Inventors list |
Agents list |
Assignees list |
List by place |
Classification tree browser |
Top 100 Inventors |
Top 100 Agents |
Top 100 Assignees |
Advanced Semiconductor Engineering, Inc.
KAOHSIUNG, TW
1. 20090261470 CHIP PACKAGE - comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided 10-22-20092. 20090218669 MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME 09-03-2009
3. 20090194227 TOOL AND METHOD FOR PACKAGING LENS MODULE 08-06-2009
4. 20090190025 Image-capturing module and manufacturing method thereof 07-30-2009
5. 20090189626 APPARATUS AND METHOD FOR DETECTING ELECTRONIC DEVICE TESTING SOCKET 07-30-2009
6. 20090184405 Package structure 07-23-2009
7. 20090175312 BONDING STRENGTH MEASURING DEVICE - for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided 07-09-2009
8. 20090170244 METHOD FOR MANUFACTURING A FLIP CHIP PACKAGE 07-02-2009
9. 20090102066 Chip package structure and method of manufacturing the same 04-23-2009
10. 20090102047 Flip chip package structure and carrier thereof 04-23-2009
11. 20090096077 Tenon-and-mortise packaging structure - including a carrier and a chip is provided 04-16-2009
12. 20090091036 Wafer structure with a buffer layer - is provided 04-09-2009
13. 20090079045 Package structure and manufacturing method thereof 03-26-2009
14. 20090065953 Chip module and a fabrication method thereof 03-12-2009
15. 20090051048 Package structure and manufacturing method thereof 02-26-2009
16. 20090051031 Package structure and manufacturing method thereof 02-26-2009
17. 20090039521 Semiconductor structure and semiconductor manufacturing method 02-12-2009
18. 20090019692 METHOD OF CUTTING SIGNAL WIRE PRESERVED ON CIRCUIT BOARD AND CIRCUIT LAYOUT THEREOF 01-22-2009
19. 20080308938 Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure 12-18-2008
20. 20080303128 LEADFRAME WITH DIE PAD AND LEADS CORRESPONDING THERETO 12-11-2008
21. 20080299757 Wafer structure and method for fabricating the same 12-04-2008
22. 20080290489 Package structure and electronic device using the same 11-27-2008
23. 20080283984 Package structure and manufacturing method thereof 11-20-2008
24. 20080252300 Detecting device - for detecting the electrical connection between several first pads and second pads of a package substrate is provided 10-16-2008
25. 20080230887 SEMICONDUCTOR PACKAGE AND THE METHOD OF MAKING THE SAME 09-25-2008
26. 20080230885 CHIP HERMETIC PACKAGE DEVICE AND METHOD FOR PRODUCING THE SAME 09-25-2008
27. 20080218981 PACKAGE STRUCTURE FOR CONNECTION WITH OUTPUT/INPUT MODULE 09-11-2008
28. 20080217758 PACKAGE SUBSTRATE STRIP, METAL SURFACE TREATMENT METHOD THEREOF AND CHIP PACKAGE STRUCTURE 09-11-2008
29. 20080211107 Via hole structure and manufacturing method thereof 09-04-2008