NEOMAX MATERIALS CO., LTD. Patent applications |
Patent application number | Title | Published |
20160118641 | BATTERY TERMINAL, METHOD FOR MANUFACTURING BATTERY TERMINAL, AND BATTERY - A battery terminal includes a shaft portion and a flange portion. The battery terminal is made of a clad material in which at least a first metal layer and a second metal layer are bonded to each other. Each of the shaft portion and the flange portion includes the first metal layer on a first side in a shaft direction and the second metal layer on a second side in the shaft direction. The first metal layer in the shaft portion includes a protruding portion that further protrudes to the second side in the shaft direction with respect to a surface of the first metal layer on the second side in the shaft direction in the flange portion. | 04-28-2016 |
20150349347 | CLADDING MATERIAL FOR BATTERY COLLECTOR AND ELECTRODE - This cladding material for a battery collector consists of a cladding material having a two-layer structure formed by bonding a first layer arranged on a first surface and constituted of an Al-based alloy and a second layer arranged on a second surface and constituted of a Cu-based alloy to each other by rolling. The ratio of the thickness of the first layer to the total thickness of the first layer and the second layer is not more than 35%. | 12-03-2015 |
20150241847 | HAIRSPRING MATERIAL FOR MECHANICAL TIMEPIECE AND HAIRSPRING USING THE SAME - [Problem] To provide a hairspring material for a mechanical timepiece, a variation in Young's modulus of which can be made smaller than that of conventional ones. [Solution] The hairspring material for a mechanical timepiece of the present invention comprises an alloy which contains 37.5 to 39.5% by mass of Ni, 9.2 to 9.9% by mass of Cr, 0.35 to 0.55% by mass of Ti and 0.6 to 0.9% by mass of Be, based on the total amount of the alloy, and contains a remainder including Fe and unavoidable impurities, said alloy being an alloy containing, as the unavoidable impurities, C (carbon), Mn in an amount of more than 0% by mass but not more than 0.5% by mass and Al in an amount of more than 0% by mass but less than 0.03% by mass, the amount of said C (carbon) being limited to not more than 0.03% by mass. | 08-27-2015 |
20150232244 | COVER MATERIAL FOR HERMETIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT - This cover material for hermetic sealing is a cover material for hermetic sealing employed for a package for containing an electronic component. The cover material | 08-20-2015 |
20150190985 | CHASSIS AND METHOD FOR MANUFACTURING CHASSIS - This chassis ( | 07-09-2015 |
20150086867 | BATTERY TERMINAL, METHOD FOR MANUFACTURING BATTERY TERMINAL, AND BATTERY - A battery terminal includes an overlay clad plate material including at least a first metal layer made of Al or Al alloy and a second metal layer made of Cu or Cu alloy, formed by bonding at least the first metal layer and the second metal layer to each other in the thickness direction. Either the first metal layer or the second metal layer of the clad plate material is partially removed to form an exposure surface on which either the second metal layer or the first metal layer is exposed in the clad plate material. | 03-26-2015 |
20140178755 | NEGATIVE-ELECTRODE TERMINAL FOR CELL - A negative-electrode terminal for a cell in which separation between a first metal layer and a second metal layer hardly takes place is provided by suppressing excess formation of an intermetallic compound on a bond interface between the first metal layer and the second metal layer. This negative-electrode terminal for a cell includes a clad portion formed by bonding a first metal layer made of Al or an Al alloy and a second metal layer containing Ni and Cu and consisting of one or a plurality of layers to each other. The first metal layer includes a connected region connected with a cell terminal connecting plate and a stacked region adjacent to the connected region on the side of the same surface, while the second metal layer is bonded to the first metal layer in the stacked region and configured to be connectable to cell negative electrodes of cells. | 06-26-2014 |
20140099543 | NEGATIVE ELECTRODE TERMINAL FOR BATTERY AND METHOD FOR PRODUCING NEGATIVE ELECTRODE TERMINAL FOR BATTERY - A negative electrode terminal for a battery in which a first metal layer and a second metal layer hardly separate from each other is provided by inhibiting an intermetallic compound from being formed between the first metal layer and the second metal layer. This negative electrode terminal ( | 04-10-2014 |
20140011074 | NEGATIVE ELECTRODE TERMINAL AND COVER MEMBER FOR LITHIUM ION BATTERY, AND LITHIUM ION BATTERY - The present invention relates to a lithium ion battery employed by connecting the positive electrode side to a negative electrode portion made of Cu or a Cu alloy by a bus bar made of Al or an Al alloy and provides a negative electrode terminal for a lithium ion battery capable of providing sufficient bonding strength between the negative electrode portion and the bus bar when the negative electrode portion and the bus bar are metallurgically bonded to each other by resistance welding or the like, for example. This negative electrode terminal for a lithium ion battery is made of a clad material having a first metal layer made of Al or an Al alloy and a second metal layer made of Cu or a Cu alloy bonded to each other through a reaction-suppressing layer suppressing a reaction therebetween. | 01-09-2014 |
20130340820 | METAL SUBSTRATE FOR DYE-SENSITIZED SOLAR CELL - This metal substrate for a dye-sensitized solar cell includes a clad material including a nonporous first metal layer, arranged on an anode side of a dye-sensitized solar cell element, made of a metal having corrosion resistance against an electrolyte of the dye-sensitized solar cell element and a second metal layer made of a metal having lower electrical resistance than the first metal layer and bonded to a side of the first metal layer opposite to the dye-sensitized solar cell element. | 12-26-2013 |
20130316217 | CONNECTION PLATE FOR BATTERY TERMINALS AND METHOD FOR MANUFACTURING CONNECTION PLATE FOR BATTERY TERMINALS - A connection plate for battery terminals capable of inhibiting a base and a battery terminal connection portion from being detached from each other is provided. This connection plate for battery terminals ( | 11-28-2013 |
20130309919 | CONNECTION PLATE FOR BATTERY TERMINALS AND METHOD FOR MANUFACTURING CONNECTION PLATE FOR BATTERY TERMINALS - A connection plate for battery terminals capable of inhibiting a first member and a second member from being detached from each other is provided. This bus bar | 11-21-2013 |
20130252094 | SECONDARY BATTERY NEGATIVE ELECTRODE MATERIAL, SECONDARY BATTERY NEGATIVE ELECTRODE, METHOD FOR MANUFACTURING SECONDARY BATTERY NEGATIVE ELECTRODE MATERIAL, AND METHOD FOR MANUFACTURING SECONDARY BATTERY NEGATIVE ELECTRODE - This secondary battery negative electrode material constitutes an active material layer formed on a current collector layer of a secondary battery negative electrode and includes a Si particle and a coating material containing Ni and P, formed to cover a surface of the Si particle. | 09-26-2013 |
20120292294 | CLADDING MATERIAL FOR LEADS AND METHOD OF WELDING CLADDING MATERIAL FOR LEADS - A cladding material for a lead capable of inhibiting foreign matter from remaining on a surface can be obtained. The cladding material ( | 11-22-2012 |
20120202090 | ALUMINUM BONDING ALLOY, AND CLAD MATERIAL AND ALUMINUM BONDING COMPOSITE MATERIAL EACH HAVING BONDING ALLOY LAYER MADE OF THE ALLOY - An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding. | 08-09-2012 |
20120177943 | METAL SUBSTRATE FOR SOLAR BATTERY AND METHOD OF MANUFACTURING METAL SUBSTRATE FOR SOLAR BATTERY - A metal substrate for a solar battery capable of inhibiting power generation efficiency of a unit solar cell from decrease due to a defect of the unit solar cell is provided. This metal substrate ( | 07-12-2012 |
20120077056 | HIGH-TEMPERATURE BIMETAL - A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C. | 03-29-2012 |
20120058360 | CLAD PLATE - A clad plate includes an aluminum plate and a hard metal plate such as a copper plate, joined together at side end surfaces thereof, the clad plate being excellent in joint strength and flexural separation-resistant characteristics. A side end surface of an aluminum plate and a side end surface of a hard metal plate are jointed together via a nickel layer by pressure welding. A ridge and a groove formed in the side end surface of the aluminum plate are respectively engaged and joined, via the nickel layer, to a groove and a ridge formed in the side end surface of the hard metal plate, and an end portion of the nickel layer extends beyond the rear end portion of the side end surface of the aluminum plate and is jointed to the plate surface of the aluminum plate with the end portion exposed thereon. The average width W of the exposed portion of the nickel layer exposed on the plate surface is preferably in the range from about 0.2 mm to about 1.5 mm. | 03-08-2012 |
20120006884 | CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL - A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability. | 01-12-2012 |
20110318484 | SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME - A silver-coated ball | 12-29-2011 |
20110156982 | SCREW FOR USE IN A RADIO WAVE RECEIVER, METHOD OF MAKING THE SCREW, AND RADIO WAVE RECEIVER USING THE SCREW - A screw for use in a radio wave receiver includes a metal screw body that includes a shank and a head, and an insulation resin layer formed on at least a back of the screw head. In the radio wave receiver, a back cover and a case are secured together firmly by a threaded engagement of a threaded part of the shank, on which no insulation resin layer is formed, with a screw hole formed in the case while the insulation resin layer is disposed therebetween. | 06-30-2011 |
20110048757 | HERMETIC SEALING CAP - A more thinnable hermetic sealing cap can be provided. This hermetic sealing cap ( | 03-03-2011 |
20100273025 | BRAZING METHOD AND BRAZED STRUCTURE - A brazing method which provides a braze joint having excellent corrosion resistance and a brazed structure including such a braze joint includes assembling a first member and a second member to be joined into a temporary assembly, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and composed of a N—Cr alloy essentially including not less than about 15% and not greater than about 40% of Cr, the second member being disposed on the diffusion suppressing layer of the first member with intervention of a brazing material of a Cu—Ni alloy essentially including not less than about 10% and not greater than about 20% of Ni, and maintaining the temporary assembly at a temperature of not less than about 1,200° C. to fuse the brazing material and diffuse Ni atoms and Cr atoms into the fused brazing material from the diffusion suppressing layer to form the braze joint, causing the resulting brazing material of the braze joint to have an increased melting point due to the increase of the Ni and Cr contents of the braze joint to self-solidify the braze joint, and then cooling the resulting assembly. | 10-28-2010 |
20100212456 | METHOD OF MANUFACTURING COMPOSITE BALL FOR ELECTRONIC PARTS - Disclosed is a method of manufacturing a composite ball for electronic parts by preparing a core ball with spherical shape, forming a solder-plated layer encompassing the core ball to obtain a composite ball, and then conducting a smoothing work on the surface of the solder-plated layer, therein the smoothing work is preferably conducted by bringing a medium into contact with the surface of the solder-plated layer. | 08-26-2010 |
20100104887 | AIRTIGHTLY SEALING CAP, ELECTRONIC COMPONENT STORING PACKAGE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT STORING PACKAGE - Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap ( | 04-29-2010 |
20100055539 | FUEL CELL SEPARATOR AND METHOD FOR PRODUCING THE SAME - A separator for a fuel cell according to the present invention includes: a base | 03-04-2010 |
20090301749 | HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND METHOD FOR PRODUCING HERMETIC SEALING CAP - A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap ( | 12-10-2009 |
20090286099 | SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME - A silver-coated ball | 11-19-2009 |
20090283573 | ELECTRODE WIRE MATERIAL AND SOLAR CELL HAVING CONNECTION LEAD WIRE FORMED OF THE WIRE MATERIAL - An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer. | 11-19-2009 |
20090272577 | CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL - A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability. | 11-05-2009 |
20090045506 | Cu-Mo SUBSTRATE AND METHOD FOR PRODUCING SAME - A Cu—Mo substrate | 02-19-2009 |
20090038823 | WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN - A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad. | 02-12-2009 |
20080271908 | Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package - Cap for airtight sealing ( | 11-06-2008 |