MAXIM INTEGRATED PRODUCTS, INC. Patent applications |
Patent application number | Title | Published |
20160116515 | TEMPERATURE COMPENSATED REAL-TIME CLOCK - A temperature compensated real-time clock systems and methods can include: measuring a temperature with a temperature sensor; detecting a temperature dependent frequency from an oscillator; inputting the temperature and determining a temperature estimate for the oscillator with an infinite impulse response filter; and determining a compensation factor, for the oscillator. | 04-28-2016 |
20160099714 | SYSTEMS AND METHODS FOR ENHANCING CONFIDENTIALITY VIA LOGIC GATE ENCRYPTION - Presented are systems and methods that allow hardware designers to protect valuable IP and information in the hardware domain in order to increase overall system security. In various embodiments of the invention this is accomplished by configuring logic gates of existing logic circuitry based on a key input. In certain embodiments, a logic function provides results that are dependent not only on input values but also on an encrypted logic key that determines connections for a given logic building block, such that the functionality of the logic function cannot be determined by reverse engineering. In some embodiments, the logic key is created by decrypting a piece of data using a secret decryption key. Advantages of automatic encryption include that existing circuitry need not be re-implemented or re-built, and that the systems and methods presented are backward compatible with standard manufacturing tools. | 04-07-2016 |
20160098918 | TAMPER DETECTION SYSTEMS AND METHODS FOR INDUSTRIAL & METERING DEVICES NOT REQUIRING A BATTERY - Embodiments of the invention prevent unauthorized access to electronic systems by providing an enclosure with improved intrusion detection around sensitive areas of a secured electronic system. Certain embodiments eliminate the need for constant battery power and yet provide uninterrupted high-security supervision at the device perimeter such that even following a power down event it is possible to determine whether a device has been tampered with, so that appropriate action can be taken. This is especially useful in applications in which batteries are not acceptable. | 04-07-2016 |
20160094125 | THREE PHASES CONTROLLER FOR BUCK-BOOST REGULATORS - Systems, devices and methods using three separate switching phases for a buck-boost regulator are disclosed. The regulator may operate in a boost mode, a buck mode or in a buck-boost mode. The output voltage remains constant through mode changes and the ripple voltage is well-controlled. If the input voltage is lower than the output voltage by a first threshold, the regulator operates in boost (step-up) mode. If the input voltage is higher than the output voltage by a second threshold, it operates in buck (step-down) mode. The regulator operates in the buck-boost mode when the difference between the input and output voltages is within a certain range. | 03-31-2016 |
20160087795 | SECURE MEMORIES USING UNIQUE IDENTIFICATION ELEMENTS - Various embodiments of the invention relate to secure systems and modules, and more particularly, to systems, devices and methods of generating and applying identification elements uniquely associated with memory, memory mapping and encrypted storage. These unique identification elements provide an improved, statistically random source from which keys and memory mappings may be derived. The application of these keys across various architectures result in an improvement in the security of data stored within a system. | 03-24-2016 |
20160072628 | SYSTEMS AND METHODS FOR MANAGING CRYPTOGRAPHIC KEYS IN A SECURE MICROCONTROLLER - The present invention relates to key management in a secure microcontroller, and more particularly, to systems, devices and methods of automatically and transparently employing logic or physical address based keys that may also be transferred using dedicated buses. A cryptographic engine translates a logic address to at least one physical address, and processes a corresponding data word based on at least one target key. The target key is selected from a plurality of keys based on the logic or physical address. A universal memory controller stores each processed data word in the corresponding physical address within a memory. Each key is associated with a memory region within the memory, and therefore, the logic or physical address associated with a memory region may be used to automatically identify the corresponding target key. A dedicated secure link may be used to transport key request commands and the plurality of keys. | 03-10-2016 |
20160042199 | DETECTING AND THWARTING BACKSIDE ATTACKS ON SECURED SYSTEMS - Security devices for protecting ICs from backside security attacks. A security device includes an N− well formed in a substrate, a P+ center disposed in the central region of the N− well, and a P+ ring surrounding the N− well. To prevent latchup, a pair of inner and outer N+ rings is formed in the N− well. When a current source is applied to the P+ center, the current flows through a portion of the substrate and is picked up by the P+ ring. When an attacker mills the substrate or makes a trench in the substrate, the resistance of the substrate changes. By monitoring the voltage difference between the P+ center and P+ ring, the attempt to attack the die can be detected. | 02-11-2016 |
20160040991 | Gyroscope Shock and Disturbance Detection Circuit - The invention relates to integrated circuits, and more particularly, to systems, devices and methods of integrating a gyro sensing circuit with a gyroscope to detect a shock or a disturbance, and accurately differentiate rotation-based sense signals from noises introduced by the shock or disturbance. The gyro sensing circuit may be implemented in a differential or non-differential demodulation scheme, and comprises at least one demodulation unit and a peak detector. The at least one demodulation unit demodulates a gyro output signal provided by the gyroscope with a reference signal. In a demodulated gyro output signal, a shock signal or a gyro disturbance signal is substantially isolated out from interested gyro sense signals that are used to sense a rate of rotation. A peak detector samples the modulated gyro output signal, determines whether the signal exceeds a threshold level V | 02-11-2016 |
20160040990 | Micro-Gyroscope and Method for Operating a Micro-Gyroscope - A micro-gyroscope for determining a rate of rotation about a Z-axis includes a substrate and two sensor devices each of which comprises at least one drive mass, at least one anchor, drive elements, at least one sensor mass and sensor elements. The drive mass is mounted linearly displaceably in the direction of an X-axis, and can be driven in an oscillatory manner with respect to the X-axis. The sensor mass is coupled to the drive mass by means of springs. The sensor mass is displaceable in the Y-direction, and sensor elements detects a deflection of the sensor mass in the Y-axis. The two sensor devices are disposed parallel to each other and one above the other in the direction of the Z-axis, and the drive mass in these two sensor devices are coupled to each other by means of a coupling spring. | 02-11-2016 |
20160033275 | MICRO RATE OF ROTATION SENSOR AND METHOD FOR OPERATING A MICRO RATE OF ROTATION SENSOR - The present invention relates to a method for operating a rotation sensor for detecting a plurality of rates of rotation about orthogonal axes (x,y,z). The rotation sensor comprises a substrate, driving masses, X-Y sensor masses, and Z sensor masses. The driving masses are driven by drive elements to oscillate in the X-direction. The X-Y sensor masses are coupled to the driving masses, and driven to oscillate in the X-Y direction radially to a center. When a rate of rotation of the substrate occurs about the X-axis or the Y-axis, the X-Y sensor masses are jointly deflected about the Y-axis or X-axis. When a rate of rotation of the substrate occurs about the Z-axis, the X-Y sensor masses are rotated about the Z-axis, and the Z sensor masses are deflected substantially in the X-direction. | 02-04-2016 |
20160027226 | METHOD AND DEVICE FOR ISSUING AN ACCESS AUTHORIZATION - A method and a device for issuing an authorization for access to a secured area, particularly a building, a room, a vehicle, a computer system or the like, or for starting a machine, a vehicle, a computer or the like, having a monitoring unit comprising a transmitter, a receiver, and an evaluation device, and having a key, a key card or similar, referred to as a key in short below, having a transmitter, a receiver and an electronic device. A permissible position and/or a permissible distance between the transmitter of the monitoring unit to a permissible key is captured for issuing an authorization, wherein the transmitter of the monitoring unit transmits signals and the key transmits response signals back to the monitoring unit. The permissible position and/or the permissible distance of the key are determined from the signals of the transmitter received by the key, wherein a signal strength of said signals is evaluated in various directions and/or angles. A monitoring unit and a key are suitable for use in a device according to the preceding claims. | 01-28-2016 |
20160025786 | METHOD AND APPARATUS FOR SENSING CAPACITANCE VALUE AND CONVERTING IT INTO DIGITAL FORMAT - A capacitive sensing system are configured to sense a capacitance value and convert the sensed capacitance value to a digital format. The capacitive sensing system provides good selectivity and immunity to noise and interference, which can be further enhanced by enabling spread spectrum excitation. In some embodiments, the capacitive sensing system utilizes a sinusoidal excitation signal that results in low electromagnetic emissions, limited to narrow frequency band. In some embodiments, the capacitive sensing system is configured to operate in a spread spectrum mode, in which the majority of the excitation signal power is carried in the assigned bandwidth. The excitation frequency and the bandwidth of the spread spectrum excitation signal are programmable in a wide range, which allows for avoiding frequency conflicts in the operating environment. | 01-28-2016 |
20160025492 | MEMS Gyroscope for Determining Rotational Movements about an X, Y, and/or Z Axis - The invention relates to a MEMS gyroscope for detecting rotational motions about an x-, y-, and/or z-axis, in particular a 3-D sensor, containing a substrate, several, at least two, preferably four, drive masses ( | 01-28-2016 |
20160018948 | WEARABLE DEVICE FOR USING HUMAN BODY AS INPUT MECHANISM - The invention relates to wearable devices for sensing gestures. A watch, which is a wearable device, includes an ultrasonic system that has an ultrasonic transducer and one or more sensors and measures the location of a finger on the back of the user's hand. Using the ultrasonic system, it is possible to use the back of the hand as an extension to the screen display of the watch. The watch can be used as a motion detector and interface with various types of mobile devices, such as computerized eyeglass. The watch can also function as a generic input mechanism for various types of devices, such as tablet, TV, or laptop computer, where these devices are coupled to the watch via a suitable communication system, such as Bluetooth® interconnection system. | 01-21-2016 |
20160006497 | ELECTRONIC CIRCUIT ARRANGEMENT FOR RECEIVING LOW FREQUENCY ELECTRO-MAGNETIC WAVES WITH AN ADJUSTABLE ATTENUATOR ELEMENT - An electronic circuit arrangement for receiving low-frequency electromagnetic waves is proposed, having an inductor (L) acting as an antenna for generating a received signal, having a first receiver ( | 01-07-2016 |
20160003617 | Method for Detecting Accelerations and Rotation Rates, and MEMS Sensor - The invention concerns a MEMS sensor and a method for detecting accelerations along, and rotation rates about, at least one, preferably two of three mutually perpendicular spatial axes x, y and z by means of a MEMS sensor ( | 01-07-2016 |
20150331065 | BIPOLAR CHOPPING FOR 1/F NOISE AND OFFSET REDUCTION IN MAGNETIC FIELD SENSORS - A chopping technique, and associated structure, is implemented to cancel the magnetic 1/f noise contribution in a Tunneling Magnetoresistance (TMR) field sensor. The TMR field sensor comprises a first bridge circuit including multiple TMR elements to sense a magnetic field and a second circuit to apply a bipolar current pulse adjacent to each TMR element. The current lines are serially or sequentially connected to a current source to receive the bipolar current pulse. The field sensor has an output comprising a high output and a low output in response to the bipolar pulse. This asymmetric response allows a chopping technique for 1/f noise reduction in the field sensor. | 11-19-2015 |
20150330784 | SHOCK-ROBUST INTEGRATED MULTI-AXIS MEMS GYROSCOPE - Various embodiments of the invention integrate multiple shock-robust single-axis MEMS gyroscopes into a single silicon substrate while avoiding the complexities typically associated with designing a multi-drive control system for shock immune gyroscopes. In certain embodiments of the invention, a shock immune tri-axial MEMS gyroscope is based on a driving scheme that employs rotary joints to distribute driving forces generated by two sets of driving masses to individual sensors, thereby, simplifying the control of the gyroscope. | 11-19-2015 |
20150330783 | SYSTEMS AND METHODS FOR MEMS GYROSCOPE SHOCK ROBUSTNESS - Various embodiments of the invention allow for increased shock robustness in gyroscopes. In certain embodiments, immunity against undesired forces that corrupt signal output is provided by a chessboard-pattern architecture of proof masses that provides a second layer of differential signals not present in existing designs. Masses are aligned parallel to each other in a two-by-two configuration with two orthogonal symmetry axes. The masses are driven to oscillate in such a way that each mass moves anti-parallel to an adjacent proof mass. In some embodiments of the invention, a mechanical joint system interconnects proof masses to suppress displacements due to mechanical disturbances, while permitting displacements due to Coriolis forces to prevented erroneous sensor signals. | 11-19-2015 |
20150274505 | MEMS PRESSURE SENSOR WITH IMPROVED INSENSITIVITY TO THERMO-MECHANICAL STRESS - This invention relates generally to semiconductor manufacturing and packaging and more specifically to semiconductor manufacturing in MEMS (Microelectromechanical systems) inertial sensing products. Embodiments of the present invention improve pressure sensor performance (e.g., absolute and relative accuracy) by increasing pressure insensitivity to changes in thermo-mechanical stress. The pressure insensitivity can be achieved by using the array of pressure sensing membranes, suspended sensing electrodes, and dielectric anchors. | 10-01-2015 |
20150268060 | METHOD AND SYSTEM FOR QUADRATURE ERROR COMPENSATION - The present invention concerns an MEMS sensor and a method for compensation of a quadrature error on an MEMS sensor, which is intended for detection of movements of a substrate, especially accelerations and/or rotation rates. At least one mass arranged on the substrate and mounted to move relative to it is driven by means of drive electrodes. The mass/es execute a movement deviating from the prescribed movement due to a quadrature error. A deflection of the mass/es occurring due to Coriolis force and quadrature error is detected with detection electrodes. It is proposed according to the invention that a capacitance change be detected as a function of drive movement of the mass/es by means of compensation electrodes. A compensation charge dependent on the quadrature error of the MEMS sensor is generated on the compensation electrodes. For compensation, the distorted or incorrect charge generated by the quadrature error in the detection electrodes is compensated with the compensation charge. | 09-24-2015 |
20150261641 | ACCESSORY MANAGEMENT AND DATA COMMUNICATION USING AUDIO PORT - A method for accessory management and data communication between a portable electronic device and an accessory via audio port is disclosed. The method involves using a microphone line of the accessory in different communication modes including a MIC data mode and a power mode. In the MIC data mode, the MIC line disconnects from a microphone load to operate on a voltage above a predetermined threshold whenever the accessory needs to communicate with the host electronic device. In the MIC power mode, the MIC line connects with the microphone load for the normal operation of the microphone. | 09-17-2015 |
20150236602 | PREDICTIVE SAMPLING FOR PRIMARY SIDE SENSING IN ISOLATED FLYBACK CONVERTERS - A system comprises a pulse width modulator, a voltage sensing circuit, a pulse generator, and a sampling circuit. The pulse width modulator generates a control signal to control a switch connected to an input voltage via a primary winding and to regulate an output voltage across a secondary winding that is supplied to a load through a component connected in series with the secondary winding. The voltage sensing circuit senses a first voltage across the primary winding that represents the output voltage. The pulse generator generates a single pulse at a sampling time during a first cycle of the control signal, which is determined based on the input voltage, a voltage drop across the switch, an on-time of the switch, and the first voltage sensed during the first cycle. The sampling circuit samples the first voltage based on the single pulse at the sampling time during the first cycle. | 08-20-2015 |
20150206682 | System and Method to Reduce Power Consumption in a Multi-Sensor Environment - Various embodiments of the invention provide for fully-integrated, low-latency power reduction in multi-sensor systems. In certain embodiments, power consumption is minimized by modulating power and mode of operation of gyroscopes, magnetometers, and accelerometers under certain conditions. Certain embodiments provide for reduction of power consumption by the use of emulated gyroscope data. | 07-23-2015 |
20150194097 | ELIMINATING VISIBLE FLICKER IN LED-BASED DISPLAY SYSTEMS - A system includes a driver circuit, a modulator circuit, and a reset circuit. The driver circuit drives a plurality of light emitting diodes via a switch. The switch is controlled by a first signal having a first frequency. The driver circuit controls brightness of the light emitting diodes based on a second signal including a plurality of pulses. The modulator circuit modulates the first signal using a direct sequence spread spectrum modulation. The direct sequence spread spectrum modulation uses a sequence generated based on the first signal. The reset circuit resets the modulator circuit at each of the plurality of pulses of the second signal. The modulator circuit repeats the sequence at each of the plurality of pulses of the second signal. | 07-09-2015 |
20150137782 | Systems and methods to monitor current in switching converters - Various embodiments of the invention increase current monitoring accuracy in switching converters. In particular, certain embodiments of the invention allow reduce noise associated with transients that are typically generated at transitions when power FETs are turn on and off and allow to accurately sense inductor DC current of switching converters, thereby, increase current monitoring accuracy without requiring any blanking circuitry. In certain embodiments of the invention, this is accomplished by an acquisition circuit that dynamically monitors current in various operating modes. A phase frequency detector (PFD) and control circuit in the acquisition circuit automatically align a narrow sampling window and the midpoint of a turn-on signal. Certain embodiments utilize an analog multiplier circuit to sense current in skip mode operation. | 05-21-2015 |
20150121507 | Systems and methods to secure industrial sensors and actuators - Various embodiments of the invention provide for secure data communication in industrial process control architectures that employ a network of sensors and actuators. In various embodiments, data is secured by a secure serial transmission system that detects and authenticates IO-Link devices that are equipped with secure transceivers circuits, thereby, ensuring that non-trusted or non-qualified hardware is prevented from connecting to a network and potentially compromising system behavior. | 04-30-2015 |
20150109785 | WAFER LEVEL LENS IN PACKAGE - A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment. | 04-23-2015 |
20150085418 | SYSTEMS AND METHODS FOR DISCHARGING INDUCTORS WITH TEMPERATURE PROTECTION - An integrated circuit for demagnetizing an inductive load includes a first switch to control current supplied by a voltage supply to the inductive load. A Zener diode includes an anode connected to a control terminal of the first switch and a cathode connected to the voltage supply. A second switch includes a control terminal and first and second terminals. A temperature sensing circuit is configured to sense a temperature of the first switch and to generate a sensed temperature. A comparing circuit includes inputs that receive a reference temperature and the sensed temperature and an output connected to the control terminal of the second switch. | 03-26-2015 |
20150073239 | CONTINUOUS CUFFLESS BLOOD PRESSURE MEASUREMENT USING A MOBILE DEVICE - A mobile blood pressure monitor is described that includes an integrated acoustic device, an optical sensor including at least one of a light source or a pulse oximeter device, and control circuitry coupled to the integrated acoustic device and the optical sensor. Additionally, a mobile electronic device configured to measure blood pressure is described that includes a mobile system and a mobile blood pressure monitor as disclosed above. In implementations, a process for measuring blood pressure includes sensing a heart sound with an integrated acoustic device, measuring a blood pulse rate at a peripheral site with an optical sensor, calculating a pulse wave transit time using a sensed heart sound and a measured blood pulse rate, and correlating a blood pressure using the heart sound and the blood pulse rate. | 03-12-2015 |
20150061920 | Time of arrival delay cancellations - The invention relates to a ranging system for measuring the distance between an interrogator and a transponder. The transponder includes: a signal receiver for receiving a challenge signal from an interrogator; a signal processor for processing the challenge signal and generating a response signal in response to the challenge signal; a buffer for storing the response signal generated by the signal processor; and a signal transmitter for sending the response signal stored in the buffer when the signal processor receives a ranging signal from the interrogator, wherein a time interval between the challenge signal and the ranging signal is known to both transponder and the interrogator. | 03-05-2015 |
20150050777 | Integrated circuit package having surface-mount blocking elements - A first cavity-down ball grid array (BGA) package includes a substrate member and an array of bond balls. The array of bond balls includes a pair of parallel extending rows of outer mesh bond balls and a row of inner signal bond balls that is parallel to the pair of rows of outer mesh bond balls. A surface-mount blocking element is disposed between the row of inner signal bond balls and the pair of rows of outer mesh bond balls. The surface-mount blocking element is either a passive or an active component of the BGA package. In one example, the first cavity-down BGA package is surface-mounted to a second cavity-down BGA package to form a package-on-package (POP) security module. The surface-mount blocking element provides additional physical barrier against the probing of the inner signal bond balls. Sensitive data is therefore protected from unauthorized access. | 02-19-2015 |
20150049498 | GLASS BASED MULTICHIP PACKAGE - In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate. | 02-19-2015 |
20150028455 | METHOD FOR VARIED TOPOGRAPHIC MEMS CAP PROCESS - A device includes sidewalls formed in a wafer surface, where the sidewalls descend to a recessed surface. The recessed surface generally promotes resist coverage on the wafer surface, including corners (e.g., junctions between the wafer surface and various surface topographies, such as cavities, the recessed surface, and so forth) on the wafer. In one or more implementations, a wet etching procedure is used to form the sidewalls and recessed surface. A resist material (e.g., a photoresist material) is deposited onto the wafer surface, where the photoresist fully covers one or more of the top corners of the wafer surface. In one or more implementations, the recessed surface is positioned adjacent a trench formed in the wafer to promote resist coverage on the top surface of the wafer. | 01-29-2015 |
20150022318 | TRANSPONDER - A transponder for receiving a wireless electromagnetic query signal and for transmitting a wireless electromagnetic response signal with a coil acting as a first antenna for generating a first wired electrical incoming signal from the query signal and with at least one further coil acting as an antenna for generating a further wired electrical incoming signal from the query signal, and wherein an axis of the first coil and an axis of the further coil are differently aligned in space, and wherein the coils are assigned at least one means for limiting the voltage of the respective incoming signals, and wherein the incoming signals are routed, respectively, via a first full-wave rectifier for generating a rectified incoming signal, and wherein the rectified incoming signals are routed, respectively, to a current-controlled source of current for generating a current signal that corresponds to the respective incoming signal, and wherein the current signals are routed, respectively, to a peak value of current detector for generating a peak value of current signal, and wherein the peak value of current signals are routed to a comparison arrangement for comparing the generated peak value of current signals, and wherein the comparison arrangement is configured for generating a control signal that indicates the strongest peak value of current signal of the generated peak value of current signals. | 01-22-2015 |
20150011171 | Electronic circuit arrangement for receiving low frequency electromagnetic waves with an adjustable attenuator element - An electronic circuit arrangement for receiving low-frequency electromagnetic waves is proposed, having an inductor (L) acting as an antenna for generating a received signal, having a first receiver ( | 01-08-2015 |
20150008576 | WAFER-LEVEL CHIP-SCALE PACKAGE DEVICE HAVING BUMP ASSEMBLIES CONFIGURED TO FURNISH SHOCK ABSORBER FUNCTIONALITY - Semiconductor devices are described that have bump assemblies configured to furnish shock absorber functionality. In an implementation, a wafer-levelchip-scale package devices include an integrated circuit chip having an array of bump assemblies disposed over the integrated circuit chip. The array of bump assemblies comprises a plurality of first bump assemblies that include solder bumps composed at least substantially of a solder composition (i.e., solder bumps that do not include a core). The array further comprises a plurality of second bump assemblies that includes a solder bump having a core configured to furnish shock absorber functionality to the integrated circuit chip. | 01-08-2015 |
20140376906 | DIRECT REFERENCE SUBTRACTION SYSTEM FOR CONTROL OF OPTICAL TRANSMITTERS - An optical measurement system configured to determine whether an optical transmitter signal requires calibration is disclosed. In an implementation, the system includes an optical transmitter configured to emit electromagnetic radiation in limited spectrums of wavelengths at amplitudes based upon one or more transmission signals, and an optical sensor configured to detect the electromagnetic radiation in the limited spectrums of wavelengths and to generate a signal in response thereto. The system includes reference current sources configured to generate a respective reference current and a switch configured to transition between a first configuration and a second configuration based upon the transmission signals. The reference currents are configured to subtract from the signal generated by the optical sensor such that a difference remains. A comparison device is configured to compare the difference portion to a reference signal and output a signal indicative of the direction in which an optical transmitter driver signal should be adjusted. | 12-25-2014 |
20140375598 | SYSTEM AND METHOD TO DRIVE TOUCH PANEL TO MEASURE HOVER - Techniques in accordance with the present disclosure allow the detection of hover events and/or touch events performed over the touch panel without requiring that the touch panel be equipped with additional hardware and/or materials. In one or more implementations, the apparatus includes a touch panel controller configured to operatively couple to a touch panel sensor. The touch panel sensor includes at least one drive electrode and at least one sense electrode. The touch panel controller includes output circuitry operatively coupled to the at least one drive electrode. The output circuitry is configured to generate drive signals to drive the drive electrode (i.e., drive the touch panel sensor). The touch panel controller also includes input circuitry operatively coupled to the at least one sense electrode. The input circuitry is configured to measure mutual-capacitance between the at least drive electrode and the at least one sense electrode to detect a hover event. The present disclosure is directed to driving a subset of rows (or columns) and senses the subset of the remaining rows (or columns). Thus, the same sensor can measure multi-touch event and hover without changes to sensor pattern. | 12-25-2014 |
20140375487 | MDAC with differential current cancellation - Various embodiments of the invention provide for cancellation of a residue amplifier output charging current at the reference voltage source of the reference buffer thereby preventing the charging current from altering the effective reference voltage of a reference buffer. In certain embodiments, current cancellation is accomplished by subtracting a current of the same magnitude. | 12-25-2014 |
20140361879 | Transponder - Proposed is a transponder for receiving a wireless electromagnetic interrogation signal and for transmitting a wireless electromagnetic response signal with a first coil acting as an antenna for generating a first wired electrical receive signal from the interrogation signal, and with at least one further coil acting as an antenna for generating a further wired electrical receive signal from the interrogation signal, wherein an axis of the first coil and an axis of the further coil are aligned differently in the space, wherein in each case one full-wave rectifier for rectifying the respective receive signal is assigned to the coils, wherein a summing element for summing up the rectified receive signals generated by the full-wave rectifiers is provided in order to generate in this manner a pulsating sum signal, the frequency of which corresponds to twice the frequency of the interrogation signal. | 12-11-2014 |
20140361480 | PRECISION ALIGNMENT UNIT FOR SEMICONDUCTOR TRAYS - A precision alignment unit and techniques are described that include a tray assembly configured to be used in a testing system, where the tray assembly includes at least one pocket formed in the tray assembly, the pocket configured to contain an integrated circuit chip, and at least one pin pass-through, and a device positioning unit including at least one alignment device configured to extend through the at least one pin pass-through. In implementations, a process for using the precision alignment system that employs the techniques of the present disclosure includes mounting a precision alignment unit to a vacuum chuck of a handler; loading at least one alignment tray into the handler; placing the at least one alignment tray on the precision alignment unit; and aligning at least one integrated circuit chip device disposed on the at least one alignment tray. | 12-11-2014 |
20140354328 | Programmable mixed-signal input/output (IO) - Techniques are described for providing highly integrated and configurable IO ports for integrated circuits that can be individually configured for a variety of general purpose digital or analog functions, such as multiple channel analog-to-digital converters (ADC), multiple channel digital-to-analog converters (DAC), multiplexers, GPIOs, analog switches, switch and multiplexers, digital logic level translators, comparators, temperature sensors and relays, and so forth. The configurations of individual ports can be set by a configuration register that can, for instance, designate the function and voltage range of the port without impacting the other ports. In embodiments, logic mapping of a port order sequence can be defined. A data register can also be included for handling microcontroller commands and storing conversion results from, for instance, a port functioning as an ADC input port. These capabilities can be combined with its multi-range, high voltage and high current capability to increase functionality. | 12-04-2014 |
20140347311 | CAPACITIVE TOUCH PANEL CONFIGURED TO SENSE BOTH ACTIVE AND PASSIVE INPUT WITH A SINGLE SENSOR - A capacitive touch panel includes sense electrodes arranged next to one another and drive electrodes arranged next to one another across the sense electrodes. The drive electrodes and the sense electrodes define a coordinate system where each coordinate location comprises a capacitor formed at a junction between one of the drive electrodes and one of the sense electrodes via mutual capacitance between the electrodes. The drive electrodes are configured to receive a first signal from a driver coupled with the drive electrodes for powering the drive electrodes to sense passive input to the capacitive touch panel at each coordinate location. Passive input can also be sensed via self-capacitance of the capacitive touch panel sensors. The drive electrodes and the sense electrodes are configured to receive a second signal from an active stylus to sense active input to the capacitive touch panel at each coordinate location. | 11-27-2014 |
20140341398 | MULTICHANNEL DIGITAL AUDIO INTERFACE - A multichannel input device with automatic number-of-channels detection includes an automatic channel and bit depth detector, a digital audio interface (DAI), an analog device, and a digital-to-analog converter (DAC) coupling the DAI to the analog device. The automatic number-of-channels and bit depth detector has a BCLK input, a LRCLK input, a number of channels NCHAN output, and a bit depth B output. The DAI has a data DIN input, the BCLK input, the LRCLK input, an NCHAN input and a B input and has an output including data associated with an assigned channel. | 11-20-2014 |
20140341230 | Method and Apparatus for Controlling a Multichannel TDM device - A method for developing TDM data with embedded control data includes obtaining signal data and control data, formatting the signal data and the control data into a plurality of channels of a DIN signal, and transmitting the DIN signal on one line of a 3-bit TDM bus. A multichannel input device includes a control extractor receptive to the three-bit TDM bus and operative to extract CNTL data from the DIN data, a DAI receptive to the 3-bit TDM bus and the channel select input and operative to develop a SIGNAL data output, and a DAC block including a DAC, the DAC block being receptive to the SIGNAL data and the CNTL data. | 11-20-2014 |
20140312690 | SYSTEM AND METHOD FOR SEQUENTIALLY DISTRIBUTING POWER AMONG ONE OR MORE MODULES - A programmable power distributing sequencer including a plurality of internal regulators, an internal memory adapted to store a user programmable script including instructions for sequentially enabling and disabling the regulators, and a controller adapted to enable and disable the regulators based on the script. The controller may receive the user programmable script from a programming source, such as an applications processor, an external memory, or external programming device. Before using the user programmable script, the controller may execute a default script stored in the internal memory to initially power up the programming source. The sequencer may further include an external port for similarly controlling one or more external regulators. The port may also be used to connect multiple sequencers together, such as in a cascaded, hierarchical, and/or redundant manner. Additionally, the sequencer may include a fault detection module for detecting faulty operating regulators. | 10-23-2014 |
20140301005 | Low Side NMOS Protection Circuit for Battery Pack Application - An electric circuit comprising means for communicating with an external device coupled to means for measuring the charge condition of an external battery. In some embodiments, the circuit comprises at least one level shifter for changing the reference voltage of communication signals. In some embodiments, the circuit comprises a first driver and a second driver for driving external switching elements for the controlled charge and discharge of the battery. | 10-09-2014 |
20140300425 | ELECTRO-MECHANICAL RESONANCE LOOP - The invention relates to a controller, and more particularly, to systems, devices and methods of controlling a sensor having a resonating mass. The controller includes: an analog-to-digital converter (ADC) unit for extracting a digitized sensor signal from the sensor signal; a phase controller for generating, based on the digitized sensor signal, a phase-controlled signal that is locked in phase with the digitized sensor signal; an amplitude controller for applying a gain to the digitized sensor signal to thereby generate an amplitude-adjusted signal; a modulator for modulating the amplitude-adjusted signal to thereby generate a modulated signal; and a phase shifter for shifting the phase of the modulated signal by 90 degrees. The output signal from the phase shifter is amplified and input to the drive for exciting the resonating mass, to thereby form a closed resonance loop for controlling the oscillation amplitude of the resonating mass. | 10-09-2014 |
20140300415 | INPUT COMMON MODE CONTROL USING A DEDICATED COMPARATOR FOR SENSOR INTERFACES - Various embodiments of the invention allow for low-noise, high performance input common mode voltage control in capacitive sensor front end amplifiers. In certain embodiments overcome the shortcomings of the prior art by implementing a full voltage swing common mode voltage comparator in a parallel feed-forward path to compensate large common mode input signal variations. | 10-09-2014 |
20140300331 | Systems and Methods to Control DC/DC Multiphase Switching Regulators - Various embodiments of the invention provide extend the switching frequency range of DC/DC multiphase switching regulators in order to overcome prior art frequency limitations in the number of available phases, for example, in low input to output ratio applications. In certain embodiments, this is accomplished by enabling partial overlap between multiple phases using asynchronous logic. The invention is easily scalable without introducing significant silicon area penalties. | 10-09-2014 |
20140300329 | Systems and Methods to Auto-Adjust Zero Cross Circuits for Switching Regulators - Various embodiments of the present invention provide for an adaptive and accurate zero cross circuit that can operate without directly sensing an inductor current. Certain embodiments allow adjustment of a zero crossing condition while eliminating the need for a blanking time. In certain embodiments this is accomplished by detecting the effects of turning off a switch on a switching node voltage of a buck converter. | 10-09-2014 |
20140299664 | SECURE PAYMENT CARD INTERFACE - The invention relates to a smartcard reader, and more particularly, to systems, devices and methods of creating a card input/output interface that allows the smartcard reader to couple to a smartcard within a secure cavity. The secure cavity is mounted on an internal side of a system housing, i.e., a smartcard socket, included in the smartcard reader. An interface chip is further attached inside the secure cavity. When the smartcard is inserted to a designated position or depth inside the system housing, the secure cavity encloses the interface chip and its contact area with the smartcard. Mechanical contacts on the interface chip are thus aligned to and physically contact electrical connectors on the inserted smartcard, so as to electrically couple the interface chip and the smartcard. As a result, sensitive data within the smartcard may be protected from exposure to any tamper attempt and processed with an enhanced security level. | 10-09-2014 |
20140298910 | MICROELECTROMECHANICAL Z-AXIS OUT-OF-PLANE STOPPER - The present invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of incorporating z-axis out-of-plane stoppers that are controlled to protect the structure from both mechanical shock and electrostatic disturbance. The z-axis out-of plane stoppers include shock stoppers and balance stoppers. The shock stoppers are arranged on a cap substrate that is used to package the structure. These shock stoppers are further aligned to a proof mass in the structure to reduce the impact of the mechanical shock. The balance stoppers are placed underneath the proof mass, and electrically coupled to a balance voltage, such that electrostatic force and torque imposed by the shock stoppers is balanced by that force and torque generated by the balance stoppers. This structure is less susceptible to mechanical shock, and shows a negligible offset that may be induced by electrostatic disturbance caused by the shock stoppers. | 10-09-2014 |
20140298909 | Micro-Electromechanical Structure with Low Sensitivity to Thermo-Mechanical Stress - The invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of compensating the effect of the thermo-mechanical stress by incorporating and adjusting elastic elements that are used to couple a moveable proof mass to anchors. The proof mass responds to acceleration by displacing and tilting with respect to a moveable mass rotational axis. The thermo-mechanical stress is accumulated in the structure during the courses of manufacturing, packaging and assembly or over the structure's lifetime. The stress causes a displacement on the proof mass. A plurality of elastic elements is coupled to support the proof mass. Geometry and configuration of these elastic elements are adjusted to reduce the displacement caused by the thermo-mechanical stress. | 10-09-2014 |
20140284462 | OPTICAL GESTURE SENSOR HAVING A LIGHT MODIFYING STRUCTURE - A gesture sensing device includes a single light source and a multiple segmented single photo sensor, or an array of photo sensors, collectively referred to herein as segmented photo sensors. A light modifying structure relays reflected light from the light source onto different segments of the segmented photo sensors. The light modifying structure can be an optical lens structure or a mechanical structure. The different segments of the photo sensor sense reflected light and output corresponding sensed voltage signals. A control circuit receives and processes the sensed voltage signals to determine target motion relative to the segmented photo sensor. | 09-25-2014 |
20140281628 | Always-On Low-Power Keyword spotting - The invention relates to an electronic device that includes a wake-up system that operates at a substantially low power level and is applied to wake up the electronic device from a sleep mode. The wake-up system comprises a sound transducer that converts a received sound signal to an electrical signal and a keyword detection logic that preliminarily identifies a speech energy profile that corresponds to at least one of a plurality of keywords in a part of the electrical signal. In some embodiments, a keyword finder is further activated to identify with an enhanced accuracy whether the at least one keyword exists in the part of the electrical signal, and generates a wake-up control to activate a host of the electronic device from its sleep mode. | 09-18-2014 |
20140281484 | System and Method to Securely Transfer Data - Various embodiments of the invention achieve optimal data security by adding a security layer to data at the point of generation. Some embodiments add a security feature to data that controls or configures a device at a physical interface. | 09-18-2014 |
20140268341 | PLANAR DIFFRACTIVE OPTICAL ELEMENT LENS AND METHOD FOR PRODUCING SAME - A planar diffractive optical element (DOE) lens is described herein. The planar DOE lens includes a substrate. The planar DOE lens further includes a first layer, the first layer being formed upon the substrate. The planar DOE lens further includes a diffractive optical element, the diffractive optical element being formed upon the first layer. The planar DOE lens further includes a second layer, the second layer being formed upon the first layer. The second layer is also formed over the diffractive optical element. The second layer encloses the diffractive optical element between the first layer and the second layer. The second layer includes a planar surface. | 09-18-2014 |
20140266135 | MULTI-LEVEL STEP-UP CONVERTER TOPOLOGIES, CONTROL AND SOFT START SYSTEMS AND METHODS - A multi-level, step-up converter circuit includes an inductor including one terminal in communication with an input voltage supply. N transistor pairs are connected in series, where N is an integer greater than one. First and second transistors of a first pair of the N transistor pairs are connected together at a node. The node is in communication with another terminal of the inductor. Third and fourth transistors of a second pair of the N transistor pairs are connected to the first and second transistors, respectively. (N−1) capacitors have terminals connected between the N transistor pairs, respectively. An output capacitor has a terminal in communication with at least one transistor of the N transistor pair. | 09-18-2014 |
20140266134 | SOFT START SYSTEMS AND METHODS FOR MULTI-STAGE STEP-UP CONVERTERS - A control circuit for a step-up converter includes a soft start module configured to control states of N transistor pairs of the step-up converter, where N is an integer greater than two. A driver module is in communication with the soft start module and configured to generate a first signal when N transistor pairs of the step-up converter are ready to switch. A first charging circuit is configured to charge (N−1) capacitors of the step-up converter to an input voltage of the step-up converter in response to the first signal and to generate a second signal when charging is complete. A second charging circuit is configured to sequentially charge the (N−1) capacitors of the step-up converter to (N−1) predetermined voltage values in response to the first signal and the second signal and before operation of the step-up converter begins. | 09-18-2014 |
20140264711 | LIGHT SENSOR WITH VERTICAL DIODE JUNCTIONS - Light sensors are described that include a trench structure integrated therein. In an implementation, the light sensor includes a substrate having a dopant material of a first conductivity type and multiple trenches disposed therein. The light sensor also includes a diffusion region formed proximate to the multiple trenches. The diffusion region includes a dopant material of a second conductivity type. A depletion region is created at the interface of the dopant material of the first conductivity type and the dopant material of the second conductivity type. The depletion region is configured to attract charge carriers to the depletion region, at least substantially a majority of the charge carriers generated due to light incident upon the substrate. | 09-18-2014 |
20140253459 | CHIP-ON-GLASS FOR TOUCH APPLICATIONS - A touch panel assembly device implementing chip-on-glass technology and a method (e.g., process) for making same are described herein. The touch panel assembly includes a touch panel (e.g., a capacitive touch panel). The touch panel includes a substrate formed of insulator material (e.g., glass). The touch panel also includes a plurality of conductors (e.g., transparent conductors, indium tin oxide traces) formed on the substrate. The touch panel assembly further includes an integrated circuit (e.g., a touch chip). The integrated circuit is disposed upon the substrate and is connected (e.g.., mechanically and electrically connected) to one or more conductors included in the plurality of conductors. The integrated circuit is communicatively coupled with the touch panel. | 09-11-2014 |
20140252592 | PAD DEFINED CONTACT FOR WAFER LEVEL PACKAGE - A device and fabrication techniques are described that employ wafer-level packaging techniques for fabricating semiconductor devices that include a pad defined contact. In implementations, the wafer-level package device that employs the techniques of the present disclosure includes a substrate, a passivation layer, a top metal contact pad, a thin film with a via formed therein, a redistribution layer structure configured to contact the top metal contact pad, and a dielectric layer on the thin film and the redistribution layer structure. In implementations, a process for fabricating the wafer-level package device that employs the techniques of the present disclosure includes processing a substrate, forming a passivation layer, depositing a top metal contact pad, forming a thin film with a via formed therein, forming a redistribution layer structure in the via formed in the thin film, and forming a dielectric layer on the thin film and the redistribution layer structure. | 09-11-2014 |
20140252571 | WAFER-LEVEL PACKAGE MITIGATED UNDERCUT - A wafer-level package device and techniques are described that include utilizing a dry-etch process for mitigating metal seed layer undercut. In an implementation, a process for fabricating the wafer-level package device that employs the techniques of the present disclosure includes processing a substrate, depositing a metal seed layer on the substrate, depositing and patterning a resist layer, depositing a redistribution layer structure, removing the photoresist layer, and dry-etching the metal seed layer. In implementations, the wafer-level package device that employs example techniques in accordance with the present disclosure includes a substrate, a metal seed layer disposed on the substrate, and a redistribution layer structure formed on the metal seed layer. The metal seed layer is dry-etched so that undercut is mitigated. | 09-11-2014 |
20140247032 | SYSTEMS AND METHODS FOR FEED-FORWARD CONTROL OF LOAD CURRENT IN DC TO DC BUCK CONVERTERS - A system for controlling load current in a voltage converter includes a current normalization module that receives a first measurement corresponding to the load current, receives a second measurement corresponding to an inductor current, and matches a first gain of the first measurement corresponding to the load current to a second gain of the second measurement corresponding to the inductor current to generate a normalized load current. A feed-forward generation module receives the normalized load current from the current normalization module and generates a load current feed-forward (LCFF) signal based on the normalized load current. A duty cycle generation module generates a duty cycle used to control the voltage converter based on a commanded output voltage of the voltage converter and the LCFF signal. | 09-04-2014 |
20140240280 | TOUCH PANEL SENSOR HAVING DUAL-MODE CAPACITIVE SENSING FOR DETECTING AN OBJECT - An apparatus configured to determine an approximate position of an object utilizing mutual-capacitance sensing capabilities during a first mode of operation and determining one or more attributes of the object utilizing self-capacitance sensing capabilities during a second mode of operation is disclosed. The apparatus includes a touch panel controller configured to operatively couple to a touch panel sensor. The touch panel sensor includes a plurality of drive electrodes and at least one sense electrode. A plurality of nodes are formed at the intersections of the plurality of drive electrodes and the at least one sense electrode. The touch panel controller is configured to determine an approximate position of an object performing a touch event over the touch panel sensor during the first mode of operation and to determine one or more attributes of the object during the second mode of operation. | 08-28-2014 |
20140232456 | Fast-Settling Capacitive-Coupled Amplifiers - Fast-settling capacitive-coupled amplifiers are disclosed. The amplifiers use two Capacitive Coupled paths embedded in a Multipath Hybrid Nested Miller Compensation topology. One path is a direct high frequency path and the other path is a slower stabilization path. This combination results in a flat frequency response to and through the chopper frequency, and a fast settling response. Various exemplary embodiments are disclosed, including operational amplifier and instrumentation amplifier configurations. | 08-21-2014 |
20140231635 | MULTICHIP WAFER LEVEL PACKAGE (WLP) OPTICAL DEVICE - Optical devices are described that integrate multiple heterogeneous components in a single, compact package. In one or more implementations, the optical devices include a carrier substrate having a surface that includes two or more cavities formed therein. One or more optical component devices are disposed within the respective cavities in a predetermined arrangement. A cover is disposed on the surface of the carrier substrate so that the cover at least substantially encloses the optical component devices within their respective cavities. The cover, which may be glass, is configured to transmit light within the predetermined spectrum of wavelengths. | 08-21-2014 |
20140230550 | Accelerometer with Low Sensitivity to Thermo-Mechanical Stress - The invention relates to a microelectro-mechanical structure (MEMS), and more particularly, to systems, devices and methods of compensating effect of thermo-mechanical stress on a micro-machined accelerometer by incorporating and adjusting elastic elements to couple corresponding sensing electrodes. The sensing electrodes comprise moveable electrodes and stationary electrodes that are respectively coupled on a proof mass and a substrate. At least one elastic element is incorporated into a coupling structure that couples two stationary electrodes or couples a stationary electrode to at least one anchor. More than one elastic element may be incorporated. The number, locations, configurations and geometries of the elastic elements are adjusted to compensate an output offset and a sensitivity drift that are induced by the thermo-mechanical stress accumulated in the MEMS device. | 08-21-2014 |
20140210539 | Low Distortion MOS Attenuator - An attenuation circuit uses a voltage controlled variable resistance transistor as a signal attenuator for receivers operating in the zero Hz to about 30 MHz range. The transistor functions in the linear region to linearize the transistor resistance characteristics used for signal attenuation. In an exemplary application, the attenuation circuit is used as an RF attenuator for AM radio broadcast receivers and amplifiers with automatic gain control. Multiple attenuation circuits can be coupled in parallel, each attenuation circuit having a different sized variable resistance transistor, to form sequentially activated stages that increase the range of attenuation while minimizing distortion. | 07-31-2014 |
20140198025 | SYSTEM AND METHOD FOR DISCERNING COMPLEX GESTURES USING AN ARRAY OF OPTICAL SENSORS - A method for gesture determination (e.g., discerning complex gestures) via an electronic system (e.g., a gesture sensing system) including an array of optical sensors is described herein. The method includes detecting a plurality of sub-gestures (e.g., simple gestures provided by a target located proximate to the system) via the array of optical sensors. The sensors generate signals based upon the detected (e.g., received) sub-gestures and transmit the signals to a processor of the gesture sensing system. The processor processes the signals to obtain data associated with the sub-gestures and analyzes the sub-gesture data to determine if the sub-gestures collectively constitute a gesture (e.g., complex gesture). When the analyzing indicates that the sub-gestures collectively constitute a complex gesture, the gesture sensing system detects the complex gesture. | 07-17-2014 |
20140183747 | MULTI-DIE, HIGH CURRENT WAFER LEVEL PACKAGE - Wafer-level package semiconductor devices for high-current applications are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar. The wafer-level package device also includes an integrated circuit chip device (e.g., small die) configured upon the integrated circuit chip (e.g., large die). In the wafer-level package device, the height of the integrated circuit chip device is less than the height of the pillar and/or less than the combined height of the pillar and the one or more solder contacts. | 07-03-2014 |
20140169571 | DIRECT MEASUREMENT OF AN INPUT SIGNAL TO A LOUDSPEAKER TO DETERMINE AND LIMIT A TEMPERATURE OF A VOICE COIL OF THE LOUDSPEAKER - Aspects of the disclosure pertain to a system and method for providing temperature limiting for a voice coil of a speaker. The system and method provide the aforementioned temperature limiting based upon monitoring (e.g., measurement) of an amplifier output signal provided to the speaker. Providing the aforementioned temperature limiting promotes improved protection for the speaker. | 06-19-2014 |
20140167996 | CURRENT-STEERING DIGITAL-TO-ANALOG CONVERTER WITH CANCELLATION OF DYNAMIC DISTORTION - A digital-to-analog converter (DAC) includes, in a segment of the DAC, a first switch and a second switch. The first switch includes a first pair of transistors having a first set of inputs and has a first output connected to an output of the DAC. The second switch includes second and third pairs of transistors having second and third sets of inputs, respectively, and has a second output that is connected to the output of the DAC. A driver module generates control signals to drive the first, second, and third sets of inputs based on data received by the DAC for conversion from digital to analog format at a conversion rate determined by a clock. The control signals toggle one of the first and second switches during each cycle of the clock. | 06-19-2014 |
20140167252 | LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WAFER-LEVEL PACKAGING (WLP) PACKAGES - Techniques are described herein for a dip soldering process which provides a low-profile, low-cost solder bump formation process which may be implemented to promote package thickness scaling (e.g., reduce the overall package thickness). For example, the dip soldering process disclosed herein may enable ultra-thin wafer-level packages (WLP), ultra-thin wafer level quad-flat no-leads (WQFN) packages, or the like. | 06-19-2014 |
20140161200 | System to Determine Associated Electronic Devices - Various embodiments of the invention allow for electronic labeling and identification of electronic equipment. Contact-based and contactless systems and methods to electronically associate hardware are described. | 06-12-2014 |
20140152479 | DIGITAL TO ANALOG CONVERTERS WITH ADJUSTABLE OUTPUT RESOLUTION - A digital to analog converter (DAC) includes: first and second nodes; a first switching device; a second switching device; and a switch control module. The switch control module selectively configures the first and second switching devices such that: in a first configuration, the first switching device connects a first current to the first node and the second switching device connects a second current to the second node; in a second configuration, the first switching device connects the first current to the second node and the second switching device connects the second current to the first node; and in a third configuration, the first and second switching devices disconnect the first current and the second current from the first and second nodes. | 06-05-2014 |
20140152328 | CONTINUOUS TIME CORRELATOR ARCHITECTURE - A system includes a signal generator and a correlator. The signal generator outputs a first signal to a first end of a capacitance to be measured. The correlator is connected to an output of the signal generator that outputs the first signal and to a second end of the capacitance. The correlator receives the first signal from the output of the signal generator and receives a second signal from the second end of the capacitance. The correlator correlates the first signal and the second signal and generates an output signal based on a correlation between the first signal and the second signal. The output signal is proportional to a capacitance value of the capacitance. | 06-05-2014 |
20140145997 | DUAL-MODE CAPACITANCE SENSING IN A TOUCH PANEL SENSOR - A touch panel sensor system configured to measure mutual-capacitance and self-capacitance is disclosed. The touch panel sensor system includes a sensor configured to detect a change in capacitance associated with a touch event upon a touch panel and a measuring component. The measuring component is configured to detect mutual-capacitance during the first mode of operation and to detect self-capacitance during the second mode of operation. The system also includes a selection component that is configured to receive a selection signal to cause selection of the mode of operation. The system also includes a driver component coupled to the selection component and configured to generate a drive signal, which is furnished to the sensor during the first mode of operation and furnished to the measuring module during the second mode of operation. The amplitude characteristic of the drive signal may have differing values for the first and second modes of operation. | 05-29-2014 |
20140145669 | Simple and High Efficiency Balancing Circuits and Methods for Hybrid Batteries - A balancing circuits and methods for hybrid batteries having two different rechargeable batteries that are coupled in series includes coupling a fuel gauge to each battery to determine the state of charge of each battery, comparing the state of charge of the two batteries, and if the state of charge of the two batteries is more than a predetermined difference, then enabling a switching converter to source current to a node between the batteries or to sink current from the node between the batteries, as required to tend to equalize the state of charge of the two batteries. | 05-29-2014 |
20140140535 | Dynamic Speaker Management for Multichannel Audio Systems - A multiband limiter with selective sideband linking includes first and second frequency band splitters, a first and second plurality of limiters, first and second summers, and a plurality of selectable links coupling the first plurality of limiters to the second plurality of limiters. The first plurality of limiters each have a band input coupled to one of the first plurality of band outputs, a link port and a limiter output, and the first summer is receptive to the limiter outputs of the first plurality of limiters and has a first channel output. The second plurality of limiters each have a band input coupled to one of the second plurality of band outputs, a link port and a limiter output, and the second summer is receptive to the limiter outputs of the second plurality of limiters and has a second channel output. | 05-22-2014 |
20140139107 | LED Lighting System and Method - Various embodiments of the invention allow LED lamp fixtures to pass EMI testing irrespective of whether the lamp fixture is operated by a magnetic transformer or an electric transformer without causing input current waveform distortion and without defeating transformer compatibility. In certain embodiments, the type of transformer is determined based on detecting characteristic voltage waveforms and based that determination an EMI filter is automatically switched in and out of the lamp circuit. | 05-22-2014 |
20140135078 | Dynamic Speaker Management with Echo Cancellation - A system for echo cancellation includes a dynamic speaker management (DSM) module, a current/voltage sensing amplifier, a sound pressure level (SPL) model module and an echo canceller. The example DSM module is receptive to a far-end signal and is operative to develop a modified far-end signal and a plurality of parameter outputs. The example current/voltage sensing amplifier is coupled to the modified far-end signal and develops an amplifier output, a voltage (V) parameter output, and a current (I) parameter output. The example sound pressure level (SPL) model module is coupled to the plurality of parameter outputs of the of the DSM module and is operative to develop a predicted SPL. The example echo canceller module is responsive to the predicted SPL and to a near-end signal and operative to develop an echo-canceled output signal. | 05-15-2014 |
20140131450 | EMBEDDED RADIO FREQUENCY IDENTIFICATION (RFID) PACKAGE - A radio frequency identification (RFID) device is described. In one or more implementations, the RFID device includes an integrated circuit (IC) die electrically connected to a radio frequency (RF) antenna winding for transmitting electronically stored information via the RF antenna winding. The RFID device also includes a substrate comprising a first core laminated to a second core. The RF antenna winding is routed through the first core and the second core. The first core defines a cavity for retaining the IC die. The cavity is disposed within the RF antenna winding in the first core. | 05-15-2014 |
20140124797 | SYSTEM AND METHOD FOR REDUCING AMBIENT LIGHT SENSITIVITY OF INFRARED (IR) DETECTORS - Aspects of the disclosure pertain to a system and method for reducing ambient light sensitivity of Infrared (IR) detectors. Optical filter(s) (e.g., absorption filter(s), interference filter(s)) placed over a sensor of the IR detector (e.g., gesture sensor) absorb or reflect visible light, while passing specific IR wavelengths, for promoting the reduced ambient light sensitivity of the IR detector. | 05-08-2014 |
20140104221 | CAPACITIVE TOUCH PANEL SENSOR FOR MITIGATING EFFECTS OF A FLOATING CONDITION - A capacitive touch panel includes elongated drive electrodes arranged next to one another and elongated sense electrodes arranged next to one another across the elongated drive electrodes. One or more of the elongated drive electrodes defines a notch along an edge of a drive electrode, where the notch is positioned between adjacent sense electrodes. In some embodiments, the drive electrode also defines a generally opposing notch on an opposing edge of the drive electrode. Additionally, one or more of the elongated sense electrodes can define an elongated aperture, and a second notch can be defined along the edge of the drive electrode proximate to the elongated aperture. | 04-17-2014 |
20140101459 | MODE-BASED SECURE MICROCONTROLLER - Various embodiments of the present invention are related to integrated circuits for processing data at a microcontroller interface. The microcontroller interfaces to a memory. The method is employed to process input data provided by the microcontroller during a memory write operation, or input data extracted from the memory during a memory read operation, respectively. A write/read control is used to indicate the memory write or read operation, and a logic address is translated to at least one physical address in the memory. The write/read control and the logic address are further employed to determine a data process mode. In various data processing modes, the input data are processed according to at least one of a plurality of data processing methods to result in processed data in different data formats. Data in different formats may be stored in various regions of the memory. | 04-10-2014 |
20140085948 | ACTIVE BRIDGE BACK POWERING PROTECTION AND POWERED DEVICE INTERFACE WITH ACTIVE BRIDGE CONTROL - A method is disclosed to at least partially prevent back powering of power sourcing equipment. In one or more implementations, the method includes detecting a magnitude of current through a current sensor, such as a transistor and/or a resistor. The active FET bridge is configured to rectify input power supplied by power sourcing equipment to a power over Ethernet (PoE) powered device. The method also includes causing the transistor to transition from a closed configuration to an open configuration to at least substantially prevent current flow through the transistor when the magnitude of current is below a predefined threshold to at least substantially prevent back powering of the PSE. | 03-27-2014 |
20140084681 | MAINTAIN POWER SIGNATURE (MPS) FROM A POWERED DEVICE (PD) WHILE POWER IS DRAWN FROM ANOTHER SOURCE - A system for sinking maintain power signature (MPS) current to a rectifier bridge from a powered device (PD) controller in a Power over Ethernet (PoE) network is disclosed. In one or more implementations, the system includes a rectifier bridge configured to electrically connect to Power over Ethernet power sourcing equipment for receiving power from the power sourcing equipment. The system also includes a powered device controller operatively connected to the rectifier bridge and configured to control power supplied to a load. The load is configured to receive power from the power sourcing equipment and a second power source. The powered device controller is configured to source maintain power signature current to the power sourcing equipment using an input of the rectifier bridge when the second power source is furnishing power to the load. | 03-27-2014 |
20140077385 | SEMICONDUCTOR PACKAGE DEVICE HAVING PASSIVE ENERGY COMPONENTS - A semiconductor package device is disclosed that includes a passive energy component integrated therein. In an implementation, the semiconductor package device includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate includes one or more integrated circuits formed proximal to the first surface. The semiconductor package device also includes a passive energy component positioned over the second surface. The passive energy component is electrically connected to one or more integrated circuits. The semiconductor package device also includes an encapsulation structure disposed over the second surface and at least substantially encapsulates the passive energy component. | 03-20-2014 |
20140077355 | THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE DEVICE HAVING ENHANCED SECURITY - A semiconductor package device that includes an integrated circuit device package having a storage circuitry is disclosed. In an implementation, the semiconductor package device includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate includes one or more integrated circuits formed proximal to (e.g., adjacent to, in, or on) the first surface. The semiconductor package device also includes an integrated circuit device disposed over the second surface, the integrated circuit device including storage circuitry for storing sensitive data. In one or more implementations, the semiconductor package device includes a through-substrate via that furnishes an electrical connection to the integrated circuit package. The semiconductor package device also includes an encapsulation structure disposed over the second surface and at least substantially encapsulates the integrated circuit device package. | 03-20-2014 |
20140070666 | PIEZO DRIVER HAVING RECHARGING CAPABILITY - A piezo driver is described that is configured to furnish electric charge to a piezo component and configured to transfer electric charge from the piezo component to a passive energy storage component during various operational states of the piezo driver. In one or more implementations, the piezo driver includes a first passive energy storage component and a second passive energy storage component configured to store electric charge. The piezo driver also includes a voltage converter configured to electrically connect between a piezo component and the first passive energy storage component and the second passive energy storage component. The voltage converter is configured to furnish electric charge from the first passive energy storage component to the piezo component, and vice versa. The voltage converter is also configured to furnish electric charge from the second passive energy storage component to the piezo component, and vice versa. | 03-13-2014 |
20140070665 | PIEZO DRIVER HAVING PASSIVE ENERGY STORAGE COMPONENT RECHARGING CAPABILITY - A piezo driver is described that is configured to furnish electric charge to a piezo component during a first operational state and configured to transfer electric charge from the piezo component to a passive energy storage component during a second operational state. In one or more implementations, the piezo driver includes a passive energy storage component configured to store electric charge. The piezo driver also includes a voltage converter configured to electrically connect between a piezo component and the passive energy storage component. The voltage converter is configured to furnish electric charge from the passive energy storage component to the piezo component during a first state of operation and configured to furnish electric charge from the piezo component to the passive energy storage component during a second state of operation. | 03-13-2014 |
20140063958 | N-Channel Multi-Time Programmable Memory Devices - N-channel multi-time programmable memory devices having an N-conductivity type substrate, first and second P-conductivity type wells in the N-conductivity type substrate, N-conductivity type source and drain regions formed in the first P-conductivity type well, the source and drain regions being separated by a channel region, an oxide layer over the N-conductivity type substrate; and a floating gate extending over the channel region and over the second P-conductivity type well in the N-conductivity type substrate, the multi-time programmable memory cell being programmable by hot electron injection and erasable by hot hole injection. | 03-06-2014 |
20140035812 | GESTURE SENSING DEVICE - A gesture sensing device having a single illumination source is disclosed. In one or more implementations, the gesture sensing device includes a single illumination source configured to emit light and a light sensor assembly configured to detect the light reflected from an object and to output time dependent signals in response thereto. The gesture sensing device also includes a processing circuit coupled to the light sensor assembly and configured to analyze the time dependent signals received from the light sensor assembly to determine object directional movement proximate to the light sensor assembly. | 02-06-2014 |
20140035542 | NON-LINEAR PWM CONTROLLER - A switching power supply includes a circuit having at least two reactive components to provide an output voltage and capable of being switched from a first output state to a second output state. A switching component switches the circuit between at least two switching states including the first output state and the second output state. A pulse width modulator receives a duty cycle and drives the switching component to cause switching between two of the at least two switching states. A nonlinear controller component provides a duty cycle to the pulse width modulator. The duty cycle corresponds to at least one predetermined power supply state variable. The nonlinear controller component includes a processor to apply an optimization technique to minimize a predetermined function of the duty cycle and internal states of the power supply and to obtain a relationship between the duty cycle and at least one predetermined state variable. | 02-06-2014 |
20140035012 | LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER INTEGRATED ON-CHIP - Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. | 02-06-2014 |
20140027876 | LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEGRATED ON-CHIP - A light sensor is described that includes an IR interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are disposed proximate to the surface of the substrate. An IR interference filter is disposed over the photodetectors. The IR interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photo detectors. | 01-30-2014 |
20140015605 | Active Transducer Probes and Circuits - In an example embodiment, a method for bidirectional signal propagation comprises: a) sensing a voltage level of a first signal at a first port; b) coupling the first port to an output of an amplifier with a solid state switch if the voltage level of the first signal is less than a threshold voltage, whereby a second signal applied to a second port coupled to an input of the amplifier is propagated in a first direction from the second port to the first port; and c) bypassing the amplifier if the voltage level of the first signal is greater than the threshold voltage such that the first signal is propagated in a second direction from the first port to the second port. | 01-16-2014 |
20140006190 | Secure Payments with Untrusted Devices | 01-02-2014 |
20130341393 | Safety device and method for using a safety device - The invention relates to a security device with sensors for checking whether the security device ( | 12-26-2013 |
20130335225 | GESTURE DETECTION AND RECOGNITION - Techniques are described for tracking and recognizing gestures performed within a field-of-view of a sensor. In one or more implementations, the techniques may be implemented within an electronic device that is configured to receive a signal from a sensor in response to the sensor detecting a gesture occurring within a field of view of the sensor. A lens is positioned over the sensor to collimate light incident on the lens and to pass the collimated light to the sensor. The electronic device is configured to generate one or more light intensity ratios based upon the signal. The electronic device is then configured to determine a type of gesture performed based upon the one or more light intensity ratios. | 12-19-2013 |
20130293013 | DAISY CHAIN CONFIGURATION FOR POWER CONVERTERS - A system includes a plurality of power supplies and a controller. The plurality of power supplies outputs power to a load. A serial bus connects the plurality of power supplies in a daisy chain. The controller is connected to first and last ones of the power supplies by the serial bus. The controller is connected to a management bus via a management bus interface. The controller monitors the plurality of power supplies via the serial bus. The controller transmits status information of the plurality of power supplies to the management bus via the management bus interface of the controller. | 11-07-2013 |
20130269469 | MICROMECHANICAL CORIOLIS RATE OF ROTATION SENSOR - A micromechanical Coriolis rate of rotation sensor for detecting a rate of rotation, comprising a substrate, a measurement axis (X-axis), a detection axis (Y-axis), and a drive axis (Z-axis), each disposed orthogonally to each other and a first and a second driving mass ( | 10-17-2013 |
20130238907 | SYSTEMS AND METHODS FOR MANAGING CRYPTOGRAPHIC KEYS IN A SECURE MICROCONTROLLER - The present invention relates to key management in a secure microcontroller, and more particularly, to systems, devices and methods of automatically and transparently employing logic or physical address based keys that may also be transferred using dedicated buses. A cryptographic engine translates a logic address to at least one physical address, and processes a corresponding data word based on at least one target key. The target key is selected from a plurality of keys based on the logic or physical address. A universal memory controller stores each processed data word in the corresponding physical address within a memory. Each key is associated with a memory region within the memory, and therefore, the logic or physical address associated with a memory region may be used to automatically identify the corresponding target key. A dedicated secure link may be used to transport key request commands and the plurality of keys. | 09-12-2013 |
20130221869 | METHOD AND APPARATUS FOR ACTIVE RIPPLE CANCELATION - Various embodiments of the invention allow for active AC ripple noise cancellation. In certain embodiments, noise cancellation is accomplished by modulating an LED driver output in a polarity opposite to the ripple, thereby, preventing interference with ripple-sensitive loads. Certain embodiments take advantage of a filter network to prevent the LED driver from modulating LED current in response to ripple that falls within a visible frequency range so as to prevent flicker in an LED backlight display. | 08-29-2013 |
20130214841 | Low Distortion MOS Attenuator - An attenuation circuit uses a voltage controlled variable resistance transistor as a signal attenuator for receivers operating in the zero Hz to about 30 MHz range. The transistor functions in the linear region to linearize the transistor resistance characteristics used for signal attenuation. In an exemplary application, the attenuation circuit is used as an RF attenuator for AM radio broadcast receivers and amplifiers with automatic gain control. Multiple attenuation circuits can be coupled in parallel, each attenuation circuit having a different sized variable resistance transistor, to form sequentially activated stages that increase the range of attenuation while minimizing distortion. | 08-22-2013 |
20130207924 | CAPACITIVE TOUCH PANEL FOR MITIGATING AND/OR EXAGGERATING FLOATING CONDITION EFFECTS - A capacitive touch panel includes elongated drive electrodes arranged next to one another and elongated sensor electrodes arranged next to one another across the drive electrodes. Together, the drive electrodes and the sensor electrodes define a coordinate system where each coordinate location comprises a capacitor formed at an intersection between one of the drive electrodes and one of the sensor electrodes. In implementations, the drive electrodes and/or the sensor electrodes are configured to block capacitance between a touch at a coordinate location and the drive electrodes during a floating condition for the panel. In other implementations, the drive electrodes and/or the sensor electrodes are configured to exaggerate capacitance between a touch at a coordinate location and the drive electrodes during a floating condition for the panel. | 08-15-2013 |
20130207923 | CAPACITIVE TOUCH PANEL HAVING PROTRUSIONS FORMED BETWEEN DRIVE AND/OR SENSOR ELECTRODES - A capacitive touch panel includes elongated drive electrodes arranged next to one another and having a characteristic spacing between adjacent drive electrodes. The capacitive touch panel also includes elongated sensor electrodes arranged next to one another across the drive electrodes and having a characteristic spacing between adjacent sensor electrodes. The drive electrodes and/or the sensor electrodes have protrusions into the spaces between adjacent electrodes. The characteristic spacing between the sensor electrodes may be at least substantially greater than the characteristic spacing between the drive electrodes. The sensor electrodes may have a pitch based upon a touch diameter of a finger, and the touch panel may be capable of sensing a stylus having a touch diameter substantially less than the touch diameter of the finger. | 08-15-2013 |
20130207595 | USB Dedicated Charger Identification Circuit - In an embodiment, set forth by way of example and not limitation, a USB dedicated charger identification circuit includes a USB D+ port, a USB D− port, a first circuit conforming to a first identification protocol, a second circuit conforming to a second identification protocol, and logic selectively coupling one of the first circuit and the second circuit to the USB D+ port and the USB D− port. In an alternate embodiment set forth by way of example and not limitation, a method to provide USB charger identification includes providing a first USB charger identification at a USB D+ port and a D− port, Next, it is detected if the first USB charger identification was inappropriate. Then, if the first USB charger identification was inappropriate, a second USB charger identification is provided at the USB D+ port and the D− port. | 08-15-2013 |
20130194225 | TOUCH PANEL EXCITATION USING A DRIVE SIGNAL HAVING TIME-VARYING CHARACTERISTICS - A capacitive touch panel may include a driver and a drive electrode configured to be connected to the driver. The driver is configured to power the drive electrode with a drive signal having a first signal characteristic during a first time interval, and a second signal characteristic different from the first signal characteristic during a second time interval subsequent to the first time interval. The first signal characteristic may comprise one or more of a first frequency, a first phase, or a first amplitude during the first time interval, and the second signal characteristic may comprise one or more of a second frequency, a second phase, or a second amplitude, where one or more of the first frequency, first phase, or first amplitude may be different from one or more of the second frequency, second phase, or second amplitude, respectively. | 08-01-2013 |
20130188689 | VIDEO ENCODING CONTROL USING NON-EXCLUSIVE CONTENT CATEGORIES - In some embodiments, macroblock-level encoding parameters are assigned to weighted linear combinations of corresponding content-category-level encoding parameters. For example, a macroblock quantization parameter (QP) modulation is set to a weighted linear combination of content category QP modulations. Content categories may identify potentially overlapping content types such as sky, water, grass, skin, and red content. The combination weights may be similarity measures describing macroblock similarities to content categories. A macroblock may be associated with multiple content categories, with different similarity levels for different content categories. A similarity measure for a given macroblock with respect to a content category may be defined as a number (between 0 and 8) of neighboring macroblocks that meet a similarity condition, provided the macroblock meets a qualification condition. The similarity condition may be computationally simpler than the qualification condition. Content-category-level statistics are generated by combining block-level statistics. Content-category-level statistics may be used in encoding subsequent frames. | 07-25-2013 |
20130182246 | AMBIENT LIGHT BASED GESTURE DETECTION - A gesture sensing device includes one or more sensors and a processor for processing sensed voltages output from the sensors based on ambient light and/or reflected light received by the sensors. The processor determines an ambient light level and/or a distance between the target and the sensors such that, if the ambient light level exceeds an ambient light threshold and/or the distance is less than a distance threshold, the processor determines the motion of a target relative to the sensors based on the ambient light instead of the reflected light. | 07-18-2013 |
20130175666 | SEMICONDUCTOR DEVICE HAVING CAPACITOR INTEGRATED THEREIN - Semiconductor devices are described that include a capacitor integrated therein. In an implementation, the semiconductor devices include a substrate including a dopant material of a first conductivity type. A plurality of trenches are formed within the substrate. The semiconductor devices also include a diffusion region having dopant material of a second conductivity type formed proximate to the trenches. A capacitor is formed within the trenches and at least partially over the substrate. The capacitor includes at least a first electrode, a second electrode, and a dielectric material formed between the first and second electrodes. | 07-11-2013 |
20130173840 | COMMUNICATIONS CONTROL SYSTEM WITH A SERIAL COMMUNICATIONS INTERFACE AND A PARALLEL COMMUNICATIONS INTERFACE - A communications control system is disclosed that includes a serial communications interface and a parallel communications interface for coupling a plurality of input/output modules with a control module. The serial communications interface is configured for connecting the plurality of input/output modules to the control module in parallel to transmit information between the plurality of input/output modules and the control module, and the parallel communications interface is configured for separately connecting the plurality of input/output modules to the control module to transmit information between the plurality of input/output modules and the control module, and to transmit information between individual ones of the plurality of input/output modules. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise a cross switch. | 07-04-2013 |
20130173832 | SWITCH FABRIC HAVING A SERIAL COMMUNICATIONS INTERFACE AND A PARALLEL COMMUNICATIONS INTERFACE - A switch fabric is disclosed that includes a serial communications interface and a parallel communications interface. The serial communications interface is configured for connecting a plurality of slave devices to a master device in parallel to transmit information between the plurality of slave devices and the master device, and the parallel communications interface is configured for separately connecting the plurality of slave devices to the master device to transmit information between the plurality of slave devices and the master device, and to transmit information between individual ones of the plurality of slave devices. The parallel communications interface may comprise a dedicated parallel communications channel for each one of the plurality of slave devices. The serial communications interface may comprise a multidrop bus, and the parallel communications interface may comprise a cross switch. | 07-04-2013 |
20130170258 | ELECTROMAGNETIC CONNECTOR - An electromagnetic connector is disclosed that is configured to form a first magnetic circuit portion comprising a first core member and a first coil disposed of the first core member. The electromagnetic connector is configured to mate with a second electromagnetic connector, where the second electromagnetic connector is configured to form a second magnetic circuit portion comprising a second core member and a second coil disposed of the second core member. The first core member and the second core member are configured to couple the first coil to the second coil with a magnetic circuit formed from the first magnetic circuit portion and the second magnetic circuit portion when the electromagnetic connector is mated with the second electromagnetic connector. The magnetic circuit is configured to induce a signal in the first coil when the second coil is energized. | 07-04-2013 |
20130169857 | SELF-CALIBRATED RINGING COMPENSATION FOR AN AUTOFOCUS ACTUATOR IN A CAMERA MODULE - Various embodiments of the present invention relate to an actuator driver in a camera module, and more particularly to methods, systems and devices of employing self-calibrated ringing compensation to improve the autofocus rate of the camera module that is driven by an actuator. Oscillation characteristics of the actuator are calibrated to control a sink current that drives the actuator during an autofocus. The actuator driver comprises a digital-to-analog converter (DAC), a filter, a current sink and a self calibration module. The self calibration module calibrates the free-oscillation frequency and damping coefficient, and accordingly, the DAC generates a voltage that may be subsequently bypassed, filtered or shaped by the filter. This voltage is further converted to the sink current by the current sink. Such self-calibrated ringing compensation allows close tracking of free oscillation, and may efficiently enhance the settling time of the lens and autofocus rate of the camera module. | 07-04-2013 |
20130168850 | SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA - Semiconductor devices are described that include a via that extends only partially through the substrate. Through-substrate vias (TSV) furnish electrical interconnectivity to electronic components formed in the substrates. In implementations, the semiconductor devices are fabricated by first bonding a semiconductor wafer to a carrier wafer with an adhesive material. The semiconductor wafer includes an etch stop disposed within the wafer (e.g., between a first surface a second surface of the wafer). One or more vias are formed through the wafer. The vias extend from the second surface to the etch stop. | 07-04-2013 |
20130167641 | MEMS ACCELERATION SENSOR - The present invention relates to a MEMS acceleration sensor comprising a substrate and a sensor mass that is disposed parallel to the substrate in an X-Y plane. The sensor mass is rotatable about a rotary axis, and includes a plurality of holes. The weight of the sensor mass is different on the two sides of the rotary axis. The sensor further includes sensor elements for detecting a rotary motion of the sensor mass about the rotary axis. To change the weight of the sensor mass on one side of the rotary axis relative to the other side, material of the sensor mass is partially removed in some of the holes for reducing the weight of the sensor mass, and/or material of the sensor mass is added in the Z-direction, in particular in the extension of the holes, for increasing the weight of the sensor mass. | 07-04-2013 |
20130167637 | MICROELECTROMECHANICAL SYSTEM - A microelectromechanical system for detecting accelerations about or along an X-axis, Y-axis, and/or Z-axis, having a substrate and having a driving mass and a detection mass ( | 07-04-2013 |
20130167636 | MICRO RATE OF ROTATION SENSOR AND METHOD FOR OPERATING A MICRO RATE OF ROTATION SENSOR - The present invention relates to a method for operating a rotation sensor for detecting a plurality of rates of rotation about orthogonal axes (x,y,z). The rotation sensor comprises a substrate, driving masses, X-Y sensor masses, and Z sensor masses. The driving masses are driven by drive elements to oscillate in the X-direction. The X-Y sensor masses are coupled to the driving masses, and driven to oscillate in the X-Y direction radially to a center. When a rate of rotation of the substrate occurs about the X-axis or the Y-axis, the X-Y sensor masses are jointly deflected about the Y-axis or X-axis. When a rate of rotation of the substrate occurs about the Z-axis, the X-Y sensor masses are rotated about the Z-axis, and the Z sensor masses are deflected substantially in the X-direction. | 07-04-2013 |
20130162586 | CAPACITIVE TOUCH SENSE ARCHITECTURE - An analog front end circuit utilizes coherent detection within a capacitance measurement application. The analog front end circuit uses coherent detection to measure capacitance of a touch screen display. An analog excitation signal is modulated by a capacitor to be measured. The modulated signal is synchronously demodulated using a correlator, which includes a discrete mixer and a discrete integrator. The excitation signal is also input to the mixer such that the modulated signal is multiplied by the excitation signal. The excitation signal is an analog signal having a sine wave function or other waveform. | 06-27-2013 |
20130162520 | GESTURE DETECTION AND COMPACT REPRESENTATION THEREOF - Techniques are described that may be implemented with an electronic device to detect a gesture within a field of view of a sensor and generate a compact data representation of the detected gesture. In implementations, a sensor is configured to detect a gesture and provide a signal in response thereto. An estimator, which is in communication with the sensor, is configured to generate an elliptical representation of the gesture. Multiple coefficients for the compact representation of the gesture can be used to define the ellipse representing the gesture. | 06-27-2013 |
20130161817 | TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES - Semiconductor package device, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar. | 06-27-2013 |
20130161792 | SEMICONDUCTOR DEVICE HAVING TRENCH CAPACITOR STRUCTURE INTEGRATED THEREIN - Semiconductor devices are described that include a capacitor integrated therein. In an implementation, the semiconductor devices include a substrate. The substrate includes multiple capacitor regions, such as a first capacitor region and a second capacitor region that are adjacent to one another. Each capacitor region includes trenches that are formed within the substrate. A metal-insulator-metal capacitor is formed within the trenches and at least partially over the substrate. The trenches disposed within the first capacitor region are at least substantially perpendicular to the trenches disposed within the second capacitor region. | 06-27-2013 |
20130160545 | MICRO-GYROSCOPE AND METHOD FOR OPERATING A MICRO-GYROSCOPE - A micro-gyroscope for determining a rate of rotation about a Z-axis includes a substrate and two sensor devices each of which comprises at least one drive mass, at least one anchor, drive elements, at least one sensor mass and sensor elements. The drive mass is mounted linearly displaceably in the direction of an X-axis, and can be driven in an oscillatory manner with respect to the X-axis. The sensor mass is coupled to the drive mass by means of springs. The sensor mass is displaceable in the Y-direction, and sensor elements detects a deflection of the sensor mass in the Y-axis. The two sensor devices are disposed parallel to each other and one above the other in the direction of the Z-axis, and the drive mass in these two sensor devices are coupled to each other by means of a coupling spring. | 06-27-2013 |
20130154718 | Fully Capacitive Coupled Input Choppers - A method of differential signal transfer from a differential input Vinp and Vinn having a common mode input voltage that can be higher than the power supply voltage by providing an input chopper having Vinp and Vinn as a differential input, providing an output chopper, capacitively coupling a differential output Voutp and Voutn of the input chopper to a differential input of the output chopper, capacitively coupling a clock to the input chopper and coupling the clock to the output chopper, the clock having a first phase and a second phase opposite from the first phase, the first phase being coupled to the gates of the first and second transistors and the second phase being coupled to the gates of the third and fourth transistors, and providing protection of the gates of the first through fourth transistors from excessive voltages. Various embodiments are disclosed. | 06-20-2013 |
20130154603 | MAINTAIN POWER SIGNATURE (MPS) POWERED DEVICE (PD) - A Maintain Power Signature (MPS) Powered Device (PD) is described. In one or more implementations, the MPS device comprises a current sensor configured to sense current flowing from Power Sourcing Equipment (PSE) to the PD. The current sense based MPS device also comprises a current generator configured to sink electrical current to prevent the PSE from removing power to the PD. Thus, the electrical current comprises a current amplitude characteristic selected based upon MPS requirements of the PSE. In some implementations, the current is sunk to a ground. In other implementations, the current is sunk to a storage device, such as a storage device included with the PD and/or external to the PD. | 06-20-2013 |
20130147458 | ADAPTIVE DEAD-TIME CONTROL - A DC-to-DC converter includes first and second transistors that are connected in series between a supply voltage and ground and that are driven by PWM pulses. A junction of the transistors is connected to an inductance that is connected in series to a load. A first timing module determines a first time difference between a first edge of a first signal at the junction and a first edge of a second signal at a control terminal of the first transistor. A second timing module determines a second time difference between a second edge of the first signal and a second edge of the second signal. The first and second edges of the second signal respectively correspond to first and second edges of one of the PWM pulses. A delay module delays the first and second edges of the second signal respectively based on the first and second time differences. | 06-13-2013 |
20130134303 | LIGHT SENSING DEVICE HAVING A LENS - Light sensing devices are described that have a lens to focus light. In one or more implementations, the light sensing devices include a substrate having a photodetector formed thereon. The photodetector is capable of detecting light and providing a signal in response thereto. The devices also include a display screen that allows light to at least substantially pass through the display screen. An optical baffle extends above a surface of the substrate to display screen and is configured to at least substantially prevent transmission of optical crosstalk to the photodetector. The devices also include a lens disposed proximate to the display screen. The lens is configured to focus light incident upon the lens and to pass the focused light to the photodetector. | 05-30-2013 |
20130127516 | Offset Cancellation for Sampled-Data Circuits - A comparator based circuit with effective offset cancellation includes first and second amplifiers and an offset capacitor operatively connected to the first and second amplifiers. An offset voltage source generates an offset voltage. A first switch connects the offset voltage source to ground during a first time period. The first amplifier generates an output voltage in response to the first switch connecting the offset voltage source to ground during the first time period. A second switch connects the offset capacitor to ground during a second time period. The first switch disconnects the offset voltage source from ground during a third time period, and the second switch disconnects the offset capacitor from ground during the third time period | 05-23-2013 |
20130113386 | LED Current Control In A Dimmable LED Illumination System - The invention relates to a light emitting diode (“LED”) illumination system, and more particularly, to systems, devices and methods of driving a LED module by a current generator that is powered and controlled by a regulated dc voltage associated with a brightness level. Such a dimmable LED illumination system is compatible with both a high-voltage ac signal coupled from any wall outlet and a low-voltage ac signal provided by an electronic transformer. A diode bridge rectifies the ac signal to a rectified ac signal, and a LED driver generates the LED current from the rectified ac signal and drives the LED to the brightness level. Within the LED driver, the level of the LED current is determined from a boost voltage that is substantially a regulated dc voltage generated from the rectified ac signal. | 05-09-2013 |
20130105966 | THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION | 05-02-2013 |
20130105950 | 3D CHIP PACKAGE WITH SHIELDED STRUCTURES | 05-02-2013 |
20130101057 | SYSTEM AND METHOD FOR APPLYING MULTI-TONE OFDM BASED COMMUNICATIONS WITHIN A PRESCRIBED FREQUENCY RANGE - According to one embodiment of the invention, an integrated circuit comprises an encoding module, a modulation module and a spectral shaped module. The encoding module includes an interleaver that adapted to operate in a plurality of modes including a first mode and a second mode. The interleaver performs repetitive encoding when placed in the second mode. The modulation module is adapted to compensate for attenuations that are to be realized during propagation of a transmitted signal over the power line. The spectral shaped module is adapted to compensate for amplitude distortion and further compensates for attenuations that will be realized during propagation of the transmitted signal over the power line. | 04-25-2013 |
20130099859 | Multilevel Class-D Amplifier - A multilevel class-D differential amplifier which can be operated in at least three modes includes a first power stage and a second power stage. In an idle mode, an output of the first power stage varies between a first voltage level and a second voltage level, wherein an output of the second power stage varies between the first voltage level and the second voltage level. In a PWM mode, the output of the first power stage varies between the first voltage level and the second voltage level, wherein the output of the second power stage varies between the first voltage level and the second voltage level. In a Multi-Level mode, the output of said first power stage varies between said second voltage level and a third voltage level, wherein said output of said second power stage is fixed at said first voltage level, and wherein said differential signal between said outputs of said power stages is pulse width modulated. | 04-25-2013 |
20130094570 | Adaptive Motion Estimation Cache Organization - In some embodiments, a motion estimation search window cache is adaptively re-organized according to frame properties including a frame width and a number of reference frames corresponding to the current frame to be encoded/decoded. The cache reorganization may include an adaptive mapping of reference frame locations to search window cache allocation units (addresses). In some embodiments, a search window is shaped as a quasi-rectangle with truncated upper left and lower right corners, having a full-frame horizontal extent. A search range is defined in a central region of the search window, and is laterally bounded by the truncated corners. | 04-18-2013 |
20130091548 | SENDING DIGITAL DATA VISUALLY USING MOBILE DISPLAY AND CAMERA SENSOR - A system for establishing a connection between a first device and a wireless network includes a first control module, located on the first device, that receives encoded digital data. The encoded digital data corresponds to a plurality of images displayed sequentially on a display of a second device. Each of the plurality of images corresponds to a different portion of the encoded digital data. A decoder module, located on the first device, converts the encoded digital data into configuration data. The configuration data includes at least one of an identifier of the wireless network, an encryption key associated with the wireless network, and a password associated with the wireless network. The first control module uses the configuration data to establish the connection with the wireless network. | 04-11-2013 |
20130089953 | Wafer Level Packaging Using a Lead-Frame - Wafer level packaging using a lead-frame. When used to package two or more chips, a final product having QFN package-like finish. The final product will also have a performance rivaling or exceeding that of a corresponding monolithic chip because of the very close connection of the two or more chips and the ability to tailor the fabrication processing of each chip to only that required for the devices on that chip. The wafer level packaging can also be used to package monolithic chips, as well as chips having active devices on one chip and passive devices on a second chip. Various exemplary embodiments are disclosed. | 04-11-2013 |
20130087850 | SEMICONDUCTOR DEVICE HAVING DMOS INTEGRATION - Semiconductor devices that include a trench with conductive material for connecting a VDMOS device to a LDMOS device are described. The semiconductor devices include a substrate having a first region and a second region, wherein the second region is disposed on the first region. A trench extends from a top surface of the second region to the first region. The semiconductor substrate includes a VDMOS device formed proximate to the top surface of the second region and a LDMOS device that is also formed proximate to the top surface of the second region. The drain region of the VDMOS device is electrically connected to the source region of the LDMOS device by way of a conductive material disposed in the trench. | 04-11-2013 |
20130085074 | Antibody Categorization Based on Binding Characteristics - Methods for categorizing antibodies based on their epitope binding characteristics are described. Methods and systems for determining the epitope recognition properties of different antibodies are provided. Also provided are data analysis processes for clustering antibodies on the basis of their epitope recognition properties and for identifying antibodies having distinct epitope binding characteristics. | 04-04-2013 |
20130082321 | DUAL-GATE VDMOS DEVICE - Semiconductor devices are described that include a dual-gate configuration. In one or more implementations, the semiconductor devices include a substrate having a first surface and a second surface. The substrate includes a first and a second body region formed proximal to the first surface. Moreover, each body region includes a source region formed therein. The substrate further includes a drain region formed proximal to the second surface and an epitaxial region that is configured to function as a drift region between the drain region and the source regions. A dual-gate is formed over the first surface of the substrate. The dual-gate includes a first gate region and a second gate region that define a gap there between to reduce the gate to drain capacitance. | 04-04-2013 |
20130082320 | STRAPPED DUAL-GATE VDMOS DEVICE - Semiconductor devices are described that include a dual-gate configuration. In one or more implementations, the semiconductor devices include a substrate having a first surface and a second surface. The substrate includes a first and a second body region formed proximal to the first surface. Moreover, each body region includes a source region formed therein. The substrate further includes a drain region formed proximal to the second surface and an epitaxial region that is configured to function as a drift region between the drain region and the source regions. A dual-gate is formed over the first surface of the substrate. The dual-gate includes a first gate region and a second gate region that define a gap there between to reduce the gate to drain capacitance. A conductive layer may be formed over the first gate region and the second gate region to lower the effective resistance of the dual-gate. | 04-04-2013 |
20130077700 | SOFT REPETITION CODE COMBINER USING CHANNEL STATE INFORMATION - An embodiment is a method and apparatus to decode a signal using channel information. A channel state estimator generates a tone value representing channel information. A quantizer quantizes the tone value. A combiner combines de-interleaved symbols weighed by the quantized tone value. A comparator compares the combined de-interleaved symbols with a threshold to generate a decoding decision. Another embodiment is a method and apparatus to decode a signal using averaging. A channel estimator provides a channel estimate. A multiplier multiplies a quantized output of a demodulator with the channel estimate to produce N symbols of a signal corresponding to a carrier. A de-interleaver de-interleaves the N symbols. An averager averages the N de-interleaved symbols to generate a channel response at a carrier. | 03-28-2013 |
20130070832 | DIGITAL FREQUENCY DIVIDER - Various embodiments of the present invention relate to systems, devices and method of frequency synthesis that generate in-phase and quadrature-phase clock signals at a programmable frequency. The generated frequency, which can range from a fraction to multiples of the input reference frequency, is generated by dividers following a phase-locked loop, thus avoiding the use of a low input reference frequency as well as frequency doubling. | 03-21-2013 |
20130056866 | STACKED WAFER-LEVEL PACKAGE DEVICE - Wafer-level package devices are described that include multiple die packaged into a single wafer-level package device. In an implementation, a wafer-level package device includes a semiconductor device having at least one electrical interconnection formed therein. At least one semiconductor package device is positioned over the first surface of the semiconductor device. The semiconductor package device includes one or more micro-solder bumps. The wafer-level package device further includes an encapsulation structure disposed over and supported by the semiconductor device for encapsulating the semiconductor package device(s). When the semiconductor package device is positioned over the semiconductor device, each micro-solder bump is connected to a respective electrical interconnection that is formed in the semiconductor device. | 03-07-2013 |
20130049617 | LOAD COMPENSATION FOR AN ELECTRONIC TRANSFORMER IN A LED ILLUMINATION SYSTEM - The invention relates to a light emitting diode (LED) illumination system, and more particularly, to systems, devices and methods of rapidly ramping up a transformer current and a LED driver current by coupling a transformer load compensation circuitry to an output of an electronic transformer. A bridge rectifier is coupled to the electronic transformer and provides full-wave rectification to an AC supply at the output of the electronic transformer. The load compensation circuitry senses the rectified AC supply and compensates the load of the electronic transformer, such that the electronic transformer starts up properly when the level of the signal envelope is below a threshold voltage. Therefore, the load compensation circuit is active for a programmed time during which the LED driver current has been increased to a sufficient value to keep the electronic transformer operational. | 02-28-2013 |
20130037948 | SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA - Semiconductor devices are described that have a through-substrate via formed therein. In one or more implementations, the semiconductor devices include a top wafer and a bottom wafer bonded together with a patterned adhesive material. The top wafer and the bottom wafer include one or more integrated circuits formed therein. The integrated circuits are connected to one or more conductive layers deployed over the surfaces of the top and bottom wafers. A via is formed through the top wafer and the patterned adhesive material so that an electrical interconnection can be formed between the integrated circuits formed in the top wafer and the integrated circuits formed in the bottom wafer. The via includes a conductive material that furnishes the electrical interconnection between the top and bottom wafers. | 02-14-2013 |
20130033791 | FAILSAFE GALVANIC ISOLATION BARRIER - A system includes a transmitter, a receiver, a isolation barrier, and a fuse. The isolation barrier is connected to the transmitter. The fuse is connected between the isolation barrier and the receiver. The isolation barrier prevents current flow from the transmitter to the receiver when a voltage across the isolation barrier is less than a first breakdown voltage. The isolation barrier short circuits when the voltage across the isolation barrier is greater than or equal to the first breakdown voltage. The fuse opens when the isolation barrier short circuits. When open, the fuse has a second breakdown voltage that is greater than the first breakdown voltage. | 02-07-2013 |
20130021953 | FULL-DUPLEX SINGLE-ENDED SERIAL LINK COMMUNICATION SYSTEM - A system for full duplex communication using a single-ended communications link is described. The system includes a first link interface configured to generate a signal for transmission via the single-ended communications link. The signal includes data encoded in a forward channel. The system also includes a second link interface configured to receive the signal from the first link interface via the single-ended communications link and modulate the signal to encode data in a reverse channel so that the signal includes the forward channel data and the reverse channel data simultaneously. | 01-24-2013 |
20130015574 | BUMP I/O CONTACT FOR SEMICONDUCTOR DEVICE - A bump contact electrically connects a conductor on a substrate and a contact pad on a semiconductor device mounted to the substrate. The first end of an electrically conductive pillar effects electrical contact and mechanical attachment of the pillar to the contact pad with the pillar projecting outwardly from the semiconductor device. A solder crown reflowable at a predetermined temperature into effecting electrical contact and mechanical attachment with the conductor is positioned in axial alignment with the second end of the pillar. A diffusion barrier electrically and mechanically joins the solder bump to the second end of the pillar and resists electro-migration into the first end of the solder crown of copper from the pillar. One diffusion barrier takes the form of a 2-20 micron thick control layer of nickel, palladium, titanium-tungsten, nickel-vanadium, or tantalum nitride positioned between the pillar and the solder crown. | 01-17-2013 |
20120326773 | SYSTEMS AND METHODS FOR POWER TRANSFER BASED ON RESONANCE COUPLING OF INDUCTORS - An integrated circuit (IC) includes first and second resonator circuits and an isolation barrier. The first resonator circuit includes first and second inductors, wherein the first resonator circuit is connected to a supply voltage. The second resonator circuit includes third and fourth inductors, wherein the second resonator circuit is matched to the first resonator circuit. The isolation barrier separates the first and second resonator circuits. The first and second inductors are inductively coupled to the third and fourth inductors, respectively, thereby providing for transfer of power from the first resonator circuit across the isolation barrier to the second resonator circuit. | 12-27-2012 |
20120326308 | ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT APPLICATIONS - A WLP device is provided with a flange shaped UBM or an embedded partial solder ball UBM on top of a copper post style circuit connection. | 12-27-2012 |
20120313890 | INTER-SYMBOL INTERFENCE REDUCTION FOR TOUCH PANEL SYSTEMS - A touch panel system is described that is configured to reduce inter-symbol interference (ISI). In an implementation, the touch panel system includes a touch panel assembly that includes a plurality of drive electrodes arranged one next to another and a plurality of sensor electrodes arranged one next to another across the drive electrodes to form a plurality of pixels having a mutual capacitance. The touch panel system also includes a transmitter configured to drive the drive electrodes with drive signals derived at least partially from excitation values. The transmitter is configured to apply a window function to the drive signals. The system also includes a receiver configured to sense signals furnished from the sensor electrodes and to determine the mutual capacitance of the pixels. | 12-13-2012 |
20120313441 | ACTIVE CELL BALANCING - A battery cell balancing system includes N switching circuits connected to first terminals and second terminals of N battery cells, respectively, where N is an integer greater than one. A first transformer includes a first core and N sets of windings wound around the first core. The N sets of windings are connected to the N switching circuits, respectively. A first control module controls switching of the N switching circuits to reverse first connections between the first terminals and the second terminals of the N battery cells and the N sets of windings, respectively, at a first frequency to balance charge levels of the N battery cells. | 12-13-2012 |
20120306071 | WAFER-LEVEL PACKAGE DEVICE - Wafer-level package semiconductor devices are described that have a smallest distance between two adjacent attachment bumps smaller than about twenty-five percent (25%) of a pitch between the two adjacent attachment bumps. The smallest distance between the two adjacent attachment bumps allows for an increase in the number of attachment bumps per area without reducing the size of the bumps, which increases solder reliability. The increased solder reliability may reduce stress to the attachment bumps, particularly stress caused by CTE mismatch during thermal cycling tests, dynamic deformation during drop tests or cyclic bending tests, and so on. | 12-06-2012 |
20120293455 | TOUCH PANEL TESTING USING MUTUAL CAPACITOR MEASUREMENTS - A capacitive touch panel is tested for the presence or absence of short and open circuits in drive and sense lines without the use of a tool that touches the surface of the panel. During a first stage of testing, drive lines of the touch panel are sequentially driven while the remaining drive lines are floated. Sense lines are read to indicate whether a driven drive line is shorted to an adjacent drive line, an open circuit, or coupled to a sense line that is an open circuit. During a second stage of testing, drive lines are driven while alternate sense lines are floated or enabled. The signals on the enabled sense lines are acquired to indicate whether the enabled sense lines are shorted to adjacent sense lines. This second stage can be repeated, switching the roles of the sense lines, to determine the locations of short and/or open circuits. | 11-22-2012 |
20120280904 | METHOD FOR DETECTING GESTURES USING A MULTI-SEGMENT PHOTODIODE AND ONE OR FEWER ILLUMINATION SOURCES - A gesture sensing device includes a multiple segmented photo sensor and a control circuit for processing sensed voltages output from the sensor. The control circuit processes the sensed voltage signals to determine target motion relative to the segmented photo sensor. The control circuit includes an algorithm configured to calculate one of more differential analog signals using the sensed voltage signals output from the segmented photo sensors. A vector is determined according to the calculated differential analog signals, the vector is used to determine a direction and/or velocity of the target motion. | 11-08-2012 |
20120280795 | Transponder - Proposed is a transponder for receiving a wireless electromagnetic interrogation signal and for transmitting a wireless electromagnetic response signal with a first coil acting as an antenna for generating a first wired electrical receive signal from the interrogation signal, and with at least one further coil acting as an antenna for generating a further wired electrical receive signal from the interrogation signal, wherein an axis of the first coil and an axis of the further coil are aligned differently in the space, wherein in each case one full-wave rectifier for rectifying the respective receive signal is assigned to the coils, wherein a summing element for summing up the rectified receive signals generated by the full-wave rectifiers is provided in order to generate in this manner a pulsating sum signal, the frequency of which corresponds to twice the frequency of the interrogation signal. | 11-08-2012 |
20120280107 | OPTICAL GESTURE SENSOR USING A SINGLE ILLUMINATION SOURCE - A gesture sensing device includes a single light source and a multiple segmented single photo sensor, or an array of photo sensors, collectively referred to herein as segmented photo sensors. A light modifying structure relays reflected light from the light source onto different segments of the segmented photo sensors. The light modifying structure can be an optical lens structure or a mechanical structure. The different segments of the photo sensor sense reflected light and output corresponding sensed voltage signals. A control circuit receives and processes the sensed voltage signals to determine target motion relative to the segmented photo sensor. | 11-08-2012 |
20120274404 | MIXED-SIGNAL INTEGRATOR ARCHITECTURE - A mixed signal correlator utilizes coherent detection within a capacitance measurement application. In some applications, the mixed signal correlator is used to measure capacitance of a touch screen display. An external capacitor whose capacitance is measured is kept small for improved sensitivity and can be used for a variety of applications having varied integration periods for measurement. The external capacitor is kept small and can be used for varied applications by adjusting the output voltage within a range that is less than the supply voltage, and maintaining a count of the adjustments to later reconstruct an actual output voltage for the integration period. An output is a weighted sum of an analog integrator output and a digital counter output. | 11-01-2012 |
20120262318 | System and Method for Background Calibration of Time Interleaved Analog to Digital Converters - Various embodiments allow for background calibration of channel-to-channel mismatch errors. | 10-18-2012 |
20120262316 | METHOD TO REDUCE VOLTAGE SWING AT COMPARATOR INPUT OF SUCCESSIVE-APPROXIMATIONS-REGISTER ANALOG-TO-DIGITAL CONVERTERS - A SAR ADC includes a DAC including a first set of capacitors each having a first end connected to a common node, and a second end, and a first set of switches each connecting the second end of a respective one of the capacitors to a first reference voltage. The SAR ADC further includes a second set of capacitors each having a first end connected to the common node and a second end that receives an input to be converted when the common node is connected to ground. The SAR ADC further includes a second set of switches that selectively connect the second end of a first capacitor of the second set of capacitors to ground when the input is disconnected from the second ends of the second set of capacitors and when the common node is disconnected from ground during a first of a plurality of successive approximations. | 10-18-2012 |
20120256659 | CURRENT SHARE COMPENSATION DESIGN - A current share system for providing current to a load includes a first power supply module that controls a first voltage converter to provide a first current to the load, that transmits synchronization information using a first pin, and that transmits at least one second type of information using the first pin. A second power supply module receives the synchronization information at a second pin, receives the at least one second type of information at the second pin, and controls a second voltage converter to provide a second current to the load based on the synchronization information and the at least one second type of information. | 10-11-2012 |
20120250469 | Apparatus and Method of Keeping Time of Day Over an Industrial Temperature Range - Various embodiments of the invention relate generally to real-time clock circuit, and more particularly to systems, devices and methods of integrating two oscillators in one real-time clock circuit to generate accurate time of day over an industrial temperature range. A primary oscillator is employed to generate a first high precision clock while having a higher frequency and consuming more power; a secondary oscillator is employed to generate a second clock that has a low frequency and consumes less power, but may not meet the time accuracy requirement. When the real-time clock is provided with sufficient power (MSN mode), time of day is constantly tracked by the primary oscillator, but when the real-time clock is powered by a battery (SLEEP mode), time of day is tracked by the secondary oscillator while the primary oscillator is switched on at an update frequency to compensate errors in the time of day. | 10-04-2012 |
20120250462 | TRANSMIT/RECEIVE SYSTEMS FOR IMAGING DEVICES - A transceiver for an ultrasonic imaging device includes a transmit circuit and a receive circuit. The transmit circuit outputs test pulses to a probe including a transducer to generate an image of a test object. A composite signal including the test pulses and a reflected signal is output by the transducer. The receive circuit receives the composite signal including the test pulses and the reflected signal and includes a filter circuit. The filter circuit filters the test pulses from the composite signal and passes the reflected signal. An impedance of the filter circuit is equal to substantially zero when the reflected signal is within a predetermined frequency range. | 10-04-2012 |
20120249103 | SYSTEMS AND METHODS FOR INTEGRATED SWITCH-MODE DC-DC CONVERTERS FOR POWER SUPPLIES - A first control system for a power supply includes a switch-mode DC-DC converter module and an FET gate drive module. The switch-mode DC-DC converter module receives an input voltage and generates first and second voltages, the first voltage powering a DC-DC control module. The FET gate drive module selectively drives a plurality of FETs of the power supply using the second voltage thereby generating a desired output voltage from the input voltage. A second control system is directed to driving the second voltage to a desired gate voltage, wherein the desire gate voltage is determined based on at least one of a plurality of operating parameters. A third control system includes controlling first and second voltages generated by a SIDO voltage converter based on the first and second voltages and a damping factor, and generating the damping factor based on current flowing through the inductor of the SIDO voltage converter. | 10-04-2012 |
20120218319 | GAMMA SWITCHING AMPLIFIER - Electronic devices with displays are configured to provide a gamma correction signal to each source driver chip driving the display. The gamma correction signal is supplied by a gamma application circuit coupled to each source driver chip. The gamma application circuit includes a switching amplifier configured to output a switching waveform and a filter to input the switching waveform and output the gamma correction signal to an input of each source driver chip. The switching amplifier functions as a switching power supply having improved power efficiency compared to conventional gamma application circuits. | 08-30-2012 |
20120218250 | VCOM AMPLIFIER WITH TRANSIENT ASSIST CIRCUIT - Electronic devices with a V | 08-30-2012 |
20120218249 | VCOM SWITCHING AMPLIFIER - Certain electronic devices with displays, such as LCDs, are configured to provide a common voltage to a display backplane. The common voltage is supplied by a common voltage application circuit coupled to the display. The common voltage application circuit includes a switching amplifier configured to output the common voltage. The switching amplifier functions as a switching power supply having improved power efficiency compared to conventional common voltage application circuits. | 08-30-2012 |
20120218223 | CONTINUOUS TIME CORRELATOR ARCHITECTURE - An analog front end circuit utilizes coherent detection within a capacitance measurement application. The analog front end circuit uses coherent detection to measure capacitance of a touch screen display. An analog excitation signal is modulated by a capacitor to be measured. The modulated signal is synchronously demodulated using a correlator, which includes an integrated mixing and integration circuit. The correlator includes a programmable impedance element that generates a time-varying conductance according to a controlling digitized waveform. | 08-30-2012 |
20120218222 | CANCELLING TOUCH PANEL OFFSET OF A TOUCH PANEL SENSOR - A touch panel sensor system for increasing the dynamic range of the system is disclosed. The touch panel sensor system comprises a sensor driver module for driving one or more sensors of a touchscreen and an offset cancellation driver module for driving an offset cancellation module. The signals generated by the sensors and the offset cancellation module are coupled to a measuring module at a node (N | 08-30-2012 |
20120218020 | CALIBRATION FOR MIXED-SIGNAL INTEGRATOR ARCHITECTURE - A mixed signal correlator utilizes coherent detection within a capacitance measurement application. In some applications, the mixed signal correlator is used to measure capacitance of a touch screen display. An external capacitor whose capacitance is measured is kept small for improved sensitivity and can be used for a variety of applications having varied integration periods for measurement. The external capacitor is kept small and can be used for varied applications by adjusting the output voltage within a range that is less than the supply voltage, and maintaining a count of the adjustments to later reconstruct an actual output voltage for the integration period. An output is a weighted sum of an analog integrator output and a digital counter output. | 08-30-2012 |
20120217981 | CIRCUITS, DEVICES AND METHODS HAVING PIPELINED CAPACITANCE SENSING - Capacitance sensing circuits, systems and method can include sample and hold (S/H) circuits that can retain analog values for one set of capacitance sensors, and sequentially convert such analog values into digital values while analog values for another set of capacitance sensors values are generated. | 08-30-2012 |
20120217978 | BACKGROUND NOISE MEASUREMENT AND FREQUENCY SELECTION IN TOUCH PANEL SENSOR SYSTEMS - A touch panel sensor system that can dynamically measure noise and automatically switch to a frequency with minimal noise is described. The touch panel sensor system includes a sensor configured to detect a change in capacitance associated with a touch upon a touch panel. The system also includes a drive module configured to generate a drive signal having a first waveform characteristic (e.g., signal having a periodic waveform characteristic) during a first phase (e.g., sensor phase) and a second drive signal having a second waveform characteristic (e.g., constant voltage signal) during a second phase (e.g., noise detection phase). The first and second drive signals are configured to drive the sensor. The system also includes a measuring module coupled to the sensor that is configured to measure noise having the first waveform characteristic (e.g., periodic waveform characteristic) during the second phase. | 08-30-2012 |
20120217945 | SYSTEMS AND METHODS FOR FEED-FORWARD CONTROL OF LOAD CURRENT IN DC TO DC BUCK CONVERTERS - A feed-forward control system for load current in a direct current (DC) to DC converter includes a current normalization module, a feed-forward generation module, and a duty cycle generation module. The current normalization module generates a normalized load current by matching a gain of a measured load current to a gain of an inductor current. The feed-forward generation module that generates a load current feed-forward (LCFF) signal based on the normalized load current. The duty cycle generation module generates a duty cycle for the DC to DC converter based on a commanded output voltage and the LCFF signal. | 08-30-2012 |
20120217940 | DELAY COMPENSATION SYSTEMS AND METHODS FOR DC TO DC CONVERTERS - A control system for a DC to DC converter includes a predicted state generator module, a voltage estimation module, an error module, and a pulse width modulation (PWM) module. During a prior sampling period, the predicted state generator module generates a predicted capacitor voltage and a predicted capacitor current for a current sampling period. The voltage estimation module generates an estimated value of an output voltage of the DC to DC converter during the current sampling period based on the predicted capacitor current, the predicted capacitor voltage, a delay value, and a duty cycle value for the prior sampling period. The error module generates a voltage error value based on difference between a measured value of the output voltage and the estimated value. The PWM module controls the duty cycle of the DC to DC converter based on the voltage error value. | 08-30-2012 |
20120211865 | DEEP TRENCH CAPACITOR WITH CONFORMALLY-DEPOSITED CONDUCTIVE LAYERS HAVING COMPRESSIVE STRESS - A high density deep trench MIM capacitor structure is provided wherein conductive-compressive-conformally applied layers of a semiconductor material, such as a Poly-Si | 08-23-2012 |
20120201260 | Symmetrical, Direct Coupled Laser Drivers - Symmetrical, direct coupled laser drivers for high frequency applications. The laser drivers are in integrated circuit form and use a minimum of relatively small (low valued) external components for driving a laser diode coupled to the laser driver through transmission lines. An optional amplifier may be used to fix the voltage at an internal node at data frequency spectrum to improve circuit performance. Feedback to a bias input may also be used to fix the voltage at the internal node. Programmability and a burst mode capability may be included. | 08-09-2012 |
20120200442 | PRECISION SUB-RADIX2 DAC WITH LINEARITY CALIBRATION - A system includes an N bit sub-binary radix digital-to-analog converter (DAC) that converts an m bit digital input signal to an analog output signal, where m and N are integers greater than or equal to 1 and N>m. A radix conversion module determines a code ratio, the code ratio being a ratio of a total number of available monotonic codes to 2 | 08-09-2012 |
20120194306 | PREVENTING CONTACT STICTION IN MICRO RELAYS - A micro relay of a micro-electro-mechanical system (MEMS), includes a cap substrate, a first electrical contact, an actuator, and a second electrical contact. The first electrical contact is formed on the cap substrate, includes a platinum group metal, and includes a first surface layer of an oxide of the platinum group metal. The second electrical contact is formed on the actuator, includes the platinum group metal, and includes a second surface layer of the oxide of the platinum group metal. At least a first portion of the first surface layer contacts at least a second portion of the second surface layer during cycling of the micro relay. | 08-02-2012 |
20120194264 | CURRENT MIRROR AND CURRENT CANCELLATION CIRCUIT - Techniques are described to mirror currents and subtract currents accurately. In an implementation, a circuit includes a first current source coupled to a first node to provide a current IPD | 08-02-2012 |
20120194161 | INDUCTOR CURRENT MEASUREMENT FOR DC TO DC CONVERTERS - A system includes an estimation module and a current measuring module. The estimation module estimates current through an inductor in an output stage of a power supply using a model of the current and generates an estimated current. The current measuring module measures the current through the inductor and generates a measured current. The estimation module adjusts the model based on the measured current. | 08-02-2012 |
20120193808 | BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED WAFERS - A wafer structure includes a first wafer stack and a first bonding layer disposed on the first wafer stack. The wafer structure further includes a second wafer stack that includes a first surface and a second surface opposing the first surface. A second bonding layer is disposed on the second surface and is in contact with the first bonding layer. The second wafer stack comprises through-silicon-vias (TSVs) that extend from the first surface to the second bonding layer. A seed layer is disposed on the first surface and is in contact with the TSVs. | 08-02-2012 |
20120188111 | CIRCUIT AND METHOD FOR OPTIMIZING DYNAMIC RANGE IN A DIGITAL TO ANALOG SIGNAL PATH - A circuit for maximizing dynamic range in a digital to analog signal path comprises an input for receiving an input signal, a first gain stage coupled to the input having a first gain setting, an second gain stage coupled to the first gain stage, the second gain stage having an second gain setting, a controller configured to selectively increase the first gain setting and decrease the second gain setting according to the input signal level and an output coupled to the second gain stage for transmitting an output signal. A method for maximizing dynamic range in a digital to analog signal path comprises detecting a digital input signal level, detecting a desired user gain level, applying a first gain to the digital input signal, converting the digital input signal into an analog signal, and applying a second gain to the analog signal, wherein the first and second gain are selectively and inversely manipulated according to the digital input signal while maintaining a desired user gain level. | 07-26-2012 |
20120187515 | LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE WITH LENS FORMED THEREIN - Light sensor devices are described that have a glass substrate, which includes a lens to focus light over a wide variety of angles, bonded to the light sensor device. In one or more implementations, the light sensor devices include a substrate having a photodetector formed therein. The photodetector is capable of detecting light and providing a signal in response thereto. The sensors also include one or more color filters disposed over the photodetector. The color filters are configured to pass light in a limited spectrum of wavelengths to the photodetector. A glass substrate is disposed over the substrate and includes a lens that is configured to collimate light incident on the lens and to pass the collimated light to the color filter. | 07-26-2012 |
20120187513 | LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEGRATED ON-CHIP - A light sensor is described that includes an IR cut interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are formed in the substrate proximate to the surface of the substrate. An IR cut interference filter is disposed over the photodetectors. The IR cut interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR cut interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photo detectors. | 07-26-2012 |
20120187512 | LIGHT SENSOR HAVING IR CUT INTERFERENCE FILTER WITH COLOR FILTER INTEGRATED ON-CHIP - Techniques are described to furnish a light sensor that includes a patterned IR cut interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR cut interference filter configured to block infrared light is formed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR cut interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. In an implementation, a buffer layer is formed over the surface and configured to encapsulate the plurality of color pass filters to facilitate formation of the IR cut interference filter. In another implementation, the buffer layer is formed over the IR cut interference filter to function as a quasi-sacrificial buffer layer to facilitate formation of the color pass filters. | 07-26-2012 |
20120187281 | LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND THROUGH-SUBSTRATE VIAS - Techniques are described to furnish an IR suppression filter that is formed on a glass substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate and configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a glass substrate. The light sensor also includes a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. The light sensor further includes through-silicon vias to provide electrical interconnections between different conductive layers. | 07-26-2012 |
20120187280 | LIGHT SENSOR HAVING IR SUPPRESSION FILTER AND TRANSPARENT SUBSTRATE - Techniques are described to furnish an IR suppression filter, or any other interference based filter, that is formed on a transparent substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate. The photodetectors are configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a transparent substrate. The light sensor may also include a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. | 07-26-2012 |
20120153960 | Negative Peak Voltage Detection for Enhanced FuelGauge Empty Voltage Prediction - Negative peak voltage detection for battery end of life estimations in fuel gauging is disclosed. Battery powered devices such cell phones and laptop computers create some noise in the form of negative excursions from the average output voltage of the battery which can cause the battery powered device to stop functioning. By negative peak detection relative to the average battery voltage, the end of life or discharged voltage condition can be altered in response to the negative peaks to obtain the maximum battery life without risk of the device inadvertently shutting down. Average output voltage of the battery may be taken as an estimated open circuit voltage or some other battery voltage. Various embodiments are disclosed. | 06-21-2012 |
20120139546 | State Based Full and Empty Control for Rechargeable Batteries - State based full and empty control for rechargeable batteries that will assure a uniform battery empty condition, even in the presence of a load on the battery. A fuel gauge provides a prediction of the open circuit voltage of the battery, and when the predicted open circuit voltage of the battery reaches the predetermined open circuit voltage of an empty battery, the load is terminated, after which the battery will relax back to the predetermined open circuit voltage of an empty battery. A similar technique is disclosed for battery charging, allowing faster battery charging without overcharging. Preferably an RC battery model is used as the fuel gauge to provide the prediction, but as an alternative, a coulomb counter may be used to provide the prediction, with error correction between successive charge discharge cycles. | 06-07-2012 |
20120114033 | USING MULTI-LEVEL PULSE WIDTH MODULATED SIGNAL FOR REAL TIME NOISE CANCELLATION - A mixed signal processing circuit includes an analog to PWM converting circuit and a finite impulse response (FIR) filter having a multiple output tapped delay line and a summing and integration circuit. The mixed signal processing circuit converts an input analog signal to a PWM signal, forms a multi-level PWM signal from the PWM signal and one or more delayed versions of the PWM signal, and converts the multi-level PWM signal to an output analog signal. The analog to PWM converting circuit is implemented using a triangle waveform generator and a comparator. The FIR filter is implement using a resistive network to apply scaling coefficients of the FIR filter. The mixed signal processing circuit can be implemented within a noise cancellation headphone to generate a noise cancelling signal or generally in applications that would be benefitted from the combination of analog input/output and digital filter techniques. | 05-10-2012 |
20120106953 | Dual Laser-Power-Level Control and Calibration System for Burst-Mode and Continuous-Mode Transmitter - Dual laser-power-level control and calibration system for burst-mode and continuous-mode transmitter. A first signal path receives a transmit signal that also drives the transmit laser, and a second signal path receives the output of a monitor diode. The first and second signal paths include filtering so that the two signal paths have a similar frequency response. The upper and lower excursions in both signal paths are compared, and the power levels of the optical transmitter are adjusted based on those comparisons. Embodiments with one control loop and two control loops are disclosed. | 05-03-2012 |
20120081125 | Integrated MOSFET Current Sensing for Fuel-Gauging - Integrated MOSFET current sensing for fuel-gauging. A | 04-05-2012 |
20120081095 | SYSTEMS AND METHODS FOR CONTROLLING INDUCTIVE ENERGY IN DC-DC CONVERTERS - A DC-DC converter comprises a high-side switch, a low-side switch connected to the high-side switch, and an output capacitance. An inductance has one end connected to the high-side switch and the low-side switch and another end connected to the output capacitance. A shunting device circulates current flowing through the inductance back to the inductance during a load reduction transition to control a voltage across the output capacitance. | 04-05-2012 |
20120078546 | LOAD-SIDE VOLTAGE DETECTION VIA ELECTRIC METERING PROCESSING - Load-side voltage detection via electric metering processing is disclosed. In one aspect, load-side voltage is provided as an input to a metering processing unit. The metering processing unit determines a voltage level of the load-side voltage. An application processing unit uses the voltage level to control operation of a service disconnect relay. | 03-29-2012 |
20120039376 | Systems And Methods For Digital Control Utilizing Oversampling - Methods and systems for digital control utilizing oversampling. | 02-16-2012 |