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LINGSEN PRECISION INDUSTRIES, LTD.
TAICHUNG, TW
1. 20090286355 FLIP-CHIP PROCESS BY PHOTO-CURING ADHESIVE 11-19-20092. 20090239341 IC PACKAGING PROCESS - includes the steps of preparing a substrate having a chip-receiving place formed on a front side thereof 09-24-2009
3. 20090236712 IC PACKAGE HAVING REDUCED THICKNESS - includes a lead frame, a chip, and a plurality of bonding wires 09-24-2009
4. 20090178758 METHOD OF ARRANGING STACKED CHIP BY PHOTO-CURING ADHESIVE 07-16-2009