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FUJITSU LIMITED
KAWASAKI-SHI, KANAGAWA, JP
1. 20090291525 METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WITH FIRST RESIN LAYER AND SECOND SUBSTRATE WITH SECOND RESIN LAYER ADHERED TO THE FIRST RESIN LAYER 11-26-20092. 20090245162 Communication Systems - method of assessing a potential communication link in a wireless communication system the system comprising a source apparatus 10-01-2009
3. 20090220205 WIRE ACCOMMODATION APPARATUS - wire accommodating apparatus includes a cylindrical portion around which a wire connected to a signal transmission part 09-03-2009
4. 20090219876 RADIO RESOURCE ALLOCATION CONTROL APPARATUS AND METHOD AND BASE STATION 09-03-2009
5. 20090219153 CHECKOUT SYSTEM, CHECKOUT SYSTEM CONTROL PROGRAM, AND CHECKOUT SYSTEM CONTROL METHOD 09-03-2009
6. 20090185479 Communication Systems - uplink transmission method for use in a multi-hop communication system the system comprising a mobile station 07-23-2009
7. 20090140306 Semiconductor device and manufacturing method thereof 06-04-2009
8. 20090131113 BASE STATION APPARATUS AND RECEPTION PROCESSING METHOD THEREOF 05-21-2009
9. 20080282217 METHOD FOR CREATING MASK LAYOUT DATA, APPARATUS FOR CREATING MASK LAYOUT DATA, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 11-13-2008
10. 20080233734 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 09-25-2008
11. 20080206999 METHOD FOR WET ETCHING WHILE FORMING INTERCONNECT TRENCH IN INSULATING FILM 08-28-2008
12. 20080205303 FRAME TRANSMISSION APPARATUS - apparatus including a first interface unit configured to perform frame communication processing with a ring network 08-28-2008
13. 20080203173 RFID TAG AND RFID TAG MANUFACTURING METHOD 08-28-2008
14. 20080197506 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER STRUCTURE 08-21-2008