Muhlbauer AG Patent applications |
Patent application number | Title | Published |
20130213456 | METHOD AND APPARATUS FOR MANUFACTURING A SOLAR MODULE AND A SOLAR MODULE HAVING FLEXIBLE THIN FILM SOLAR CELLS - A thin film solar module including a first film web, a series of electrically conductive contact pads arranged at intervals on the first film web, where the contact pads each have a first and a second area, and a series of flexible thin film solar cells. The thin film solar cells each include a first side which at least partially forms a first electrically conductive pole, a second side, which at least partially forms a second electrically conductive pole, a photovoltaically active layer composition, and at least one electrical contact located on the layer composition, which contacts the first electrically conductive pole, wherein the electrical conductor extends past a side of the photovoltaically active layered composition. | 08-22-2013 |
20110278830 | Method for producing an insert leaf for a book-like document - The invention relates to a method for producing an insert leaf for a book-like document, in particular to a method for producing a data page for an identification document. In order to achieve a straightforward method for producing an insert leaf ( | 11-17-2011 |
20110121083 | DEVICE HAVING AN RFID TRANSPONDER IN AN ELECTRICALLY CONDUCTIVE OBJECT AND METHOD FOR PRODUCING SAID DEVICE - The invention concerns an RFID transponder device with at least one substrate and at least one RFID chip, with at least one electrically conductive first surface element, which is at a distance from the substrate and connected electrically to the substrate and/or the RFID chip by means of at least one electrically conductive first connecting element. | 05-26-2011 |
20110102577 | OPTICAL DETECTION DEVICE AND METHOD FOR DETECTING SURFACES OF COMPONENTS - The invention relates to an optical detection device for the detection of at least one surface ( | 05-05-2011 |
20110084473 | IDENTIFICATION DOCUMENT WITH IMPROVED ANTI-TAMPER SECURITY; METHOD OF PRODUCING AN IDENTIFICATION DOCUMENT WHICH FACILITATES DETECTION OF TAMPERING WITH THE IDENTIFICATION DOCUMENT - An identification document has a substrate and a laminating film bonded to the substrate. The surface of the substrate facing the laminating film bears first text, numeric and/or image data detectable with the naked eye at least when illuminated by daylight and a first zone with a fluorescent substance. Under excitation with light in a specific wavelength range the substance fluoresces in colour in a manner detectable with the naked eye. The laminating film has a second zone which bears second text, numeric and/or image data. The first zone of the surface of the substrate and the second zone of the laminating film overlap one another at least partially. | 04-14-2011 |
20100314366 | APPARATUS AND METHOD FOR ARRANGING THROUGH OPENINGS IN A MOVABLE BAND - An apparatus and a method for arranging through-openings in a flexible, movable band, said through-openings being arranged in series in at least one row, wherein each through-opening is arranged in the bottom of one of a plurality of depressions for receiving electronic components, said depressions being arranged in series in at least one row, wherein a laser device with at least one laser beam is arranged so as to act on sides of bottoms of the depressions facing away from the depressions, wherein the laser device is designed in such a way that, by means of the at least one laser beam, the through-openings can be burned into a predefinable portion of the band at predefinable positions on the bottom sides, within a predefinable period of time. | 12-16-2010 |
20100181385 | METHOD FOR PRODUCING AN ANTENNA ON A SUBSTRATE - A simple and universal technique for fabricating different antenna structures, in particular a multilayer antenna structure, on a substrate is disclosed. Before the antenna is actually fabricated or placed on the substrate, connecting surfaces for connecting an antenna conductor and/or a chip or a chip module as well as through-platings extending through the antenna substrate are prepared between the connecting surfaces. | 07-22-2010 |
20100025481 | METHOD FOR PRODUCING AN APPARATUS FOR WIRELESS COMMUNICATION OR FOR PRODUCING A PRELAMINATE FOR SUCH AN APPARATUS - In a method for producing an apparatus for wireless communication, particularly a contactless card, a E-passport, a Smart label or the like, or for producing a prelaminate for such an apparatus, an antenna is produced by applying an antenna structure to a substrate using an additive method, such as metal deposition. The substrate can be made of a PVC or polycarbonate material. A transponder is then produced by connecting a bare chip to the antenna using a direct assembly process, such as a flip-chip process. In a next step, the apparatus or the prelaminate for the apparatus is produced by connecting the transponder to further layers using a laminating method, wherein at least one of the further layers in directly adjoining relationship to the substrate is made of a same material as the substrate. | 02-04-2010 |
20090277346 | EMBOSSING APPARATUS, AND METHOD FOR EMBOSSING CARDS - The invention relates to an embossing apparatus for embossing cards, in particular plastic cards, comprising a feed unit for feeding a card into an embossing region, and an embossing device. The embossing device comprises a displaceable, actuatable embossing die which can be positioned above a position that is to be embossed in the embossing region; a plunger unit which has a displaceable plunger for moving forward the actuatable embossing die, and a striking mechanism for applying pressure to the plunger of the plunger unit in order to carry out an embossing on a card in the embossing region by means of the embossing die. | 11-12-2009 |
20090261074 | THERMODE DEVICE FOR A MULTITUDE OF SEMICONDUCTOR COMPONENTS - A thermode device for connecting and/or electrically contacting a plurality of first semiconductor components to at least one support element and/or to a plurality of second semiconductor components by heating an adhesive under the application of pressure. An example thermode device includes a basic body and a heating element which can be extended out of the basic body and which, under the application of pressure, acts on at least one of the first semiconductor components, wherein the basic body has on its underside a plurality of heating plates which are oriented vertically and are arranged next to one another. Each heating plate has on its end and underside a plurality of the extendable heating elements, to the underside of each of which there is assigned a first semiconductor component. | 10-22-2009 |
20090213365 | Device and method for checking and rotating electronic components - The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips. | 08-27-2009 |