Inventors list |
Agents list |
Assignees list |
List by place |
Classification tree browser |
Top 100 Inventors |
Top 100 Agents |
Top 100 Assignees |
Fairchild Semiconductor Corporation
SOUTH PORTLAND, ME US
1. 20090072362 THERMAL ENHANCED UPPER AND DUAL HEAT SINK EXPOSED MOLDED LEADLESS PACKAGE 03-19-20092. 20080227275 METHOD AND DEVICE WITH DURABLE CONTACT ON SILICON CARBIDE 09-18-2008
3. 20080211014 ULTRA DENSE TRENCH-GATED POWER DEVICE WITH THE REDUCED DRAIN-SOURCE FEEDBACK CAPACITANCE AND MILLER CHARGE 09-04-2008
4. 20080210974 High voltage LDMOS - power semiconductor device having high avalanche capability comprises an N 09-04-2008