090290246 | Method for testing performance of a magnetic head slider - A method for testing performance of a magnetic head slider includes the steps of: (1) rotating the disk and positioning the slider over the rotating disk at an initial fly-height; (2) exciting the fly-height actuator to make the slider touch the disk and recording a touch down spacing of the read head of the slider; (3) backing off the slider at a predetermined backoff amount from the disk; (4) testing dynamic performance of the slider to obtain a reference value which is related to the spacing between the disk and the slider; (5) varying the initial fly-height of the slider; (6) repeating the steps (2) to (4) with the backoff amount fixed; and (7) calculating a dynamic fly-height gamma ratio based at least in part on the recorded touch down spacing and the obtained reference values. | 11-26-2009 |