SHIBUYA KOGYO CO., LTD. Patent applications |
Patent application number | Title | Published |
20150331018 | ELECTRON BEAM DETECTING DEVICE - An electron beam detecting device detects a state of an electron beam radiated by an electron beam radiation device. A plurality of wire electrodes, which are conductors, are disposed corresponding to a plurality of filaments, the wire electrodes being electrically insulated from each other, in the area in which the electron beams are radiated. The electrical current flowing through each of the wire electrodes is measured by an electric current measuring instrument (measuring unit). A CPU (determining unit) determines the radiation level of the electron beams by receiving a signal output by the electric current measuring instrument. The CPU judges that when the measuring instrument measures a decrease of the current value, an abnormal condition exists in the filament corresponding to the conductor with the lower current value. | 11-19-2015 |
20150139855 | INCUBATOR AND METHOD FOR DECONTAMINATING INCUBATOR - An incubator includes filters in supply passages for supplying an environment-adjusting-medium. Divergent passages are connected to portions of the supply passages upstream from the filters. The divergent passages converge to a single supply/exhaust passage, which is provided with a pump. By driving the pump in a forward or reverse direction, decontamination gas is pumped from a culture space and discharged outside, and open air is introduced into the culture space. After sucking the contamination gas to adsorb it on the filter, open air is introduced so that the contamination gas is discharged into the culture space | 05-21-2015 |
20140352141 | BONDING DEVICE - A boding device includes a light guiding part that guides laser beam oscillated from a laser oscillator, a bonding head that heats a chip with the laser beam, and a bonding head moving part that moves the bonding head between a supply position and a bonding position. The laser oscillator is separated from the bonding head. The light guiding part includes an irradiation barrel that is provided in the vicinity of the bonding position and, a shutter part that is provided in the irradiation barrel, and a light receiving part that is provided in the bonding head and guides the laser beam to the chip. When the bonding head moving part moves the bonding head to the bonding position, the shutter part is opened so that the laser beam from the irradiation barrel is guided to the bonding head through the light receiving part. | 12-04-2014 |
20140290162 | ISOLATOR SYSTEM - An isolator system includes an isolator, a pass box, a clean booth, and a determination gas supply unit. The isolator includes a sterile operation area formed therein and a wearing entity for an operator to operate externally. The pass box is arranged for introducing an object into the sterile operation area. The clean booth, in which an operator can enter, encloses at least an external insertion port of the wearing entity arranged in the isolator and an object inlet port for introducing the object into the pass box, and includes a clean gas supply unit to supply clean gas to an internal space thereof. The decontamination gas supply unit supplies decontamination gas into the sterile operation area and the clean booth. The isolator, the pass box, and the clean booth are arranged in a building. An interior air pressure of the clean booth is maintained equal to or higher than an ambient air pressure in the building, but lower than an interior air pressure of the sterile operation area after the interiors of the sterile operation area and the clean booth are decontaminated with the decontamination gas. | 10-02-2014 |
20130221244 | ELECTRON BEAM IRRADIATION APPARATUS - An electron beam irradiation apparatus is provided that includes a vacuum room, an electron beam generator, a window frame, and an irradiation foil. The vacuum room includes a wall having an opening through which an electron beam is irradiated. An internal atmosphere of the vacuum room is evacuated. The electron beam generator is provided inside the vacuum room. The window frame is attached to and surrounds the opening in the wall of the vacuum room. The irradiation foil, through which an electron beam generated in the vacuum room is transmitted, is fixed to the window frame. The surface of the window frame, at least an area exposed to the vacuum room, is substantially covered with material including an element or elements with an atomic number less than or equal to 10. | 08-29-2013 |
20130182363 | METHOD OF ELIMINATING STATIC CHARGE FROM RESIN VESSEL, METHOD OF STERILIZING AND FILLING RESIN VESSEL, METHOD OF FILLING AND CAPPING RESIN VESSEL, APPARATUS FOR ELIMINATING STATIC CHARGE FROM RESIN VESSEL, AND RESIN VESSEL STERILIZING AND FILLING SYSTEM - To eliminate charges accumulated inside a wall structure of a resin vessel | 07-18-2013 |
20130161532 | ELECTRON BEAM STERILIZER FOR CAP - An electron beam cap-sterilizer radiates an electron beam onto caps while the caps are continuously conveyed. The caps are conveyed in the restricting conveying section while the movements of the caps are restricted, so that the caps roll down freely and separately from each other in the free conveying section. The electron beam radiating device emits electron beams onto the inside of the caps in the lateral direction while the caps are conveyed in the free conveying section. A deflecting device is provided in the free conveying section. The deflecting device is located at the opposite side of the electron beam radiating device to deflect the electron beams emitted by the electron beam radiating device onto the outside of the caps. | 06-27-2013 |
20130098975 | METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS - A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting positions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in positions corresponding to the mounting positions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount. | 04-25-2013 |
20110174442 | BONDING APPARATUS - A bonding apparatus includes: a bonding head having a bonding tool for sucking and holding an electronic part; elevator means lifting up/down the bonding head; a stopper provided to the bonding head; a stopper support that regulates a descending height of the bonding head with engagement with the stopper; distance detection means that detects a distance between the stopper and the stopper support; stopper support elevator means that lifts up/down the stopper support independently from the bonding head; and control means that controls the stopper support elevator means. The control means controls a height of the stopper support so as to keep the distance between the stopper and the stopper support at a predetermined distance by using a signal from the distance detection means until the bump is melted in heating and pressing the electronic part to the substrate. | 07-21-2011 |
20110121055 | BONDING APPARATUS - There is provided a bonding apparatus for holding a semiconductor chip by using a bonding head and bonding the semiconductor chip onto a substrate. The bonding head includes: a holding part for holding the semiconductor chip; gas exhausting means for surrounding the holding part and exhausting gas toward the holding part; and an elevator means for lifting down/up the gas exhausting means to a lift-down state, in which at least a portion of the gas exhausting means protrudes downward from the bottom face of the holding part, and a lift-up state, in which any portion of the gas exhausting means does not protrude downward from the bottom face of the holding part. When the bonding apparatus holds and conveys the semiconductor chip by using the bonding head, the bonding apparatus brings the gas exhausting means to the lift-down state and exhausts the gas toward the semiconductor chip. | 05-26-2011 |
20100127048 | CONDUCTIVE BALL MOUNTING APPARATUS - A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a stage, by arranging a ball reservoir having an opening for reserving a plurality of conductive balls, in the bottom, by moving the ball reservoir along the array mask, by dropping the conductive balls into the individual through holes of the array mask, adopts the following means. Firstly, the conductive ball mounting apparatus comprises moving means for moving the array mask and the stage relative to each other in horizontal directions. Secondly, the positions of the conductive balls in the through holes are arranged by finely moving at least one of the array mask and the stage relative to each other in the horizontal directions after the balls were dropped. | 05-27-2010 |
20100044413 | MINUTE BALL ARRAY APPARATUS - A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls. | 02-25-2010 |
20100044412 | BALL ARRAY MASK AND BALL ARRAY MASK SUPPORTING APPARATUS - A ball array mask includes: a metal mask, which includes through holes into which minute balls are inserted, and which is positioned at a location above an object to be mounted; a hollow frame; a stretchable sheet, edges of the metal mask being affixed to the hollow frame by the stretchable sheet; and projection members that are attached to respective corners of the metal mask so as to pull the metal mask outwardly. | 02-25-2010 |
20090307900 | METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS - A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting positions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in positions corresponding to the mounting positions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount. | 12-17-2009 |
20090071945 | BONDING DEVICE - A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light on the electronic component held by the bonding tool from an inside of the bonding head, the laser heater including a collective unit for condensing laser light emitted from a light source. A focusing point of the laser light condensed by the collective unit is formed inside the bonding head. | 03-19-2009 |
20090057372 | CONDUCTIVE BALL MOUNTING APPARATUS - A conductive ball mounting apparatus includes a stage including a placement surface, stage moving means that moves the stage between a supply position and a mounting position, mounting means that comprises an array mask and mounts the conductive ball to the object to be mounted via the array mask, elevating means that changes a distance between the array mask of the mounting means and the placement surface of the stage, and thickness measuring means provided at the supply position so as to measure a thickness of the object to be mounted placed on the placement surface. The thickness of the object to be mounted is measured at the supply position, and the conductive ball is mounted by controlling the elevating means to set a distance between an upper surface of the array mask and an upper surface of the object to be mounted at the mounting position to a predetermined value in accordance with the measured thickness. | 03-05-2009 |