NIHON SUPERIOR SHA CO., LTD. Patent applications |
Patent application number | Title | Published |
20100266870 | SOLDER JOINT - A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions. | 10-21-2010 |
20090289102 | SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH - Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range. | 11-26-2009 |
20090277302 | METHOD OF COPPER PRECIPITATION IN LEAD-FREE SOLDER, GRANULATION AND SEPARATION OF (CuX)6Sn5 COMPOUNDS AND RECOVERY OF TIN - The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX) | 11-12-2009 |
20080216605 | Method of Depositing Copper in Lead-Free Solder, Method of Granulating (Cux)6Sn5 Compound and Method of Separating the Same, and Method of Recovering Tin - The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX) | 09-11-2008 |