KELK LTD. Patent applications |
Patent application number | Title | Published |
20160141479 | THERMOELECTRIC POWER MODULE - A thermoelectric power module capable of suppressing increase of heat-leakage between a heat exchanger at a higher temperature part and another heat exchanger at a lower temperature part while effectively preventing oxidation of a thermoelectric element, an electrode, and a joint layer for joining the thermoelectric element to the electrode, and preventing a short circuit due to extraneous materials, dew condensation, and so on. The thermoelectric power module includes: a thermoelectric element employing a bismuss-tellurium (Bi—Te) based thermoelectric material; at least one barrier layer disposed on the thermoelectric element; an electrode; an electrode protection layer disposed at least on one principal surface of the electrode; a solder layer having a side surface formed with a recess, the solder layer joining a first region of the electrode protection layer to the at least one barrier layer; and a coating film disposed on a side surface of the thermoelectric element, a side surface of the at least one barrier layer, and the side surface of the solder layer, the coating film covering a second region adjacent to the first region of the electrode protection layer and being filled into the recess of the solder layer. | 05-19-2016 |
20160020376 | THERMOELECTRIC POWER GENERATION DEVICE AND THERMOELECTRIC POWER GENERATION METHOD - A thermoelectric power generation unit is installed to face a steel material, and installed depending on an output of the thermoelectric power generation unit. A thermoelectric power generation device including a thermoelectric power generation unit that converts heat energy which varies in release state into electric energy to recover the energy can thus be provided in a continuous casting line or slab continuous casting line in which a heat source flows. | 01-21-2016 |
20160020375 | THERMOELECTRIC POWER GENERATION DEVICE AND THERMOELECTRIC POWER GENERATION METHOD USING THE SAME - A thermoelectric power generation device includes: a thermoelectric power generation unit; and a transporter capable of moving the thermoelectric power generation unit. A thermoelectric power generation device including a thermoelectric power generation unit that converts heat energy which varies in release state into electric energy to recover the energy can thus be provided in a steel material manufacturing line in which a heat source flows. | 01-21-2016 |
20150212528 | Temperature Controller for Semiconductor Wafer and Temperature Control Method for Semiconductor Wafer - A temperature controller that performs a temperature control on a plurality of temperature adjusters including a reference temperature adjuster to adjust a temperature of a semiconductor wafer includes a setpoint setting section that: sets a temperature detected by a master temperature detector as a control setpoint for a reference one of the temperature adjusters of a master loop, until a temporary setpoint below an actual control setpoint preset as a desired temperature of the semiconductor wafer is reached; and sets the actual control setpoint as the control setpoint for the master loop after the temporary setpoint is reached. | 07-30-2015 |
20140230872 | THERMOELECTRIC GENERATOR - A thermoelectric generator includes: a heat-receiving plate being adapted to receive heat; a cooling plate being maintained at a low temperature as compared with the heat-receiving plate; a thermoelectric module being interposed between the heat-receiving plate and the cooling plate; a terminal block at which a lead wire from the thermoelectric module is connected to an external power line, the terminal block being located on the cooling plate; and a metal cover being fixed on the cooling plate to cover the terminal block. | 08-21-2014 |
20140216516 | THERMOELECTRIC GENERATOR - A thermoelectric generator includes: a heat-receiving plate being adapted to receive heat; a cooling plate being maintained at a low temperature as compared with the heat-receiving plate; a thermoelectric module being interposed between the heat-receiving plate and the cooling plate; a first O-ring being interposed between the heat-receiving plate and the cooling plate to surround an outside of the thermoelectric module; a bolt with which the heat-receiving plate and the cooling plate are connected to each other at an outside of the first O-ring; and an elastic coil spring being provided as an assisting member on the bolt to bias the heat-receiving plate and the cooling plate in a mutually approaching direction. | 08-07-2014 |
20140150463 | THERMOELECTRIC MODULE - A thermoelectric module includes a thermoelectric element and an electrode. The thermoelectric element has a rectangular end face. The electrode includes a first joint portion joined to a center portion of the end face; and a second joint portion joined to one end and a third joint portion joined to the other end. Each of the second joint portion and the third joint portion is disposed at a distance from each of four corners of the end face. A joint length in the second direction orthogonal to the first direction between the first joint portion and the end face is longer than each of a joint length in the second direction between the second joint portion and the end face, and a joint length in the second direction between the third joint portion and the end face. | 06-05-2014 |
20130152605 | FLUID TEMPERATURE ADJUSTING DEVICE - A fluid temperature adjusting device includes: a heater configured to heat a fluid passing through a fluid passageway; a peltier module including a plurality of peltier elements, the peltier module being configured to heat or cool the fluid passing through the fluid passageway; and a controller configured to divide a total thermal energy for keeping the fluid at a target temperature into a thermal energy to be supplied from the heater and a thermal energy to be supplied from the peltier module to give the total thermal energy from both the heater and the peltier module to the fluid. | 06-20-2013 |
20130152604 | FLUID TEMPERATURE ADJUSTING DEVICE - A fluid temperature adjusting device includes: a heater configured to heat a fluid passing through a fluid passageway; a peltier module including a plurality of peltier elements, the peltier module configured to heat or cool the fluid passing through the fluid passageway; and a controller configured to supply thermal energy from both the heater and the peltier module to the fluid and switch magnitudes of an operation amount of the heater and an operation amount of the peltier module when heating the fluid so that the fluid is kept at a target temperature. | 06-20-2013 |
20130098068 | TEMPERATURE CONTROL DEVICE - A temperature control device includes: a top plate; a heat exchanger plate; a thermoelectric module including a temperature-control-side electrode disposed near the top plate, a heat-exchanger-side electrode disposed near the heat exchanger plate and a thermoelectric element of which one side is connected with the temperature-control-side electrode and the other side is connected with the heat-exchanger-side electrode; and a polyimide film provided on the thermoelectric module near the top plate. The thermoelectric module is spaced apart from and surrounded by a seal wall having a ceramic outer circumference and disposed between the polyimide film and the heat exchanger plate. An adhesion sheet or an adhesive is interposed between the seal wall and the polyimide film. | 04-25-2013 |
20110315985 | SENSOR-FITTED SUBSTRATE AND METHOD FOR PRODUCING SENSOR-FITTED SUBSTRATE - A sensor-fitted substrate allowing a sensor-fitted wafer for measuring the temperature or strain to be produced inexpensively, moreover, allowing measurements of the temperature or strain to be carried out with satisfactory accuracy, and a method for producing such a sensor-fitted substrate. An undercoat film is formed on the surface of a substrate, the film being configured, compared to when no undercoat film is formed, to allow the strength of close contact of a dispersed nano-particle ink with the substrate to be increased, the diffusion of the dispersed nano-particle ink into the substrate to be suppressed, and the growth of metal crystal particles contained in the dispersed nano-particle ink to be suppressed. A wiring pattern of the sensor is traced on the surface of the undercoat film of the substrate surface by using the dispersed nano-particle ink, and the dispersed nano-particle ink is baked and metalized. | 12-29-2011 |
20110283715 | TEMPERATURE ADJUSTMENT APPARATUS - A temperature adjustment apparatus suppresses decline in temperature adjustment performance by avoiding even partial impairment of the function of a thermoelectric module in respective zones, which is accomplished due to the presence of terminals. A terminal is provided via an electrode extension section on a heat exchange plate side electrode of the thermoelectric module of inner zones apart from an outermost zone, of four zones. The electrode extension section is disposed at a position which is sandwiched between adjacent thermoelectric elements and over which a temperature adjustment side electrode spans. The terminals are disposed outside the thermoelectric module in the outermost zone. | 11-24-2011 |
20110277983 | TEMPERATURE CONTROLLER, FLUID CIRCULATOR AND TEMPERATURE CONTROL METHOD USING TEMPERATURE CONTROLLER - A temperature controller includes: a closed first circulation circuit having a fluid cooler; a closed second circulation circuit having a halogen lamp heater as a fluid heater and feeding a thermal fluid heated by the halogen lamp heater to a vacuum chamber as an object to be temperature-controlled; a feed path that feeds the thermal fluid from the first circulation circuit to the second circulation circuit; and a discharge path that discharges the thermal fluid from the second circulation circuit and returns the thermal fluid to the first circulation circuit. A flow-rate control valve that adjusts and controls a feed flow-rate of the thermal fluid from the first circulation circuit is provided in the feed path. A pressure control valve that compensates a pressure of the thermal fluid at a predetermined pressure level or less is provided in the discharge path. | 11-17-2011 |
20110066294 | APPARATUS AND METHOD FOR CONTROLLING TEMPERATURE OF SEMICONDUCTOR WAFERS - A manufacturing time of a semiconductor device is shortened by raising and dropping a base temperature of a semiconductor wafer such as silicon wafer to a target temperature at a high speed, a semiconductor device is manufactured with high qualities by making an in-plane temperature distribution of the semiconductor wafer a desired temperature distribution with high accuracy (by uniformizing an in-plane temperature and varying the in-plane temperature distribution for each region), and furthermore, an apparatus with excellent energy efficiency can be simply configured. When the temperature of the semiconductor wafer is controlled to be the target temperature by raising the temperature of the semiconductor wafer, control means performs switching so as to supply a high-temperature circulating liquid at a temperature higher than the target temperature in a high-temperature tank to a channel in a stage, and controls the thermoelectric element in plural zones so that the temperature of the semiconductor wafer coincides with the target temperature and the in-plane temperature distribution of the semiconductor wafer becomes the desired temperature distribution. | 03-17-2011 |
20110048486 | THERMOELECTRIC MODULE - A thermoelectric module includes: a plurality of thermoelectric elements that is electrically series-connected via a plurality of electrodes; and a pair of substrates on which the plurality of electrodes are formed on facing surfaces of the pair of substrates, the pair of substrates being provided perpendicularly to a heat transfer direction with the plurality of thermoelectric elements being interposed. An electrode of an upper substrate includes a first electrode having a size enough to electrically connect the thermoelectric elements that are spaced apart from each other by a distance corresponding to an area equivalent to an adjacent pair of the thermoelectric elements. An electrode of a lower substrate is provided correspondingly to a maximum placement number of the thermoelectric elements interposed between the substrates, and also has a size enough to electrically connect the adjacent pair of the thermoelectric elements. | 03-03-2011 |
20100031989 | THERMOELECTRIC MODULE AND METALLIZED SUBSTRATE - A thermoelectric module ( | 02-11-2010 |
20090236072 | Device and method for adjusting temperature of fluid - An estimator estimates the outlet temperature of fluid at an outlet of heating tanks to which no outlet temperature sensor is provided. For a heating tank to which an outlet temperature sensor is provided, a control unit determines an manipulated variable on the basis of the outlet temperature which has been measured and a target temperature, while it determines an manipulated variable for a heating tank to which no outlet temperature sensor is provided, on the basis of the estimated temperature estimated by the estimator and a target temperature. | 09-24-2009 |