National Starch and Chemical Investment Holding Corporation Patent applications |
Patent application number | Title | Published |
20090306255 | NOVEL WATER-BASED ADHESIVES FOR INDUSTRIAL APPLICATIONS - The invention relates to water-based adhesives for industrial applications obtained by mixing water-redispersible polymer powder and water-soluble polymer powder with water, wherein the weight ratio of the water-redispersible polymer powder to the water-soluble polymer powder is from about 0.001:1 to 100:1 and the water-based adhesive has a set speed of less than 300 sec, when measured with a 36 μm thick layer at 23° C. and 50% relative humidity and 385 μm thick carton boards with a weight of 275+/−3 g/m2 and Cobb values on one side of 43 g/min/m2 and 27 g/min/m2 on the other side, has a solids content of about 7.5 to 70 wt.-% and a Brookfield viscosity at 23° C. at 20 rpm, measured according to the ASTM D1084 standard, of about 500 to 10,000 mPas. The water-based industrial adhesive has the capability to bond a low surface tension substrate to a cellulosic substrate, in particular with a weight-ratio of water-redispersible polymer powder to water-soluble polymer powder from about 0.5:1 to 100:1 thus can replace conventional aqueous adhesives based on synthetic polymer dispersions. The benefits of the invention are manifold such as faster set speeds and increased machine speeds, logistical advantages due to handling powders instead of liquids, leading to e.g. prolonged shelf life, no water transportation and being an environmentally friendly, low VOC containing adhesive. | 12-10-2009 |
20090203847 | Hot Melt Adhesive - Hot melt adhesives are provided that have improved heat resistance. The adhesives comprise a metallocene polyolefin, an amorphous α-olefin polymer, a tackifier and a functional polyolefin. The functional polyolefin is used in an amount sufficient to increase the heat resistance. A preferred functional polyolefin is a maleated polyolefin such as maleated polypropylene. A preferred tackifier is a hydrogenated hydrocarbon tackifier. | 08-13-2009 |
20090192242 | Dispersion compositions for tile adhesives - The invention relates to an aqueous dispersion and dispersion powder composition for highly flexible, waterproof, hydraulically binding tile adhesives having an extended open time, and containing an emulsion polymer (A) having a glass transition temperature (T | 07-30-2009 |
20090165942 | Insulation and Method of Installing - Insulation blankets having preapplied thereon a reactivatable hot melt adhesive. | 07-02-2009 |
20090159206 | MOISTURE CURABLE HOT MELT ADHESIVE - Moisture curable hot melt adhesive compositions that contain functionally modified polyolefins and have improved green strength before set are prepared without using added crystalline polyester polyol. | 06-25-2009 |
20090159205 | METHOD FOR PREPARING A MOISTURE CURABLE HOT MELT ADHESIVE - Moisture curable reactive hot melt adhesive compositions are prepared using a novel two-step polymerization process. Resulting adhesives have improved green strength. | 06-25-2009 |
20090082485 | UV Curable Coating Composition - The invention provides an isocyanate free UV curable hot melt composition which may be hardened upon exposure to UV radiation to provide a protective coating. The coating is particularly useful in wood-working and furniture applications. | 03-26-2009 |
20090042040 | Reactive Hot Melt Adhesive - High green strength reactive hot melt adhesives are prepared using silane-functional liquid polymers. The adhesive are formulated using a silane-reactive polymer or, alternatively, a non-silane-reactive polymer together with a compatible tackifier. | 02-12-2009 |
20090017186 | Hydrocolloid Blend For Innovative Texture - The present invention relates to a hydrocolloid blend which exhibits an innovative texture in compositions. The blend consists essentially of a waxy starch which has been enzymatically debranched and a non-high amylose starch which has been stabilized and inhibited in a ratio of 0.8:1 to 8:1. | 01-15-2009 |
20080292801 | Corrosion-Preventive Adhesive Compositions - The present invention concerns adhesive compositions that provide corrosion-preventative properties and improved adhesive bonding on corrodible surfaces, such as may be found in electronic components. These compositions provide the substrates with greatly increased resistance to corrosion, especially during long term exposure to high temperatures and/or high humidity. When used on conductive substrates, the compositions also maintain good initial and ongoing electrical conductivity. | 11-27-2008 |
20080250972 | Electrically Conductive UV-Curable Ink - An ultraviolet or electron beam curable conductive material for use in the electronics industry. The conductive material has a low viscosity and is capable of application to a substrate by high speed printing techniques such as flexography and rotogravure and provides high electrical conductivity following cure. The conductive material comprises one or more oligomers, one or more acrylate carriers, one or more reactive monomers such as vinyl ether, conductive filler and one or more photoinitiators. Optional additional ingredients, such as diluents, dispersants, etc. may be added as desired. | 10-16-2008 |
20080207894 | Crosslinking Reactions - The present invention relates to a process of making a starch crosslinked with sodium trimetaphosphate or with a combination of sodium trimetaphosphate and sodium tripolyphosphate. The reaction has increased efficiency over the standard crosslinking process and/or reduced phosphorus effluent. | 08-28-2008 |
20080202380 | CONDUCTIVE MATERIALS - A material for producing a conductive composition comprising polymer particles, conductive particles, and a liquid medium. The material is in a liquid/dispersion form until it is cured at which time it forms an electrically conductive composition. The composition contains larger sized polymer particles along with smaller metal conductive filler particles such as nanoparticle-sized filler particles. The larger polymer particles create excluded volume in the material matrix and reduce the percolation threshold of the conductive filler particles to provide a conductive material with a reduced volume fraction of electrically conductive filler. The electrical conductivity of the material is further increased after heat treatment which causes the conductive filler particles to sinter together to form a highly conductive network. | 08-28-2008 |