Cabot Microelectronics Corporation

AURORA, IL US

1. 20090291559 STABLE, HIGH RATE SILICON SLURRY - chemical-mechanical polishing composition comprising wet-process silica 11-26-2009
2. 20090236559 COMPOSITIONS FOR POLISHING ALUMINUM/COPPER AND TITANIUM IN DAMASCENE STRUCTURES 09-24-2009
3. 20090232279 X-RAY SOURCE WITH NONPARALLEL GEOMETRY - improved electron bombardment device includes a first tubular member for containing a target material and a 09-17-2009
4. 20090173717 COMPOSITION AND METHOD FOR POLISHING NICKEL-PHOSPHOROUS-COATED ALUMINUM HARD DISKS 07-09-2009
5. 20090152240 CHEMICAL-MECHANICAL POLISHING COMPOSITION AND METHOD FOR USING THE SAME 06-18-2009
6. 20090137124 POLISHING COMPOSITION AND METHOD FOR HIGH SILICON NITRIDE TO SILICON OXIDE REMOVAL RATE RATIOS 05-28-2009
7. 20090124173 COMPOSITIONS AND METHODS FOR RUTHENIUM AND TANTALUM BARRIER CMP 05-14-2009
8. 20090090696 SLURRIES FOR POLISHING OXIDE AND NITRIDE WITH HIGH REMOVAL RATES 04-09-2009
9. 20090081927 POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE 03-26-2009
10. 20090081871 POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE 03-26-2009
11. 20090075566 LOW PH BARRIER SLURRY BASED ON TITANIUM DIOXIDE 03-19-2009
12. 20090029633 METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC 01-29-2009
13. 20080274674 STACKED POLISHING PAD FOR HIGH TEMPERATURE APPLICATIONS 11-06-2008
14. 20080220610 Silicon oxide polishing method utilizing colloidal silica 09-11-2008
15. 20080203059 DILUTABLE CMP COMPOSITION CONTAINING A SURFACTANT 08-28-2008